JPS6355214B2 - - Google Patents
Info
- Publication number
- JPS6355214B2 JPS6355214B2 JP60158157A JP15815785A JPS6355214B2 JP S6355214 B2 JPS6355214 B2 JP S6355214B2 JP 60158157 A JP60158157 A JP 60158157A JP 15815785 A JP15815785 A JP 15815785A JP S6355214 B2 JPS6355214 B2 JP S6355214B2
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- wire bonder
- optical system
- fan
- microairflow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Wire Bonding (AREA)
Description
【発明の詳細な説明】
〔技術分野〕
本発明は例えば半導体ペレツトの如きペレツト
上の電極にワイヤボンデイングを施すためのワイ
ヤボンダに関し、特に、ワイヤボンダに用いて好
適な外観認識装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a wire bonder for performing wire bonding to an electrode on a pellet such as a semiconductor pellet, and more particularly to an appearance recognition device suitable for use in a wire bonder.
特開昭49−46684号公報にも示されるように外
観認識装置は、被観察物体を光学系を介して検知
する。
As disclosed in Japanese Unexamined Patent Publication No. 49-46684, an appearance recognition device detects an object to be observed through an optical system.
この外観認識装置はいろいろなシステムに応用
可能であるが、例えば半導体ペレツト上面を、顕
微鏡とテレビカメラとを用いて拡大映像としてモ
ニタし、外観認識技術を応用してワイヤボンデイ
ングすべき所定位置を検知し、上記所定位置にボ
ンデイングを施す自動ワイヤボンダが知られてい
る。 This appearance recognition device can be applied to various systems, but for example, the top surface of a semiconductor pellet can be monitored as an enlarged image using a microscope and a television camera, and the predetermined position for wire bonding can be detected by applying appearance recognition technology. However, an automatic wire bonder that performs bonding at the predetermined position is known.
ところで、従来の自動ワイヤボンダにおいて
は、ペレツトを加熱状態にして映像をモニタした
場合、ペレツト上に加熱によるかげろうのような
上昇気流が発生し、映像にゆらぎを生じるため、
ペレツトを常温下で予め映像モニタし、所要のボ
ンデイング位置を検出した後ペレツトを加熱位置
に移してボンデイングを施していた。このためフ
レームの位置決めを高精度で行なわねばならず、
しかもボンデイング位置の精度を±40μm以上に
高めることは極めて困難であつた。このように、
加熱された物体と光学系間に生じる上昇気流は外
観認識精度を低下させる。 By the way, in conventional automatic wire bonders, when the pellet is heated and the image is monitored, an upward air current like heat wax is generated on the pellet due to heating, causing fluctuation in the image.
The pellets were image-monitored in advance at room temperature to detect the required bonding position, and then the pellets were moved to a heating position and bonded. For this reason, it is necessary to position the frame with high precision.
Moreover, it has been extremely difficult to increase the accuracy of bonding position to ±40 μm or more. in this way,
The rising air current generated between the heated object and the optical system reduces appearance recognition accuracy.
本発明は簡単な構成により上述の如き欠点を解
決した新規なワイヤボンダを提供する目的でなさ
れたものである。
The present invention has been made for the purpose of providing a new wire bonder which solves the above-mentioned drawbacks with a simple structure.
本発明の外観認識装置は、被処理物とその被処
理物上面を映像モニタするための光学系との間の
空間に気流を形成せしめる手段を設けてなること
を特徴とするものである。
The appearance recognition apparatus of the present invention is characterized in that it is provided with means for forming an airflow in a space between a workpiece and an optical system for video monitoring the upper surface of the workpiece.
図は本発明のワイヤボンダの要部を模式的に示
したもので、被処理物であるペレツト１と光学系
（顕微鏡）の対物レンズ２との間において、上記
レンズ２の光軸４に直交する方向に層流的な微気
流を生起せしめるためのフアン３を設けたもので
ある。即ち、ペレツト１は支持体であるリードフ
レーム（図示せず）によつて加熱ブロツク５上の
所定位置に搬送され、所要温度まで加熱される。
このとき、ペレツト１の上部では上昇気流が発生
し、かげろう現象が発生するわけであるが本発明
の一実施例によればフアン３によつて微気流を生
起せしめ、上昇気流を光学系の視野から吹払つて
しまうため、モニタされる映像の歪みは極めて少
なくなる。従つて本発明によればペレツト上のボ
ンデイング位置検出と実際のボンデイングとを同
位置で行なうことが可能となりボンデイング位置
の精度を±20μm以下の高精度にすることができ
る。
The figure schematically shows the main parts of the wire bonder of the present invention. Between the pellet 1, which is the object to be processed, and the objective lens 2 of the optical system (microscope), the A fan 3 is provided to generate a laminar microairflow in the direction. That is, the pellet 1 is conveyed to a predetermined position on the heating block 5 by a lead frame (not shown) serving as a support, and heated to a required temperature.
At this time, an upward air current is generated in the upper part of the pellet 1, and a heat fog phenomenon occurs.According to one embodiment of the present invention, a fine air current is generated by the fan 3, and the upward air current is brought into the field of view of the optical system. The distortion of the monitored image becomes extremely small. Therefore, according to the present invention, it is possible to detect the bonding position on the pellet and to perform the actual bonding at the same position, and the accuracy of the bonding position can be made as high as ±20 μm or less.
