JPS6344606B2 - - Google Patents
Info
- Publication number
- JPS6344606B2 JPS6344606B2 JP59020467A JP2046784A JPS6344606B2 JP S6344606 B2 JPS6344606 B2 JP S6344606B2 JP 59020467 A JP59020467 A JP 59020467A JP 2046784 A JP2046784 A JP 2046784A JP S6344606 B2 JPS6344606 B2 JP S6344606B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- tape
- carrier tape
- plastic
- recessed hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Containers And Plastic Fillers For Packaging (AREA)
- Packages (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Description
【発明の詳細な説明】
(1) 発明の技術分野
本発明は、チツプ化された電子部品を自動挿入
機により、電子機器に装着する時に都合のよいキ
ヤリアテープの製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION (1) Technical Field of the Invention The present invention relates to a method for manufacturing a carrier tape that is convenient for mounting chipped electronic components into electronic equipment using an automatic insertion machine.
(2) 発明の技術的背景
電子機器に使用されている部品は、小型化が進
み、チツプ化されているため、このような電子部
品を人手によつて電子機器に装着することは、高
度の技術と時間を必要とした。しかし、自動挿入
機の開発が進むに従い、チツプ化された電子部品
は、キヤリアテープに実装され、電子機器に人手
を使わずに短時間のうちに正確に取付けられるよ
うになつた。このように、チツプ化された電子部
品が自動挿入機によつて正確で、しかも短時間に
取付けられるようにするためには、自動挿入機だ
けではなく、キヤリアテープの精度も問題にな
る。(2) Technical background of the invention As parts used in electronic devices are becoming smaller and chipped, it is difficult to manually attach such electronic parts to electronic devices. It required skill and time. However, as the development of automatic insertion machines progresses, chipped electronic components can now be mounted on carrier tape, allowing them to be accurately attached to electronic equipment in a short period of time without the need for human intervention. In this way, in order to be able to accurately and quickly mount chipped electronic components using an automatic inserter, not only the automatic inserter but also the precision of the carrier tape is an issue.
そのため、チツプ化された電子部品の実装位置
およびキヤリアテープの送り孔の位置はJIS規格
によつて定められている。 Therefore, the mounting position of chipped electronic components and the position of the feed hole of the carrier tape are determined by the JIS standard.
(3) 従来技術とその問題点
第１図は、従来のキヤリアテープで、このキヤ
リアテープ１は紙テープに送り孔３とチツプ化さ
れた電子部品を挿入する開孔２をあけ、開孔２に
チツプ化された電子部品（図示されていない）を
挿入した後、上下両面からプラスチツクフイルム
（図示されていない）を貼り、自動挿入機にかけ
ていた。(3) Prior art and its problems Figure 1 shows a conventional carrier tape.This carrier tape 1 has a feed hole 3 and an opening 2 for inserting a chipped electronic component in the paper tape. After inserting chipped electronic components (not shown), plastic films (not shown) were applied from both the top and bottom sides, and the device was placed in an automatic insertion machine.
このようなキヤリアテープは、開孔する工程と
前記プラスチツクフイルムを上下両面から貼り合
せる工程とが必要となる。また、紙テープを開孔
する場合、紙の繊維がわずかに残るため、これが
チツプ化された電子部品を電子機器に装着する
時、障害を起こすことがあるという問題があつ
た。 Such a carrier tape requires a step of opening holes and a step of bonding the plastic film from both the upper and lower sides. Furthermore, when punching holes in the paper tape, a small amount of paper fiber remains, which may cause problems when chipped electronic components are installed in electronic equipment.
この紙の繊維を除去する方法としては、紙を合
成樹脂で含浸したり、あるいは紙テープを火にあ
ぶり、繊維のみを焼き切ることが行なわれてい
た。 Methods for removing paper fibers include impregnating the paper with synthetic resin, or burning paper tape to burn off only the fibers.
このため、紙の繊維を除去するための工程が更
に必要であるという問題があつた。 Therefore, there was a problem in that an additional process for removing paper fibers was required.
紙テープのかわりにプラスチツクテープを使用
した場合、紙の繊維を除去する工程は不要となる
が、チツプ化された電子部品を挿入した後、その
上下両面からプラスチツクフイルムを貼る工程が
必要である点、紙テープとかわりがなかつた。 If plastic tape is used instead of paper tape, the process of removing paper fibers is not necessary, but after inserting the chipped electronic component, a process of pasting plastic film on both the top and bottom sides is required. It was no different than paper tape.
また、キヤリアテープ自体をプラスチツクとす
るものがあるが、熱を加えて押出し加工をする熱
間加工工程が必要であつた。熱を加えずにプラス
チツクテープを加工するとくぼみ穴の部分の肉が
はみ出したり、プラスチツクテープにひび割れが
生じ、チツプ化された電子部品の脱落事故を起こ
す原因となるという問題があつた。 In addition, some carrier tapes themselves are made of plastic, but they require a hot processing process in which heat is applied and extrusion processing is performed. When plastic tape is processed without applying heat, there is a problem in that the flesh in the recessed holes protrudes or cracks occur in the plastic tape, which can cause chipped electronic components to fall off.
