JPS6348306B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a B-scope recording method for displaying or recording the defect distribution according to the position in the depth direction of a test material in an ultrasonic flaw detection test.

In general, in ultrasonic flaw detection testing, the method of displaying the A-scope figure as a line by modulating its brightness and displaying the position of the probe on the test material and the propagation time as rectangular coordinates on a cathode ray tube is called the B-scope method. ing. This B-scope method requires (a) a cathode ray tube with memory; (B)
As a recording method, it is necessary to take a picture of the screen on the cathode ray tube.

There is a problem. In particular, when recording using the B-scope method, a photograph of the screen is often not sufficient to accurately determine the position of the defect from the surface and the length of the defect. The present invention was made in order to solve the problem of the B-scope method, and it develops an arbitrary cross section of a test material in a plane and draws it on an It is an object of the present invention to provide a B-scope recording method in an ultrasonic flaw detector that can record positions on an XY recording surface. By the way, in recent years, ultrasonic C-scan equipment, which observes and records the planar distribution of internal defects while sequentially scanning the surface of a test material with an ultrasonic probe in the X-Y direction, has been used for the purpose of evaluating steel materials. Although it is often used in
A major drawback of C-scope projection figures is that information in the depth direction cannot be obtained.

Another object of the present invention is to compensate for the drawbacks of the above-mentioned ultrasonic C-scan device.

That is, the present invention can record and display the position in the thickness direction of an internal defect that cannot be detected with the C-scope method as a planar development, and therefore the internal defect distribution obtained with the C-scope method can be recorded and displayed. If the present invention is applied to a cross section in which an internal defect exists, accurate cross-sectional information can be obtained.

The present invention will be described in more detail below based on the illustrated embodiments.

As shown in the principle configuration in FIG. 1, the probe 2 of the ultrasonic flaw detection device 1 is placed on an arbitrary cross section of the test material 3, preferably on a cross section S where internal defects P and Q are confirmed to exist by C scan. Scan repeatedly.

In response to this repeated scanning on the cross section S of the probe 2, the XY recording device 5 moves the recording pen 6 along the virtual line F on the XY recording surface 5a based on a command from the control circuit 4. Perform a meandering scan as shown. This meandering scan is
When the probe 2 scans once in the forward direction a, the recording pen 6 is scanned in the forward direction c, and then when the probe 2 is scanned in the backward direction b, it is displaced by one pitch in the Y direction. Then, when the recording pen 6 is scanned in the backward direction d, the number of scans n of the probe 2 and the number of meandering times of the recording pen 6 are in a one-to-one correspondence.

As shown in FIG. 2 specifically showing the configuration of the control circuit 4, the control circuit 4 includes a scanning counter that counts the number of scans of the probe 2 (both forward scanning and backward scanning are counted as one). 7 and is reset by the oscillation wave T applied from the ultrasonic flaw detector 1 to the probe 2, and the reflected wave S from the surface of the test material 3 is input from the probe 2 via the ultrasonic flaw detector 1. a clock counter 9 that opens a gate and counts the clock signal CK from the clock generator 8 when
When the count outputs of both counters 7 and 9 match, in other words, a clock signal equal to the number of scans is generated.
The digital comparator 10 outputs a coincidence signal h when the clock counter 9 counts CK.
The basic configuration is to set the JK flip-flop 11 and close the gate of the clock counter 9 using the match signal h.

By shorting its terminal and the K terminal, the JK flip-flop 11 is set by the match signal h and then clocked by the clock generator 8.
The Q output becomes "high" for one pulse of the clock signal CK input from The presence or absence of internal defects is determined during the time width of this flaw detection gate signal G,
When there is an internal defect, a recording signal r is output to the XY recording device 5, and the recording pen 6 is operated at the scanning position to record the internal defect on the XY recording surface 5a.

The operation of the above configuration will now be described.

Now, when an oscillation wave T is emitted from the probe 2 toward the test material 3 while the probe 2 is scanning, as shown in Fig. 3A, a surface reflected wave S, and if there is an internal defect, the oscillation wave T is emitted from the probe 2 to the test material 3. The probe 2 receives the reflected waves in the order of the defect signal F, which is the reflected wave of , and the back surface reflected wave B.

