JPS6336121B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for packaging electronic components, and in particular to a method for reducing the creeping of resin material onto external lead members when the main parts of a solid electrolytic capacitor are immersed in resin material. This is the purpose.

In general, this type of fixed electrolytic capacitor is made of a capacitor element A made by press-molding metal powder having a valve action such as tantalum, niobium, aluminum, etc. into a cylindrical shape and sintering it, as shown in Fig. 1. Connect the metal wire with valve action to the anode lead B
The first external lead member C is welded to the protruding portion of the anode lead B, and the second external lead member D is soldered to the electrode extraction layer E formed on the circumferential surface of the capacitor element A. , After that, the entire circumferential surface of the capacitor element A is coated with a resin material F.
It is covered with

By the way, the resin material F of the capacitor element A
The coating is carried out by a dipping method, and when the capacitor element A is immersed in a liquid resin material and pulled up, the area between the first and second external lead members C and D on the protruding side of the anode lead B is Since there is a lack of a holding member for the resin material F, the resin material F hangs down and a dent G is formed, which significantly impairs the appearance characteristics. In addition, especially when this recess G is large, the resin material F may sag and cause the resin material to fall into the first and second positions.
It is thinly applied to the external lead members C and D as if climbing up (generally referred to as climbing up).
For this reason, for example, when mounting on a printed board,
There is a drawback that the creeping resin material protrudes to the back side of the printed board, significantly reducing the reliability of soldering.

Therefore, conventionally, in order to prevent the resin material F from creeping up on the first and second external lead members C and D, a liquid water-repellent member H is applied to desired portions of the first and second external lead members C and D.
It is being applied. For example, Figure 2~
As shown in FIG. 3 (see Japanese Utility Model Publication No. 52-23577), prior to immersing the resin material in the exterior, a pair of rollers K ₁ and K ₂ having a water-repellent material H coated on their circumferential surfaces is heated. 1. It is attached to a desired portion by passing the second external lead members C and D. According to this method, the first and second external lead members C, D
Although the creeping up of the resin material F against the resin material F was slightly improved, a fully satisfactory effect was not obtained.
In other words, as _shown in _FIG .
However, since it is not adhered to the non-contact parts, when the resin material F is immersed in the exterior, creeping up is formed in the parts where the water-repellent member H is not applied, and the electrical connection to the printed board is interrupted. The problem is that there is a lack of certainty.

In other words, the first and second external leads of the rollers K ₁ and K 2 are attached so that the water-repellent member H is applied to the entire circumferential surfaces of desired portions of the first and _second external lead members C and D. It would be better to increase the contact pressure on the lead members C and D, but as shown in _FIG .
The water-repellent material H is spread vertically and applied only to the contact area of K ₂ , and its level is uneven, and the creeping up of the resin material F cannot be improved to a level that is sufficiently satisfactory for practical use. It is.

In view of these points, the present invention provides a method for packaging electronic components that allows a water-repellent material to be applied almost uniformly to a desired portion of an external lead member using a simple method, and that effectively prevents the resin material from creeping up. An example of application to a solid electrolytic capacitor will be described below with reference to FIGS. 5 to 9.

First, as shown in Fig. 5, a metal wire having a valve action is implanted in advance as an anode lead 2 into a capacitor element (component body) 1, which is made by press-molding metal powder having a valve action into a cylindrical shape and sintering it. An L-shaped first external lead member 3 is welded to the protruding portion of the anode lead 2, and a straight second external lead member 4 is coated with an oxide layer on the circumferential surface of the capacitor element 1. A capacitor structure is formed by connecting the electrode lead layer 5 formed through the semiconductor layer using a solder member 6. Next, as shown in FIGS. 6 and 7, the first and second external lead members 3 and 4 of the capacitor structure are passed through a water-repellent material coating device 7. Note that this deposition device 7
is composed of a pair of plate-like members 8 and 9, and a gap 10 large enough for an external lead member to pass through is formed in the opposing portion thereof, and a guide opening 11 is formed in one end. ing. Grooves 12 and 1 are provided in the longitudinal direction on the opposing surfaces of the respective plate members 8 and 9.
3 is formed by dividing it into an upper part and a lower part, and the upper groove 12 of one plate-like member 8 has a hole 14 that opens on the upper surface.
is connected to. Then, the liquid water repellent member 15
By dropping a certain amount of
A water-repellent member 15 is supported in the gap 10 through 2. By moving the water-repellent member 15 in the direction of the arrow shown in the figure, a coating of the water-repellent member 15 is applied to desired portions of the first and second external lead members 3 and 4, as shown in FIG. It is formed. Next, the capacitor structure is reversed, and the capacitor element 1 is immersed in the liquid resin material 16 so that the upper end portions of the coatings 15 on the first and second external lead members 3 and 4 are immersed, and then pulled up and cured by heating. By doing so, a solid electrolytic capacitor shown in FIG. 9 is obtained.