(4) 発明の目的
本発明は、上記問題を除去するために、プラス
チツクテープに押出し加工を施すことによつて、
くぼみ穴を設け、この穴にチツプ化された電子部
品を挿入し、該電子部品の上面にのみ、プラスチ
ツクフイルムを貼るだけで、紙の繊維による障害
をなくすと共に、プラスチツクフイルムを下面に
貼る手間とそのプラスチツクフイルムを節約する
キヤリアテープの製造方法を提供することを目的
とするものである。(4) Purpose of the invention In order to eliminate the above-mentioned problems, the present invention provides a solution by applying extrusion processing to a plastic tape.
By simply creating a recessed hole, inserting a chipped electronic component into the hole, and pasting plastic film only on the top surface of the electronic component, you can eliminate problems caused by paper fibers and save the trouble of pasting plastic film on the bottom surface. The object of the present invention is to provide a method for manufacturing a carrier tape that saves plastic film.
また、本発明は、くぼみ穴の押出し加工におい
て、その部分の肉がはみ出したり、キヤリアテー
プにひび割れが生じるのを防ぐキヤリアテープの
製造方法を提供することを目的とするものであ
る。 Another object of the present invention is to provide a method for manufacturing a carrier tape that prevents the flesh of the recessed hole from protruding or causing cracks in the carrier tape during extrusion processing of the recessed hole.
さらに、本発明は、送り孔および貫通孔を形成
する工程と、くぼみ穴を形成する工程とを一つの
金型により同時に行なうことのできるキヤリアテ
ープの製造方法を提供することを目的とするもの
である。 Furthermore, it is an object of the present invention to provide a method for manufacturing a carrier tape in which the process of forming feed holes and through holes and the process of forming recessed holes can be performed simultaneously using one mold. be.
(5) 発明の構成
本発明のキヤリアテープ４は、チツプ化された
電子部品（図示されていない）を、プラスチツク
テープ４の一方のみ開孔しているくぼみ穴７に挿
入して、その上面にのみプラスチツクフイルム
（図示されていない）を貼るものであるから、キ
ヤリアテープの厚さは、従来のものより厚くな
り、その厚さは、チツプ化された電子部品をくぼ
み穴７に挿入し得る程度となる。(5) Structure of the Invention In the carrier tape 4 of the present invention, a chipped electronic component (not shown) is inserted into a recessed hole 7 that is open on only one side of the plastic tape 4, and the chipped electronic component (not shown) is inserted into the upper surface of the carrier tape 4. Since a plastic film (not shown) is attached only to the carrier tape, the thickness of the carrier tape is thicker than that of conventional carrier tape, and the thickness is sufficient to insert chipped electronic components into the recessed hole 7. becomes.
また、上記厚さを有するプラスチツクテープ４
に金型等でくぼみ穴７を押出し加工する場合、く
ぼみ穴７となる部分に相当する肉がテープの上下
両面に押し出され、テープの送り精度を悪くす
る。 Also, plastic tape 4 having the above thickness is used.
When the recessed hole 7 is extruded using a mold or the like, the flesh corresponding to the portion that will become the recessed hole 7 is extruded to both the upper and lower sides of the tape, impairing the tape feeding accuracy.
このため、送り孔６を開口すると同時に、第２
図のようにくぼみ穴７の位置にくぼみ穴７より小
さい貫通孔５を開口する。その後、貫通孔５の中
心部分に押出し加工を施して、くぼみ穴７を作
る。 Therefore, at the same time as opening the feed hole 6, the second
As shown in the figure, a through hole 5 smaller than the recessed hole 7 is opened at the position of the recessed hole 7. Thereafter, the central portion of the through hole 5 is extruded to form a recessed hole 7.
この時のくぼみ穴７にあつたプラスチツクの肉
部分は、貫通孔５に逃げ、貫通孔５は第３図のよ
うにほとんど閉鎖される。そして、くぼみ穴７に
チツプ化された電子部品を挿入し、その上面にプ
ラスチツクフイルムを貼る。この場合、テープ送
り孔６とくぼみ穴７の肉部のはみ出しを逃げるた
めおよびテープの割れを防ぐための貫通孔５とを
開口する工程、およびくぼみ穴７を作る押出し加
工をする工程は、一つのプレス金型によつて同時
に行なうことができる。 At this time, the plastic flesh in the recessed hole 7 escapes into the through hole 5, and the through hole 5 is almost closed as shown in FIG. Then, a chipped electronic component is inserted into the recessed hole 7, and a plastic film is pasted on its upper surface. In this case, the process of opening the tape feed hole 6 and the through hole 5 to escape the protrusion of the flesh of the recessed hole 7 and to prevent the tape from cracking, and the process of extrusion processing to create the recessed hole 7 are performed in one step. This can be done simultaneously using two press dies.
