JPS6355637B2 - - Google Patents
Info
- Publication number
- JPS6355637B2 JPS6355637B2 JP55062985A JP6298580A JPS6355637B2 JP S6355637 B2 JPS6355637 B2 JP S6355637B2 JP 55062985 A JP55062985 A JP 55062985A JP 6298580 A JP6298580 A JP 6298580A JP S6355637 B2 JPS6355637 B2 JP S6355637B2
- Authority
- JP
- Japan
- Prior art keywords
- liquid
- temperature control
- temperature
- tank
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- ing And Chemical Polishing (AREA)
- Weting (AREA)
- Control Of Temperature (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、恒温処理装置に係り、特に直接熱交
換法を用いた恒温処理装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a constant temperature processing apparatus, and particularly to a constant temperature processing apparatus using a direct heat exchange method.
エツチングなどの化学的処理は、温度条件によ
つて反応速度が大きく変化するため、常に綿密な
温度制御を行う必要がある。
In chemical treatments such as etching, the reaction rate varies greatly depending on temperature conditions, so careful temperature control is always required.
従来のエツチング装置における温度制御方法と
しては、２つの方法に大別される。その１つは、
１例を第１図に示すように、タンク１を２段に仕
切り、タンク１の底部１ａと仕切板２とにより形
成された空間部３内に冷却用液体１０を注入し、
ポンプ５によりパイプ６、熱交換器７を介してこ
れを循環させ、仕切板２の上側に注入したエツチ
ング液を当該仕切板２を介して冷却する方法であ
る。そして他の１つは、第２図に示すように、エ
ツチング液１１を熱交換器７内に循環させ、該エ
ツチング液を直接温度制御する方法である。 Temperature control methods in conventional etching equipment can be roughly divided into two methods. One of them is
As an example, as shown in FIG. 1, a tank 1 is partitioned into two stages, and a cooling liquid 10 is injected into a space 3 formed by a bottom 1a of the tank 1 and a partition plate 2.
In this method, the etching liquid is circulated by a pump 5 through a pipe 6 and a heat exchanger 7, and the etching liquid injected onto the upper side of the partition plate 2 is cooled through the partition plate 2. The other method, as shown in FIG. 2, is to circulate the etching liquid 11 in a heat exchanger 7 and directly control the temperature of the etching liquid.
しかしながら、前者においてはタンク１、およ
び仕切板２にはテフロン加工などの表面処理によ
つて耐蝕性を持たせる必要がある。しかしこのよ
うな表面処理面は傷付き易く信頼性が低い。また
仕切板２を介して熱交換を行うため熱交換率が低
い上、温度分布を均一にするためにエツチング液
を常に撹拌する必要があり、作業性が悪いと言う
問題があつた。
However, in the former case, the tank 1 and the partition plate 2 need to be made corrosion resistant by surface treatment such as Teflon treatment. However, such a surface treatment surface is easily damaged and has low reliability. Furthermore, since heat exchange is performed through the partition plate 2, the heat exchange rate is low, and the etching solution must be constantly stirred to make the temperature distribution uniform, resulting in poor workability.
また、後者においては、タンク、ポンプ、パイ
プ、ジヨイント、熱交換器等の全ての部品を耐蝕
性の部材で構成しなければならず、極めて高価で
ある。更に、ビーカー等にエツチング液を注入し
外側を水等で温度制御するという方法も提案され
ているが、このような方法は少量の処理しかでき
ず、工業的には使用できない。 In addition, in the latter case, all parts such as tanks, pumps, pipes, joints, heat exchangers, etc. must be made of corrosion-resistant materials, which is extremely expensive. Furthermore, a method has been proposed in which an etching solution is poured into a beaker or the like and the temperature of the outside is controlled with water or the like, but such a method can only treat a small amount and cannot be used industrially.
本発明は前記実情に鑑みてなされたもので、高
効率でコストの低い恒温処理装置を提供すること
を目的とする。 The present invention has been made in view of the above-mentioned circumstances, and an object of the present invention is to provide a constant temperature processing apparatus with high efficiency and low cost.