なお、気流を吹きつけることによつてペレツト
の温度が下らないようになされている。すなわ
ち、フアン３により生起された気流は上述したよ
うに微気流であり、かつ図面に示されるように気
流の吹きつけ範囲は枠体６で制限されペレツトに
直接には当たらないようになされている。又、上
述したように、光軸４と直交する方向に気流を生
起させると光学系とペレツト間の空間を気流が最
短距離で横切るためにかげろうを光学系視野外に
効果的に吹きはらうことができるとともにふきは
らつた方向（フアン３の反対方向）には該気流お
よびふきはらわれたかげろうが悪影響をおよぼす
物体（例えばペレツトやレンズ等の光学系）が存
在せずなんら悪影響が発生しない。 Note that the temperature of the pellets does not drop by blowing the air current. That is, the airflow generated by the fan 3 is a microairflow as described above, and as shown in the drawing, the range of the airflow is restricted by the frame 6 so that it does not directly hit the pellets. . Furthermore, as mentioned above, when an airflow is generated in a direction perpendicular to the optical axis 4, the airflow crosses the space between the optical system and the pellet in the shortest distance, making it possible to effectively blow away the heat wax out of the field of view of the optical system. There are no objects (for example, pellets or optical systems such as lenses) that would be adversely affected by the airflow and the blown away heat in the direction in which it is generated and blown away (the direction opposite to the fan 3), so no adverse effects occur.
以上述べた如く本発明の外観認識装置をワイヤ
ボンダによれば、従来の如く、ボンデイング位置
検出後、ペレツトを加熱ブロツク上で精密に位置
決めし直すといつた手間が不要となり、しかもボ
ンデイング精度を非常に高めることができるため
従来より高集積密度の半導体装置に対しても自動
ワイヤボンデイング方式を適用することができ
る。
As described above, by using the wire bonder as the appearance recognition device of the present invention, it is possible to eliminate the labor involved in precisely repositioning the pellet on the heating block after detecting the bonding position as in the conventional method, and it also greatly improves the bonding accuracy. Therefore, the automatic wire bonding method can be applied to semiconductor devices with higher integration density than conventional ones.
また、フアンによる気流によつてペレツトの温
度が下がらないように構成されているため、フア
ンによる気流生起によつてボンダビリテイーが低
下されてしまうのを未然に回避することができ
る。 Furthermore, since the pellet temperature is not lowered by the air flow generated by the fan, it is possible to prevent bondability from being lowered due to air flow generated by the fan.
第１図は本発明の一実施例によるワイヤボンダ
の要部を模式的に示す図である。
１……ペレツト、２……対物レンズ、３……フ
アン、４……光軸、５……加熱ブロツク、６……
枠体。
FIG. 1 is a diagram schematically showing essential parts of a wire bonder according to an embodiment of the present invention. 1... Pellet, 2... Objective lens, 3... Fan, 4... Optical axis, 5... Heating block, 6...
frame body.
Claims (1)
し、加熱手段の反対側からペレツトを観察するよ
うに構成されている外観認識手段とを備えている
ワイヤボンダにおいて、前記ペレツトと外観認識
手段との間に微気流を生起するフアンが設けられ
ており、このフアンは微気流の吹きつけ範囲を枠
体によつて制限されることにより、層流を呈する
微気流を前記光学系の光軸に直交する方向であつ
て、前記ペレツトに対して非接触となる方向に形
成するように構成されていることを特徴とするワ
イヤボンダ。1. In a wire bonder equipped with a heating means for heating a pellet and an appearance recognition means having an optical system and configured to observe the pellet from the opposite side of the heating means, A fan that generates a microairflow is provided in between, and the fan blows the microairflow perpendicularly to the optical axis of the optical system by restricting the blowing range of the microairflow by the frame. A wire bonder characterized in that the wire bonder is configured to form the wire in a direction in which the wire bonder does not contact the pellet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60158157A JPS6143715A (en) | 1985-07-19 | 1985-07-19 | Recognizing device for outward appearance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60158157A JPS6143715A (en) | 1985-07-19 | 1985-07-19 | Recognizing device for outward appearance |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8944878A Division JPS5516445A (en) | 1978-07-24 | 1978-07-24 | Wire bonder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6143715A JPS6143715A (en) | 1986-03-03 |
| JPS6355214B2 true JPS6355214B2 (en) | 1988-11-01 |
Family
ID=15665510
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60158157A Granted JPS6143715A (en) | 1985-07-19 | 1985-07-19 | Recognizing device for outward appearance |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6143715A (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5188177U (en) * | 1975-01-11 | 1976-07-14 | ||
| JPS5310268A (en) * | 1976-07-15 | 1978-01-30 | Cho Onpa Kogyo Co | Method of preventing image of heated semiconductor pellet from flickering of heat haze |
-
1985
- 1985-07-19 JP JP60158157A patent/JPS6143715A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6143715A (en) | 1986-03-03 |
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