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JPS6353717B2 - - Google Patents
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JPS6353717B2 - - Google Patents

Info

Publication number
JPS6353717B2
JPS6353717B2 JP16697283A JP16697283A JPS6353717B2 JP S6353717 B2 JPS6353717 B2 JP S6353717B2 JP 16697283 A JP16697283 A JP 16697283A JP 16697283 A JP16697283 A JP 16697283A JP S6353717 B2 JPS6353717 B2 JP S6353717B2
Authority
JP
Japan
Prior art keywords
optical waveguide
reflective coating
coating film
laser
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP16697283A
Other languages
Japanese (ja)
Other versions
JPS6057991A (en
Inventor
Noryuki Hirayama
Masaaki Ooshima
Naoki Takenaka
Yukihiro Kino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP58166972A priority Critical patent/JPS6057991A/en
Publication of JPS6057991A publication Critical patent/JPS6057991A/en
Publication of JPS6353717B2 publication Critical patent/JPS6353717B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/40Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4031Edge-emitting structures

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)

Description

【発明の詳細な説明】 産業上の利用分野 この発明は、オプトエレクトロニクス分野にお
ける光フアイバ通信などの光源として用いる多波
長半導体レーザに関する。
DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application This invention relates to a multi-wavelength semiconductor laser used as a light source for optical fiber communications in the field of optoelectronics.

従来例の構成とその問題点 従来、半導体レーザは光フアイバ通信をはじめ
として、光情報処理や光応用機器等の光源として
大きく期待され、すでに長寿命化、性能の飛躍的
な向上に伴い実用化段階に入つているが、その多
くのものは半導体レーザ単体から単一波長の発光
を得るもので、例えば光フアイバ通信において
は、まだ光フアイバの価格が高い等の経済的理由
やさらに大容量の情報伝送を達成しようという目
的から、波長多重通信における多波長半導体レー
ザの実現が今後の課題となつている。
Conventional configurations and their problems Semiconductor lasers have traditionally held great promise as light sources for optical fiber communications, optical information processing, optical application equipment, etc., and have already been put into practical use due to longer lifespans and dramatic improvements in performance. However, most of these devices emit light of a single wavelength from a single semiconductor laser.For example, in optical fiber communications, there are economical reasons such as the high price of optical fibers and the need for larger capacity. With the aim of achieving information transmission, the realization of multi-wavelength semiconductor lasers for wavelength division multiplexing communications is a future challenge.

通常の半導体レーザの構造は、安定な単一横モ
ードおよび低しきい値電流等の要請から、接合に
平行な方向において、屈折率に段差を設けて活性
層内への光の閉じ込めを良くしたものや、活性層
の両側を電流ブロツク層とすることで電流の閉じ
込めを良くしたもの等の工夫をこらしたものが一
般的である。多波長の半導体レーザの達成のため
に考えられることは、バンドギヤツプの異なる活
性層をいくつか設ければよいが、前述のような構
造を有する半導体レーザにおいては、接合に平行
な方向に並列にバンドギヤツプの異なる活性層を
設けることは結晶成長不可能であり、したがつて
バンドギヤツプの異なる活性層は接合に垂直な成
長方向に設けざるを得ない。第1図はInP基板3
上にバンドギヤツプの異なるInGaAsP活性層1,
2を二層設けて二重DH構造とした二波長半導体
レーザの従来例で、その概略断面図である。3は
基板、4,5,6はクラツド層である。波長の異
なる二つのレーザ光は端子T3−T1間に電流I1を、
端子T3−T2間に電流I2を流すことにより、
InGaAsP第1活性層1、InGaAsP第2活性層2
から取り出される。この構造では、バンドギヤツ
プの異なる活性層を設けることはできても、今度
は接合に平行な方向において、それぞれの活性層
の両側に屈折率の段差を設けたり、電流ブロツク
層を設けることが難しいため、横モードの安定化
および単一化やしきい値電流の低域は困難であ
る。すなわち、従来へき開を用いて形成した共振
器面からレーザ光を取り出す構造の半導体レーザ
においては、極めてへき開工程が繁雑であるとと
もに多波長化を図るためにバンドギヤツプの異な
る活性層をいくつか設けることと、横モードの安
定化および単一化やしきい値電流の低減を図るこ
ととが両立できない問題点があつた。
In order to meet the requirements for a stable single transverse mode and low threshold current, the structure of a typical semiconductor laser is designed to improve the confinement of light within the active layer by providing a step in the refractive index in the direction parallel to the junction. In general, the active layer is made of a thin film, or it is made with a device that uses current blocking layers on both sides of the active layer to improve current confinement. A conceivable way to achieve a multi-wavelength semiconductor laser is to provide several active layers with different band gaps, but in a semiconductor laser with the structure described above, band gaps may be formed in parallel in the direction parallel to the junction. It is impossible to provide active layers with different band gaps due to crystal growth, and therefore active layers with different band gaps must be provided in the growth direction perpendicular to the junction. Figure 1 shows InP substrate 3
InGaAsP active layer 1 with different band gaps on top,
2 is a schematic cross-sectional view of a conventional example of a two-wavelength semiconductor laser having a double DH structure by providing two layers. 3 is a substrate, and 4, 5, and 6 are cladding layers. Two laser beams with different wavelengths generate a current I 1 between terminals T 3 - T 1 ,
By passing current I 2 between terminals T 3T 2 ,
InGaAsP first active layer 1, InGaAsP second active layer 2
taken from. In this structure, although it is possible to provide active layers with different band gaps, it is difficult to provide a step in the refractive index on both sides of each active layer in the direction parallel to the junction, or to provide a current blocking layer. However, it is difficult to stabilize and unify the transverse mode and to lower the threshold current. In other words, in conventional semiconductor lasers with a structure in which laser light is extracted from a cavity surface formed using cleavage, the cleavage process is extremely complicated, and in order to achieve multiple wavelengths, it is necessary to provide several active layers with different band gaps. However, there was a problem in that it was not possible to simultaneously stabilize and unify the transverse mode and reduce the threshold current.

