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JPS634364B2 - - Google Patents
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JPS634364B2 - - Google Patents

Info

Publication number
JPS634364B2
JPS634364B2 JP10558580A JP10558580A JPS634364B2 JP S634364 B2 JPS634364 B2 JP S634364B2 JP 10558580 A JP10558580 A JP 10558580A JP 10558580 A JP10558580 A JP 10558580A JP S634364 B2 JPS634364 B2 JP S634364B2
Authority
JP
Japan
Prior art keywords
coating layer
piezoelectric ceramic
layer
ceramic plate
spacer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP10558580A
Other languages
Japanese (ja)
Other versions
JPS5731217A (en
Inventor
Tetsuo Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokin Corp
Original Assignee
Tohoku Metal Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tohoku Metal Industries Ltd filed Critical Tohoku Metal Industries Ltd
Priority to JP10558580A priority Critical patent/JPS5731217A/en
Publication of JPS5731217A publication Critical patent/JPS5731217A/en
Publication of JPS634364B2 publication Critical patent/JPS634364B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • H03H9/05Holders or supports
    • H03H9/10Mounting in enclosures
    • H03H9/1007Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1042Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a housing formed by a cavity in a resin

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Description

【発明の詳細な説明】 本発明は長さ方向の一方の端部の表面に駆動電
極を、この駆動電極に対応する裏面の位置に浮遊
電極を設け、また表面の他方の端部に駆動電極の
一部を延長して外部接続用端子を設けた圧電セラ
ミツク板を複数個厚さの方向に重ね合せたエツジ
モードセラミツクフイルタにおいて、圧電セラミ
ツク板のそれぞれの層間に層間隔よりわずかに薄
い紙などのスペーサーを挾み、また駆動電極の端
部から、セラミツク板の幅の約1.5倍の位置まで
パラフインのような常温で固体または半固体化す
る低温溶融材料の溶融液に浸して第1被膜層を形
成し、さらにその第1被膜層の外側と外部接続端
子を含めて、多孔質の熱硬化性樹脂に浸して第2
の樹脂被覆層を形成させ同時に加熱によつて第1
被膜層を樹脂被覆層に吸収させて多素子エツジモ
ードセラミツクフイルタの樹脂層およびスペーサ
ーと圧電セラミツク板のそれぞれの間に微小空間
を形成させることにある。
Detailed Description of the Invention The present invention provides a drive electrode on the surface of one end in the length direction, a floating electrode at a position on the back surface corresponding to this drive electrode, and a drive electrode on the other end of the surface. In edge-mode ceramic filters, in which multiple piezoelectric ceramic plates each having external connection terminals extended from a portion of the piezoelectric ceramic plate are layered in the thickness direction, there is paper or the like that is slightly thinner than the layer spacing between each layer of the piezoelectric ceramic plates. A first coating layer is formed by sandwiching the spacer and immersing it in a melt of a low-temperature melting material that becomes solid or semi-solid at room temperature, such as paraffin, from the end of the drive electrode to a position approximately 1.5 times the width of the ceramic plate. The outside of the first coating layer and the external connection terminals are then immersed in a porous thermosetting resin to form a second layer.
The first resin coating layer is formed by heating at the same time.
The purpose is to absorb the coating layer into the resin coating layer to form micro spaces between the resin layer and spacer of the multi-element edge mode ceramic filter and the piezoelectric ceramic plate.

