JPS6337901B2 - - Google Patents
Info
- Publication number
- JPS6337901B2 JPS6337901B2 JP55164423A JP16442380A JPS6337901B2 JP S6337901 B2 JPS6337901 B2 JP S6337901B2 JP 55164423 A JP55164423 A JP 55164423A JP 16442380 A JP16442380 A JP 16442380A JP S6337901 B2 JPS6337901 B2 JP S6337901B2
- Authority
- JP
- Japan
- Prior art keywords
- acoustic radiation
- signal
- period
- predetermined value
- cracks
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/14—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object using acoustic emission techniques
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/26—Scanned objects
- G01N2291/269—Various geometry objects
- G01N2291/2696—Wheels, Gears, Bearings
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、シヤフト等の被加工材の歪取り装置
に用いる割れ検出装置に関するもので、特に歪取
り作業時に被加工材より発生する音響放射（以下
AEと略記する）波を検出して、歪取りを行う際
に被加工材に生じる微細な割れを即時にしかも精
度良く検出できる信頼性の高い割れ検出装置に関
するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a crack detection device used in a device for removing strain from a workpiece such as a shaft, and in particular detects acoustic radiation generated from the workpiece during strain relief work. (below
The present invention relates to a highly reliable crack detection device that detects waves (abbreviated as AE) and can instantly and accurately detect minute cracks that occur in a workpiece during strain relief.
自動車構成部品等におけるシヤフト類の被加工
材の中には、その表面部を高周波浸炭焼入れ等の
熱処理を施しているものがある。この熱処理後の
被加工材には、焼入れによる熱歪が加わり若干の
曲がりが発生する。特にシヤフトのような回転体
においては、この曲がりは回転ムラ、組付精度不
良等の悪影響を及ぼすため、曲がりを矯正する必
要があり、そのために歪取り工程が設けられてい
る。
BACKGROUND OF THE INVENTION Some workpieces, such as shafts used in automobile components, have their surfaces subjected to heat treatment such as induction carburizing and quenching. After this heat treatment, the workpiece is subjected to thermal strain due to quenching, causing some bending. Particularly in a rotating body such as a shaft, this bending has adverse effects such as rotational unevenness and poor assembly accuracy, so it is necessary to correct the bending, and for this purpose, a strain relief process is provided.
歪取り作業を行う際には、被加工材の曲がり変
位量、加圧荷重、付加変位量によつて被加工材に
割れが発生する可能性がある。このため、従来歪
取り後の被加工材については、磁粉探傷等により
割れの発生の有無を調査しているが、磁粉探傷で
は、検査に時間がかかり、また磁粉濃度によつて
検出力が左右される等の問題点があつた。さらに
AE波を利用して割れを検出する技術は、各種材
料試験、例えば降伏点を検出する引張り試験、曲
げ試験、疲労試験等に用いられているが、材料加
工中に発生する割れを生産ラインで自動的に検査
する方法はまだ実用化されていない。これは、加
工工程中には、被加工材に生じる割れに基づく
AE波の他に、他の機械からの振動に基づく雑音
が発生するため、加工工程中のAE波を検出して
も正しい割れ検出ができないと考えられる。ま
た、AE波を検出するための計測系が正常に動作
しているか否かを容易かつ確実にチエツクするこ
とができないため、割れが発生しているにも拘わ
らず計測系が故障して割れの発生を見過ごす事態
が発生すること等が原因と考えられる。
When performing strain relief work, cracks may occur in the workpiece due to the amount of bending displacement, pressurizing load, and additional displacement of the workpiece. For this reason, conventionally, the workpiece after strain removal is investigated for the occurrence of cracks using magnetic particle testing, etc. However, with magnetic particle testing, the inspection takes time and the detection power varies depending on the magnetic particle concentration. There were some problems, such as: moreover
The technology to detect cracks using AE waves is used in various material tests, such as tensile tests to detect yield points, bending tests, fatigue tests, etc. An automatic inspection method has not yet been put to practical use. This is based on the cracks that occur in the workpiece during the machining process.