発明の目的 本発明は、安定な単一横モードおよび単一縦モ
ードで波長の異なるレーザ光を基板裏面から取り
出す多波長半導体レーザを得ることを目的とす
る。
OBJECTS OF THE INVENTION The object of the present invention is to obtain a multi-wavelength semiconductor laser that extracts laser beams of different wavelengths from the back surface of a substrate in a stable single transverse mode and a single longitudinal mode.

発明の構成 この発明は、レーザ光をへき開により形成した
共振器面から取り出すのではなく、光導波路の軸
方向に対してほぼ45゜の角度をもつ共振器面を光
導波路の両端に形成して、レーザ光を鏡面研磨を
ほどこした基板裏面から取り出す構造とし、前記
ほぼ45゜の角度をもつ共振器面と基板裏面に反射
コーテイング膜を設け、さらに光導波路内の一部
に屈折率の異なる領域を設けて単一縦モード化を
図つた以上の構造を、ゲインピークの位置が反射
コーテイング膜の膜厚によつて変わることを利用
し、前記反射コーテイング膜の膜厚をそれぞれ変
えて光導路の軸方向にアレイ化した構造とするこ
とにより、前記問導点を解決すべく横モードの安
定化および単一化を図つた活性層を一層設けるだ
けで波長の異なるレーザ光をそれぞれ安定な単一
横モードおよび単一縦モードで基板裏面から取り
出すことを可能にした多波長半導体レーザであ
る。
Structure of the Invention This invention does not extract laser light from a resonator surface formed by cleavage, but instead forms resonator surfaces at both ends of an optical waveguide that have an angle of approximately 45° with respect to the axial direction of the optical waveguide. , the laser beam is extracted from the mirror-polished back surface of the substrate, a reflective coating film is provided on the resonator surface having an angle of approximately 45 degrees and the back surface of the substrate, and a region with a different refractive index is provided in a part of the optical waveguide. By using the above structure in which a single longitudinal mode is achieved by providing a single longitudinal mode, the position of the gain peak changes depending on the thickness of the reflective coating film. By creating an arrayed structure in the axial direction, laser beams of different wavelengths can be stably unified by simply providing one layer of active layer that stabilizes and unifies the transverse mode in order to solve the problem mentioned above. This is a multi-wavelength semiconductor laser that can be extracted from the backside of a substrate in both a transverse mode and a single longitudinal mode.

実施例の説明 以下に図面をもとに、実施例にてこの発明を詳
細に説明する。
DESCRIPTION OF EMBODIMENTS The present invention will be described in detail below with reference to the drawings.

