JPS6356878B2 - - Google Patents
Info
- Publication number
- JPS6356878B2 JPS6356878B2 JP14310080A JP14310080A JPS6356878B2 JP S6356878 B2 JPS6356878 B2 JP S6356878B2 JP 14310080 A JP14310080 A JP 14310080A JP 14310080 A JP14310080 A JP 14310080A JP S6356878 B2 JPS6356878 B2 JP S6356878B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- tin
- speculum
- copper
- hydrophilic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 15
- 239000010949 copper Substances 0.000 claims description 15
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052804 chromium Inorganic materials 0.000 claims description 6
- 239000011651 chromium Substances 0.000 claims description 6
- 230000005660 hydrophilic surface Effects 0.000 claims description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 150000002736 metal compounds Chemical class 0.000 claims description 4
- 150000002739 metals Chemical class 0.000 claims description 3
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 claims description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- 229910052793 cadmium Inorganic materials 0.000 claims description 2
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims description 2
- 229910017052 cobalt Inorganic materials 0.000 claims description 2
- 239000010941 cobalt Substances 0.000 claims description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 61
- 229910000831 Steel Inorganic materials 0.000 description 12
- 239000010959 steel Substances 0.000 description 12
- 229910045601 alloy Inorganic materials 0.000 description 11
- 239000000956 alloy Substances 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 238000001556 precipitation Methods 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000005028 tinplate Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- ALKZAGKDWUSJED-UHFFFAOYSA-N dinuclear copper ion Chemical compound [Cu].[Cu] ALKZAGKDWUSJED-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910000597 tin-copper alloy Inorganic materials 0.000 description 2
- 239000005749 Copper compound Substances 0.000 description 1
- 229910017755 Cu-Sn Inorganic materials 0.000 description 1
- 229910017927 Cu—Sn Inorganic materials 0.000 description 1
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
- 101000621511 Potato virus M (strain German) RNA silencing suppressor Proteins 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 description 1
- GPHCZOCPBPPOSQ-UHFFFAOYSA-N tricyanostannylformonitrile Chemical compound N#C[Sn](C#N)(C#N)C#N GPHCZOCPBPPOSQ-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/04—Printing plates or foils; Materials therefor metallic
- B41N1/08—Printing plates or foils; Materials therefor metallic for lithographic printing
- B41N1/10—Printing plates or foils; Materials therefor metallic for lithographic printing multiple