In this way, the plate members 8 and 9 in the deposition device 7
A liquid water-repellent member 15 is supported in the gap 10 so that the thickness of the liquid water-repellent member 15 is approximately the same as that of the plate-like members 8 and 9 due to its surface tension. 1. Second external lead members 3, 4
By passing the water-repellent member 15 through the water, the water-repellent member 15 can be applied almost uniformly to the entire circumferential surface of the desired portion. For this reason, when the capacitor element 1 is immersed in the resin material 16, it is possible to prevent the first and second external lead members 3 and 4 from creeping up to desired portions.

In particular, if the width of the coating 15 formed on the first and second external lead members 3 and 4 is approximated to the amount of sagging of the resin material 16, the dent in the top surface portion 16a can be minimized and It is possible to virtually eliminate the formation of upward slopes. Therefore, the reliability of soldering and electrical connection during mounting on a printed board can be significantly improved.

Furthermore, a liquid water-repellent member 15 is supported in the gap 10 between the plate-like members 8 and 9, and by forming two grooves 12 and 13 at least on the upper and lower sides of the opposing surfaces, The ability to supply and support the water-repellent member 15 into the gap 10 can be significantly improved compared to a structure in which no grooves are formed.

Next, specific examples will be described. The thickness of the plate-shaped member is 2.15mm, the gap between the plate-shaped members is 1.0 to 1.5mm,
The groove width is set to 0.2 to 0.3 mm and the groove depth is set to 0.2 to 0.5 mm, and a water-repellent material made of Daikin Corporation's Daifree FS-126 (Teflon solution) is supplied and supported in this gap. . When the first and second external lead members each having a wire diameter of 0.5 mm were passed through this water-repellent member, a coating with a width of 2.3 mm was formed. When this capacitor structure was coated with a resin material by immersion, almost no creeping of the resin material was observed. Further, it was not observed that the water-repellent member flowed down along the external lead member or fell through the gap.

In the above embodiment, the water-repellent material is supplied to the deposition device by dropping a certain amount of the water-repellent material into a hole that is open on the top surface and communicates with the groove of the plate-shaped member. is not limited to this, for example, a fixed amount may be supplied directly or indirectly into the gap using a pipe or the like. Further, in the above embodiment, a guide opening is formed at one end of the pair of plate-like members, but this does not necessarily have to be formed. Further, the width and length of the plate member can be changed as appropriate. Furthermore, resistors other than solid electrolytic capacitors,
It can also be applied to electronic components such as coils and ceramic capacitors.

As described above, according to the present invention, a water-repellent member can be applied almost uniformly to a desired portion of an external lead member using a simple method, and creeping up of the resin material can be effectively prevented.

[Brief explanation of drawings]

Fig. 1 is a side cross-sectional view showing a conventional solid electrolytic capacitor, Fig. 2 is a perspective view for explaining the method of forming a water-repellent member, Fig. 3 is a cross-sectional view of Fig. 2, and Fig. 4 is a cross-sectional view of a conventional solid electrolytic capacitor.
The figures are enlarged views of the main parts of the external lead member, Figures 5 to 9.
The figures are explanatory diagrams of the method of the present invention, in which Fig. 5 is a side sectional view of the capacitor structure, Fig. 6 is a front sectional view showing the state of attachment of the water repellent member to the external lead member, and Fig. 7
The figures are a cross-sectional view taken from the side shown in FIG. 6, FIG. 8 is a side cross-sectional view showing a state in which a coating is formed, and FIG. 9 is a side cross-sectional view showing a state covered with resin. In the figure, 1 is the component body (capacitor element),
3 and 4 are external lead members, 8 and 9 are plate-shaped members, 1
0 is a gap, 15 is a water repellent member, and 16 is a resin material.

Claims (1)

[Claims] 1. Before coating the main part of an electronic component, which includes a component body and a plurality of external lead members led out in the same direction from the component body, with a resin material, create a gap large enough to allow the external lead members to pass through. A liquid water-repellent member is supported between a pair of plate-like members having grooves formed in the longitudinal direction on the opposite surfaces thereof, and the external lead member is passed through the water-repellent member. A method for packaging an electronic component, comprising applying a water-repellent material to a portion of an external lead member corresponding to a surface immersed in a resin material.