まず、この発明では次に説明する二つの点を利
用している。
First, this invention utilizes the following two points.

〔1〕 共振器面に反射コーテイング膜を設ける
とその膜厚によつて本来のゲインピークの位
置、すなわち発光波長が変わる。
[1] When a reflective coating film is provided on the resonator surface, the position of the original gain peak, that is, the emission wavelength changes depending on the film thickness.

〔2〕 光導波路内の一部に屈折率の異なる領域
を設けて実効的に二つの合成された共振器をも
つ半導体レーザ(Internal−Reflection−
Interference−Laser:以下IRIレーザと略す)
では、安定した単一縦モードが得られる。
[2] Semiconductor laser (Internal-Reflection-
Interference-Laser: Hereafter abbreviated as IRI laser)
In this case, a stable single longitudinal mode is obtained.

最初に〔1〕について説明すると、通常半導体
レーザはへき開を用いて形成した一対の共振器面
を持ち、光導波路内の光は空気層に対して共振器
面において反射をくり返す。この際、光導波路が
InGaAsPである場合、波長1.3μmの光に対する屈
折率は3.529で空気層の屈折率を1に等しいとす
ると反射率は約31.2%である。この共振器面に例
えばSiO2膜を設けると光導波路内の光は、光導
波路とSiO2膜の界面およびSiO2膜と空気層の界
面において反射し、膜の膜厚によつて反射光に位
相差が生じる。この結果本来のゲインピークの位
置が変化し、すなわち、発光波長が変化する。第
2図は接合に平行な方向において、活性層の両側
に屈折率の段差および電流ブロツク層を設けた構
造の1.3μm帯InGaAsP/InP系半導体レーザの共
振器面に、SiO2/Au,SiO2/Siから成る反射コ
ーテイング膜を設けた場合の膜厚とゲインピーク
の位置の関係を示す。ここでSiO2膜はAuおよび
Siを通してのリーク電流を防ぐために絶縁膜とし
て用いている。また波長1.3μmの光に対するSiO2
の屈折率は1.47で、SiO2膜だけを設けた場合、反
射率は20%以下となり、前述の31.2%に比べて共
振器内部の利得をかせげないので、一方の共振器
面には反射率の高いAuをSiO2膜上に設けてほぼ
全反射とし、もう一方の共振器面には屈折率が
InGaAsPにほぼ等しい(3.5)SiをSiO2膜上に設
けて反射率を上げるとともにレーザ光の取出面と
している。第2図は半導体レーザ7の側面図であ
る。この図において、次の5つの条件における発
光スペクトルを第3図に示す。
First, to explain [1], a semiconductor laser normally has a pair of resonator surfaces formed using cleavage, and light within an optical waveguide is repeatedly reflected at the resonator surfaces against an air layer. At this time, the optical waveguide
In the case of InGaAsP, the refractive index for light with a wavelength of 1.3 μm is 3.529, and assuming that the refractive index of the air layer is equal to 1, the reflectance is about 31.2%. For example, if a SiO 2 film is provided on this cavity surface, the light inside the optical waveguide will be reflected at the interface between the optical waveguide and the SiO 2 film and the interface between the SiO 2 film and the air layer, and the reflected light will change depending on the thickness of the film. A phase difference occurs. As a result, the position of the original gain peak changes, that is, the emission wavelength changes. Figure 2 shows, in the direction parallel to the junction, SiO 2 /Au, SiO The relationship between the film thickness and the position of the gain peak when a reflective coating film made of 2 /Si is provided is shown. Here the SiO2 film is Au and
It is used as an insulating film to prevent leakage current through Si. Also, SiO 2 for light with a wavelength of 1.3 μm
has a refractive index of 1.47, and when only the SiO 2 film is provided, the reflectance is less than 20%, which does not increase the gain inside the cavity compared to the 31.2% mentioned above, so one cavity surface has a reflectance. Au with a high refractive index is placed on the SiO 2 film to achieve almost total reflection, and the other cavity surface has a high refractive index.
Si, which is approximately the same as InGaAsP (3.5), is placed on the SiO 2 film to increase the reflectance and serve as the laser beam extraction surface. FIG. 2 is a side view of the semiconductor laser 7. In this figure, the emission spectra under the following five conditions are shown in FIG.