In addition to AE waves, noise is generated due to vibrations from other machines, so even if AE waves are detected during the machining process, accurate crack detection may not be possible. In addition, because it is not possible to easily and reliably check whether the measurement system for detecting AE waves is operating normally, the measurement system may malfunction even though cracks have occurred. This is thought to be due to the occurrence of situations that are overlooked.
したがつて、本発明の目的は、上述の諸問題に
鑑み、被加工材より発生するAE波を高Ｓ／Ｎ比
で検出して、歪取り加工中に比加工材の割れを精
度良く且つ確実に検出することにある。 Therefore, in view of the above-mentioned problems, an object of the present invention is to detect the AE waves generated from the workpiece with a high S/N ratio, and to detect cracks in the workpiece with high precision during strain relief processing. The goal is to detect it reliably.
かかる目的を達成するため本発明は、歪取り加
工機の加圧棒又は支持台内に埋設したAE波検出
用センサの所定期間内の出力信号に基づき、割れ
の発生および検出装置自身の異常の有無を検出す
ることを特徴としている。
In order to achieve this object, the present invention detects the occurrence of cracks and abnormalities in the detection device itself based on the output signal within a predetermined period of the AE wave detection sensor embedded in the pressure rod or support of the strain relief processing machine. It is characterized by detecting presence or absence.
具体的には、歪取り加工機の加圧棒支持台内に
埋設されたAE波検出用センサで歪取り加工中に
被加工材に生じるAE波を検出し、前記AE波検出
センサからの出力信号のうち、歪取り加工中被加
工材に割れによるAE波が発生する可能性のある
第１の期間内に発生するAE波信号が予め定めた
第１の所定値より大なる時に割れ発生と判別し、
前記AE波検出センサからの出力信号のうち、歪
取り加工中被加工材に割れ以外によるAE波が発
生する第２の期間内に発生するAE波信号が前記
第１の所定値より小なる予め定めた第２の所定値
より小なる時に検出装置自身が異常であると判別
することを特徴とする。 Specifically, an AE wave detection sensor embedded in the pressure rod support of the strain relief processing machine detects the AE waves generated in the workpiece during strain relief processing, and the output from the AE wave detection sensor is detected. Among the signals, cracking occurs when the AE wave signal generated within the first period in which AE waves due to cracks may occur in the workpiece during strain relief processing exceeds a first predetermined value. determine,
Among the output signals from the AE wave detection sensor, an AE wave signal generated within a second period in which AE waves are generated due to other than cracks in the workpiece during strain relief processing is smaller than the first predetermined value. It is characterized in that the detection device itself determines that there is an abnormality when the value is smaller than a second predetermined value.
かかる本発明によれば、磁粉探傷のごとく、磁
化、磁粉散布等被加工材を直接検査する手段の必
要がなく、極めて安価な設備費で、充分な精度か
つリアルタイムに、また、検出装置自身の故障に
よる割れの発生の見過ごしを生じることなく割れ
発生を確実に検出でき、検査工程をもふくめた歪
取り工程の自動化、磁粉探傷工程の省略及び歪取
り時間の大幅な短縮化を可能にするに至つたもの
である。
According to the present invention, there is no need for direct inspection of the workpiece, such as magnetization and magnetic particle dispersion, as in magnetic particle flaw detection. It is possible to reliably detect the occurrence of cracks without overlooking the occurrence of cracks due to failures, and it is possible to automate the strain relief process including the inspection process, omit the magnetic particle inspection process, and significantly shorten the strain relief time. It has been reached.