エツジモードセラミツクフイルタの素子は第1
図に示すように薄い矩形の圧電セラミツク板1の
一つの表面には第1図aのように端部に金属製駆
動電極2,3および4を設け、さらにそれらの電
極の一部をそれぞれ圧電セラミツク板1の他端部
まで延ばして入力端子2′、アース端子3′、およ
び出力端子4′を引き出して外部接続用の端子と
する。また裏面には第1図bに示すように第1図
aの駆動電極2,3、および4にほぼ対向して浮
遊電極5および5′を設ける。この圧電セラミツ
ク板1の両面に電極を設けて構成されたフイルタ
素子は入力端子2′とアース端子3′に入力電圧を
加えると、圧電セラミツク板1は主面に対して平
行な変位方向に振動するエツジモード振動を生
じ、圧電セラミツク板1の幅によつてきまる周波
数帯を選択した出力電圧を出力端子2′とアース
端子3′との間に発生する。しかもこの振動は主
面に対して直角な方向に機械的に触れても振動の
特性にはほとんど影響を及ぼさない。このときの
振動のエネルギーは駆動電極2,3,4が設けら
れている端部のみに集中しているので、圧電セラ
ミツク板1の長さを幅の2〜3倍としたときは駆
動電極2,3,4のある端面から圧電セラミツク
板1の幅の1.5倍以上の位置を固定してもフイル
タとしての特性には影響を与えない。またこの種
のエツジモードセラミツクフイルタでは圧電セラ
ミツク板1の厚さは幅の約1/10が望ましい。例え
ばラジオや無線受信機の中間周波数445KHzのフ
イルタは圧電セラミツク板1の幅約3mmに対し
て、厚さは0.2程度の薄いものとなる。したがつ
てエツジモードセラミツクフイルタを振動に影響
のない一端で固定しようとすると、振動、衝撃に
対して機械的に弱く、破損するおそれがある。
The edge mode ceramic filter element is the first
As shown in the figure, on one surface of a thin rectangular piezoelectric ceramic plate 1, metal drive electrodes 2, 3 and 4 are provided at the ends as shown in Figure 1a, and a portion of each of these electrodes is connected to a piezoelectric ceramic plate. The ceramic plate 1 is extended to the other end, and the input terminal 2', the ground terminal 3', and the output terminal 4' are pulled out to serve as terminals for external connection. Furthermore, as shown in FIG. 1b, floating electrodes 5 and 5' are provided on the back surface substantially opposite to the drive electrodes 2, 3, and 4 in FIG. 1a. The filter element is constructed by providing electrodes on both sides of the piezoelectric ceramic plate 1. When an input voltage is applied to the input terminal 2' and the ground terminal 3', the piezoelectric ceramic plate 1 vibrates in a displacement direction parallel to the main surface. Edge mode vibration is generated, and an output voltage having a frequency band determined by the width of the piezoelectric ceramic plate 1 is generated between the output terminal 2' and the ground terminal 3'. Furthermore, even if this vibration is mechanically touched in a direction perpendicular to the main surface, it has almost no effect on the vibration characteristics. The energy of the vibration at this time is concentrated only at the ends where the drive electrodes 2, 3, and 4 are provided, so if the length of the piezoelectric ceramic plate 1 is set to 2 to 3 times the width, , 3, and 4 at a position 1.5 times the width or more of the piezoelectric ceramic plate 1 from the end face thereof will not affect the characteristics as a filter. Further, in this type of edge mode ceramic filter, the thickness of the piezoelectric ceramic plate 1 is preferably about 1/10 of the width. For example, a filter with an intermediate frequency of 445 KHz for a radio or radio receiver has a thickness of about 0.2 mm compared to the width of the piezoelectric ceramic plate 1 of about 3 mm. Therefore, if an edge mode ceramic filter is fixed at one end that is not affected by vibrations, it will be mechanically weak against vibrations and shocks and may be damaged.

本発明は矩形の圧電セラミツク板に電極をつけ
てエツジモード振動を行なわせるエツジモードセ
ラミツクフイルタを複数個厚さの方向に重ね、そ
の振動部分の層間にスペーサー7を挾んだ後、駆
動電極部分をパラフイン、ワツクスなどで覆つて
第1被膜層を作り、次にこの被膜の外側に多孔性
の熱硬化性樹脂を浸して加熱硬化させ樹脂層を形
成させるとき第1被膜層を液化させて樹脂層に吸
収させて、スペーサーと圧電セラミツク板との間
に微小空間を設けるようにして樹脂層を外装する
多素子エツジモードセラミツクフイルタの外装法
に関する。
In the present invention, a plurality of edge mode ceramic filters are stacked in the thickness direction by attaching electrodes to a rectangular piezoelectric ceramic plate to cause edge mode vibration, and after sandwiching a spacer 7 between the layers of the vibrating part, the driving electrode part is A first coating layer is created by covering with paraffin, wax, etc., and then a porous thermosetting resin is soaked on the outside of this coating and heated to harden to form a resin layer.The first coating layer is liquefied to form a resin layer. The present invention relates to a coating method for a multi-element edge mode ceramic filter, in which a resin layer is coated by absorbing the resin layer into the piezoelectric ceramic plate to provide a minute space between the spacer and the piezoelectric ceramic plate.

