JPS6353263B2 - - Google Patents
Info
- Publication number
- JPS6353263B2 JPS6353263B2 JP54129147A JP12914779A JPS6353263B2 JP S6353263 B2 JPS6353263 B2 JP S6353263B2 JP 54129147 A JP54129147 A JP 54129147A JP 12914779 A JP12914779 A JP 12914779A JP S6353263 B2 JPS6353263 B2 JP S6353263B2
- Authority
- JP
- Japan
- Prior art keywords
- copper tape
- solder
- tape
- rolls
- roll
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 31
- 229910052802 copper Inorganic materials 0.000 claims description 31
- 239000010949 copper Substances 0.000 claims description 31
- 229910000679 solder Inorganic materials 0.000 claims description 27
- 238000007747 plating Methods 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 10
- 238000005476 soldering Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 5
- 230000004907 flux Effects 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
- C23C26/02—Coating not provided for in groups C23C2/00 - C23C24/00 applying molten material to the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
- B23K35/007—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of copper or another noble metal
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Coating With Molten Metal (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Description
【発明の詳細な説明】
本発明は銅テープへの部分半田メツキ方法に係
り、特に半田メツキ厚さを一様にするのに好適な
部分半田メツキ方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for selectively soldering a copper tape, and more particularly to a method for selectively soldering a copper tape to a method suitable for making the solder plating thickness uniform.
さきに本発明の出願人は、加熱されている上下
一対のロール間で銅テープと該ロールにより加熱
溶融された半田線とを接触させて銅テープ上へ溶
融半田を部分メツキする方法を提案（特公昭58−
43181号公報）したが、上記ロール間を通過後の
銅テープをそのまま同一水平面上に引き取るよう
にしているので、ロール間を通過直後の銅テープ
上の溶融半田が周囲に不定形に流れることによ
り、銅テープ上の半田メツキ厚さが一様になら
ず、以後の半田付けに悪い影響を与えていた。 First, the applicant of the present invention proposed a method of partially plating molten solder onto a copper tape by bringing the copper tape into contact with the solder wire heated and melted by the rolls between a pair of heated upper and lower rolls ( Special Public Service 1978-
However, since the copper tape after passing between the rolls is taken up on the same horizontal plane, the molten solder on the copper tape immediately after passing between the rolls flows around it in an amorphous manner. However, the thickness of the solder plating on the copper tape was not uniform, which adversely affected subsequent soldering.
本発明は上記に鑑みてなされたもので、その目
的とするところは、半田メツキ厚さを一様にする
ことができる銅テープへの部分半田メツキ方法を
提供することにある。 The present invention has been made in view of the above, and an object of the present invention is to provide a method for selectively soldering a copper tape, which can make the solder plating thickness uniform.
即ち、本発明の要旨は、予め半田メツキすべき
部分に半田メツキ用フラツクスを塗布した銅テー
プを上下に配列された一対の加熱ロール間を通過
されると共に、前記加熱ロールのうち上下ロール
の素材供給側の周端面に半田メツキ用半田材を供
給して溶融し、前記加熱ロール間で前記溶融半田
を前記銅テープの前記半田メツキすべき部分に接
触付着させ、加熱ロール間を通過後前記により溶
融半田が接触付着された銅テープを上方ロール側
に登り勾配を持たらせながら張力を作用させて一
定速度で引き取ることを特徴とする銅テープへの
部分半田メツキ方法にある。 That is, the gist of the present invention is that a copper tape coated with solder flux on the portion to be soldered in advance is passed between a pair of heating rolls arranged vertically, and the material of the upper and lower rolls of the heating rolls is A solder material for solder plating is supplied to the peripheral end surface of the supply side and melted, and the molten solder is brought into contact with and adhered to the part of the copper tape to be soldered between the heating rolls, and after passing between the heating rolls, the solder material is melted. This method of partially soldering a copper tape is characterized in that the copper tape to which molten solder is attached is pulled up at a constant speed by applying tension while making the copper tape have an upward slope toward the upper roll side.
次に添付図面により本発明銅テープへの部分半
田メツキ方法の一実施例を説明する。 Next, an embodiment of the method for selectively soldering a copper tape according to the present invention will be described with reference to the accompanying drawings.