以下、図面により本発明の実施例について説明
する。第１Ａ図は、本発明の実施例における機械
的構成部分、すなわち加工機及びその周辺をあら
わす図である。同図において、符号１は歪みを除
去するために加圧される被加工材（以下、ワーク
と称する）であり、符号２は加圧棒、符号３は加
圧棒２に連絡するピストン、符号３は前記ピスト
ン３を使つて加圧棒２を上昇・下降させる油圧シ
リンダをそれぞれ示している。前記加圧棒２内に
は、音響放出波用センサであるAE波検出用のセ
ンサ５が埋め込まれており、さらにアーム６が固
着されている。前記アーム６の所定位置には、突
起部７が設けられている。この突起部７は、加圧
棒２が上下動した際に第１期間設定回路および第
２期間設定回路を構成するリミツトスイツチ９の
レバーに押しあてることができるよう配設され
る。すなわち、前記加圧棒２が上方の所定位置か
ら下降を開始し、ワーク１と当接すると、リミツ
トスイツチ９がオフされるようにされている。
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1A is a diagram showing mechanical components, ie, a processing machine and its surroundings, in an embodiment of the present invention. In the same figure, numeral 1 is a workpiece that is pressurized to remove distortion (hereinafter referred to as a workpiece), numeral 2 is a pressure rod, and numeral 3 is a piston connected to the pressure rod 2, numeral 3 is a workpiece that is pressurized to remove strain. Reference numeral 3 indicates a hydraulic cylinder that uses the piston 3 to raise and lower the pressure rod 2, respectively. A sensor 5 for detecting AE waves, which is an acoustic emission wave sensor, is embedded in the pressure rod 2, and an arm 6 is further fixed thereto. A protrusion 7 is provided at a predetermined position on the arm 6. This protrusion 7 is arranged so that it can be pressed against a lever of a limit switch 9 constituting a first period setting circuit and a second period setting circuit when the pressure rod 2 moves up and down. That is, when the pressure rod 2 starts descending from a predetermined position above and comes into contact with the workpiece 1, the limit switch 9 is turned off.
第１Ｂ図は、本実施例における歪取り加工時に
センサ５によつて検出されるAE波形の一例であ
り、同図のａは、割れが発生しなかつた場合であ
り、ｂ ワーク１が加圧される際に発生する割れ
１１ａ，１１ｂによる割れAE波をそれぞれ示し
ている。第２図は、本発明における電気的構成部
分、すなわち割れ検出回路の一実施例を現わす回
路図であり、第３図は、第２図の回路の各部の波
形である。第２図において、符号９は第１Ａ図で
説明したリミツトスイツチであり、符号５は同じ
くセンサである。前記リミツトスイツチ９の一端
は、電源電圧を所定の電圧に分圧して供給する分
圧抵抗１２（前記リミツトスイツチ９と一緒に第
１期間設定回路および第２期間設定回路を構成す
る）に接続されている。前述のごとく、リミツト
スイツチ９は加圧棒２の端面がワーク１の加圧が
終了してその当接位置まで加圧棒２が戻るまでの
間オンとなるから、その他端には、第３図Ａに示
すごとき信号ｅが現われる。ここで、信号ｅのう
ち所定の電圧が発生する期間を信号ｅの論理
“１”の期間とすれば、この期間は第１Ｂ図に示
す割れAE波の発生する可能性のある第１の期間
Ｔ（期間）に対応している。なお、本実施例で
は、Ｔの期間の信号をリミツトスイツチ９により
得ているが、リミツトスイツチ９以外に、信号ｅ
の論理“１”を発生できるタツチセンサあるいは
圧力スイツチを用いても良い。また、この実施例
では、被加工材の割れによるAE波が発生する可
能性のある期間と、割れ以外のAE波が発生す
る第２の期間である期間とを、ともに同一の期
間Ｔに設定しているが、勿論、期間ととは
別々の期間に区別しても良い。第２図において符
号１７，１８はプリセツタブルダウンカウンタを
示している。このダウンカウンタ１７，１８の初
期値は、初期値設定回路１５，１６から与えられ
る。トリガ信号ｆは、第３Ｂ図に示すごとく信号
ｅの立上りエツジでトリガ信号形成回路１３によ
つて形成される。そして、ダウンカウンタ１７，
１８のリセツトはトリガ信号ｆによつてなされ
る。さらに、ダウンカウンタ１７，１８は、ナン
ド回路２９，３０を介して送りこまれるリミツタ
回路２７，２８の出力をクロツクパルスとして計
数とする。初期設定された値を計数し終るとダウ
ンカウンタ１７，１８は、ナンド回路１９，２０
を介してフリツプフロツプ２１，２２のセツト入
力に信号を送りこむ。フリツプフロツプ２１，２
２の出力は、表示機構２３，２４に送りこまれ、
これらをそれぞれ作動することができるよう構成
される。 Fig. 1B is an example of an AE waveform detected by the sensor 5 during strain relief processing in this embodiment. The crack AE waves due to cracks 11a and 11b that occur when the wires are removed are respectively shown. FIG. 2 is a circuit diagram showing an embodiment of the electrical components of the present invention, that is, a crack detection circuit, and FIG. 3 shows waveforms of various parts of the circuit of FIG. In FIG. 2, the reference numeral 9 is the limit switch explained in FIG. 1A, and the reference numeral 5 is the same sensor. One end of the limit switch 9 is connected to a voltage dividing resistor 12 (which together with the limit switch 9 constitutes a first period setting circuit and a second period setting circuit) supplies the power supply voltage by dividing it into a predetermined voltage. . As mentioned above, the limit switch 9 is turned on until the end surface of the pressure rod 2 returns to the contact position after the end of pressing the workpiece 1, so the limit switch 9 is turned on until the end surface of the pressure rod 2 returns to the contact position. A signal e as shown in A appears. Here, if the period in which a predetermined voltage is generated in signal e is defined as the period of logic "1" in signal e, this period is the first period in which cracking AE waves may occur as shown in Figure 1B. It corresponds to T (period). In this embodiment, the signal for the period T is obtained by the limit switch 9, but in addition to the limit switch 9, the signal e
A touch sensor or pressure switch capable of generating a logic "1" may also be used. In addition, in this example, the period in which AE waves may occur due to cracks in the workpiece material and the second period in which AE waves other than cracks occur are both set to the same period T. However, it is of course possible to distinguish between periods and periods. In FIG. 2, numerals 17 and 18 indicate presettable down counters. The initial values of the down counters 17 and 18 are given from initial value setting circuits 15 and 16. The trigger signal f is generated by the trigger signal forming circuit 13 at the rising edge of the signal e, as shown in FIG. 3B. And down counter 17,
18 is reset by the trigger signal f. Further, the down counters 17 and 18 count the outputs of the limiter circuits 27 and 28, which are sent through the NAND circuits 29 and 30, as clock pulses. After counting the initially set value, the down counters 17 and 18 start the NAND circuits 19 and 20.
A signal is sent to the set inputs of flip-flops 21 and 22 via the input terminal. flipflop 21,2
The output of 2 is sent to display mechanisms 23 and 24,
It is configured to be able to operate each of these.
次に、本実施例の動作及び作用について説明す
る。前述のごとく、歪取り加工の１サイクルが実
施されると、センサ５からは第１Ｂ図に示すごと
くAE波が検出される。第３Ｃ図は、説明を容易
にするためこの波形を簡略化してあらわしたもの
である。センサ５によつて検出され、増幅回路２
５、フイルタ２６で適宜のレベルに調整された検
出信号ｈは、割れ判別回路を構成するリミツタ回
路２７、および異常判別回路を構成するリミツタ
回路２８において第１および第２の所定値である
基準レベルi1及びi2〔第３図Ｃ参照〕を閾値として
波形整形されパルス信号となる。このパルス信号
は、信号ｅが論理“１”のときナンド回路２９，
３０（それぞれ、リミツタ回路２７，２８と一緒
になつて割れ判別回路および異常判別回路を構成
する）が開成するから、第３図Ｄ，Ｅで示すよう
にパルス信号J1，J2となつてダウンカウンタ１
７，１８にクロツクパルスとして送りこまれるこ
とになる。 Next, the operation and effect of this embodiment will be explained. As described above, when one cycle of strain relief processing is performed, an AE wave is detected from the sensor 5 as shown in FIG. 1B. FIG. 3C shows this waveform in a simplified manner for ease of explanation. is detected by the sensor 5 and the amplifier circuit 2
5. The detection signal h adjusted to an appropriate level by the filter 26 is set to a reference level, which is a first and second predetermined value, in a limiter circuit 27 that constitutes a crack discrimination circuit and a limiter circuit 28 that constitutes an abnormality discrimination circuit. The waveform is shaped using i 1 and i 2 (see FIG. 3C) as threshold values to become a pulse signal. This pulse signal is transmitted to the NAND circuit 29 when the signal e is logic "1".
