JPS6345908B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a fully automatic IC soldering device that automatically performs soldering to IC lead terminals.

As is well known, the lead terminals of an IC are soldered in advance in order to prevent them from oxidizing and to easily and reliably solder the IC after mounting it on a printed circuit board.

Conventionally, when soldering IC lead terminals, the ICs were manually placed one by one on a jig to be attached to a carrier, and this jig was then attached to the carrier. Furthermore, even after soldering to the lead terminals was completed, the jig had to be manually removed from the carrier and the ICs were removed one by one from the jig, which required a lot of manpower and was time-consuming. Therefore, there were drawbacks such as poor soldering workability and increased costs.

This invention was made in order to eliminate the above-mentioned drawbacks, and by simply placing the case containing the IC on the soldering machine, the subsequent delivery, transfer, pickling, flux treatment, soldering, etc. The purpose of the present invention is to provide a soldering device in which all processes such as cleaning, drying, and storage can be performed automatically, and in which a conveyor rail, a cleaning tank, and a fluxer are integrally formed. This invention will be explained below.

1A and 1B are a plan view and a side view showing an embodiment of the present invention, and FIG. 2 is a perspective view showing a case in which an IC is housed. In these figures, 1
The figure shows the entire fully automatic IC soldering machine. 2
is the IC, 3 is the lead terminal of the IC2, 4 is the IC
2 is housed in a line in the longitudinal direction, the case is made of synthetic resin and is open at both ends, and has an appropriate length l. Reference numeral 5 denotes a base of the fully automatic IC soldering apparatus 1, and a plurality of cases 4 are arranged in parallel at the end thereof. 6 is a transport rail on which the IC 2 is transported; 7 is a delivery device that sends out the IC 2 from the case 4 to the transport rail 6; 8 is an air cylinder that serves as a driving source for the delivery device 7; 9 is advanced by the air cylinder 8; Multiple receding rods arranged in parallel. 10 is an endless conveying chain, as shown in FIG. 1b,
The return route is formed so that it overlaps with the top and bottom, and the first
As shown in FIG. 11 is a sprocket, and 12 is a claw for pushing the rear end of the IC 2 on the transport rail 6 to transport it, which are arranged at a pitch p corresponding to the length l of the case 4. 13 is a mounting plate for the claw 12;
Both ends thereof are attached to the conveyance chain 10, respectively. 14 is an acid cleaning tank for removing dirt etc. attached to the IC 2, 15 is a water cleaning tank for washing away the acid attached in the acid cleaning tank 14, and 16 is a cleaning tank for cleaning the IC 2.
A fluxer 17 for fluxing the IC2 is a preheater, which is provided as required. 18 is a jet soldering bath, 19 is after soldering
A water cleaning tank for cleaning IC2, 20 is a hot water cleaning tank,
Water is used as needed. 21 is a finishing cleaning tank with water, 22 is a drying heater, 23 is a movable rail on which the soldered IC 2 is placed, 24
2 is a movable stand to which the movable rail 23 is attached, the tip end of which is rotatably connected to the base 5, and the rear end of which is rotatably connected to the rod 26 of the air cylinder 25. The movable table 24 uses its tip as a fulcrum and rotates to a tilted position in a direction opposite to the direction of conveyance of the IC 2 so as to be in a descending state. Reference numeral 27 designates the entire storage device in which the IC 2 on the movable base 24 is stored in the case 4. 28 is an air cylinder, 2
A plurality of rods 9 are moved by the drive of the air cylinder 28, and a claw 30 is attached to the tip of each rod 29 to push the rear end of the IC 2 into the case 4.

Figures 3a and 3b show the mechanism for transporting the IC2, and Figure 3a is an enlarged side view of the X section in Figure 1b.
FIG. 3b is a sectional view taken along the - line in FIG. 3a. In these figures, the same reference numerals as in FIGS. 1 and 2 indicate the same parts, and 31 is the transport rail 6.
These are long guide plates that cover the upper part of the guide plates, and are arranged in parallel, and slits 32 through which the pawls 12 pass are formed between adjacent guide plates 31. Reference numeral 33 denotes a holding plate that fixes the end of the guide plate 31.

