JPS6347271B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to improvement of a multilayer hybrid integrated circuit device. A well-known multilayer hybrid integrated circuit is a micromodule. A micromodule is a structure in which desired small circuit elements are built into a plurality of insulating substrates and laminated via through-hole electrodes. Although such micromodules can be miniaturized, there are significant restrictions on the circuit elements that can be incorporated, and they cannot be applied to all circuits. Furthermore, since through-hole electrodes are essential, mass productivity is poor in terms of manufacturing technology.

Therefore, a simplified multilayer structure is shown in FIG. 1 is a hybrid integrated circuit board, 2 is a frame-shaped spacer,
3 is an external lead. In this structure, desired circuit elements are attached to separate hybrid integrated circuit boards 1 in separate steps, and external leads 3 are connected to electrode pads (not shown).
After the two substrates 1, 1 are fixed to each other, the two substrates 1, 1 are integrated with a frame-shaped spacer 2. Therefore, although it can be said to have a multilayer structure on the package, on the circuit it is simply a combination of separate circuits placed close to each other. Furthermore, since the two substrates 1, 1 are manufactured in separate processes, mass production is likely to be a step ahead.

The present invention has been made in view of the above, and an object thereof is to provide a multilayer hybrid integrated circuit device that greatly improves the conventional drawbacks. An embodiment of the present invention will be described in detail below with reference to FIGS. 2 and 3.

The multilayer hybrid integrated circuit according to the present invention includes a metal substrate 10 bent into a U-shape, a circuit element 11 attached to the inner main surface of the substrate 10, and electrode pads 12 provided at at least both ends of the substrate 10. The electrode pad 12
The external lead 13 is fixed to the external lead 13.

The metal substrate 10 is made of aluminum whose surface is anodized to improve heat dissipation and at the same time facilitate bending.

As shown in FIG. 2, such a substrate 10 can be manufactured using conventional manufacturing techniques by forming a desired circuit in a flat plate state. A desired circuit is formed on the substrate 10 by attaching a conductive path 14 made of copper foil, a resistor 15 by screen printing, a transistor, an IC 16, etc. Note that no circuit is formed in the center of the substrate 10 to be bent, but a slit 17 is formed to facilitate bending.

The electrode pads 12 extend the aforementioned conductive paths 14 and are provided at regular intervals on both ends of the substrate 10. Such electrode pads 12 are made to correspond in position to the opposing pads.

The substrate 10 thus prepared is bent into a U-shape at the center, so that the inner main surfaces of the substrate 10 on which the circuit elements 11 are provided face each other at a constant interval.

External leads 13 are fixed to each electrode pad 12 by solder. The tip of the external lead 13 may be formed into a cap shape as shown in FIG. 3, and the cap-shaped tip 18 may be soldered to the opposing electrode pad 12.

In the multilayer hybrid integrated circuit device of the present invention, by using the metal substrate 10, the substrates manufactured in the same process are finally bent into a U-shape, thereby eliminating the need for the conventional frame-shaped spacer and reducing the production time. It has the advantage of improving sexual performance.

Next, since the conductive path 14 cannot be arranged at the bent portion of the board 10, circuits on both sides cannot be connected. However, this drawback can be overcome by the external lead 13 having the capped tip 18. . That is, the turnip-shaped tip 18 can realize both functions of taking out the electrode and electrically connecting both electrodes at the same time. Therefore, unnecessary parts of the external leads 13 can be cut and removed, and vertical connections can be made using the beveled tips 18.

As described in detail above, according to the present invention, a multilayer hybrid integrated circuit device that is extremely easy to mass-produce can be realized by using the U-shaped metal substrate 10 and the dovetail-shaped external leads 13.

[Brief explanation of drawings]

FIG. 1 is a sectional view illustrating a conventional example, and FIGS. 2 and 3 are a plan view and a sectional view illustrating the present invention. Explanation of the main figure numbers: 10 is a metal substrate, 11 is a circuit element, 12 is an electrode pad, 13 is a head-shaped external lead, and 17 is a slit.

Claims (1)

[Claims] 1. A metal substrate bent into a U-shape with a slit in the center, a desired circuit element formed on the inner main surface of the substrate via a thin insulating layer, and electrodes provided corresponding to both ends of the substrate. A pad, an external lead having a cap-shaped tip fixed to the electrode pad, and a cap-shaped connecting body formed by cutting and removing an unnecessary part of the external lead, and the cap-shaped connecting body A multilayer hybrid integrated circuit device characterized by connecting circuits.