30 (which together with the limiter circuits 27 and 28 form a crack detection circuit and an abnormality detection circuit, respectively) are opened, so that the pulse signals J 1 and J 2 are generated as shown in FIG. 3D and E. down counter 1
7 and 18 as clock pulses.
次に、本実施例の動作について説明する。 Next, the operation of this embodiment will be explained.
まず、割れが発生しない場合の動作について説
明する。この場合の検出信号ｈは、第３図Ｃに示
すようになる。リミツタ回路２７及び２８に入力
されている基準レベルi1，i2は、i1≪i2なる関係に
設定されており、割れが発生しない場合の検出信
号ｈの振幅は、i1の基準レベルをこえるが基準レ
ベルi2には到達しないため、検出信号ｈは基準レ
ベルi1が入力されているリミツタ回路２７でのみ
パルス信号に波形整形される。パルス信号は、信
号ｅが論理“１”のときナンド回路２９が開成さ
れているから、パルス信号j1としてダウンカウン
タ１７へ入力される。このダウンカウンタ１７
は、信号ｅの立上り時点でリセツトされ、割れが
発生しない場合のAE波の量よりも充分小さな値
に設定される。 First, the operation when no cracks occur will be explained. The detection signal h in this case becomes as shown in FIG. 3C. The reference levels i 1 and i 2 input to the limiter circuits 27 and 28 are set in the relationship i 1 << i 2 , and the amplitude of the detection signal h when no cracking occurs is the reference level of i 1 However, since the detection signal h does not reach the reference level i2 , the detection signal h is waveform-shaped into a pulse signal only in the limiter circuit 27 to which the reference level i1 is input. Since the NAND circuit 29 is open when the signal e is logic "1", the pulse signal is input to the down counter 17 as the pulse signal j1. This down counter 17
is reset at the rising edge of the signal e, and is set to a value sufficiently smaller than the amount of AE waves when no cracking occurs.
次に、割れが発生した場合の動作について説明
する。割れ発生時の検出信号h′の振幅は、割れが
発生しない場合に比べ充分高く、j2の基準レベル
をこえる程度〔第３図C′〕になり、割れ発生時に
は、両方のリミツタ回路２７，２８でパルス信号
に波形整形される。パルス信号は、信号ｅが論理
“１”のときナンド回路２９，３０が開成状態に
なつているため、パルス信号j1としてダウンカウ
ンタ１７へ、またパルス信号j2としてダウンカウ
ンタ１８へそれぞれ入力される。このカウンタ１
７，１８は、信号ｅの立上り時点で割れが発生し
ない場合の初期値及び割れ発生時の初期値にプリ
セツトされている。従つて割れ発生時には両方の
カウンタに計数されるパルス信号j1，j2が上記初
期値をこえ、フリツプフロツプ２１，２２がナン
ド回路１９，２０を介してセツトされ、表示機構
２３，２４を作動し、その状態を維持する。初期
値設定回路１６による初期値は、割れが発生した
際に生じるAE波の量よりも小さく設定される。
従つて、オペレータは、表示機構２３が作動さ
れ、なおかつ表示機構２４が作動された場合に
は、被加工材に割れが発生したと判断し、表示機
構２３が作動され、かつ表示機構２４が作動され
なかつた場合は、被加工材に割れが発生しなかつ
たと判断する。また、表示機構２３が全く作動さ
れなかつた場合は、割れ検出装置に故障が生じた
と判断する。なお、フリツプフロツプ２１又は２
２若しくはその両方の出力を表示機構以外に供給
して、例えば加工機の運転を停止する等の動作を
行わせることもできる。 Next, the operation when a crack occurs will be explained. The amplitude of the detection signal h' when a crack occurs is sufficiently higher than when no crack occurs, exceeding the reference level of j2 [Fig. 3 C'], and when a crack occurs, both limiter circuits 27, At step 28, the waveform is shaped into a pulse signal. Since the NAND circuits 29 and 30 are open when the signal e is logic "1", the pulse signal is input to the down counter 17 as the pulse signal j 1 and to the down counter 18 as the pulse signal j 2 . Ru. This counter 1
7 and 18 are preset to initial values when no cracking occurs at the rising edge of the signal e and initial values when cracking occurs. Therefore, when a crack occurs, the pulse signals j 1 and j 2 counted by both counters exceed the above-mentioned initial values, and the flip-flops 21 and 22 are set via the NAND circuits 19 and 20, and the display mechanisms 23 and 24 are activated. , maintain that state. The initial value set by the initial value setting circuit 16 is set to be smaller than the amount of AE waves generated when a crack occurs.