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/04—Printing plates or foils; Materials therefor metallic
- B41N1/08—Printing plates or foils; Materials therefor metallic for lithographic printing
Landscapes
- Printing Plates And Materials Therefor (AREA)
- Laminated Bodies (AREA)
- Electroplating Methods And Accessories (AREA)
Description
本発明は親水性層として錫−銅合金、さらに特
にスペキユラム合金を含有する新規のオフセツト
板に関するものである。
既に、オフセツト板を実現する際の錫表面の親
水性および表面電位の利用は知られている。しか
し、実際にこの種のオフセツト板(すなわち錫成
分の親水性層を有するオフセツト板)は、
−一方では、一般に市販されている錫表面に、必
要な親インク性層を被着することは困難であ
り、
−他方では、錫は硬度が不十分なため極めて容易
にかき傷ができる、
故に決して商品化されることはなかつた。
本発明は、今日まで錫の利用において出会う障
害の全部または一部を解決することができる鋼板
および錫を基礎とした親水性表面から成るオフセ
ツト板に関するものである。
一層大きい表面硬度を与えるため錫に混入する
ことができる金属のうち、銅が好ましい金属であ
ることを見出した。また、
−一方では、約45〜55%までの銅を含有する錫−
銅2元素金属化合物は無光沢または半光沢の形
で極めて容易に析出することができ、
−他方では、約45〜60%までの銅を含有する錫−
銅2元素金属化合物は、銅の既知の親水性にも
かかわらず、錫の親水性および嫌インク性を保
持し、
−最後に、利用し得る錫−銅2元素金属化合物の
うち、スペキユラムが本発明の好ましい生成物
を構成することを見出した。
スペキユラムは基部が銅と錫であり約60〜55%
の銅と約40〜45%の錫を含むことができる既知の
合金である。この合金は今まで、生成物の表面硬
度、不変性および外観(すなわち色調)を用い
て、種々の目的の表面を実現させるために本来用
いられてきた。
従つて、本発明は40〜90重量%の錫および10〜
60重量%の銅を含有する錫−銅合金を基礎とした
親水性表面を示し、さらに特にスペキユラム表面
を示すオフセツト板に関するものである。
本発明による親水性表面が錫−銅2元素金属表
面である場合、この表面は亜鉛、コバルト、ニツ
ケルおよびカドミウムから選ばれた第3成分を含
有することができる。この第3成分は比較的少
量、20%以下、好ましくは5%以下の量で含まれ
る。
しかし、本発明により利用するに好ましい合金
はスペキユラムである。この合金は実際、オフセ
ツト板に前記合金を使用する場合、完全な一連の
好ましい性質を有する。これらの性質は本来次の
ようである。
−目的とする実施に十分な表面硬度、
−評価し得る表面の外観(艶消し)、
−目的とする実施に用い得る金属層および必要に
応じて有機層との良好な適合性、
−この技術分野で一般に利用される腐蝕溶液に対
する顕著な抵抗性、
−ゼロに近い電位、
−および水分を捕えインクを弾く能力。
親水性のスペキユラム層に2種の方法を用いる
ことができる。
(a) まず初めに、印刷用の板を用いる場合、親水
性層としてすなわち水分を捕えインクを捕えな
い層として利用することができる。この種のオ
フセツト板を実現するため、適当な支持体に析
出させたスペキユラム層を、既知の方法によ
り、既知の親インク性金属(または合金)層に
よつて(例えば銅)または既知の感光性樹脂層
によつて被覆する。
(b) しかし同様に特にこのスペキユラム層を親水
性金属層の下層として使用することができる。
従つてスペキユラム層にクロム層または錫−ニ
ツケル層を析出させることができる。この種の
実施では印刷用に板を用いる場合、水を捕える
層はスペキユラム層ではなくこれを被覆する親
水性層である。しかし、前述のスペキユラム層
に親水性金属の非常に薄い層を析出させること
ができるので、このような実施においても、ス
ペキユラム層の親水性は極めて大きい重要性を
有する。仮定として表面の親水性金属層が小孔
が多いにせよ未完成であるにせよ、オフセツト
板の表面の一部の親水性を確保することを見出
した。スペキユラムを親水性金属層の下層とし
て用いる第2の利用可能性としては、一方では
艶消しの様相(スペキユラムに析出した親水性
金属層の表面に見出される様相)を備え得るス
ペキユラムの特性、および他方では特に二元素
金属板を使用する際に用いられる腐蝕溶液に抵
抗するスペキユラムの特性が同時に認められる
ことにある。
この種のオフセツト板を実現するには、適当な
支持体に析出したスペキユラム層に親水性金属層
(例えばクロムまたは錫−銅)を既知の方法で被
覆し、前記の親水性層を親インク性金属層およ
び/または感光性樹脂層で被覆する。
本発明の親水性合金、および特にスペキユラム
を多くの表面に析出させ固着させることができる
が、支持体として、極めて薄い錫層または錫を基
礎とした合金層を表面に被覆したいわゆる鉄(ま
たは鋼)のブリキを利用した本発明を使用するこ
とは特に興味あることである。このような材料
(ブリキ)は特に罐詰工業に一般に利用される。
以下、本発明を実施例により説明する。
実施例 1
スペキユラムの析出
(1) スペキユラム析出のための電解槽
現在知られているスペキユラム析出のための
電解槽は文献に記載されており、その基本的特
徴は次のようである。
(a) 組成(平均)
錫 40g/
銅 8g/
遊離シアン化物 16g/
遊離水酸化ナトリウム 15g/
(b) 操作条件
65℃の温度で操作する。陽極は一部は電解
銅で一部は純錫である。各陽極を特別の回路
に供給する。この回路は銅に対して2〜3ボ
ルトOA、62アンペア/dm2および錫に対し
て3〜5ボルト1A、8アンペア/dm2であ
る。この条件でのスペキユラムの析出速度は
5分間で約3ミクロンである。
(2) 板
鋼板USINOR上に、前記槽を用いて、3ミ
クロン厚さのスペキユラム層(銅58%および錫
42%)を析出後、洗浄、すすぎ、磨き、再度す
すぎを行つた。
スペキユラム層の外観は艶消しの乳色であつ
た。
すすぎと乾燥を行つた後、約80tr/分で施廻
盤を回転させて約1.8ミクロンの印刷感光層
(ラソシエテPCASのPR12層)を被覆した。熱
風で5分間次いで乾燥炉で層を乾かした。
日光にさらした後、使用する感光層に合う現
像液で現像した。可溶部分を除去してスペキユ
ラム層を裸にした。すすぎ洗いの後、過剰の水
をへらで押し出し、3%の燐酸溶液を2分間仕
上に注いだ。次いですすぎ乾燥後、板にゴムを
塗つた。機械に利用するこの板はいかなる場合
も油などで運転を妨げず、また10000回以上実
施後も利用することができた。
実施例 2
スペキユラムの沈澱
上に述べたと同様の方法により(スペキユラム
層の沈澱に関して)次に示す板を製造した。
(A) 鋼(支持体)
スペキユラム1.9ミクロン(吸水層)
印刷感光層
(B) 鋼(支持体)
スペキユラム2.5ミクロン(吸水層)
銅0.09ミクロン(中間保護層)
印刷感光層
(C) 鋼(支持体)
スペキユラム2.5ミクロン(吸水層)
銅2.5ミクロン(親インク層)
(D) 鋼(支持体)
スペキユラム1.5ミクロン(中間層)
クロム0.5ミクロン(吸水層)
印刷感光層
(E) 鋼(支持体)
スペキユラム1ミクロン(中間層)
クロム1ミクロン(吸水層)
銅0.09ミクロン(中間層)
印刷感光層
A、B、C、DおよびEの板において、鋼の支
持体を不酸化鋼またはブリキ(すなわち錫の薄層
で被覆した鋼)の支持体、または例えば錫めつき
法で適当に処理したアルミニウム支持体で、代用
することができる。
DおよびEの板において、吸水性の層(クロ
ム)を、他の吸水性の金属層例えば錫−ニツケル
層で代用することができる。
スペキユラム層の厚さを条件(支持体、スペキ
ユラム層の作用等)により変化させることがで
き、また、特に中間層の場合、僅か0.005ミクロ
ンの厚さから5ミクロンの厚さまでの層を有する
ことができ、これ以上の厚さでは評価し得る程の
特性は何ら示さない。
実施例 3
銅および錫のシアン化物を基礎とした既知の槽
(特にピロ燐酸カリウムおよびシアン化カリウム
を同量含有する槽)により、鋼板の艶のある滑ら
かな表面に約60%の錫および40%の銅を含有する
合金を析出させた。
得られた表面は完全に親水性でインクを嫌うの
で(適当な感光層で被覆後)板をオフセツト板と
して利用することができる。
実施例 4
同様の電解析出の方法に従つて、鋼板を2元素
金属の錫−銅化合物により被覆した。
得られた層の硬度および親水性(+)を測定し
た。
結果を次表に示した。
The present invention relates to a novel offset plate containing a tin-copper alloy, more particularly a speculum alloy, as a hydrophilic layer. The use of the hydrophilicity and surface potential of the tin surface in realizing offset plates is already known. However, in reality, this type of offset plate (i.e., an offset plate with a hydrophilic layer of tin component) is difficult to apply. -On the other hand, tin is not hard enough and can be scratched very easily, so it was never commercialized. The present invention relates to an offset plate consisting of a steel plate and a tin-based hydrophilic surface, which makes it possible to overcome all or some of the obstacles encountered to date in the use of tin. It has been found that of the metals that can be mixed with tin to provide greater surface hardness, copper is the preferred metal. Also - on the one hand, tin containing up to about 45-55% copper -
Copper binary metal compounds can be deposited very easily in matte or semi-bright form - on the other hand, tin containing up to about 45-60% copper -
Copper binary metal compounds retain the hydrophilicity and ink repellency of tin, despite copper's known hydrophilic properties; -Finally, of the available tin-copper binary metal compounds, speculum is the most important. It has been found that this constitutes a preferred product of the invention. Speculum has a base of copper and tin, about 60-55%
is a known alloy that can contain about 40-45% copper and about 40-45% tin. This alloy has hitherto been used primarily to achieve various desired surfaces using the surface hardness, constancy and appearance (i.e. color) of the product. Therefore, the present invention contains 40-90% by weight of tin and 10-90% by weight of tin.
It relates to an offset plate exhibiting a hydrophilic surface and more particularly a speculum surface based on a tin-copper alloy containing 60% by weight of copper. If the hydrophilic surface according to the invention is a tin-copper binary metal surface, this surface may contain a third component selected from zinc, cobalt, nickel and cadmium. This third component is present in a relatively small amount, less than 20%, preferably less than 5%. However, the preferred alloy for use in accordance with the present invention is speculum. This alloy actually has a complete set of favorable properties when using said alloy in offset plates. These properties are essentially as follows. - Sufficient surface hardness for the intended implementation; - Appreciable surface appearance (matte); - Good compatibility with metallic and optionally organic layers that can be used for the intended implementation; - the technology Outstanding resistance to corrosive solutions commonly used in the field, - near-zero electrical potential, - and the ability to trap moisture and repel ink. Two methods can be used for the hydrophilic speculum layer. (a) First of all, when using a printing plate, it can be used as a hydrophilic layer, ie a layer that traps moisture but not traps ink. To realize an offset plate of this kind, a speculum layer deposited on a suitable support is coated by a known method with a layer of a known ink-philic metal (or alloy) (e.g. copper) or a known photosensitive material. Cover with a resin layer. (b) However, it is likewise possible in particular to use this speculum layer as an underlayer of a hydrophilic metal layer.
It is therefore possible to deposit a chromium layer or a tin-nickel layer on the speculum layer. In this type of implementation, when the plate is used for printing, the water-trapping layer is not the speculum layer but a hydrophilic layer covering it. However, even in such implementations, the hydrophilicity of the speculum layer is of great importance, since very thin layers of hydrophilic metals can be deposited in the speculum layer mentioned above. Assuming that the hydrophilic metal layer on the surface is porous or unfinished, it has been found that the hydrophilicity of a portion of the surface of the offset plate is ensured. A second possibility of using speculum as an underlayer of a hydrophilic metal layer is the property of speculum, which can have a matte appearance (a feature found on the surface of a hydrophilic metal layer deposited on speculum) on the one hand, and on the other hand At the same time, the properties of speculum in resisting corrosive solutions used, especially when using two-element metal plates, are recognized at the same time. To realize an offset plate of this type, the speculum layer deposited on a suitable support is coated with a hydrophilic metal layer (for example chromium or tin-copper) in a known manner, and the said hydrophilic layer is made ink-philic. Coating with a metal layer and/or a photosensitive resin layer. The hydrophilic alloys of the invention, and in particular speculum, can be deposited and fixed on many surfaces, but as a support the so-called iron (or steel) whose surface is coated with a very thin layer of tin or a layer of tin-based alloy Of particular interest is the use of the present invention utilizing tinplate. Such materials (tinplate) are commonly used, especially in the packaging industry. The present invention will be explained below using examples. Example 1 Deposition of speculum (1) Electrolytic cell for speculum precipitation Currently known electrolytic cells for speculum precipitation are described in the literature, and their basic characteristics are as follows. (a) Composition (average) Tin 40g / Copper 8g / Free cyanide 16g / Free sodium hydroxide 15g / (b) Operating conditions Operate at a temperature of 65°C. The anode is partly electrolytic copper and partly pure tin. Each anode is fed into a special circuit. This circuit is 2-3 volts OA , 62 amps/dm 2 for copper and 3-5 volts 1 A , 8 amps/dm 2 for tin. The deposition rate of speculum under these conditions is about 3 microns per 5 minutes. (2) Plate A 3 micron thick speculum layer (copper 58% and tin
After depositing 42%), washing, rinsing, polishing, and rinsing again were performed. The appearance of the speculum layer was a matte milky color. After rinsing and drying, a printing photosensitive layer of approximately 1.8 microns (PR12 layer from La Société PCAS) was coated by rotating the coating plate at approximately 80 tr/min. The layer was dried with hot air for 5 minutes and then in a drying oven. After exposure to sunlight, it was developed with a developer compatible with the photosensitive layer used. The soluble portion was removed to expose the speculum layer. After rinsing, excess water was pushed out with a spatula and a 3% phosphoric acid solution was poured over the finish for 2 minutes. After rinsing and drying, the board was then coated with rubber. This board used in machinery did not interfere with operation under any circumstances due to oil, and was able to be used even after more than 10,000 trials. Example 2 Speculum Precipitation The following plates were produced in a manner similar to that described above (with respect to speculum layer precipitation). (A) Steel (support) Speculum 1.9 micron (water absorption layer) Printed photosensitive layer (B) Steel (support) Speculum 2.5 micron (water absorption layer) Copper 0.09 micron (intermediate protective layer) Printed photosensitive layer (C) Steel (support Speculum 2.5 micron (water absorption layer) Copper 2.5 micron (ink-friendly layer) (D) Steel (support) Speculum 1.5 micron (intermediate layer) Chromium 0.5 micron (water absorption layer) Printed photosensitive layer (E) Steel (support) Speculum 1 micron (intermediate layer) Chromium 1 micron (water absorbing layer) Copper 0.09 micron (intermediate layer) Printed photosensitive layer In plates A, B, C, D and E, the steel support is made of non-oxidized steel or tin plate (i.e. tin). A support of steel coated with a thin layer of aluminum or an aluminum support suitably treated, for example by a tinning method, can be substituted. In plates D and E, the water-absorbing layer (chromium) can be replaced by another water-absorbing metal layer, such as a tin-nickel layer. The thickness of the speculum layer can be varied depending on the conditions (support, action of the speculum layer, etc.) and, especially in the case of intermediate layers, it is possible to have layers from only 0.005 microns thick to 5 microns thick. However, if the thickness is greater than this, no properties that can be evaluated will be exhibited. EXAMPLE 3 A known bath based on copper and tin cyanide (in particular a bath containing equal amounts of potassium pyrophosphate and potassium cyanide) deposits about 60% tin and 40% tin on the shiny smooth surface of a steel sheet. A copper-containing alloy was deposited. The resulting surface is completely hydrophilic and ink-phobic so that (after coating with a suitable photosensitive layer) the plate can be used as an offset plate. Example 4 A steel sheet was coated with a bimetallic tin-copper compound following a similar electrolytic deposition method. The hardness and hydrophilicity (+) of the resulting layer were measured. The results are shown in the table below.
【表】
2元素金属層の親水性は極めて明確であると評
価できると考えられ、錫につき約40重量%まで含
有するCu−Snの合金を利用することができる。[Table] It is considered that the hydrophilicity of the two-element metal layer can be evaluated to be extremely clear, and a Cu-Sn alloy containing up to about 40% by weight of tin can be used.
Claims (1)
60重量%の銅を含有する2元素金属化合物の親水
性表面を示すことを特徴とするオフセツト板。 2 親水性表面が亜鉛、コバルト、ニツケルおよ
びカドミウムから選ばれた他の金属を20重量%ま
で含むことができる特許請求の範囲第1項記載の
オフセツト板。 3 前記表面がスペキユラムである特許請求の範
囲第1項記載のオフセツト板。 4 スペキユラム層を親水性金属層、好ましくは
クロム層または錫−ニツケル層の下層として利用
する特許請求の範囲第3項記載のオフセツト板。[Scope of Claims] 1. The offset plate is made of 40 to 90% by weight of tin and 10 to 90% by weight of tin.
1. An offset plate characterized in that it exhibits a hydrophilic surface of a two-element metal compound containing 60% by weight of copper. 2. Offset plate according to claim 1, in which the hydrophilic surface can contain up to 20% by weight of other metals chosen from zinc, cobalt, nickel and cadmium. 3. The offset plate according to claim 1, wherein the surface is a speculum. 4. Offset plate according to claim 3, in which the speculum layer is used as an underlayer of a hydrophilic metal layer, preferably a chromium layer or a tin-nickel layer.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7925605A FR2467087A1 (en) | 1979-10-15 | 1979-10-15 | Offset printing plate having tin-copper alloy layer - giving high hardness, hydrophilicity and ink-repellency |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5662194A JPS5662194A (en) | 1981-05-27 |
| JPS6356878B2 true JPS6356878B2 (en) | 1988-11-09 |
Family
ID=9230687
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14310080A Granted JPS5662194A (en) | 1979-10-15 | 1980-10-15 | Offset board |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS5662194A (en) |
| FR (1) | FR2467087A1 (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL114440B (en) * | ||||
| BE425188A (en) * | 1936-12-14 | |||
| DE1965231A1 (en) * | 1969-02-19 | 1970-09-10 | Svu Materialu | Pressure measuring probe arrangement for compacted material |
| FR2098784A5 (en) * | 1970-07-28 | 1972-03-10 | Kodak Pathe | Lithographic plate prepn - by treatment of copper plate with ferrocyanide ions |
| FR2417795A1 (en) * | 1978-02-15 | 1979-09-14 | Rhone Poulenc Graphic | NEW LITHOGRAPHIC PLATE SUPPORT AND IMPLEMENTATION PROCESS |
-
1979
- 1979-10-15 FR FR7925605A patent/FR2467087A1/en active Granted
-
1980
- 1980-10-15 JP JP14310080A patent/JPS5662194A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| FR2467087A1 (en) | 1981-04-17 |
| JPS5662194A (en) | 1981-05-27 |
| FR2467087B1 (en) | 1984-07-27 |
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