〔課題を解決するための手段〕
そこで本発明では、処理液の充填されたタンク
の底部の１端から他端に向けて、該処理液よりも
比重が大きくかつ不活性な温度制御液を流動さ
せ、前記処理液と前記温度制御液とを上下２層に
分離させて両液の境界面において直接熱交換を行
わせると共に、該温度制御液の流動に伴い界面で
該処理液に流動を引き起こし自然対流により処理
液を常に所定の温度に保つようにしている。[Means for Solving the Problems] Therefore, in the present invention, a temperature control liquid which has a higher specific gravity than the processing liquid and is inert is flowed from one end of the bottom of the tank filled with the processing liquid to the other end. The processing liquid and the temperature control liquid are separated into upper and lower two layers, direct heat exchange is performed at the interface between the two liquids, and flow is caused in the processing liquid at the interface as the temperature control liquid flows. The processing liquid is always kept at a predetermined temperature by natural convection.
上記構成によれば、処理液は強制的に循環させ
ることなく、温度制御液のみを循環流動せしめる
ようにしており、処理液は温度制御液の流動に伴
い界面で流れを生じ、この流れと熱交換による温
度差とによつて静かに自然対流を生じながら効率
よく、直接熱交換を行うことができる。
According to the above configuration, only the temperature control liquid is circulated and flowed without forcing the processing liquid to circulate, and the processing liquid generates a flow at the interface with the flow of the temperature control liquid, and this flow and heat Due to the temperature difference caused by the exchange, natural convection is generated quietly and direct heat exchange can be performed efficiently.
従つて、処理液は直接温度制御液と熱交換を行
うため、高効率であるうえ、耐蝕性部材で構成し
なければならないのはタンクのみである。 Therefore, since the processing liquid directly exchanges heat with the temperature control liquid, it is highly efficient, and only the tank needs to be constructed of a corrosion-resistant material.
また、処理液は自然対流を受けるのみで、静か
な液面を維持することができるため、このタンク
をそのままエツチング等の処理槽として使用でき
る。 Furthermore, since the processing liquid is only subjected to natural convection and a quiet liquid level can be maintained, this tank can be used as it is as a processing tank for etching, etc.
さらにまた、強制的に循環するのは、温度制御
液のみであり、循環に要するエネルギーを大幅に
節減することができる。 Furthermore, only the temperature control liquid is forcibly circulated, and the energy required for circulation can be significantly reduced.
以下、本発明の実施例について図面を参照しつ
つ詳細に説明する。
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
第３図は、本発明実施例の恒温処理装置を示す
図である。 FIG. 3 is a diagram showing a constant temperature processing apparatus according to an embodiment of the present invention.
この恒温処理装置は、タンク２０の対向する側
部２０ａ，２０ｂの下方所定位置にはパイプ２
１，２２が対向して配設されており、これらのパ
イプ２１，２２の一方端部２１ａ，２２ａは閉塞
される一方、他方端部２１ｂ，２２ｂはタンクの
側部２０ｃからタンク外に導出されている。 This constant temperature processing apparatus has a pipe 2 at a predetermined position below the opposing sides 20a and 20b of the tank 20.
1 and 22 are arranged facing each other, and one end portions 21a and 22a of these pipes 21 and 22 are closed, while the other end portions 21b and 22b are led out of the tank from a side portion 20c of the tank. ing.
これらの各パイプ２１，２２には夫々所定の間
隔で対向して孔２１ｃ，２２ｃ（第４図）が搾設
されている。もちろん、これらの各パイプ２１，
２２とタンク側部２０ｃとの間は液が漏洩しない
ように構成されている。そしてこれらの各パイプ
２１，２２の開口端部２１ｂ，２２ｂは夫々接続
パイプ２５を介してポンプ５および熱交換器７に
接続されており、タンク２０内の流体はポンプ５
により、ポンプ５−熱交換器７−パイプ２５−パ
イプ２１−タンク２０−パイプ２２−ポンプ５の
流体通路で循環し得るようになつている。 Each of these pipes 21 and 22 is provided with holes 21c and 22c (FIG. 4) facing each other at a predetermined interval. Of course, each of these pipes 21,
22 and the tank side portion 20c are configured to prevent liquid from leaking. The open ends 21b and 22b of each of these pipes 21 and 22 are connected to the pump 5 and the heat exchanger 7 via connection pipes 25, respectively, and the fluid in the tank 20 is transferred to the pump 5.
Therefore, the fluid can be circulated through the pump 5 - heat exchanger 7 - pipe 25 - pipe 21 - tank 20 - pipe 22 - pump 5 fluid passage.