Therefore, if the display mechanism 23 is activated and the display mechanism 24 is activated, the operator determines that a crack has occurred in the workpiece, and the display mechanism 23 is activated and the display mechanism 24 is activated. If not, it is determined that no cracks have occurred in the workpiece. Furthermore, if the display mechanism 23 is not activated at all, it is determined that a failure has occurred in the crack detection device. In addition, flip-flop 21 or 2
It is also possible to supply two or both of the outputs to a device other than the display mechanism to perform an operation such as stopping the operation of the processing machine.
次に、センサ５の取付構造について説明する。
第４図は、センサ５の取付部分の拡大図である。
AE波を安定的に受信するためには、センサ５を
一定支持圧で保持し、またセンサ受信面へのゴミ
等の付着を除去することが重要なポイントであ
る。第４図Ａでは、加圧棒２の一部に穴をあけ、
この中にセンサ５を挿入し、Ｏリング３５によつ
てセンサ５受信面３８へのゴミ等の進入を防ぎ、
さらにセンサ保持具３７を介して取り付けられて
いるスプリング３６によつて、常に一定支持圧で
セツトできるようにし、AE波を長期にわたり安
定に検出することを可能にした。また、第４図Ｂ
は、ワークチヤツク部３９及び固定具４０へセン
サ５を組付けた実施例を示したものである。 Next, the mounting structure of the sensor 5 will be explained.
FIG. 4 is an enlarged view of the mounting portion of the sensor 5.
In order to receive AE waves stably, it is important to maintain the sensor 5 at a constant support pressure and to remove dust and the like from the sensor receiving surface. In FIG. 4A, a hole is made in a part of the pressure rod 2,
The sensor 5 is inserted into this, and the O-ring 35 prevents dust from entering the sensor 5 receiving surface 38.
Furthermore, the spring 36 attached via the sensor holder 37 makes it possible to always set a constant support pressure, making it possible to stably detect AE waves over a long period of time. Also, Figure 4B
1 shows an embodiment in which a sensor 5 is assembled to a workpiece chuck portion 39 and a fixture 40. FIG.
本実施例の場合、センサ５からのAE波信号を
リミツタ回路２７，２８でそれぞれ基準値i1、i2
との大小比較の形でパルス信号に波形整形したあ
と、さらにダウンカウンタ１７，１８でカウント
して、このカウント値に基づき、割れの発生およ
び検出装置の異常を判別するようにしているの
で、前記センサ５からのAE波信号に単発的に電
気ノイズが重畳しても、この単発的なノイズは、
前記ダウンカウンタ１７，１８のカウント値に基
づく判断過程で無視され、耐ノイズ性がさらに向
上する。 In the case of this embodiment, the AE wave signal from the sensor 5 is converted to reference values i 1 and i 2 by limiter circuits 27 and 28, respectively.
After shaping the waveform into a pulse signal by comparing the magnitude with Even if electrical noise is superimposed on the AE wave signal from sensor 5, this isolated noise will
It is ignored in the judgment process based on the count values of the down counters 17 and 18, further improving noise resistance.
