JPS6347089B2 - - Google Patents
Info
- Publication number
- JPS6347089B2 JPS6347089B2 JP15102581A JP15102581A JPS6347089B2 JP S6347089 B2 JPS6347089 B2 JP S6347089B2 JP 15102581 A JP15102581 A JP 15102581A JP 15102581 A JP15102581 A JP 15102581A JP S6347089 B2 JPS6347089 B2 JP S6347089B2
- Authority
- JP
- Japan
- Prior art keywords
- plating layer
- contact
- layer
- copper
- reed switch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
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Description
【発明の詳細な説明】
本発明は主にリードスイツチに用いる電気接点
に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates primarily to electrical contacts used in reed switches.
近時、特に音響機器用として接点の開閉音が低
いリードスイツチの需要が多くなつている。この
リードスイツチは、その接点めつき厚を厚くして
低開閉音を図つたものであるが、この厚めつきを
ただロジウム等の貴金属で厚くしたのでは、コス
ト高なリードスイツチになつてしまう。またこの
種用途のリードスイツチは無負荷或は微少電流の
接点開閉を行うために貴金属の使用量はできるだ
け少ないことが望ましい。 Recently, there has been an increasing demand for reed switches with low contact opening/closing noise, especially for use in audio equipment. This reed switch is designed to have low switching noise by thickening the contact plating, but if the thick plating was simply made thicker with a noble metal such as rhodium, the reed switch would be expensive. In addition, in reed switches for this type of use, it is desirable to use as little precious metal as possible because the contacts can be opened and closed with no load or with a small current.
本発明は上記従来の問題点を簡易に解決させる
もので、これは金属基材上に金めつき下地層を介
して銅めつき層、貴金属めつき層が順次形成され
てなる電気接点により達成できる。 The present invention easily solves the above-mentioned conventional problems, and this is achieved by an electrical contact in which a copper plating layer and a noble metal plating layer are successively formed on a metal base material via a gold plating base layer. can.
以下、本発明の一実施例を添付図面により説明
する。第１図は一般的なリードスイツチを示す
図、第２図は本発明に係るリード片端部の接点構
成を示す断面図である。 An embodiment of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a diagram showing a general reed switch, and FIG. 2 is a cross-sectional view showing a contact configuration at one end of a lead according to the present invention.
第１図において、１と２は52アロイ（52Ni−
48Fe）等からなるリード片、３はリード片１，
２の対向端部を封入したガラス管であり、外部磁
界のリード片１，２の接点端部が磁気吸収し、ま
た、磁界を取り除くとそのばね性で復帰して接点
開閉を行なう。本発明に係るリードスイツチはリ
ード片１，２の接点端部の接点構成が第２図の如
くなつている。すなわち、本接点ではリード片
１，２の表面上に先ず1μm程度の薄い金４をめつ
き形成した後、4μm程度の厚い銅めつき層５を形
成し、しかる後1μm程度の薄いロジウムめつき層
６を形成して製造されている。本接点の如く厚さ
確保のため銅を用いるとリード片との密着性等が
問題となるが、1μm程度の金めつき層４を介在さ
せることにより、これはピンホールの発生もなく
且つ酸化されにくいため密着配の良好な安定した
銅めつき層を形成できる。そして、リードスイツ
チの場合ガラス管３の封着時にリード片１，２に
約1000℃位の熱が加わるが、銅は貴金属に比べ熱
による酸化進行が大きく金めつき層４の密着性が
悪いとその部分がふくれたりはく離する。ところ
が本発明の如く銅下地層を金めつき膜で形成すれ
ば、前述したように密着性は良好なものとなり、
このような事態はほとんど発生しない。 In Figure 1, 1 and 2 are 52 alloy (52Ni-
48Fe) etc., 3 is lead piece 1,
The contact ends of the lead pieces 1 and 2 absorb magnetism from an external magnetic field, and when the magnetic field is removed, the contacts return due to their spring properties to open and close the contacts. The reed switch according to the present invention has a contact configuration at the contact end portions of reed pieces 1 and 2 as shown in FIG. That is, in this contact, a thin gold layer 4 of about 1 μm is first plated on the surfaces of the lead pieces 1 and 2, then a thick copper plating layer 5 of about 4 μm is formed, and then a thin rhodium plating layer of about 1 μm is formed. It is manufactured by forming layer 6. When copper is used to ensure thickness as in this contact, there are problems with adhesion with the lead piece, but by interposing the gold plating layer 4 of about 1 μm, this can be solved without pinholes and without oxidation. Since it is difficult to be coated, a stable copper plating layer with good adhesion can be formed. In the case of a reed switch, heat of approximately 1000°C is applied to the reed pieces 1 and 2 when the glass tube 3 is sealed, but copper oxidizes more easily due to heat than noble metals, and the adhesion of the gold plating layer 4 is poor. And that part swells or peels off. However, if the copper base layer is formed of a gold-plated film as in the present invention, the adhesion will be good as described above.
This situation almost never occurs.
以上の本発明によれば、安価で且つ接点性能の
優れた銅めつき接点を得ることができ、その実用
上の効果は著しいものである。 According to the present invention described above, it is possible to obtain a copper-plated contact which is inexpensive and has excellent contact performance, and its practical effects are remarkable.
第１図はリードスイツチを示す図、第２図は本
発明に係る接点構成を示す断面図である。
〔符号の説明〕 １，２……リード片、３……
ガラス管、４……金めつき層、５……銅めつき
層。
FIG. 1 is a diagram showing a reed switch, and FIG. 2 is a sectional view showing a contact configuration according to the present invention. [Explanation of symbols] 1, 2...Lead piece, 3...
Glass tube, 4...gold plating layer, 5...copper plating layer.
Claims (1)
き層、貴金属めつき層が順次形成されていること
を特徴とした電気接点。 ２ 前記金属基材が磁性材料からなるリード片
で、該リード片端部に前記金めつき下地層、銅め
つき層、貴金属めつき層が形成されたリードスイ
ツチ用接点であることを特徴とした特許請求の範
囲第１項記載の電気接点。[Scope of Claims] 1. An electrical contact characterized in that a copper plating layer and a noble metal plating layer are successively formed on a metal base material via a gold plating base layer. 2. The contact for a reed switch is characterized in that the metal base material is a lead piece made of a magnetic material, and the gold plating base layer, copper plating layer, and noble metal plating layer are formed on the end of the lead piece. An electrical contact according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15102581A JPS5853115A (en) | 1981-09-24 | 1981-09-24 | Copper-plated contact |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15102581A JPS5853115A (en) | 1981-09-24 | 1981-09-24 | Copper-plated contact |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5853115A JPS5853115A (en) | 1983-03-29 |
| JPS6347089B2 true JPS6347089B2 (en) | 1988-09-20 |
Family
ID=15509652
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15102581A Granted JPS5853115A (en) | 1981-09-24 | 1981-09-24 | Copper-plated contact |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5853115A (en) |
-
1981
- 1981-09-24 JP JP15102581A patent/JPS5853115A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5853115A (en) | 1983-03-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19891107 |