図は本発明の方法の一実施例を説明するための
部分半田メツキ装置の一例を示す説明図である。
図において、１は予め半田メツキすべき所定部分
に半田メツキ用フラツクスを塗布した厚さ（0.09
mm、幅120mmのテープ状銅板（本発明では銅テー
プと称する。）、２は外径0.2mmの半田線、３は幅
10mm、直径100mmの銅製の上ロール、４は幅30mm、
直径100mmの鉄製の下ロールで、上、下ール３，
４は夫々バーナー５で加熱されており、上ロール
３は280〜300℃、下ロールは約500℃にしてある。
このような状態のときに、下ロール４を図中矢印
方向に回転駆動して、ロール３，４間に銅テープ
１を通過させるとともに上ロール３の素材供給側
の周端面に半田線２を供給し、ロール３，４間で
銅テープ１の予め半田メツキ用フラツクスを塗布
してある部分に上ロール３により溶融された半田
線２を接触付着させる。一方、ロール３，４間を
通過することにより溶融半田を付着させた銅テー
プ１は、ロール３，４間より約30mm上方に設けた
ガイドロール６を介して上ロール３側に登り勾配
を持たせながら図中矢印方向に回転している巻取
機７により所定の張力を作用させて一定速度で引
き取る。尚、８は半田プール部である。 The figure is an explanatory diagram showing an example of a partial solder plating apparatus for explaining an embodiment of the method of the present invention.
In the figure, 1 is the thickness (0.09
mm, width 120mm tape-shaped copper plate (referred to as copper tape in the present invention), 2 is solder wire with outer diameter 0.2mm, 3 is width
10mm, diameter 100mm copper upper roll, 4 is 30mm wide,
Upper and lower rolls 3, 100mm diameter iron lower rolls,
4 are heated by burners 5, respectively, with the upper roll 3 at 280-300°C and the lower roll at about 500°C.
In this state, the lower roll 4 is rotated in the direction of the arrow in the figure to pass the copper tape 1 between the rolls 3 and 4, and at the same time, the solder wire 2 is applied to the peripheral end surface of the upper roll 3 on the material supply side. Then, between the rolls 3 and 4, the molten solder wire 2 is brought into contact with and adhered by the upper roll 3 to the part of the copper tape 1 to which solder plating flux has been previously applied. On the other hand, the copper tape 1 to which molten solder is attached by passing between the rolls 3 and 4 has an upward slope toward the upper roll 3 via a guide roll 6 provided approximately 30 mm above the roll 3 and 4. A predetermined tension is applied by the winding machine 7, which rotates in the direction of the arrow in the figure while moving, and the film is taken off at a constant speed. Note that 8 is a solder pool portion.
上記した本発明の実施例によれば、ロール間を
通過直後の銅テープ上の溶融半田はいずれも自重
により流れ落ちるために、結果として銅テープ１
に対する半田メツキ厚さは例えば30μ±10μと一
様な厚さとなり、半田メツキ作業も非常に安定な
ものとなる。 According to the embodiment of the present invention described above, the molten solder on the copper tape immediately after passing between the rolls flows down due to its own weight, and as a result, the copper tape 1
The solder plating thickness is uniform, for example, 30μ±10μ, and the solder plating work is also very stable.
尚、図に示してある装置では、下ロール４を回
転駆動した状態で、上、下ロール３，４間に銅テ
ープ１を挿入すると銅テープ１の走行にともなつ
て上ロール３との回転するようになつているが、
上ロール３は固定としてもよく、同一の効果が得
られる。尚、ロール加熱源としてバーナー５を用
いているが、他の加熱源でもよく、特に固定ロー
ルとする場合は、電熱器を組み込むようにしても
よい。 In the device shown in the figure, when the copper tape 1 is inserted between the upper and lower rolls 3 and 4 while the lower roll 4 is being driven to rotate, the rotation with the upper roll 3 will occur as the copper tape 1 runs. Although it is becoming more and more
The upper roll 3 may be fixed, and the same effect can be obtained. Incidentally, although the burner 5 is used as the roll heating source, other heating sources may be used, and especially when a fixed roll is used, an electric heater may be incorporated.
以上説明したように、本発明によれば、非常に
簡単な方法により銅テープに対する半田メツキ厚
さを一様にすることができ、同時に半田メツキ作
業を安定なものとすることができるという効果が
ある。 As explained above, according to the present invention, the thickness of solder plating on copper tape can be made uniform by a very simple method, and at the same time, the solder plating work can be made stable. be.