The ultrasonic flaw detector 1 resets the clock counter 9 at the output timing of the oscillation wave T, and the reset clock counter 9 is reset at the timing of the rise of the surface reflected wave S received by the probe 2 as shown in FIG. As shown, the gate is opened and the clock signal CK output from the clock generator 8 starts counting.
This clock signal CK determines the thickness T of the test material 3 by n.
It is set as a pulse having a time width τ corresponding to the equally divided thickness Δ(=T/n), for example, 0.1 mm. Conversely, the time span may be determined in advance and the number of times sufficient to cover the plate pressure may be set.

Assuming that the probe 2 is currently scanning for the third time, the scanning number counter 7 is counting "3", and the digital comparator 10 is indicating that the clock counter 9 is counting "3" from the rise of the surface reflected wave S. When the clock signal CK is counted up, as shown in FIG. At the same time, the JK flip-flop 11 is set.

At this stage, the JK flip-flop 11 receives the third clock signal as shown in FIG.
Ultrasonic flaw detection device 1 with CK as flaw detection gate signal G
to be applied. The ultrasonic flaw detection device 1 determines whether or not there is a defect signal between the pulse widths of the flaw detection gate signal G.

As is clear from the above, this judgment
It corresponds to determining whether or not an internal defect exists in the thickness from 2.△ to 3.△ from the surface of the test material 3, for example, from 0.2 mm to 0.3 mm. Therefore, the number of scans m of the probe 2 means a scan in the thickness from the surface of the test material 3 from (m-1)·Δ to m·Δ.

During any one scan, when the defect wave F is received in accordance with the flaw detection gate signal G, the ultrasonic flaw detection device 1 sends a recording signal r to the XY recording device 5.
The XY recording device 5 operates the recording pen 6 to record the defective wave F on the XY recording surface 5a.
Do it above.

As a result, on the XY recording surface 5a, as shown in FIG. ′, Q′ are recorded.

The positions of these scratch marks P' and Q' in the X direction represent the positions of the internal defects P and Q in the width direction of the test material 3, and the positions in the Y direction represent the positions of the internal defects P and Q in the thickness direction of the test material 3. Correspondingly, in other words, the scratch mark P′,
If we look at the number of meandering lines where Q′ is located,
This makes it possible to easily know the position in the thickness direction.

In the above embodiment, an XY recording device of the XY plotter type was explained, but the present invention is not limited to this.
Any device that can record the position in the direction is sufficient.

As is clear from the above description, the present invention repeatedly performs B-scans on a test material, and establishes flaw detection gates corresponding to sequentially shifting the thickness position of the test material in response to each B-scan. The present invention provides a B-scope recording method for an ultrasonic flaw detection apparatus, characterized in that the synchronization with the defect wave is achieved by applying the B-scope to the defect wave, and the result is recorded on an XY recording surface.

According to the method of the present invention, it is possible to record not only the width direction position but also the thickness position of internal defects on the XY recording surface. Defects can be confirmed, and if used in conjunction with C scan,
This provides the advantage of being able to understand internal defects in the test material three-dimensionally.

Furthermore, the recording method of the present invention further includes a clock generation circuit that determines the feed pitch in the plate pressure direction and a counter that counts the number of repeated scans, and is reset at each timing of ultrasonic transmission and counts the clock. By doing so, processing can be performed more reliably.

[Brief explanation of the drawing]

Fig. 1 is a perspective explanatory diagram showing the principle configuration of the present invention, Fig. 2 is a block explanatory diagram of a control circuit that implements the invention, and Fig. 3 A, B, C, and D explain the operation of the control circuit. FIG. 4 is a plan view showing an example of the recording results. DESCRIPTION OF SYMBOLS 1... Ultrasonic flaw detection device, 2... Probe, 3... Test material, 4... Control circuit, 5... X-Y recording device, 6... Recording pen.

Claims (1)

[Claims] 1 The ultrasonic probe is scanned back and forth in one direction on the surface of the test material, and the recording pen of the XY recording device is moved at a constant pitch on the XY recording surface in conjunction with the back and forth scan of the ultrasonic probe. At the same time, the defect gate signals corresponding to the division of the test material in the thickness direction are sequentially shifted and output for each scanning run of the ultrasonic probe. When the signal and the flaw detection signal of the ultrasonic probe match, record on the XY recording surface with the recording pen, and record the position of the flaw in the scanning direction and the thickness direction of the flaw. A B scope recording method in an ultrasonic flaw detection device, characterized in that recording is performed on a Y recording surface.