JPS6354206B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a laminated chip type LC (inductor-capacitor) composite component.

A dielectric layer and a conductive pattern for a capacitor, a magnetic layer and a conductive pattern for an inductor are laminated,
Laminated chip type LC with external electrode terminals attached
Composite parts have been proposed in the past. Conventionally, multilayer chip-type LC composite parts connected in LC series have
It was manufactured as shown in the figure. First, the first
As shown in Figure A, on a suitable dielectric layer 1,
A wide-area conductive pattern 2 for a capacitor with T ₁ exposed at one end of the dielectric layer 1 is formed, for example, by printing. Next, as shown in Figure B,
A dielectric layer 3 is formed over the entire surface. Next, as shown in FIG. C, a wide-area conductive pattern 4 for a capacitor with a connection part C ₁ exposed is placed on the dielectric layer 3 at an end perpendicular to the end where the terminal T ₁ is exposed. Form on top. Next, as shown in Figure D, a dielectric layer 5 is formed on the entire surface. Next, as shown in FIG. 5E, an insulating magnetic layer 6 is formed on the entire surface of the dielectric layer 5.
Next, as shown in FIG.
A conductive pattern 7 for an inductor is formed with a terminal T ₂ exposed at the end opposite to T ₁ . Next, as shown in FIG. G, an insulating magnetic layer 8 is formed to cover a little more than the right half of the conductive pattern 7, leaving the end of the conductive pattern 7 exposed. Next, as shown in FIG.
A conductive pattern 9 extending onto the magnetic layer 8 is formed in the shape. As a result, the conductive patterns 7 and 9 are electrically connected at the overlapping portion 10. Next, the same figure I
As shown in FIG. 2, an insulating magnetic layer 11 is now formed to cover a little more than the left half of the conductive pattern 9, leaving the end of the conductive pattern 9 exposed. Next, as shown in FIG. J, a substantially rectangular loop is drawn from the end of the conductive pattern 9 and extends onto the magnetic layer 11, corresponding to the connection part _C1 of the conductive pattern 4 for a capacitor. A conductive pattern 12 is formed with connection portions C ₂ exposed at positions and ends. As a result, the conductive patterns 9 and 12 are electrically connected at the overlapping portion 13. Next, as shown in figure K, an insulating magnetic layer 14 is formed over the entire surface. Further, a dielectric layer 15 is formed over the entire surface of the magnetic layer 14 so as to have approximately the same thickness as the capacitor portion including the dielectric layers 1, 3, and 5. The thus obtained laminate has terminals T ₁ and T ₂ on the opposing end faces.
Further, the connecting portions C ₁ and C ₂ are exposed on the same end face in a direction perpendicular to these end faces. This laminate is placed in a firing furnace and treated at the required temperature and time for dielectric and magnetic materials. The end face of the obtained fired body where the terminals T ₁ and T ₂ are exposed and the connecting parts C ₁ and C ₂
Apply conductive paste to the part of the exposed end face,
By baking at an appropriate temperature, external terminals 16, 17 and a connecting portion 18 are formed as shown in FIG. Alternatively, external terminals 16, 17 and connections 18 may be applied before firing. FIG.
is sandwiched between dielectric layers 20 in a sandwich pattern, and this cross-sectional view emphasizes this point. Also, O in the same figure is this LC
FIG. 3 is an equivalent circuit diagram of a composite component.

The dielectric layer is made by extrusion molding or a paste made by kneading dielectric powder made of ceramic, glass, alumina, barium titanate, titanium oxide, etc. with a well-known appropriate binder and solvent such as methylcellulose or butyral resin. It can be made by forming it into a sheet shape of, for example, tens to several tens of microns using a doctor blade method, or by forming it into a similar sheet shape by printing. In addition, the magnetic layer is
Powder such as ferrite magnetic material mainly composed of Fe ₂ O,
It is made by kneading a paste with the same binder and solvent as in the case of the dielectric layer and forming it into a sheet in the same manner as described above. In addition, the conductor for the conductive pattern is an Ag-Pd alloy (75:25~50:
50 alloy), Pd and other heat-resistant metal powders, and a binder. Further, the above-mentioned conductive paste may be used for the conductor for the external terminal, or if only the external terminal is baked, a similar paste made of powder of copper, silver, etc. may be used.