反射コーテイング膜なし。 No reflective coating.

半導体レーザ7の一端面にSiO2(2210Å)層
8の上にAu(〜3000Å)層9を形成。
On one end surface of the semiconductor laser 7, an Au (~3000 Å) layer 9 is formed on the SiO 2 (2210 Å) layer 8.

半導体レーザ7の一端面にSiO2(2210Å)層
8の上にAu(〜3000Å)層9、半導体レーザ7
の他端面にSiO2(2210Å)層10を形成。
On one end surface of the semiconductor laser 7, an Au (~3000 Å) layer 9 is placed on the SiO 2 (2210 Å) layer 8, and the semiconductor laser 7
A SiO 2 (2210 Å) layer 10 is formed on the other end surface.

層8,9の他にSiO2層10の上にSi(2210
Å)層11を形成。
In addition to layers 8 and 9 , Si (2210
Å) Forming layer 11.

層8〜11の他に、さらにSi(317Å)層12
を形成。
In addition to layers 8 to 11, there is also a Si (317 Å) layer 12.
form.

第3図においては、本来のゲインピークの位置
1.289μmを反射コーテイング膜の膜厚を変えるこ
とにより1.305μmまで160Åずらすことを可能と
している。なおSiO2膜は1/4波長の膜厚(波長
1.3μmの光はSiO2中ではその屈折率1.47で割つた
値となり、1/4波長は2210Åとなる)とし、各界
面における反射光の位相を合わせているので条件
,の場合は、ゲインピークの位置はほとんど
変化していない。このように反射コーテイング膜
の膜厚によつてゲインピークの位置が変化するこ
とは、レーザ光の取出面をいくつか設けて、それ
ぞれ膜厚の異なる反射コーテイング膜を設けれ
ば、一つの活性層から多波長の発光を得ることを
可能とする。
In Figure 3, the position of the original gain peak is
By changing the thickness of the reflective coating film, it is possible to shift the distance from 1.289 μm by 160 Å to 1.305 μm. Note that the SiO 2 film has a film thickness of 1/4 wavelength (wavelength
1.3 μm light is divided by its refractive index of 1.47 in SiO 2 , and the 1/4 wavelength is 2210 Å), and the phase of the reflected light at each interface is matched, so in the case of the condition, the gain peak The position has hardly changed. This change in the position of the gain peak depending on the thickness of the reflective coating film can be solved by providing several laser beam extraction surfaces, each with a reflective coating film of different thickness. It is possible to obtain multi-wavelength light emission from

次に〔2〕について説明すると、一般に通常の
半導体レーザの縦モードは温度によつてある一つ
の縦モードから隣りの縦モードへといわゆるモー
ドホツピングを起し、安定した単一縦モードを得
ることが難しいが、前記IRIレーザでは本来の共
振器から得られるゲインスペクトルが、屈折率の
異なる領域で二分されて実効的に合成された二つ
の共振器を持つことにより、二つのゲインピーク
を持つ分割された形となり、本来のゲインスペク
トルのスペクトル幅よりもそれぞれが狭いスペク
トル幅を持つ。したがつてそれぞれ分割された二
つのゲインピークは、本来のゲインピークにおけ
るよりも、ピークとなる縦モードと隣りの縦モー
ドとの強度比が大きくなり、さらに二つのゲイン
ピークが離れているので相方でモードホツピング
を起こすこともなく、結果的にどちらかのゲイン
ピークが支配的となつて安定した単一縦モードと
なる。
Next, to explain [2], in general, the longitudinal mode of a normal semiconductor laser causes so-called mode hopping from one longitudinal mode to the next longitudinal mode depending on the temperature, and a stable single longitudinal mode is obtained. However, with the IRI laser, the gain spectrum obtained from the original resonator has two gain peaks because it has two resonators that are divided into two regions with different refractive indexes and effectively combined. It becomes a divided form, and each has a narrower spectral width than the original gain spectrum. Therefore, each of the two divided gain peaks has a larger intensity ratio between the peak longitudinal mode and the adjacent longitudinal mode than the original gain peak, and since the two gain peaks are further apart, As a result, one of the gain peaks becomes dominant, resulting in a stable single longitudinal mode.

