JPS634691B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing ceramic electronic components characterized by the attachment of lead wires to ceramic electronic components, and more particularly to a method for attaching lead wires at the same time as the step of providing electrodes to ceramic elements. .

Ceramic electronic components such as ceramic capacitors, varistors, and thermistors usually have a structure in which lead wires are soldered to a disk-shaped element and the body is covered with an insulating resin.

As a method for manufacturing such ceramic electronic components, for example, there is a method for manufacturing electrodes as shown in Japanese Patent Publication No. 35-8029, and a method for manufacturing electrodes as shown in Japanese Patent Publication No. 48-42312.
As shown in the above publication, various methods have been devised, such as a method of connecting lead wires to electrodes and sheathing at the same time.

By the way, in such ceramic electronic components, especially when drawing out leads from the element, it is common to form electrodes on the element and then connect lead wires to the electrodes.The manufacturing method thereof is as follows. Sintered body 1 as shown in Fig. 1 a, b
In this method, an element body A to which an electrode 2 is attached is held at a point B where the formed lead wires 3 intersect as shown in FIG. . Here, the lead wire 3 is fixed to the base material 4 with an adhesive tape 5 for holding the element body A and for operational purposes. and,
The soldered element body is as shown in FIG. 3, with solder 6 adhering to the entire surface of the electrode, and lead wire 3 being electrically and mechanically connected. Next, an insulating coating is applied with resin for the purpose of preventing changes in characteristics due to environmental conditions.

In the case of such a manufacturing method, it is necessary to perform soldering and cleaning the flux used during soldering, and an apparatus for this purpose is also required. Furthermore, the flux used during soldering usually has an adverse effect on the characteristics of ceramic electronic components, so it must be carefully cleaned, which is a factor in increasing costs.

The present invention solves these problems. That is, the sintered body before being provided with electrodes is connected to the lead wire 3 as shown in FIG.
After holding at intersection B, an electrode is formed.
When the electrode attachment is completed, the lead wire is attached to the electrode. Therefore, soldering and the accompanying flux cleaning work are not required.

Next, one embodiment of the present invention will be described with reference to FIGS. 4 and 5, with the same numbers assigned to the same parts as above.

In FIG. 4, a varistor element 1', which is a sintered body, is held by a lead wire 3 formed as shown in FIG. Let them come into contact with you. A suitable mask or the like was attached to this, and an electrode 7 was formed on the varistor element 1' so as to cover the lead wire 3 by electrospraying aluminum or copper. This state is shown in Figure 5, where the lead wire 3 holding the varistor element 1'
is fixed by a sprayed electrode 7.
The component is completed by directly coating this element with an insulating resin. The varistor thus obtained exhibited normal characteristics, and the connection strength of the lead wires, together with the adhesion strength of the exterior resin, caused no practical problems. Here, a molded lead wire having spring properties is used as the lead wire 3, and a jig or adhesive tape is used to connect the lead wire 3 and the varistor element 1'.
Of course, it is also possible to use means for fixing.

As described above, the present invention eliminates the need for soldering lead wires and cleaning flux, and also eliminates the need for associated equipment, which has extremely high industrial value.

Although a varistor was used in the embodiment, it goes without saying that similar effects can be obtained with elements having other characteristics. Furthermore, the means for fixing the lead wires is not limited to the content of the embodiment, and the means for applying the electrodes is not limited to metal spraying, but the same effect can be obtained.

[Brief explanation of the drawing]

Figures 1a and b are top and front views of a ceramic element obtained by the conventional method, Figure 2 is a top view showing the element held on a lead wire, and Figure 3 is a ceramic element obtained by the conventional method. FIG. 4 is a top view showing a state in which a varistor element is held on a lead wire to explain the method of the present invention, and FIG. 5 is a top view of a varistor obtained by the method of the present invention. 1'... Ceramic element (varistor element), 3... Lead wire, 5... Adhesive tape, 7... Electrode (metal sprayed electrode).

Claims (1)

[Scope of Claims] 1. Bringing a part of the lead wire into contact with a portion of the ceramic element where the electrode is to be formed, and then forming an electrode on a predetermined portion of the ceramic element so as to cover the lead wire in this state. A method for manufacturing ceramic electronic components, characterized by connecting and fixing lead wires to electrodes. 2. The method of manufacturing a ceramic electronic component according to claim 1, wherein a ceramic element is held by a molded lead wire having spring properties. 3. The method of manufacturing a ceramic electronic component according to claim 1, wherein the lead wire and the ceramic element are fixed using a jig or adhesive tape. 4. A method of manufacturing a ceramic electronic component according to claim 1, wherein the electrodes are formed by thermally spraying a metal onto a ceramic element.