以上説明したように、本発明によれば、加工工
程中で割れの発生すると思われる期間のみにその
割れ検出動作を行つているため、割れの発生を確
実に精度良く検出することができる。さらに、本
発明によれば、歪取り加工機の加圧棒又は支持台
内にセンサを埋め込んでAE波を安定に受信する
とともに、このAE波に基づき１回の加工工程中
に割れ検出装置自体の作動の正常・異常が必ずチ
エツクされるため、割れ検出装置自体の故障によ
つて割れの発生を見過ごすことを未然に防止で
き、割れ検出によつて得られた結果の信頼性が非
常に高い。また、特別のチエツク回路を設けるこ
となく上記チエツクが行なえるため、回路構成が
簡単となるなど多大の効果を奏する。
As explained above, according to the present invention, since the crack detection operation is performed only during the period during which cracks are expected to occur during the processing process, the occurrence of cracks can be reliably detected with high accuracy. Further, according to the present invention, a sensor is embedded in the pressure rod or support of the strain relief processing machine to stably receive AE waves, and based on the AE waves, the crack detection device itself can be detected during one processing process. Since it is always checked whether the operation is normal or abnormal, it is possible to prevent the occurrence of cracks from being overlooked due to a failure of the crack detection device itself, and the reliability of the results obtained by crack detection is extremely high. . Further, since the above-mentioned check can be performed without providing a special check circuit, there are many advantages such as a simple circuit configuration.
第１Ａ図は、本発明の実施例における機械的構
成部分で、加工機及びその周辺をあらわす正面
図、第第１Ｂ図は、歪取り加工時にセンサによつ
て検出されるAE波形図、第２図は本発明の実施
例の電気的構成部分を示す回路図、第３図は第２
図の回路の各部動作波形図、第４Ａ図、第４Ｂ図
はセンサ取付部の概要を示す部分断面正面図であ
る。
１……ワーク（被加工材）、２……加圧棒、３
……ピストン、４……油圧シリンダ、５……セン
サ（音響放射波センサ）、６……アーム、７……
突起部、９……リミツトスイツチ（第１および第
２期間設定回路）、１１ａ，ｂ……割れ、１２…
…分圧抵抗（第１および第２期間設定回路）、１
３……トリガ信号形成回路、１５，１６……初期
値設定回路、１７，１８……プリセツタブルダウ
ンカウンタ、１９，２０……ナンド回路、２１，
２２……フリツプフロツプ回路、２３，２４……
表示機構、２２……アンプ、２６……フイルタ、
２７……リミツタ回路（割れ判別回路）、２８…
…リミツタ回路（異常判別回路）、２９……ナン
ド回路（割れ判別回路）、３０……ナンド回路
（異常判別回路）、３５……Ｏリング、３６……ス
プリング、３７……センサ保持具、３７……セン
サ受信面、３９……ワークチヤツク部、４０……
ワーク固定具。
FIG. 1A is a front view showing the mechanical components in an embodiment of the present invention, showing the processing machine and its surroundings. FIG. 1B is an AE waveform diagram detected by a sensor during strain relief processing, and FIG. The figure is a circuit diagram showing the electrical components of the embodiment of the present invention, and FIG.
4A and 4B are partial sectional front views showing an outline of the sensor mounting portion. 1... Work (workpiece material), 2... Pressure rod, 3
...Piston, 4...Hydraulic cylinder, 5...Sensor (acoustic radiation sensor), 6...Arm, 7...
Projection, 9...Limit switch (first and second period setting circuit), 11a, b...Crack, 12...
...Voltage dividing resistor (first and second period setting circuit), 1
3... Trigger signal forming circuit, 15, 16... Initial value setting circuit, 17, 18... Presettable down counter, 19, 20... NAND circuit, 21,
22...Flip-flop circuit, 23, 24...
Display mechanism, 22...Amplifier, 26...Filter,
27...Limiter circuit (crack detection circuit), 28...
... Limiter circuit (abnormality determination circuit), 29 ... NAND circuit (crack determination circuit), 30 ... NAND circuit (abnormality determination circuit), 35 ... O-ring, 36 ... Spring, 37 ... Sensor holder, 37 ...Sensor receiving surface, 39...Work chuck section, 40...
Work fixture.