図は本発明銅テープへの部分半田メツキ方法の
一実施例説明図である。
１：銅テープ、２：半田線、３：上ロール、
４：下ロール、５：バーナー、６：ガイドロー
ル、７：巻取機。
The figure is an explanatory diagram of an embodiment of the method of partially soldering a copper tape according to the present invention. 1: Copper tape, 2: Solder wire, 3: Top roll,
4: Lower roll, 5: Burner, 6: Guide roll, 7: Winder.
Claims (1)
ラツクスを塗布した銅テープを上下に配列された
一対の加熱ロール間を通過させると共に、前記加
熱ロールのうち上方ロールの素材供給側の周端面
に半田メツキ用半田材を供給して溶融し、前記加
熱ロール間で前記溶融半田を前記銅テープの前記
半田メツキすべき部分に接触付着させ、加熱ロー
ル間を通過後前記により溶融半田が接触付着され
た銅テープを上方ロール側に登り勾配を持たらせ
ながら張力を作用させて一定速度で引き取ること
を特徴とする銅テープへの部分半田メツキ方法。1. A copper tape coated with solder-plating flux on the part to be soldered in advance is passed between a pair of heating rolls arranged vertically, and solder-plating is applied to the peripheral end surface of the upper roll on the material supply side of the heating rolls. The molten solder is applied to the portion of the copper tape to be soldered between the heating rolls, and after passing between the heating rolls, the molten solder is applied to the copper tape. A method for selectively soldering copper tape, characterized by applying tension to the tape and pulling it off at a constant speed while making the tape have an upward slope on the upper roll side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12914779A JPS5655559A (en) | 1979-10-05 | 1979-10-05 | Partial solder plating method to copper tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12914779A JPS5655559A (en) | 1979-10-05 | 1979-10-05 | Partial solder plating method to copper tape |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5655559A JPS5655559A (en) | 1981-05-16 |
| JPS6353263B2 true JPS6353263B2 (en) | 1988-10-21 |
Family
ID=15002287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12914779A Granted JPS5655559A (en) | 1979-10-05 | 1979-10-05 | Partial solder plating method to copper tape |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5655559A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105886989B (en) * | 2016-06-03 | 2018-05-08 | 苏州宇邦新型材料股份有限公司 | Prepare the device of welding and its prepare the method for welding |
| PL249244B1 (en) * | 2023-03-29 | 2026-03-16 | Grundy Metals Spolka Z Ograniczona Odpowiedzialnoscia | Method for manufacturing soldering layer materials based on copper and silver alloy |
-
1979
- 1979-10-05 JP JP12914779A patent/JPS5655559A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5655559A (en) | 1981-05-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3707102A (en) | Film perforating apparatus | |
| JPS54138371A (en) | Solder supplying method | |
| JPS6353263B2 (en) | ||
| US3696777A (en) | Machines for forming wound rolls of sheet material | |
| JPS5582676A (en) | Heat-sensitive transfer recording device | |
| GB920135A (en) | Marking apparatus | |
| JP3623703B2 (en) | Electronic component soldering equipment | |
| JPS631385Y2 (en) | ||
| US3251179A (en) | Material twisting apparatus | |
| US1334947A (en) | Apparatus for and method of manufacturing mounted gold-leaf | |
| JPS603905B2 (en) | Hand-type soldering wire drawing tool | |
| US3845383A (en) | Method and apparatus for inspection of ferro-magnetic billets | |
| JPH0543903Y2 (en) | ||
| US2360037A (en) | Coating apparatus | |
| SU103061A1 (en) | Alloy Coating Machine | |
| JPS5967065A (en) | Transfer type heat sensitive recorder | |
| US1804911A (en) | Core covering apparatus | |
| JPS55235A (en) | Recording | |
| FR2480163A1 (en) | Automatic solder wire feeder for soldering iron - where feeder motor is driven by electronic speed control and timing circuit | |
| JPS58124265U (en) | Thermal heater in hot melt adhesive applicator | |
| JPS6315920B2 (en) | ||
| USRE21028E (en) | Method and apparatus fob joining | |
| JPH0671958B2 (en) | Automatic cutting and winding device for strips such as films | |
| JPS61169272A (en) | Recorder | |
| JPS60103575U (en) | Core wire straightening feeding device |