第4図イは第2図で用いたものと同様な横モー
ドの安定化を図つた構造をもつ1.3μm帯InGaAsP
系導体レーザ8であり、その光導波路内の一部に
Zn拡散にて屈折率の異なる領域9を設けて、共
振器長L〜272μm,L1〜153μm,L2〜112μmに分
割(ただしZn拡散領域幅D〜7μm)している。
そのときの周波数スペノトルをロ,ハに示す。動
作電流が小さい時には分割された二つの共振器に
よつて二つのゲインピークが得られるが動作電流
を増やすと一つが支配的になり、単一縦モードが
達成されている。ここでは二つのゲインピークの
間隔が64Åあるが、L1,L2を変えることによつ
てさらに狭くすることが可能である。また第5図
は縦モードの温度特性で、温度による波長変化は
通常の半導体レーザにおける〜3Å/℃に比べて
0.77Å/℃と小さく、30℃の温度範囲にわたりモ
ードホツピングを起さず単一縦モードを達成して
いる。このように安定な単一縦モードを達成でき
ることは、前述の反射コーテイング膜によつて多
波長化を図る際にそれぞれの発光の単一縦モード
化を可能とし、波長多重通信における多波長半導
体レーザを実現せしめるものである。
Figure 4A shows a 1.3μm band InGaAsP with a structure designed to stabilize the transverse mode, similar to the one used in Figure 2.
system conductor laser 8, and a part of the optical waveguide is
Regions 9 having different refractive indexes are provided by Zn diffusion, and are divided into resonator lengths L~272 μm, L1 ~153 μm, and L2 ~112 μm (however, the Zn diffusion region width D~7 μm).
The frequency spectrum at that time is shown in B and C. When the operating current is small, two gain peaks are obtained by the two divided resonators, but when the operating current is increased, one becomes dominant and a single longitudinal mode is achieved. Here, the interval between the two gain peaks is 64 Å, but it can be made even narrower by changing L 1 and L 2 . Also, Figure 5 shows the temperature characteristics of the longitudinal mode, and the wavelength change due to temperature is ~3 Å/℃ compared to a normal semiconductor laser.
It is as small as 0.77 Å/°C and achieves a single longitudinal mode without mode hopping over a temperature range of 30°C. Achieving a stable single longitudinal mode in this way makes it possible to convert each light emission into a single longitudinal mode when multi-wavelength is achieved using the reflective coating film mentioned above, and is useful for multi-wavelength semiconductor lasers in wavelength division multiplexing communications. This is what makes this happen.

以上説明した二つの点を利用した、この発明に
もとづく1.3μm帯InGaAsP/InP系三波長半導体
レーザの斜視図を第6図に示す。10は光導波路
の軸方向である〈011〉方向に対してほぼ45゜の角
度をもつ共振器面で〈011〉方向にV字状溝を通
常のホトリソグラフイ技術とBr−CH3OH溶液で
エツチングすることにより形成される。11aは
共振器面10上に設けたSiO2蒸着膜、11b,
11cは鏡面研磨をほどこした基板裏面に設けた
SiO2蒸着膜、、12a,12bはそれぞれSiO2
着膜11a,11b上に設けたAu蒸着膜、13
a,13b,13cはSiO2蒸着膜11c上に設
けたSi蒸着膜で、SiO2蒸着膜とAu蒸着膜11
a/12a,11b/12bおよびSiO2蒸着膜
とSi蒸着膜11c/13a,11c/13b,1
1c/13cで反射コーテイング膜を形成する。
14はZn拡散により〈011〉方向にストライプ
状に形成された拡散領域で、光導波路内の一部に
屈折率の異なる領域を与えるとともに光導波路を
l1,l2の長さに分割する。反射コーテイング膜1
1a/12a,11b/12b,11c/13
a,11c/13b,11c/13cと拡散領域
14はいずれも通常のホトリソグラフイ技術を用
いて形成される。
FIG. 6 shows a perspective view of a 1.3 μm band InGaAsP/InP based three-wavelength semiconductor laser based on the present invention, which utilizes the two points explained above. 10 is a resonator plane having an angle of approximately 45° to the <011> direction, which is the axial direction of the optical waveguide, and a V-shaped groove in the <011> direction was formed using normal photolithography technology and a Br-CH 3 OH solution. It is formed by etching. 11a is a SiO 2 vapor deposited film provided on the resonator surface 10, 11b,
11c was provided on the back surface of the mirror-polished board.
SiO 2 vapor deposited films, 12a and 12b are Au vapor deposited films provided on the SiO 2 vapor deposited films 11a and 11b, respectively.
a, 13b, 13c are Si vapor deposited films provided on the SiO 2 vapor deposited film 11c, and the SiO 2 vapor deposited film and the Au vapor deposited film 11
a/12a, 11b/12b and SiO 2 vapor deposited film and Si vapor deposited film 11c/13a, 11c/13b, 1
1c/13c to form a reflective coating film.
14 is a diffusion region formed in a stripe shape in the <011> direction by Zn diffusion, which provides a region with a different refractive index to a part of the optical waveguide and also
Divide into lengths l 1 and l 2 . Reflective coating film 1
1a/12a, 11b/12b, 11c/13
a, 11c/13b, 11c/13c and the diffusion region 14 are all formed using normal photolithography techniques.