そして、まず、タンク２０内に液面がパイプ２
１，２２の上方に位置するまで温度制御用液体３
０を注入する。この温度制御液３０は比重が大き
くかつ不活性の液体である。このような液体とし
ては、例えばフツ素系不活性液フロロカーボン
（FC）液がある。因みにこのフロロカーボン液の
比重は約1.9で弗酸（比重1.13）よりも大きい。
温度制御液３０は不活性液であり、従つて、ポン
プ５、熱交換器７、パイプ２５あるいはパツキン
などには通常の銅、ゴム部材等を使用することが
できる。なお、タンク２０は被温度制御液に応じ
た耐蝕性部材で形成すれば良い。 First, the liquid level in the tank 20 is
Temperature control liquid 3 until it is located above 1, 22
Inject 0. This temperature control liquid 30 has a large specific gravity and is an inert liquid. An example of such a liquid is a fluorocarbon (FC) liquid, which is an inert fluorine-based liquid. Incidentally, the specific gravity of this fluorocarbon liquid is approximately 1.9, which is higher than hydrofluoric acid (specific gravity 1.13).
The temperature control liquid 30 is an inert liquid, and therefore ordinary copper, rubber members, etc. can be used for the pump 5, heat exchanger 7, pipe 25, packing, etc. Note that the tank 20 may be formed of a corrosion-resistant material suitable for the temperature-controlled liquid.
次いで、比重がこの温度制御液３０よりも小さ
い被温度制御液例えばエツチング液１１を所定量
注入する。これらの両液３０，１１は比重が異な
り、かつ温度制御液３０が不活性液であるために
両液は混合及び反応し合うことなく２つの層に分
離する。すなわち温度制御液３０が下側に、エツ
チング液１１が上側に分離する。そして、これら
の両液３０，１１は界面Ｂにおいて互いに接触し
合つている。 Next, a predetermined amount of a temperature-controlled liquid, such as the etching liquid 11, whose specific gravity is smaller than that of the temperature-controlled liquid 30 is injected. These two liquids 30 and 11 have different specific gravities, and since the temperature control liquid 30 is an inert liquid, the two liquids separate into two layers without mixing or reacting with each other. That is, the temperature control liquid 30 is separated into the lower side and the etching liquid 11 is separated into the upper side. These two liquids 30 and 11 are in contact with each other at the interface B.
ポンプ５を駆動すると、温度制御液３０が第４
図に示すように熱交換器７→パイプ２５→パイプ
２１へ流入し、このパイプ２１の各孔かタンク２
０内に流出する。一方、タンク２０内の温度制御
液３０はパイプ２２の各孔２２Ｃからこのパイプ
２２内に流入し、パイプ２５→ポンプ５→熱交換
器７に流れ込み、この熱交換器７で冷却される。
エツチング液１１はこの温度制御液３０と直接接
触しており、従つて、この温度制御液３０により
冷却される。 When the pump 5 is driven, the temperature control liquid 30
As shown in the figure, it flows from the heat exchanger 7 to the pipe 25 to the pipe 21, and from each hole of this pipe 21 to the tank 2.
Outflow into 0. On the other hand, the temperature control liquid 30 in the tank 20 flows into the pipe 22 from each hole 22C of the pipe 22, flows into the pipe 25→pump 5→heat exchanger 7, and is cooled by the heat exchanger 7.
The etching liquid 11 is in direct contact with this temperature control liquid 30 and is therefore cooled by this temperature control liquid 30.
しかも、このエツチング液１１は温度制御液３
０の流れに応じて循環して撹拌され、常にほぼ均
一な温度に冷却される。勿論、エツチング液１１
は温度制御液３０の上側で循環するのみであり、
当該温度制御液３０と混合することはない。 Moreover, this etching liquid 11 is the temperature control liquid 3.
It is circulated and stirred according to the flow of water, and is always cooled to a substantially uniform temperature. Of course, etching liquid 11
is only circulated above the temperature control liquid 30,
It does not mix with the temperature control liquid 30.
このようにして両液の界面において直接熱交換
を行ないエツチング液を所定の温度に制御する。 In this way, direct heat exchange is performed at the interface between the two liquids, and the etching liquid is controlled to a predetermined temperature.
なお、タンク２０の部材としては、温度制御液
３０が接する下側の部分を通常の部材で形成し、
エツチング液１１が接する上側の部分のみを耐蝕
性部材で形成するようにしてもよく、このように
するとタンク２０を安価にすることができる。 In addition, as for the members of the tank 20, the lower part that contacts the temperature control liquid 30 is formed of a normal member,
Only the upper portion that comes into contact with the etching liquid 11 may be made of a corrosion-resistant material, and in this way the tank 20 can be made inexpensive.
