JPS6335118B2 - - Google Patents
Info
- Publication number
- JPS6335118B2 JPS6335118B2 JP10915781A JP10915781A JPS6335118B2 JP S6335118 B2 JPS6335118 B2 JP S6335118B2 JP 10915781 A JP10915781 A JP 10915781A JP 10915781 A JP10915781 A JP 10915781A JP S6335118 B2 JPS6335118 B2 JP S6335118B2
- Authority
- JP
- Japan
- Prior art keywords
- board
- component
- attached
- chip
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 10
- 239000004020 conductor Substances 0.000 description 4
- 101100008047 Caenorhabditis elegans cut-3 gene Proteins 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
Landscapes
- Connection Of Plates (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Combinations Of Printed Boards (AREA)
Description
【発明の詳細な説明】
本発明は抵抗、トランジスタ等のチツプ部品を
フレキシブルプリント基板に取付けをする取付方
法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for attaching chip components such as resistors and transistors to a flexible printed circuit board.
一般にプリント基板の小型化を行う場合、部品
点数よりも導体パターンの占める面積が問題とな
りプリント基板の小型化が困難であつた。このた
め従来では、両面基板を用いていたが、回路によ
つては導体パターンの面積を充分に減少させるこ
とができないことがあり、基板の小型化が困難な
場合があつた。 Generally, when miniaturizing a printed circuit board, the area occupied by the conductor pattern becomes more of a problem than the number of components, and it has been difficult to miniaturize the printed circuit board. For this reason, conventionally, double-sided substrates have been used, but depending on the circuit, it may not be possible to sufficiently reduce the area of the conductor pattern, making it difficult to downsize the substrate.
本発明では、上記従来の欠点を除去することを
目的とし、重ねて設けたフレキシブルプリント基
板(以下、基板と略称する。)の間にチツプ部品
を取付けることを特徴とするものである。 The present invention aims to eliminate the above-mentioned conventional drawbacks and is characterized in that chip parts are attached between flexible printed circuit boards (hereinafter abbreviated as "boards") that are stacked one on top of the other.
以下、図面に示した実施例により本発明を説明
する。まず、第1図に示したように基板1の部品
取付位置2の周囲にコ字形をした切込み3を設け
る。そして、前記部品取付位置2に接着剤4を塗
布し、第2図に示したようにチツプ部品5を前記
接着剤4によつて基板1に固定するとともにこの
チツプ部品5の一端を半田付けをし、導体パター
ン6と導通させる。そして、第3図に示したよう
にチツプ部品5を取付けた部分を折曲げる。この
場合、第4図、第5図に示したように一面に基板
1の切込み3の周囲に透孔6,6…がくるように
設けられた真空吸着盤7を設け、この吸着盤7に
基板1をチツプ部品5が下になるように載置す
る。そして、真空吸着を行なうと第6図に示した
ように基板1は吸着盤7に引きよせられチツプ部
品5を取付けた部分が折曲げられる。しかる後、
このチツプ部品5の他端を第7図に示したように
基板1に重ねて設けた基板8の透孔9に挿入し裏
面より半田付けを行い導体パターン10と導通さ
せる。この際、折曲げた基板1の端部はストツパ
ーとなりチツプ部品5が透孔9に挿入されすぎる
ことを防ぐ。また、基板間の距離を小さくするた
めに第8図に示したようにチツプ部品5を横にし
て取付けをしたり、また第9図に示したようにチ
ツプ部品5を基板8に対して斜めに取付けてもよ
い。さらに上記実施例では2枚のフレキシブルプ
リント基板1,8を重ね合わせて設けたが第10
図に示したように1枚の基板10をU字形に折曲
げて設けてもよい。 The present invention will be explained below with reference to embodiments shown in the drawings. First, as shown in FIG. 1, a U-shaped cut 3 is provided around the component mounting position 2 of the board 1. Then, an adhesive 4 is applied to the component mounting position 2, and as shown in FIG. Then, conduction is established with the conductor pattern 6. Then, as shown in FIG. 3, the part to which the chip part 5 is attached is bent. In this case, as shown in FIGS. 4 and 5, a vacuum suction cup 7 is provided on one surface so that through holes 6, 6, etc. are located around the notch 3 of the substrate 1. Place the board 1 with the chip component 5 facing down. Then, when vacuum suction is performed, the substrate 1 is pulled toward the suction cup 7, as shown in FIG. 6, and the portion to which the chip component 5 is attached is bent. After that,
As shown in FIG. 7, the other end of this chip component 5 is inserted into a through hole 9 of a substrate 8 provided overlapping the substrate 1, and soldered from the back side to be electrically connected to the conductive pattern 10. At this time, the bent end of the substrate 1 acts as a stopper to prevent the chip component 5 from being inserted into the through hole 9 too much. Also, in order to reduce the distance between the boards, the chip parts 5 may be mounted horizontally as shown in Figure 8, or the chip parts 5 may be mounted diagonally to the board 8 as shown in Figure 9. It may be installed on. Furthermore, in the above embodiment, the two flexible printed circuit boards 1 and 8 were provided on top of each other, but the 10th
As shown in the figure, one substrate 10 may be bent into a U-shape.