第7図は第6図のA−A′線すなわち(011)
通における断面図である。15はn形InP基板、
21はn形InPクラツド層、22はInGaAsP活性
層、23はP形InPクラツド層、24はP形
InGaAsPキヤツプ層、25はP形InP層、26は
n形InP層である。P形InP層25、n形InP層2
6は接合に平行な方向において、InGaAsP活性
層22の両側に屈折率の段差を設けるとともに電
流ブロツク層として横モードの安定化および単一
化を図つている。第8図は第6図のB−B′線す
なわち(011)面における断面図で共振器内の光
導波の模様を示す。第8図からわかるように、共
振器面10を形成したことにより共振器はC1
C2,C3のように個々に分割されレージ光は基板
裏面から取り出されることになる。ここで前記
〔1〕の説明で述べたように、SiO2蒸着膜11
a,11b,11c波長の膜厚で設け、反射コー
テイング膜11a/12a,11b/12bで共
振器内部の利得をかせぎ、Si蒸着膜13a,13
b,13cの膜厚とそれぞれ変えると分割された
共振器C1,C2,C3から反射コーテイング膜11
c/13a,11c/13b,11c/13cを
通して異なる波長のレーザ光λ1,λ2,β3が得られ
る。
Figure 7 shows line A-A' in Figure 6, that is (011)
FIG. 15 is an n-type InP substrate,
21 is an n-type InP cladding layer, 22 is an InGaAsP active layer, 23 is a p-type InP cladding layer, and 24 is a p-type
InGaAsP cap layer, 25 is a P-type InP layer, and 26 is an n-type InP layer. P-type InP layer 25, n-type InP layer 2
6 is provided with a refractive index step on both sides of the InGaAsP active layer 22 in the direction parallel to the junction, and serves as a current blocking layer to stabilize and unify the transverse mode. FIG. 8 is a sectional view taken along the line B-B' of FIG. 6, that is, the (011) plane, and shows the pattern of optical waveguide within the resonator. As can be seen from FIG. 8, by forming the resonator surface 10, the resonator is C 1 ,
The laser beams are individually divided into C 2 and C 3 and are extracted from the back side of the substrate. Here, as mentioned in the explanation of [1] above, the SiO 2 vapor deposited film 11
The reflective coating films 11a/12a, 11b/12b are provided with film thicknesses of wavelengths a, 11b, and 11c to increase the gain inside the resonator, and the Si vapor deposited films 13a, 13
When the film thicknesses of b and 13c are changed, the reflective coating film 11 is formed from the divided resonators C 1 , C 2 , and C 3 .
Laser beams λ 1 , λ 2 , and β 3 of different wavelengths are obtained through c/13a, 11c/13b, and 11c/13c.