第2図は第1図に示すエツジモードセラミツク
フイルタを外部へ接続するための入力端子2′、
アース端子3′、および出力端子4′のそれぞれに
リード端子2″,3″,4″を半田6をもつて半田
付して素子を作る。この素子を第3図の3素子の
例に示すように駆動電極3,4,5のある端から
圧電セラミツク板1の幅の1.5倍以上の位置に3
個の圧電セラミツク板1をほぼ等間隔になるよう
にホルダー10にて保持し、厚さの方向に重ね、
また圧電セラミツク板1の振動部分の層間に層間
隔よりわずかに厚さの小さいスペーサー7を挾み
込む。次に圧電セラミツク板1の先端から幅の約
1.5倍の位置までパラフイン、ワツクスのような
常温で固体または半固体化する低温溶融材料の溶
融液中に浸して第1の被膜層8をかぶせる。さら
に第4図に示すように第1の被膜層8の外側にホ
ルダー10と外部リード端子2″,3″,4″を含
めて、多孔質の熱硬化性樹脂を浸漬法によつて第
2の樹脂被覆層9を加熱硬化させて形成すると、
第1の被膜層8の低温溶融のワツクスは樹脂被覆
層9に吸収され、第1被膜層8の部分に空間がで
きる。スペーサー10が和紙、布、プラスチツク
など可撓性を有する材料を用いた場合、スペーサ
ー材料が圧電セラミツク板1にふれてもエツジモ
ード振動の方向と垂直の方向であるためにフイル
タ特性にはほとんど影響はない。また外部からの
振動や衝撃に対してもスペーサー10に支えられ
ているので、圧電セラミツク板1がたわむことが
少なく、強度的にも保護されるし、また樹脂被覆
層9は内部の振動部分を機械的振動や衝撃から保
護するばかりでなく、湿気などの侵入を防ぎ、長
期にわたり環境の変化に対して機械的、また電気
的に信頼性の高いエツジモードセラミツクフイル
タが得られる。
Figure 2 shows an input terminal 2' for connecting the edge mode ceramic filter shown in Figure 1 to the outside;
An element is made by soldering lead terminals 2'', 3'', and 4'' to the ground terminal 3' and output terminal 4', respectively, with solder 6. This element is shown in the example of three elements in Fig. 3. 3 at a position more than 1.5 times the width of the piezoelectric ceramic plate 1 from the end of the drive electrodes 3, 4, and 5 as shown in FIG.
Piezoelectric ceramic plates 1 are held in a holder 10 at approximately equal intervals, stacked in the thickness direction,
Further, a spacer 7 having a thickness slightly smaller than the layer spacing is inserted between the layers of the vibrating portion of the piezoelectric ceramic plate 1. Next, approximately the width from the tip of the piezoelectric ceramic plate 1.
The first coating layer 8 is covered by immersing it in a melt of a low-temperature melting material that becomes solid or semi-solid at room temperature, such as paraffin or wax, to a position 1.5 times its original size. Furthermore, as shown in FIG. 4, a porous thermosetting resin is coated on the outside of the first coating layer 8, including the holder 10 and the external lead terminals 2'', 3'', and 4'', using a dipping method. When the resin coating layer 9 is formed by heating and curing,
The low-temperature melting wax of the first coating layer 8 is absorbed into the resin coating layer 9, creating a space in the first coating layer 8. When the spacer 10 is made of a flexible material such as Japanese paper, cloth, or plastic, even if the spacer material touches the piezoelectric ceramic plate 1, it will hardly affect the filter characteristics because the direction is perpendicular to the direction of edge mode vibration. do not have. Furthermore, since it is supported by the spacer 10 against external vibrations and shocks, the piezoelectric ceramic plate 1 is less likely to bend and is protected in terms of strength, and the resin coating layer 9 protects the internal vibrating parts. It is possible to obtain an edge mode ceramic filter that not only protects against mechanical vibrations and shocks but also prevents the intrusion of moisture, etc., and has high mechanical and electrical reliability against environmental changes over a long period of time.

