JPS6338876B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for attaching an electronic component having a plurality of lead wires to a printed circuit board.

Electronic components with lead wires attached to printed circuit boards,
For example, electronic components such as ceramic capacitors and filters are equipped with an insulating exterior, as shown in Figure 1.
The lead wires 3, 3 are pulled out in parallel from the element body 1, which has been provided with
It is common to have As shown in the second figure, in order to attach this electronic component to the printed circuit board 5, the lead wires 3, 3 are inserted into the through holes 6, 6 and soldered to the wiring conductors 7, 7. It is. By the way, since the electronic component is positioned by locking the crimp parts 4, 4 onto the printed circuit board 5, the length of the lead wire becomes substantially long, and the residual inductance increases. , and the variable frequency was to be limited. This has been a big problem, especially when used for high frequencies. If so, the lead wires 3 and 3 can be made as short as possible, but there is a limit to reducing the height of the electronic component above the printed circuit board 5 due to processability, so another capacitor must be used. They were used together to design circuits.

Therefore, the main purpose of the present invention is to provide a mounting method for electronic components that can reduce the residual inductance and adjust the residual inductance even if the height of the electronic component on the printed circuit board is a predetermined height. It is to do so.

To summarize this invention, an electronic component from which a plurality of lead wires are led out and whose lead-out portions are insulated is fixed onto a printed circuit board with the lead wires, and then the lead wires are twisted at the bases of the lead-out portions. It was designed to match.

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 3 shows an example of the shape of the electronic component 11 used in the present invention, and two lead wires 13, 13 are led out in the same direction from the electronic component 11, which is entirely covered with an insulating sheath 12. This lead wire 13, 13
At least the drawer portion is insulated with insulation coatings 13a, 13a.
Specifically, formal insulated wires or wires coated with insulating resin are used.

Next, such an electronic component 11 is fixed onto a printed circuit board 14 as shown in the fourth figure. This fixation onto the printed circuit board 14 is achieved by inserting the lead wires 13, 13 into the through holes 15, 15 provided in the circuit board 14.
Connect the tips of the lead wires 13, 13 to the circuit conductors 16, 1
This is done by soldering to 6. In this case, if the tip portions of the lead wires 13, 13 are coated with an insulating coating, it is necessary to peel it off during soldering.

Finally, the electronic component 11 fixed to the printed circuit board 14 is rotated one or more times so as to twist the lead wire portions located between the electronic component 11 and the printed circuit board 14 as shown in FIG. In this case, the lead wires 13, 13 have insulation coatings 13a,
13a, there will be no short circuit due to twisting. In this way, the installation of electronic components is completed.

As a result, the inductances generated by the currents flowing in opposite directions in both lead wires 13, 13 are canceled out by each other in the twisted portion, making it possible to reduce the residual inductance by about half compared to the conventional one. Furthermore, by adjusting the number of twists, the residual inductance can be adjusted to a desired value.

Note that the above description and drawings embody the present invention, and are not limited thereto in any way. In particular, in the drawings, the lead wire of the electronic component fixed to the printed circuit board is shown as having a crimp formed thereon, but it may be straight. Further, the shape of the electronic parts and the method of fixing them are also arbitrary. Furthermore, when the number of lead wires led out from the electronic component is two, the insulating coating of the lead wires only needs to be applied to one of them, and the number of lead wires is not limited to two.

As described above, in this invention, the lead wires are twisted together after being fixed to the printed circuit board so that the residual inductance can be minimized or adjusted, and the usable frequency can be widened with simple operation. It is a highly advanced invention. Experiments have confirmed that by reducing the residual inductance by half, the usable frequency can be increased by 40%.

[Brief explanation of drawings]

Figure 1 is a front view showing the shape of a conventional electronic component;
2 is a diagram showing the electronic component installed on the same printed circuit board, 3 is a front view of the electronic component used in this invention, 4 is a diagram showing the electronic component fixed on the same printed circuit board, and 5 is a completed installation. It is a diagram. 11...Electronic component, 12...Insulating exterior, 13...
...Lead wire, 13a, 13a...Insulation coating, 14
……Printed board.

Claims (1)

[Claims] 1. After inserting and fixing the electronic component into which a plurality of lead wires are led out, the electronic component is entirely coated with insulation and at least the lead-out portion is covered with insulation, and the lead wires are inserted into the through holes of the printed circuit board and then A method for attaching an electronic component, comprising twisting lead wires at the base of a drawn-out portion to reduce or adjust residual inductance of the electronic component.