第9図および第10図は各々は拡散領域によつ
て分割された共振器長l1〜125μm、l2〜70μm、拡
散領域幅d〜7μm、SiO2蒸着膜〜2210Å、Au蒸
着膜〜3000Å、Si蒸着膜をそれぞれ152Å,315
Å,461Åとして得られたゲインスペクトルと縦
モードの温度特性を示す。第10図に示す結果で
は、100Å以上の間隔を保つて、20℃よりおよび
45℃までの実用温度範囲でモードホツピングを起
さずそれぞれ安定な単一縦モードの三波長の発光
を得ている。これは光フアイバ通信における波長
多重通信に対して十分な性能を持つものであり、
温度特性、モード安定性にも従来にない特徴を有
する。
Figures 9 and 10 show the resonator lengths divided by diffusion regions l 1 ~125 μm, l 2 ~70 μm, diffusion region width d ~7 μm, SiO 2 deposited film ~2210 Å, and Au deposited film ~3000 Å. , Si vapor deposited film of 152 Å and 315 Å, respectively.
The gain spectrum obtained as Å, 461 Å and the temperature characteristics of the longitudinal mode are shown. In the results shown in Figure 10, the distance between the
Three wavelengths of stable single longitudinal mode light emission are obtained without mode hopping in the practical temperature range up to 45℃. This has sufficient performance for wavelength division multiplexing communication in optical fiber communication,
It also has unprecedented characteristics in temperature characteristics and mode stability.

なお以上の総造の半導体レーザにおいて共振器
面10を形成する際、V字状溝を十分深くエツチ
ングすることによりチツプ化の際に従来のような
へき開を用いなくても良く、量産効果にもすぐれ
ている。また反射コーテイング膜の材質はSiO2
Au,Siに限らず、基板裏面以外の反射コーテイ
ング膜の膜厚を制御してもよく、さらに光導波路
内の一部に屈折率の異なる領域を設ける手段は拡
散だけによらず、光導波路の屈折率より小さな材
料(例えばInGaAsP光導波路中にInP)を導入し
てもよい。
In addition, when forming the resonator surface 10 in the above-mentioned integrated semiconductor laser, by etching the V-shaped groove deeply enough, there is no need to use conventional cleavage when making chips, which also improves mass production efficiency. It is excellent. In addition, the material of the reflective coating film is SiO 2 ,
In addition to Au and Si, it is also possible to control the thickness of the reflective coating film other than the back surface of the substrate.Furthermore, the method of providing regions with different refractive indexes in a part of the optical waveguide is not limited to diffusion. A material with a smaller refractive index (for example, InP in an InGaAsP optical waveguide) may be introduced.

発明の効果 以上説明したように、この発明は接合に平行な
方向において単一横モード化を図つて形成した光
導波路の両端に、反射コーテイング膜を有する共
振器面を光導波路の軸方向に対してほぼ45゜の角
度で形成し、鏡面研磨をほどこした基板裏面にも
反射コーテイング膜を設け、レーザ光を基板裏面
から取り出す共振器構造とし、さらに前記光導波
路内の一部に屈折率の異なる領域を設けた以上の
構造を反射コーテイング膜の膜厚を変えて光導波
路の軸方向にアレイ化することにより、安定な単
一横モードおよび単一縦モードで波長の異なるレ
ーザ光を基板裏面から取り出せる効果を有する。
Effects of the Invention As explained above, the present invention provides a resonator surface having a reflective coating film at both ends of an optical waveguide formed with a single transverse mode in the direction parallel to the junction, with respect to the axial direction of the optical waveguide. A reflective coating film is also provided on the back surface of the mirror-polished substrate, forming a resonator structure in which the laser beam is extracted from the back surface of the substrate, and a part of the optical waveguide has a different refractive index. By changing the thickness of the reflective coating film and arranging the above structure in the axial direction of the optical waveguide, laser light with different wavelengths can be transmitted from the back side of the substrate in a stable single transverse mode and single longitudinal mode. It has a removable effect.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来の二波長半導体レーザの概略構成
を示す断面図、第2図は共振器面に設けた反射コ
ーテイング膜を設ける条件を示す図、第3図は前
記条件とゲインピークの位置の関係を示す特性
図、第4図イ〜ハは光導波路内の一部に屈折率の
異なる領域を設けた場合のゲインスペクトル図、
第5図は第4図における半導体レーザの縦モード
の温度特性図、第6図はこの発明の一実施例であ
る三波長半導体レーザの斜視図、第7図は第6図
のA−A′線における断面図、第8図は第6図の
B−B′における断面図、第9図はこの発明にも
とずく三波長導体レーザのゲインスペクトル図、
第10図は同縦モードの温度特性図である。 10……光導波路の軸方向に対してほぼ45℃の
角度をもつ共振器面、11a,11b,11c…
…SiO2蒸着膜、12a,12b……Au蒸着膜、
13a,13b,13c……Si蒸着膜、14……
Zn拡散領域、15……n形InP基板、21……n
形InPクラツド層、22……InGrAsP活性層、2
3……P形InPクラツド層、24……P形
InGaAsPキヤツプ層、25……P形InP層、26
……n形InP層。
Figure 1 is a cross-sectional view showing the schematic configuration of a conventional two-wavelength semiconductor laser, Figure 2 is a diagram showing the conditions for providing a reflective coating film on the cavity surface, and Figure 3 is a diagram showing the conditions and the position of the gain peak. Characteristic diagrams showing the relationship; Figures 4A to 4C are gain spectrum diagrams when regions with different refractive indexes are provided in a part of the optical waveguide;
5 is a temperature characteristic diagram of the longitudinal mode of the semiconductor laser in FIG. 4, FIG. 6 is a perspective view of a three-wavelength semiconductor laser which is an embodiment of the present invention, and FIG. 7 is a line A-A' in FIG. 6. 8 is a sectional view taken along line B-B' in FIG. 6, FIG. 9 is a gain spectrum diagram of a three-wavelength conductor laser based on the present invention,
FIG. 10 is a temperature characteristic diagram in the longitudinal mode. 10... Resonator surfaces having an angle of approximately 45 degrees with respect to the axial direction of the optical waveguide, 11a, 11b, 11c...
...SiO 2 vapor deposited film, 12a, 12b...Au vapor deposited film,
13a, 13b, 13c...Si vapor deposited film, 14...
Zn diffusion region, 15... n-type InP substrate, 21... n
InP cladding layer, 22... InGrAsP active layer, 2
3...P-type InP cladding layer, 24...P-type
InGaAsP cap layer, 25...P-type InP layer, 26
...n-type InP layer.