In this way, conventional series-connected LC composite components require exposing one end of the capacitor element and one end of the inductor element to the same end surface of the laminate and electrically connecting them to each other with conductive paste. It has the disadvantage that the manufacturing process is complicated, and since the conductive paste is applied only to a portion of the same end face of the laminate, the conductor may peel off after firing or the connection may be poor.

The present invention has been made to eliminate the above-mentioned drawbacks, and its purpose is to provide a multilayer chip-type LC composite component in which one end of a capacitor element and one end of an inductor element are electrically connected to each other within a laminate. It is to be.

Hereinafter, one embodiment of the present invention will be described in detail with reference to the drawings.

Figures 2A to R are laminated chip types according to the present invention.
This is an example of one manufacturing process for an LC composite part, in which an insulating magnetic layer 21 is first formed using a sheet method or a printing method. If the magnetic material is not insulating, an insulating layer is interposed. Next, as shown in FIG. 2B, a conductive pattern 22 for an inductor is formed in which the terminal _L1 is exposed at one end of the magnetic layer 21. The reason why the exposed end portion of the conductive pattern 22 is made wide is to improve the electrical connection with an external terminal to be attached later. Next, as shown in Figure C, an insulating magnetic layer 23 is formed to cover approximately the left half of the magnetic layer 21, leaving the ends of the conductive patterns 22 exposed. Next, as shown in FIG.
form. As a result, conductive patterns 22 and 2
4 is electrically connected. Next, as shown in Figure E, an insulating magnetic layer 25 is formed to cover the exposed right half of the magnetic layer 21, leaving the ends of the conductive pattern 24 exposed. leave. Next, as shown in FIG. 5F, a conductive pattern 26 is formed extending from the end of the conductive pattern 24 to the top of the magnetic layer 25 in a substantially L shape. This electrically connects the conductive patterns 24 and 26. Next, as shown in FIG. G, an insulating magnetic layer 27 is formed to cover the magnetic layer 23, leaving the ends of the conductive pattern 26 exposed. Next, H
As shown in FIG. 2 , an L-shaped conductive pattern 28 is formed on the magnetic layer 25 from the end of the conductive pattern 26 . This electrically connects the conductive patterns 26 and 28, forming a laminated winding of about 1.5 turns. The number of turns in the laminated winding is determined depending on the required inductance value, and it is clear that the laminated winding with the required turns can be formed by repeating the above method. Note that the conductive pattern 28
is formed only on the magnetic layer 25, so the magnetic layer 27 does not need to be formed.