以上の説明はエツジモードセラミツクフイルタ
について述べたが、エツジモード共振子を複数個
重ねて構成したフイルタについても同様な方法が
適用される。
Although the above description has been made regarding an edge mode ceramic filter, the same method can be applied to a filter constructed by stacking a plurality of edge mode resonators.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はエツジモードセラミツクフイルタの構
造例を示す平面図でaは駆動電極を設けた面、b
は浮遊電極を設けた面の平面図、第2図は第1図
aの端子に外部接続用端子を半田付した平面図、
第3図は本発明の3素子について第1の被膜層を
設けた実施例の側面断面図、第4図は本発明によ
つて第2の樹脂被覆層を設けたエツジモードセラ
ミツクフイルタの側面断面図である。 図において、1……圧電セラミツク板、2,
3,4……駆動電極、5,5′……浮遊電極、
2′……入力端子、3′……アース端子、4′……
出力端子、2″,3″,4″……外部接続用端子、
6……半田、7……スペーサー、8……第1の被
膜層、9……樹脂被覆層、10……ホルダー。
FIG. 1 is a plan view showing an example of the structure of an edge mode ceramic filter, in which a is the surface where the drive electrode is provided, and b
is a plan view of the surface on which the floating electrode is provided, FIG. 2 is a plan view of the terminal in FIG.
FIG. 3 is a side cross-sectional view of an example in which three elements of the present invention are provided with a first coating layer, and FIG. 4 is a side cross-sectional view of an edge mode ceramic filter provided with a second resin coating layer according to the present invention. It is a diagram. In the figure, 1...piezoelectric ceramic plate, 2,
3, 4... Drive electrode, 5, 5'... Floating electrode,
2'...Input terminal, 3'...Ground terminal, 4'...
Output terminal, 2″, 3″, 4″……terminal for external connection,
6... Solder, 7... Spacer, 8... First coating layer, 9... Resin coating layer, 10... Holder.

Claims (1)

【特許請求の範囲】[Claims] 1 矩形圧電セラミツク板の長さ方向の一方の端
の表面に駆動電極を、またその裏面に浮遊電極を
設けた振動端部と、前記駆動電極のそれぞれの一
部を伸して外部接続用端子とした圧電セラミツク
板の複数個を厚さの方向に重ね合せたエツジモー
ドセラミツクフイルタにおいて、前記圧電セラミ
ツク板の各層間に層間隔よりやや薄いスペーサー
を挾み、また前記振動端部から前記圧電セラミツ
ク板の幅のおよそ1.5倍の位置までを常温におい
て固定または半固体化する低温溶融材の溶融液に
浸して第1被膜層を形成し、さらに前記被膜層の
外側と前記端子端部を含めて多孔質の熱硬化性樹
脂に浸して第2樹脂被覆層を形成させることによ
り、前記第1被膜層を前記第2樹脂被覆層に吸収
させて前記第1被膜層と第2樹脂被覆層との間に
微小空間を形成するようにした多素子エツジモー
ドセラミツクフイルタの外装法。
1 A vibrating end portion with a driving electrode provided on the surface of one end in the length direction of a rectangular piezoelectric ceramic plate and a floating electrode provided on the back surface thereof, and a terminal for external connection by extending a portion of each of the driving electrodes. In an edge mode ceramic filter in which a plurality of piezoelectric ceramic plates are stacked one on top of the other in the thickness direction, a spacer slightly thinner than the layer spacing is interposed between each layer of the piezoelectric ceramic plates, and a spacer is inserted between the piezoelectric ceramic plates from the vibrating end. A first coating layer is formed by immersing up to approximately 1.5 times the width of the plate in a melt of a low-temperature melting material that is fixed or semi-solid at room temperature, and further includes the outside of the coating layer and the terminal end. By soaking in a porous thermosetting resin to form a second resin coating layer, the first coating layer is absorbed into the second resin coating layer, and the first coating layer and the second resin coating layer are bonded. A method of packaging a multi-element edge-mode ceramic filter in which a microscopic space is formed between the filters.
JP10558580A 1980-07-31 1980-07-31 Packing method of multielement edge mode ceramic filter Granted JPS5731217A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10558580A JPS5731217A (en) 1980-07-31 1980-07-31 Packing method of multielement edge mode ceramic filter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10558580A JPS5731217A (en) 1980-07-31 1980-07-31 Packing method of multielement edge mode ceramic filter

Publications (2)

Publication Number Publication Date
JPS5731217A JPS5731217A (en) 1982-02-19
JPS634364B2 true JPS634364B2 (en) 1988-01-28

Family

ID=14411570

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10558580A Granted JPS5731217A (en) 1980-07-31 1980-07-31 Packing method of multielement edge mode ceramic filter

Country Status (1)

Country Link
JP (1) JPS5731217A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59223010A (en) * 1983-06-02 1984-12-14 Matsushita Electric Ind Co Ltd Resonator manufacturing method

Also Published As

Publication number Publication date
JPS5731217A (en) 1982-02-19

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