Note that FIG. 3c shows the guide plate 31 shown in FIG. 3b.
31A is a guide plate with a step formed thereon, which is used for IC2A having a higher height. 3A is a lead terminal, and 32A is a slit through which the claw 12 passes.

4a and 4b show an example of the acid cleaning tank 14 shown in FIGS. 1a and 1b. FIG. 4a is an enlarged sectional view taken along the - line in FIG. FIG. 4 is a sectional view taken along the - line in FIG. 4a. In these figures, the same reference numerals as in FIGS. 1 to 3 indicate the same parts, 41 is the outer tank of the acid cleaning tank 14, 42 is the water passage, and 43 is the inner tank, the upper part of which is connected by the conveyor rail 6. It is sealed. Reference numeral 44 denotes a cleaning liquid, and 45 denotes a spout which pressurizes the cleaning liquid 44 in the outer tank 41 by a pump (not shown) and sends it to the inner tank 43 through the passageway 42, and then blows it out from the inner tank 43. It is formed at the bottom of 6. 46 is a weir plate that dams the cleaning liquid 44 flowing over the upper surface of the guide plate 31 from the slit 32 to prevent it from flowing out to other parts; 47 is a reflux port through which the cleaning liquid 44 on the conveying rail 6 flows back to the outer tank 41; It is.

Next, the operation will be explained.

First, an outline of the operation of the fully automatic IC soldering apparatus 1 will be explained with reference to FIGS. 1a and 1b and FIG. 2.

The ICs 2 arranged in the case 4 are driven by the air cylinder 8, push the rear end of the ICs 2 with the tip of the rod 9, send them out in the direction of arrow A, and place them on the transport rail 6.

Next, as the transport chain 10 moves, the claw 12 descends, pushing the rear end of the IC 2 and transporting the IC 2 to the next acid cleaning tank 14. Next, the acid cleaning tank 14,
Each process is performed while repeatedly stopping the transport chain 10 intermittently at the positions of the water washing tank 15, fluxer 16, and preheater 17. Next, the IC 2 is soldered in the solder bath 18. Further, when the IC 2 passes over the solder bath 18, it can be moved without stopping to prevent the IC 2 from being overheated by the solder melt. To do this,
The solder bath 18 is disposed at a position where the IC 2 can be moved continuously even when the transfer chain 10 is moved intermittently. The upper part of the solder bath 18 is connected to a conveyor rail 6.
serves as a wire rail so that the solder melt can sufficiently adhere to the lead terminals 3 of the IC2.
Next, each process is performed in the water washing tank 19, the hot water washing tank 20, the finishing washing tank 21, and the drying heater 22 while stopping again, and then the IC2
After placing the IC on the movable rail 23, the claw 12 rises as the conveyance chain 10 travels and is disengaged from the IC2.

Next, the rod 2 is moved by driving the air cylinder 25.
6 descends, the movable base 24 tilts. Then,
The claw 3 of the rod 29 is activated by the operation of the air cylinder 28.
0 presses the rear end of IC2, so IC2 is housed in case 4. Next, the air cylinder 28 is driven to move the claw 30 backward, and then the air cylinder 2
5, the movable base 24 is returned to its original position.

Next, the transport mechanism of the IC 2 will be explained with reference to FIG.

As the conveyance chain 10 travels, the claw 12 descends in the direction of arrow B and enters the slit 32, pushing the rear end of the IC 2 in the direction of arrow A until it reaches the next stage of the acid cleaning tank 14 by the pitch p shown in FIG. Move and stop. In this way, the claws 12 repeatedly move intermittently to transport the IC2, perform soldering on the IC2, and then place the IC2 on the movable rail 23.

Next, the operation of the acid cleaning tank 14 will be explained with reference to FIG.

The cleaning liquid 44 in the outer tank 41 of the acid cleaning tank 14 is pressurized by a pump (not shown), enters the inner tank 43 from the water passage 42, and is sprayed upward from each spout 45, so that the cleaning liquid 44 is applied to the lead terminal 3 of the IC2. Sprayed and cleaned. The cleaning liquid 44 on the transport rail 6 flows into the reflux port 47 and is refluxed into the outer tank 41. Also, from the side of IC2, slit 32
The cleaning liquid 44 flowing out onto the guide plate 31 flows on the guide plate 31, is blocked by the weir plate 46, falls, flows into the reflux port 47, and is refluxed into the outer tank 41. During this time, the IC2 is transferred to the next water washing tank 15 by the intermittent operation of the claw.

