JPS6355740B2 - - Google Patents
Info
- Publication number
- JPS6355740B2 JPS6355740B2 JP21517981A JP21517981A JPS6355740B2 JP S6355740 B2 JPS6355740 B2 JP S6355740B2 JP 21517981 A JP21517981 A JP 21517981A JP 21517981 A JP21517981 A JP 21517981A JP S6355740 B2 JPS6355740 B2 JP S6355740B2
- Authority
- JP
- Japan
- Prior art keywords
- case
- wiring board
- insulating stand
- printed wiring
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000565 sealant Substances 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
【発明の詳細な説明】
（利用分野）
本発明はリレーの機能アツプを図る上で、IC
化された電子回路を内蔵した電子回路内蔵型リレ
ーに関する。[Detailed Description of the Invention] (Field of Application) The present invention uses IC
The present invention relates to a relay with a built-in electronic circuit that has a built-in electronic circuit.
（従来技術の問題点）
近年の電子技術の発達に伴ないリレーにIC化
した電子回路を組み込んで従来にない新しいより
高度な機能を持たせた所謂メカトロリレー（電子
回路とリレーを組み合わせたリレー）が造出され
て来た。(Problems with conventional technology) With the development of electronic technology in recent years, so-called mechatronic relays (relays that combine electronic circuits and relays) have incorporated IC-based electronic circuits into relays to provide new and more advanced functions than ever before. ) has been created.
而して、第３図の従来例に示す如くICチツプ
を有する耐熱性絶縁台イをフレキシブ型プリント
配線板ロの中央に装着し、これをカールしてケー
スハの一側に収納し、ベースニとでシール剤を充
填して密封する。 Then, as shown in the conventional example in Fig. 3, a heat-resistant insulating stand with an IC chip is attached to the center of the flexible printed wiring board, and it is curled and stored on one side of the case. Fill with sealant and seal.
ところで、その絶縁台イが硬質のためカールさ
れず傾斜し、ケースハの内面角部とで三角型の空
室ホが形成される。 By the way, since the insulating base A is hard, it is not curled but tilted, and a triangular cavity E is formed with the inner corner of the case C.
従つて、この空室が形成されると、外気の湿度
変化に対応して空室のケース内側面に水滴が付着
し、この水滴によりプリント配線板の通電部、
IC部分が腐蝕し、断線する。 Therefore, when this empty chamber is formed, water droplets adhere to the inner surface of the case of the empty chamber in response to changes in the humidity of the outside air, and these water droplets cause the current-carrying parts of the printed wiring board,
The IC part corrodes and breaks.
又、この空室に充満している空気層が内部の熱
放散を損なわせ、寿命低下ともなる。 Furthermore, the air layer filling this empty space impairs internal heat dissipation, resulting in a shortened lifespan.
（目的）
本発明は上記点に鑑みてなしたものであつて、
即ち、ケースの内面を傾斜壁としたから空室を無
くし、もつて湿度変化からくる水滴の付着を阻止
し、熱放散も良好となることを目的としたもので
ある。(Purpose) The present invention has been made in view of the above points, and
That is, since the inner surface of the case has a sloped wall, there is no empty space, and the purpose is to prevent water droplets from adhering to the case due to changes in humidity, and to improve heat dissipation.
（実施例）
以下本発明を一実施例として掲げた図面に基づ
いて説明すると、１はICチツプ２を装備した耐
熱性絶縁台で、マイカ、セラミツク等の無機質材
にて作られる。３はこの絶縁台１を中央に付着し
たフレキシブ型プリント配線板、４はケース、５
はベースで、ケース４は磁気シールドから主に金
属性となる。而してこのケース４とベースとの一
側部に前記フレキシブ型プリント配線板３がカー
ルされ収納されると共に、ベース５の差込栓刃６
と電気的接続される。７はケース４の内面に形成
された傾斜壁でICチツプの絶縁台１が傾斜して
おり、それに沿つた形状となる。而してケース４
とベース５との間にシール剤８が充填され、密封
される。このためケース４及びベース５と配線板
３との隙間にシール剤８が流れ込むのである。(Example) The present invention will be described below based on the drawings as an example. Reference numeral 1 denotes a heat-resistant insulating stand equipped with an IC chip 2, which is made of an inorganic material such as mica or ceramic. 3 is a flexible printed wiring board with this insulating stand 1 attached to the center, 4 is a case, and 5 is a
is the base, and the case 4 is mainly made of metal due to the magnetic shielding. The flexible printed wiring board 3 is curled and stored on one side of the case 4 and the base, and the plug blade 6 of the base 5 is
electrically connected to. Reference numeral 7 denotes an inclined wall formed on the inner surface of the case 4, on which the insulating stand 1 of the IC chip is inclined, and the shape follows the inclined wall. Then case 4
A sealant 8 is filled between the base 5 and the base 5, and the space is sealed. Therefore, the sealant 8 flows into the gaps between the case 4 and the base 5 and the wiring board 3.