(6) 発明の効果
本発明は、紙テープの繊維による障害をなくす
だけでなく、チツプ化された電子部品の下部に貼
るプラスチツクフイルムとこの貼る工程とが不要
となる。この時、本発明の場合、プラスチツクテ
ープの厚さが、チツプ化された電子部品を収容し
得るくぼみ穴を設けるだけの厚さが必要である
が、プラスチツクテープの価格は、その厚さに比
例することはなく、従来のプラスチツクテープと
大差が無い。(6) Effects of the Invention The present invention not only eliminates the problem caused by paper tape fibers, but also eliminates the need for a plastic film to be attached to the bottom of a chipped electronic component and the process for attaching it. At this time, in the case of the present invention, the thickness of the plastic tape needs to be thick enough to provide a recessed hole that can accommodate the chipped electronic components, but the price of the plastic tape is proportional to its thickness. There is no need to do anything, and there is no big difference from conventional plastic tape.
また、本発明は、テープ送り孔とくぼみ穴の肉
部を逃すためとプラスチツクテープの割れを防ぐ
ための貫通孔とを設ける工程と、前記貫通孔の中
心部においてくぼみ穴を押出し加工する工程とを
一つの金型で同時に行なうので、従来よりキヤリ
アテープの製造を速くすることができる。 The present invention also includes a step of providing a through hole for letting the flesh of the tape feed hole and the recessed hole escape and for preventing the plastic tape from cracking, and a step of extruding the recessed hole at the center of the through hole. Since these steps are performed simultaneously in one mold, carrier tape can be manufactured more quickly than in the past.
さらに、本発明は、押出し加工でくぼみ穴を作
る時に、くぼみ穴の肉部を逃がすためと、キヤリ
アテープの割れを防ぐための貫通孔を設けたの
で、キヤリアテープにはみ出し部や割れがない精
度の高いものが製造することができる。 Furthermore, in the present invention, when making a hollow hole by extrusion processing, a through hole is provided to allow the flesh of the hollow hole to escape and to prevent the carrier tape from cracking, so that the carrier tape has precision without protruding parts or cracks. It is possible to manufacture products with high
第１図は、従来の紙またはプラスチツクテープ
からなるキヤリアテープ。第２図はおよび第３図
は、本発明のキヤリアテープの立体図およびＡ−
A′，Ｂ−B′における断面図。
４……プラスチツクテープ（キヤリアテープ）、
５……貫通孔、６……送り孔、７……くぼみ穴。
Figure 1 shows a conventional carrier tape made of paper or plastic tape. 2 and 3 are three-dimensional views of the carrier tape of the present invention and A-
A', sectional view at BB'. 4...Plastic tape (carrier tape),
5...through hole, 6...feeding hole, 7...recessed hole.
Claims (1)
のみが開口されたくぼみ穴が設けられるだけの厚
さを有するプラスチツクテープに、テープ送り用
孔および上記くぼみ穴の肉部を逃がすためと、上
記テープの割れを防ぐための貫通孔をあける第一
工程と、前記貫通孔の中心部においてくぼみ穴を
押出し加工する第二工程とを一つのプレス金型で
同時に行なうキヤリアテープの製造方法。1. A plastic tape that accommodates chipped electronic components and is thick enough to be provided with a recessed hole with only one side open, to allow the tape feeding hole and the flesh of the recessed hole to escape, and the above-mentioned A method for manufacturing a carrier tape in which a first step of making a through hole to prevent the tape from cracking and a second step of extruding a recessed hole in the center of the through hole are performed simultaneously using one press mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59020467A JPS60180199A (en) | 1984-02-07 | 1984-02-07 | Carrier tape and method of producing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59020467A JPS60180199A (en) | 1984-02-07 | 1984-02-07 | Carrier tape and method of producing same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60180199A JPS60180199A (en) | 1985-09-13 |
| JPS6344606B2 true JPS6344606B2 (en) | 1988-09-06 |
Family
ID=12027894
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59020467A Granted JPS60180199A (en) | 1984-02-07 | 1984-02-07 | Carrier tape and method of producing same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60180199A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01135500A (en) * | 1987-08-07 | 1989-05-29 | Taiyosha Denki Kk | Perforating method to paper, etc. |
| JP4753831B2 (en) * | 2006-10-18 | 2011-08-24 | 株式会社オーディオテクニカ | Ribbon microphone unit and ribbon microphone |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6015017B2 (en) * | 1977-06-30 | 1985-04-17 | 松下電工株式会社 | Infrared absorption gas alarm |
| JPS5837199U (en) * | 1981-09-03 | 1983-03-10 | 松下電器産業株式会社 | Tape-like aggregate of chip-like electronic components |
-
1984
- 1984-02-07 JP JP59020467A patent/JPS60180199A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60180199A (en) | 1985-09-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |