JPS6338880B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION In order to supply the semiconductor components loaded on the stake to a semiconductor component supply section such as a bonding device, a handler device, a characteristic inspection device, etc., the present invention is directed to a guide rail extending from the stake to the supply section. This relates to a stick holding mechanism that is arranged in series.

The semiconductor parts supplied to the bonding equipment are
There are two main types: the frame type and the gate-shaped cross-sectional type, but in the latter, the semiconductor components are made individually, one chip at a time, from the beginning.
Moreover, because of its shape, it must be loaded onto a stake before being supplied. A supply section of a bonding apparatus that supplies semiconductor components having such a gate-shaped cross-sectional shape is provided with an inclined fixed chute for sliding the semiconductor components across, and a tilted fixed chute as shown in FIG. Semiconductor components 2 are supplied using a stake 1 of the same type. That is, a large number of semiconductor components 2 are arranged and housed in a stake 1 having an opening 1a at at least one end so that they can be slid and delivered. Then, close the opening 1a with your fingers, and with the stake 1 in a horizontal position, release your fingers while aligning the opening 1a with the end of the tilted fixed chute. Tilt the stake 1 to match the tilt angle of the fixed chute. As a result, semiconductor component 2 in stake 1
slides into a tilted fixed chute. As described above, the conventional method has had the disadvantage that the work of attaching and detaching the stakes is troublesome.

The present invention was made in view of the above-mentioned drawbacks of the prior art, and it is an object of the present invention to provide a stake holding mechanism that can quickly transfer semiconductor components to a guide rail.

Embodiments of the present invention will be described below based on the drawings. FIG. 2 is a front view showing one embodiment of the stake holding mechanism according to the present invention, before the stake is inserted. FIG. 3 is a front sectional view showing a state in which semiconductor components are fed to the stake holding mechanism of FIG. 2;
4 is a sectional view taken from the direction of arrow A in FIG. 3; FIG. 5 is a sectional view taken from the direction of arrow B of FIG. 3;
FIG. 6 is a sectional view of the guide member of FIG. 3.

Reference numeral 10 denotes an inclined stationary chute which is arranged in an inclined manner and extends to a supply section of a bonding device (not shown), over which the semiconductor component 2 can slide. Reference numeral 11 denotes a bottom plate disposed above the inclined fixed chute, and a U-shaped stake holder 12 with an open bottom is fixed to this bottom plate 11. The stake 1 shown in FIG. 1 can be inserted into a rectangular insertion opening formed by the bottom plate 11 and the stake holder 12. Also, on the top surface and one side of the stake holder 12, there are stake presser plate springs 13 and 1, respectively.
4, 15 are attached, and these stake presser plate springs 13, 14, 15 are attached to the stake holder 12.
The stick 1 is protruded inwardly from windows 12a, 12b, and 12c formed in the stack 1 and presses the stake 1. Arms 16 and 17 are rotatably supported by a fulcrum shaft 18 fixed to the tilted fixed chute 10, and are fixed to the side surface of the bottom plate 11. 19
is a guide member fixed to the center of the upper end side of the tilted fixed chute 10, and an arcuate surface 19a centered on the fulcrum shaft 18 is formed on the stake holder 12 side;
Upper limit stopper 19b for positioning the stake holder 12 on the side, stopper 19
c and a lower limit stopper 19d are formed to protrude. Reference numeral 20 denotes an L-shaped locking lever that is rotatably supported on a support shaft 21 fixed to the bottom plate 11, and has a locking portion 20a that locks on the stopper 19c of the guide member 19 at one end, and a pressing portion at the other end. 20b, and the locking portions 20a are connected to the stopper 19 by the spring 22.
It is biased so as to be locked to c. This locking lever 20 connects the arm members 16 and 17 rotatably supported by the inclined fixed chute 10 to the guide member 19.
In the normal state, movement is prevented by being locked to the stopper 19c.

Next, the operation of the stake holding mechanism having such a structure will be explained. Before inserting the stake 1, the locking portion 20a of the locking lever 20 is in contact with the upper surface of the lower limit stopper 19d as shown by A in FIG. 6, and the stake holder 12 is in a horizontal state as shown in FIG. It is in. In this state, semiconductor component 2
Insert the stake 1 into the stake holder 12 with the opening 1a of the stake 1 that is aligned and housed facing forward. When the stay 1 is completely inserted, the stay 1 is attached to the stay presser plate spring 1.
3, 14, and 15, and are positioned horizontally. Further, upward movement is prevented by a stopper 19c. Moreover, the semiconductor component 2 in the stake 1 approaches the lower part of the arcuate surface 19a of the guide member 19 at the tip of the opening 1a, and is prevented from moving. Next, press the pressing part 20b of the locking lever 20 with the arrow C
When pressed in the direction, the locking portion 20a is released from the stopper 19c of the guide member 19, as shown by B in FIG. As a result, arm members 16,1
The stake holder 12 integrated with 7 is a fulcrum shaft 18
Therefore, when the stake holder 12 is rotated in the direction of arrow D, the stake 1
The semiconductor component 2 loaded into the stake 1 begins to slide within the stake 1 at a predetermined inclination angle, but the guide member 19
This circular arc surface 19a while contacting the circular arc surface 19a of
move along. Furthermore, stake holder 12
When the locking lever 2 is rotated, the locking lever 2 is attached to the upper limit stopper 19b at a position corresponding to the same angular position as the tilting angle of the tilting fixed chute 10, as shown by C in FIG.
The locking portion 20a of 0 contacts. When the locking lever 20 is released from the pressure, the stopper 20c engages with the upper surface of the stopper 20c as shown by D in FIG. 6 due to the biasing force of the spring 22, resulting in the state shown in FIG. 3. In this state, the stake holder 12 and the tilted fixed chute 10 are positioned at the same level and held tilted. At this time, the arcuate surface 19a of the guide member 19 that was in contact with the opening 1a of the stake 1 is placed in a position where it is retracted downward, so that the semiconductor component 2 stored in the stake 1 is tilted due to its own weight. It slides along the fixed chute 10.

After the semiconductor component 2 has been fed out from the stake 1, the stake 1 is removed from the stake holder 12. To insert the stake 1 again, rotate the stake holder 12 in the opposite direction of arrow D while pressing the locking lever 20. Locking lever 2
If the pressure is released at the position where the locking portion 20a of the lock 20a contacts the lower limit stopper 19d, the stake holder 12 is fixed at a horizontal position with respect to the tilt angle of the tilt fixing chute 10, and the stake 1 can be inserted again. do.

In this way, the stake 1 can be inserted into the stake holder 12 in a horizontal position, and even if the stake holder 12 is rotated to the tilted angle position of the tilted fixed chute 10, the semiconductor component 2 loaded in this stake 1 will slide midway. Since the semiconductor component 2 can be held without twisting and can be slid and sent out only at a predetermined angular position, the operation is very easy and work efficiency can be improved.

As is clear from the above description, the stake holding mechanism according to the present invention greatly facilitates the operation of supplying semiconductor components to the inclined fixed chute, and is therefore highly effective as a component supply device for a bonding apparatus.

[Brief explanation of drawings]

FIG. 1 is a perspective view of the stake, FIGS. 2 to 6 show an embodiment of the stake holding mechanism according to the present invention, FIG. 2 is a front view before the stake is inserted, and FIG. 3 is a semiconductor 4 is a front sectional view of the parts being supplied, FIG. 4 is a sectional view taken from the direction of arrow A in FIG. 3, FIG. 5 is a sectional view taken from the direction of arrow B of FIG. 3, and FIG. The figure is a sectional view of the guide member of FIG. 3. DESCRIPTION OF SYMBOLS 1... Stake, 1a... Opening, 2... Semiconductor component, 10... Inclined fixed chute, 12...
Stake holder, 16, 17...arm member, 19...guide member, 19b...upper limit stopper, 19c...stopper, 19d...lower limit stopper, 20...locking lever, 22...spring.

Claims (1)

[Claims] 1. A stand having at least one end open and capable of arranging and storing a large number of semiconductor components having a gate-shaped cross section and slidingly sending out the semiconductor components, and a stand arranged at an angle so that the semiconductor components can slide across it. an inclined fixed chute, a stake holder that forms an insertion opening into which the stake is inserted and is rotatably supported by the inclined fixed chute; A stake holder consisting of a guide member in which a stopper portion for positioning the lower limit is formed, and a locking lever that is rotatably supported on the lower surface of the stake holder and biased to lock in the stopper portion of the guide member. mechanism.