（効果）
本発明は上記の如く、ケース４の内面を傾斜し
たICチツプの絶縁台１に沿う傾斜壁７としたか
ら、従来の如く傾斜した絶縁台１とケース４との
間に三角形の空室が出来るようなことがなく、従
つて外気の湿度変化からくる水滴の付着が阻止で
き、もつて充電部、ICチツプの腐蝕が防止でき、
且つ空気層のための熱放散の悪影響もない効果が
ある。(Effects) As described above, in the present invention, since the inner surface of the case 4 is formed with the inclined wall 7 along the inclined insulating stand 1 of the IC chip, a triangular space is formed between the inclined insulating stand 1 and the case 4 as in the conventional case. This prevents the formation of cavities and prevents the adhesion of water droplets caused by changes in the humidity of the outside air, thereby preventing corrosion of live parts and IC chips.
In addition, there is no adverse effect of heat dissipation due to the air layer.
図面第１図及び第２図は本発明電子回路内蔵型
リレーの一実施例を示し、第１図は斜面図、第２
図は切欠正面図、第３図は従来例図である。
１……絶縁台、２……ICチツプ、３……プリ
ント配線板、４……ケース、５……ベース、７…
…傾斜壁、８……シール剤。
Figures 1 and 2 show an embodiment of the relay with built-in electronic circuit according to the present invention.
The figure is a cutaway front view, and FIG. 3 is a diagram of a conventional example. 1... Insulation stand, 2... IC chip, 3... Printed wiring board, 4... Case, 5... Base, 7...
...Sloped wall, 8...Sealant.
Claims (1)
絶縁台を中央に装着したフレキシブ型プリント配
線板と、このフレキシブ型プリント配線板をカー
ルして収納すると共に、而もその傾斜して収納さ
れた絶縁台に沿う傾斜壁を形成したケースと、こ
のケースとでシール剤を充填するベースとでなし
たことを特徴とした電子回路内蔵型リレー。1. A heat-resistant insulating stand equipped with an IC chip, a flexible printed wiring board with this insulating stand mounted in the center, and a flexible printed wiring board that is curled and stored, and is also stored at an angle. A relay with a built-in electronic circuit characterized by a case formed with an inclined wall along an insulating stand, and a base filled with a sealant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21517981A JPS58117626A (en) | 1981-12-29 | 1981-12-29 | Electric circuit built-in relay |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21517981A JPS58117626A (en) | 1981-12-29 | 1981-12-29 | Electric circuit built-in relay |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58117626A JPS58117626A (en) | 1983-07-13 |
| JPS6355740B2 true JPS6355740B2 (en) | 1988-11-04 |
Family
ID=16667972
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21517981A Granted JPS58117626A (en) | 1981-12-29 | 1981-12-29 | Electric circuit built-in relay |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58117626A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62145392U (en) * | 1986-03-07 | 1987-09-12 | ||
| JPH0636634Y2 (en) * | 1986-12-27 | 1994-09-21 | キヤノン株式会社 | Lens barrel |
| JP2588884B2 (en) * | 1987-02-18 | 1997-03-12 | オリンパス光学工業株式会社 | Electrical built-in lens |
| DE102021211327A1 (en) | 2021-10-07 | 2023-04-13 | Brose Fahrzeugteile SE & Co. Kommanditgesellschaft, Würzburg | Process for manufacturing an electronic unit |
-
1981
- 1981-12-29 JP JP21517981A patent/JPS58117626A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58117626A (en) | 1983-07-13 |
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