Claims (1)

【特許請求の範囲】[Claims] 1 接合に平行な方向において屈折率の段差をも
たせて形成した内部ストライプ状光導波路の両端
に、反射コーテイング膜を設けた共振器面を前記
光導波路の軸方向に対してほぼ45゜の角度で形成
し、鏡面研磨をほどこした基板裏面にも反射コー
テイング膜を設けて、レーザ光を基板裏面から取
り出す共振器構造とし、さらに前記光導波路内の
一部に屈折率の異なる領域を設けて単一縦モード
化を図つた以上の構造を光導波路の軸方向にアレ
イ化し、個々のレーザの反射コーテイング膜の膜
厚を制御し、波長の異なるレーザ光をそれぞれ安
定な単一横モードおよび単一縦モードで基板裏面
から取り出すことを特徴とする多波長半導体レー
ザ。
1. A resonator surface provided with a reflective coating film at both ends of an internal striped optical waveguide formed with a step in the refractive index in a direction parallel to the junction is placed at an angle of approximately 45° with respect to the axial direction of the optical waveguide. A reflective coating film is also provided on the back surface of the substrate, which has been formed and mirror-polished, to create a resonator structure that extracts the laser beam from the back surface of the substrate.Furthermore, regions with different refractive indexes are provided in a part of the optical waveguide to form a single layer. By arraying the above structures in the axial direction of the optical waveguide and controlling the thickness of the reflective coating film of each laser, laser beams with different wavelengths can be converted into stable single transverse mode and single longitudinal mode. A multi-wavelength semiconductor laser that is extracted from the backside of the substrate using a mode.
JP58166972A 1983-09-09 1983-09-09 Multiwavelength semiconductor laser Granted JPS6057991A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58166972A JPS6057991A (en) 1983-09-09 1983-09-09 Multiwavelength semiconductor laser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58166972A JPS6057991A (en) 1983-09-09 1983-09-09 Multiwavelength semiconductor laser

Publications (2)

Publication Number Publication Date
JPS6057991A JPS6057991A (en) 1985-04-03
JPS6353717B2 true JPS6353717B2 (en) 1988-10-25

Family

ID=15841027

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58166972A Granted JPS6057991A (en) 1983-09-09 1983-09-09 Multiwavelength semiconductor laser

Country Status (1)

Country Link
JP (1) JPS6057991A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62128587A (en) * 1985-11-29 1987-06-10 Matsushita Electric Ind Co Ltd semiconductor laser
JPS6332981A (en) * 1986-07-25 1988-02-12 Mitsubishi Electric Corp Semiconductor laser array

Also Published As

Publication number Publication date
JPS6057991A (en) 1985-04-03

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