Claims (1)
れた音響放射波検出用センサと、歪取り作業中被
加工材に割れによる音響放射波が発生する可能性
のある第１の期間の間信号を出力する第１期間設
定回路と、歪み取り作業中被加工材に割れ以外に
よる音響放射波が発生する第２の期間の間信号を
出力する第２期間設定回路と、前記第１期間設定
回路の出力信号に基づき前記音響放射波検出用セ
ンサの出力信号を予め定めた第１の所定値と比較
して音響放射波検出用センサの出力信号が前記第
１の所定値より大なる時に割れ発生信号を出力す
る割れ判別回路と、前記第２期間設定回路の出力
信号に基づき前記音響放射波検出用センサの出力
信号を前記第１の所定値より小なる予め定めた第
２の所定値と比較して音響放射波検出用センサの
出力信号が前記第２の所定値より小なる時に異常
信号を出力する異常判別回路とからなることを特
徴とする歪取り割れ検出装置。 ２ 歪取り作業中、被加工材に割れによる音響放
射波が発生する可能性のある第１の期間と、割れ
以外の音響放射波が発生する第２の期間を設定
し、歪取り加工機の加圧棒支持台内に埋設された
音響放射波検出用センサからの出力信号のうち、
前記第１の期間内に発生する音響放射波信号を、
予め定めた第１の所定値と比較して前記音響放射
波信号が前記第１の所定値より大なるときに割れ
の発生を判別し、前記第２の期間内に発生する音
響放射波信号を、前記第１の所定値より小なる予
め定めた第２の所定値と比較して前記音響放射波
信号が前記第２の所定値より小なるときに検出装
置自身に異常が発生したことを判別することを特
徴とする歪取り割れ検出方法。[Claims] 1. A sensor for detecting acoustic radiation waves embedded in a pressure rod or support of a strain relief processing machine, and a sensor for detecting acoustic radiation waves that may be generated due to cracks in a workpiece during strain relief processing. A first period setting circuit that outputs a signal during a certain first period, and a second period setting circuit that outputs a signal during a second period during which acoustic radiation waves are generated due to something other than cracks in the workpiece during strain removal work. The output signal of the acoustic radiation wave detection sensor is compared with a predetermined first predetermined value based on the output signal of the first period setting circuit, so that the output signal of the acoustic radiation wave detection sensor is equal to the first value. a crack determination circuit that outputs a crack occurrence signal when the signal is larger than a predetermined value; and a predetermined output signal of the acoustic radiation wave detection sensor that is smaller than the first predetermined value based on the output signal of the second period setting circuit. and an abnormality determination circuit that outputs an abnormal signal when the output signal of the acoustic radiation wave detection sensor is smaller than the second predetermined value. Device. 2. During strain removal work, set a first period in which acoustic radiation waves may occur due to cracks in the workpiece material and a second period in which acoustic radiation waves other than cracks may occur, and Of the output signals from the acoustic radiation wave detection sensor embedded in the pressure rod support,
The acoustic radiation wave signal generated within the first period,
Comparing the acoustic radiation wave signal with a predetermined first predetermined value, it is determined that a crack has occurred when the acoustic radiation wave signal is larger than the first predetermined value, and the acoustic radiation wave signal generated within the second period is determined. , determining that an abnormality has occurred in the detection device itself when the acoustic radiation wave signal is smaller than the second predetermined value by comparing it with a predetermined second predetermined value that is smaller than the first predetermined value; A strain relief crack detection method characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16442380A JPS5788362A (en) | 1980-11-20 | 1980-11-20 | Device and method for detection of stress relief cracking |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16442380A JPS5788362A (en) | 1980-11-20 | 1980-11-20 | Device and method for detection of stress relief cracking |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5788362A JPS5788362A (en) | 1982-06-02 |
| JPS6337901B2 true JPS6337901B2 (en) | 1988-07-27 |
Family
ID=15792860
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16442380A Granted JPS5788362A (en) | 1980-11-20 | 1980-11-20 | Device and method for detection of stress relief cracking |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5788362A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61108965U (en) * | 1984-12-19 | 1986-07-10 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54134689A (en) * | 1978-04-12 | 1979-10-19 | Hitachi Ltd | Abnormality detecting method at press fitting in press fitting machine |
-
1980
- 1980-11-20 JP JP16442380A patent/JPS5788362A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5788362A (en) | 1982-06-02 |
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