Next, as shown in FIG. 1, a dielectric layer 30 having an opening 29 on the winding end side of the laminated winding, that is, at a position corresponding to a portion of the conductive pattern 28, is formed over the entire surface. If necessary, before forming the dielectric layer 30, an insulating magnetic layer having openings at corresponding positions is formed on the entire surface or approximately on the right half. Next, as shown in FIG.
Formed on 0. As a result, the conductive pattern 28
and 31 are electrically connected through the opening 29.
Next, as shown in FIG. 3K, a dielectric layer 33 having an opening 32 at a position corresponding to the right end of the conductive pattern 31 is formed over the entire surface. Next, as shown in FIG. L, the terminals of the inductor conductive pattern 22 are
A wide-area conductive pattern 34 for a capacitor is formed on the dielectric layer 33, exposing the terminal C ₁ at the end opposite to L ₁ and not extending to the opening 32 . Next, as shown in FIG. M, a dielectric layer 36 having an opening 35 of approximately the same size at a position corresponding to the opening 32 is formed over the entire surface. Next, as shown in FIG. N, at a position approximately corresponding to the conductive pattern 31,
A wide-area conductive pattern 37 of approximately the same size is formed on the dielectric layer 36 including the opening 35 . As a result, the conductive patterns 31 and 37 are connected to the openings 32 and 35.
are electrically connected to each other through. Next, as shown in figure O, a dielectric layer 38 is formed on the entire surface,
Next _, as _shown in FIG.
Form on 8. Next, as shown in FIG. Q, a dielectric layer 40 is formed on the entire surface. The thus obtained laminate is placed in a firing furnace and treated at the required temperature and time for the dielectric and magnetic materials. A conductive paste is applied to the opposite end faces of the obtained fired body where the terminals L ₁ and C ₁ , C ₂ are exposed, and baked at an appropriate temperature to form external terminals 41 and 42 as shown in FIG. Alternatively, the external terminals 41, 42 may be applied before firing the laminate. FIG. 3A is a perspective view of a laminated chip-type LC composite component according to the present invention thus obtained, and FIG. 3B is an equivalent circuit diagram thereof.

With this configuration, there is no need to expose one end of the inductor element and one end of the capacitor element to the end face of the laminate and electrically connect them to each other using a dielectric, thereby simplifying the manufacturing process. Furthermore, since the inductor conductive pattern 28 and the capacitor conductive pattern 31 are electrically connected to each other through the opening 29, the connection area is wide and the connection is strong, thus ensuring a reliable electrical connection. , there are advantages such as improved reliability.

In the above embodiment, four layers of conductive patterns for capacitors were formed, but if the required capacitance value can be obtained with two layers of conductive patterns, it is not necessary to provide the opening 32 in the process shown in FIG. The lamination process is completed by forming a dielectric layer 36 on the entire surface in the process shown in FIG. 2M. Also, as in the conventional example shown in Figure 1, if a dielectric layer with approximately the same thickness as the stacked dielectric layers is formed on the opposite side of the magnetic layer to create a sandwich structure, it is possible to Curving of parts due to differences in shrinkage ratio can be effectively prevented. Also, the capacitor element is formed first,
The inductor element may be formed after that. In addition, although we have explained the manufacturing method of one LC composite part, it is also possible to simultaneously form many LC composite parts on a large-area magnetic layer and dielectric layer, and then divide them into individual parts before or after firing. This allows for mass production. In this case, work efficiency is good and quality (characteristics) can be made uniform. It goes without saying that various other modifications and changes can be made as necessary.

As described above, according to the present invention, an easily manufactured
Since highly reliable laminated chip-type LC composite parts can be obtained, they can be used in various electronic circuits, electronic devices, etc., and have the effect of miniaturization and improved reliability, making them a great contribution to the development of industry. There is something.

[Brief explanation of drawings]

Figures 1 A to M are plan views showing one manufacturing process of conventional LC composite parts, Figure N is a schematic sectional view, Figure O is an equivalent circuit diagram, and Figures 2 A to R are LC composite parts according to the present invention. FIG. 3A is a plan view showing the manufacturing process of an embodiment of the present invention, FIG. 3A is a perspective view of an embodiment of the LC composite component according to the present invention, and FIG. 3B is an equivalent circuit diagram thereof. 21, 23, 25, 27: insulating magnetic layer, 2
2, 24, 26, 28: conductive pattern for inductor, 30, 33, 36, 38, 40: dielectric layer,
31, 34, 37, 39: conductive pattern for capacitor, 29, 32, 35: opening, 41, 42: external terminal.

Claims (1)

[Claims] 1. In a laminated LC composite component having a configuration in which an inductor element formed by laminating a magnetic layer and a conductive pattern and a capacitor element formed by laminating a dielectric layer and a conductive pattern are superposed, one end of the conductive pattern of the inductor element and one end of the conductive pattern of the capacitor element are electrically connected to each other through an opening formed in a layer interposed between these conductive patterns.