上記構成によれば、エツチング液は強制的に循
環させることなく、温度制御液のみを循環流動せ
しめるようにしており、エツチング液は温度制御
液の流動に伴い界面で流れを生じ、この流れと熱
交換による温度差とによつて静かに自然対流を生
じながら効率よく、直接熱交換を行うことができ
る。 According to the above configuration, only the temperature control liquid is circulated and flowed without forcing the etching liquid to circulate, and the etching liquid generates a flow at the interface with the flow of the temperature control liquid, and this flow and heat Due to the temperature difference caused by the exchange, natural convection is generated quietly and direct heat exchange can be performed efficiently.
従つて、エツチング液は直接温度制御液と熱交
換を行うため、高効率であるうえ、耐蝕性部材で
構成しなければならないのはタンクのみである。 Therefore, since the etching liquid directly exchanges heat with the temperature control liquid, it is highly efficient and only the tank needs to be constructed of a corrosion-resistant material.
また、エツチング液は自然対流を受けるのみ
で、静かな液面を維持することができるため、こ
のタンクをそのままエツチング等の処理槽として
使用できる。 Furthermore, since the etching liquid is only subjected to natural convection and a quiet liquid level can be maintained, this tank can be used as it is as a processing tank for etching and the like.
さらにまた、強制的に循環するのは、温度制御
液のみであり、循環に要するエネルギーを大幅に
節減することができる。 Furthermore, only the temperature control liquid is forcibly circulated, and the energy required for circulation can be significantly reduced.
尚、本実施例においては温度制御液を冷却液と
して使用する場合について記述したがこれに限る
ものではなく、上述とは反対に加熱液として使用
してもよいことは言うまでもない。 Although the present embodiment describes the case where the temperature control liquid is used as a cooling liquid, it is not limited to this, and it goes without saying that it may be used as a heating liquid contrary to the above.
さらに、熱交換器として通常の循環型恒温装置
例えばクールニクスサーキユレータ等をそのまま
使用することができるために汎用性があり、各種
の熱交換装置に容易に採用することができる等の
優れた効果がある。 Furthermore, it has excellent versatility as it can be used as a heat exchanger with a regular circulation type constant temperature device, such as a coolix circulator, and can be easily adopted in various heat exchange devices. effective.
以上説明したように本発明によれば温度制御液
として不活性液を使用するためにタンク、ポン
プ、熱交換器、配管部材等に特別な部材を使用す
る必要がなく装置を安価に構成することができ、
かつ安全性及び信頼性が著しく向上する。また、
温度制御液と処理液との比重差を利用して両液を
直接接触させこれらの境界面で熱交換を行なわせ
るために熱交換比率が高く、しかも温度制御液の
循環に応じて処理液も循環するために撹拌するこ
となく液温を均一にすることができる。
As explained above, according to the present invention, since an inert liquid is used as the temperature control liquid, there is no need to use special members such as tanks, pumps, heat exchangers, piping members, etc., and the apparatus can be configured at low cost. is possible,
Moreover, safety and reliability are significantly improved. Also,
Utilizing the difference in specific gravity between the temperature control liquid and the processing liquid, the two liquids are brought into direct contact and heat exchange occurs at the interface between them, resulting in a high heat exchange ratio. Due to circulation, the temperature of the liquid can be made uniform without stirring.
第１図及び第２図は従来の熱交換方法の説明
図、第３図は本発明の恒温処理装置のタンクの一
実施例を示す一部切欠斜視図、第４図は第３図の
タンクを使用した熱交換を実施する場合の説明図
である。
５……ポンプ、７……熱交換器、１１……エツ
チング液、２０……タンク、２１，２２，２５…
…パイプ、３０……温度制御液。
1 and 2 are explanatory diagrams of the conventional heat exchange method, FIG. 3 is a partially cutaway perspective view showing an embodiment of the tank of the constant temperature processing apparatus of the present invention, and FIG. 4 is the tank of FIG. 3. FIG. 2 is an explanatory diagram when heat exchange is performed using 5... Pump, 7... Heat exchanger, 11... Etching liquid, 20... Tank, 21, 22, 25...
...Pipe, 30...Temperature control liquid.
Claims (1)
理液よりも比重が大きくかつ不活性な温度制御液
を流動させる温度制御液流動手段と、 該温度制御液の温度を所定の温度に制御する温
度制御手段と、 を備え、前記処理液と前記温度制御液とを上下２
層に分離させて両液の境界面において直接熱交換
を行わせると共に、該温度制御液の流動に伴い界
面で該処理液に流動を引き起こし自然対流により
処理液を常に所定の温度に保つようにしたことを
特徴とする恒温処理装置。[Claims] 1. A tank filled with a processing liquid, and temperature control for flowing an inert temperature control liquid with a higher specific gravity than the processing liquid from one end of the bottom of the tank to the other end. a liquid flow means; a temperature control means for controlling the temperature of the temperature control liquid to a predetermined temperature;
The two liquids are separated into layers and direct heat exchange is performed at the interface between the two liquids, and as the temperature control liquid flows, the processing liquid is caused to flow at the interface, and the processing liquid is always maintained at a predetermined temperature by natural convection. A constant temperature processing device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6298580A JPS56160585A (en) | 1980-05-13 | 1980-05-13 | Heat exchanging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6298580A JPS56160585A (en) | 1980-05-13 | 1980-05-13 | Heat exchanging method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56160585A JPS56160585A (en) | 1981-12-10 |
| JPS6355637B2 true JPS6355637B2 (en) | 1988-11-02 |
Family
ID=13216156
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6298580A Granted JPS56160585A (en) | 1980-05-13 | 1980-05-13 | Heat exchanging method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56160585A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01307302A (en) * | 1988-06-06 | 1989-12-12 | Nec Corp | Loop antenna for portable radio equipment |
| JPH04196727A (en) * | 1990-11-27 | 1992-07-16 | Matsushita Electric Ind Co Ltd | Display device for small-sized electronic equipment |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102393160B (en) * | 2011-11-10 | 2013-07-17 | 广州市高衡力节能科技股份有限公司 | Symmetrical balanced type fluid directors |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5230953A (en) * | 1975-09-03 | 1977-03-09 | Mitsubishi Heavy Ind Ltd | Heat-exchanging process by mixing two liquids |
-
1980
- 1980-05-13 JP JP6298580A patent/JPS56160585A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01307302A (en) * | 1988-06-06 | 1989-12-12 | Nec Corp | Loop antenna for portable radio equipment |
| JPH04196727A (en) * | 1990-11-27 | 1992-07-16 | Matsushita Electric Ind Co Ltd | Display device for small-sized electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56160585A (en) | 1981-12-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111552359B (en) | Immersion liquid cooling tank and cooling device | |
| CN111615291B (en) | Immersion cooling device | |
| JPS6355637B2 (en) | ||
| CN219372963U (en) | Liquid cooling cabinet, liquid cooling equipment and liquid cooling system | |
| JPH0317443A (en) | Heat exchanger | |
| CN113213769B (en) | Etching thinning system | |
| CN111831084B (en) | Cooling system | |
| US3469625A (en) | Heat exchanger for cooling liquids | |
| SU981813A1 (en) | Unit for heating and cooling agressive liquids | |
| CN215917354U (en) | Cooling device for waste sulfuric acid treatment reaction tank | |
| JPH0616215Y2 (en) | Heat exchanger | |
| CN209953345U (en) | Circulation groove structure | |
| CN222560728U (en) | Temperature adjusting device of extraction liquid and extraction system | |
| CN210400060U (en) | Heat exchanger flow straightener | |
| SU1416161A1 (en) | Film tubular heat-mass exchange apparatus | |
| CN222883621U (en) | Battery pack liquid cooling circulation device | |
| CN217431756U (en) | Heat insulation device for centralized synthesis reaction and series or parallel structure of heat insulation device | |
| CN223144501U (en) | Mixing mechanism for hydrofluoric acid blending | |
| CN221349851U (en) | Stripping agent dosing device | |
| JPH0627364Y2 (en) | Hot plate hot plate heating mechanism | |
| CN114375132B (en) | Electronic device heat dissipation system for preventing condensation and water mechanical equipment | |
| CN217979496U (en) | Printing ink refrigerating device | |
| CN111912255B (en) | High-efficiency spiral-flow type heat exchanger | |
| CN112235995A (en) | A chilled water system for data center cooling | |
| JPH11142072A (en) | Vertical type heat exchanger |