The configuration of this acid cleaning tank 14 is the same as that of the other cleaning tanks 15 and 19, the fluxer 16, and the hot water cleaning tank 2.
0, the shape is almost the same as the finish cleaning tank 21, and the manner in which the water cleaning tanks 15, 19, the warm water cleaning tank 20, the finishing cleaning tank 21, and the fluxer 16 are attached to the conveyor rail 6 is also almost the same, Therefore, the flow path of each cleaning liquid or flux is also the same.

As explained above, the present invention provides a fully automatic IC soldering machine in which each cleaning tank and fluxer are divided into an outer tank and an inner tank, and are installed below the conveyor rail in order to clean the IC with a cleaning liquid. The upper part of the inner tank is sealed with a transport rail, and a spout is provided at the lower part of the transport rail corresponding to the inner tank part through which cleaning liquid or flux from the inner tank is spouted upward.
In addition, the transport rail is equipped with a return port that allows the cleaning fluid or flux ejected from the spout to flow back into the outer tank, making it possible to thoroughly clean the IC before and after soldering, and to use cleaning tanks with different types of cleaning fluids. The cleaning solution does not mix with each other even when a large number of ICs are lined up, and the space required for the soldering device is small, making it highly workable and providing a fully automatic IC soldering device with excellent productivity.

[Brief explanation of drawings]

Figures 1a and b are a plan view and side view showing an embodiment of the present invention, Figure 2 is a perspective view of a case in which an IC is stored, and Figures 3a and b are views of a mechanism for transporting an IC. Figure 3a is an enlarged side view of the X part in Figure 1b, Figure 3b is a sectional view taken along the - line in Figure 3a, and Figure 3c is an enlarged side view of the guide plate in Figure 3b. Cross-sectional views showing other shapes, Figures 4a and 4b show parts of the acid cleaning tank in Figures 1a and b, and Figure 4a is the 1st
FIG. 4b is an enlarged sectional view taken along the line - in FIG. 4a, and FIG. 4b is a sectional view taken along the line - 4 in FIG. 4a. In the figure, 1 is a fully automatic IC soldering machine, and 2 is
IC, 3 is lead terminal, 4 is case, 5 is base,
6 is a transport rail, 7 is a delivery device, 8 is an air cylinder, 9 is a rod, 10 is a transport chain, 11 is a sprocket, 12 is a pawl, 13 is a mounting plate, 14 is an acid cleaning tank, 15 is a water cleaning tank, 16 is a fluxer, 17 is a preheater, 18 is a soldering bath, 19 is a water cleaning bath,
20 is a hot water cleaning tank, 21 is a finishing cleaning tank, 22 is a heater, 23 is a movable rail, 24 is a movable table, 25 is an air cylinder, 26 is a rod, 27 is a storage device,
28 is an air cylinder, 29 is a rod, 30 is a claw,
31 is a guide plate, 32 is a slit, 33 is a holding plate,
41 is an outer tank, 42 is a water passage, 43 is an inner tank, 44 is a cleaning tank, 45 is a spout, 46 is a weir plate, and 47 is a reflux port.

Claims (1)

[Claims] 1. A transport rail that transports an IC to be soldered, a transport chain that transports the IC intermittently,
An acid cleaning tank and a water cleaning tank for cleaning the IC before soldering, a fluxer for fluxing the cleaned IC, a soldering bath for performing soldering, and a washing tank for cleaning the IC after soldering.
In a fully automatic soldering machine in which water cleaning tanks for cleaning ICs are sequentially arranged, each cleaning tank and a fluxer are divided into an outer tank and an inner tank for cleaning the ICs with a cleaning liquid, and the transport rail the upper part of the inner tank is hermetically sealed with the transport rail, and the lower part of the transport rail corresponding to the inner tank is provided with a spout through which the cleaning liquid or flux in the inner tank is spouted upward; A fully automatic soldering device for ICs, characterized in that the conveyance rail is provided with a return port that allows the cleaning liquid or flux spouted from the jet port to flow back into the outer tank.