以上述べた通り本発明では、上下に重ねて設け
たフレキシブルプリント基板の一方の基板にコ字
形をした切込みを設け、この部分にコンデンサ等
の電子部品を取付け、この部分を折曲げ他方の基
板に固定することにより導体パターンの面積を大
巾に減少することができ、またジヤンパー線が不
必要になるという利点がある。さらに、この時、
折曲げた基板の端部が他方の基板の透孔に対して
ストツパーの作用をなすようにしているので、チ
ツプ部品が透孔に挿入されすぎるというようなこ
とがなく、他方の基板への取付けがきわめて容易
に行える。 As described above, in the present invention, a U-shaped notch is provided in one of the flexible printed circuit boards that are stacked one on top of the other, electronic components such as capacitors are attached to this part, and this part is bent and attached to the other board. By fixing it, the area of the conductor pattern can be greatly reduced, and there is an advantage that a jumper wire becomes unnecessary. Furthermore, at this time,
Since the bent end of the board acts as a stopper against the through-hole of the other board, there is no possibility that the chip components will be inserted too far into the through-hole, making it easier to attach them to the other board. can be done extremely easily.
第1図は本発明による基板の平面図、第2図は
本発明によりチツプ部品を基板に取付けたときの
平面図、第3図は本発明により基板を折曲げたと
きの側面図、第4図は基板を折曲げる際に使用す
る真空吸着盤の斜視図、第5図は真空吸着盤に載
置したときの断面側面図、第6図は基板を吸着し
たときの断面側面図、第7図はチツプ部品を基板
に取付けしたときの断面側面図、第8図は本発明
の他の実施例の断面側面図、第9図はまた他の実
施例の断面側面図、第10図はさらに他の実施例
の側面図である。
1,8…フレキシブルプリント基板、2…部品
取付位置、3…切込み、5…チツプ部品、6…透
孔、7…真空吸着盤。
FIG. 1 is a plan view of a board according to the present invention, FIG. 2 is a plan view when a chip component is attached to the board according to the present invention, FIG. 3 is a side view when the board is bent according to the present invention, and FIG. The figure is a perspective view of the vacuum suction cup used when bending the substrate, Figure 5 is a cross-sectional side view when placed on the vacuum suction cup, Figure 6 is a cross-sectional side view when the substrate is suctioned, and Figure 7 8 is a sectional side view of another embodiment of the present invention, FIG. 9 is a sectional side view of another embodiment, and FIG. FIG. 7 is a side view of another embodiment. 1, 8... Flexible printed circuit board, 2... Component mounting position, 3... Notch, 5... Chip component, 6... Through hole, 7... Vacuum suction cup.
Claims (1)
周囲にコ字形をした切込みを設け、この部品取付
位置にチツプ部品の一端を取付け、そしてこの基
板の部品を取付けた部分を折曲げ、この基板と一
定間隔をおいて設けた基板の透孔に前記チツプ部
品の他端を挿入し取付けるとともに、前記折曲げ
た基板の端部は前記透孔に対するストツパーとし
てなることを特徴とする部品の取付方法。1. Make a U-shaped notch around the component mounting position of the flexible printed circuit board, attach one end of the chip component to this component mounting position, then bend the part of this board where the component is attached, and cut it at a certain distance from the board. A method for attaching a component, characterized in that the other end of the chip component is inserted and attached to a through hole in a board provided at a distance, and the bent end of the board serves as a stopper for the through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10915781A JPS5810894A (en) | 1981-07-10 | 1981-07-10 | Method of mounting part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10915781A JPS5810894A (en) | 1981-07-10 | 1981-07-10 | Method of mounting part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5810894A JPS5810894A (en) | 1983-01-21 |
| JPS6335118B2 true JPS6335118B2 (en) | 1988-07-13 |
Family
ID=14503079
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10915781A Granted JPS5810894A (en) | 1981-07-10 | 1981-07-10 | Method of mounting part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5810894A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5109644B2 (en) * | 2007-12-20 | 2012-12-26 | カシオ計算機株式会社 | Flexible wiring board mounting structure and liquid crystal display module using it. |
-
1981
- 1981-07-10 JP JP10915781A patent/JPS5810894A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5810894A (en) | 1983-01-21 |
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