JPS6357517B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an apparatus for supplying basic metal ions to a plating solution, and more particularly to an apparatus capable of preventing accumulation and blockage of basic compound powder.

In an electroplating line having an insoluble anode, when plating metal is plated onto a steel strip, the ion concentration of the plating metal in the plating solution decreases, and the hydrogen ion concentration decreases. In order to adjust the composition of the plating solution in response to this change, a basic compound of the plating metal is introduced into the plating solution in the form of a powder or slurry from outside the plating line.

A conventional method for dissolving a powdered basic compound in a continuously circulating plating solution will be explained with reference to FIGS. 1 and 2. The steel strip 2 is plated using the insoluble anode 4 as a positive electrode, but the metal ions in the plating solution 10 in the plating tank 6 are consumed, and the same amount of hydrogen ions are generated, and the pH of the plating solution 10 decreases. do. For this purpose, a basic compound of plating metal ions is added to the plating solution 10 from outside the system to adjust the metal ion concentration and pH. For this purpose, the plating liquid 10 is transferred to the plating liquid receiving pipe 1.
2 into the dissolution tank 14, and on the other hand, the powdered basic compound 16 is transferred from the hopper 18 to the weighing tank 22 by the conveyor 20 as needed, and is weighed by the load cell 24 while being fed at a predetermined feed rate. Euphida 26 passes through the charging cylinder 28 and enters the dissolution tank 1.
4, and stirred with a stirrer 30 and dissolved in the tightening liquid 10. The plating liquid 10, which has been replenished with metal ions by dissolving the basic compound 16 and whose pH has been adjusted, is sent to the plating tank 6 by the plating liquid return piping 32 and the liquid sending pump 34. On the other hand, since the powder of the basic compound 16 is suspended in the exhaust gas from the dissolution tank 14, the powder is removed by a wet dust collector 38 through an exhaust pipe 36 and discharged.

The conventional basic metal ion replenishment device described above has the following drawbacks.

(a) The steam generated from the high-temperature plating liquid 10 condenses inside the charging tube 28, and the powder of the basic compound 16 adheres and accumulates, and in the worst case, the charging tube 28 becomes blocked.

(b) Powder adheres and accumulates on the inner wall of the dissolution tank 14.

(c) The exhaust pipe 36 becomes blocked with dust, making it impossible to exhaust the air.

(d) If the powder does not dissolve and floats in the plating liquid 10, the quality of plating will deteriorate.

In the conventional replenishing device, powder adheres and accumulates in various places as described above, which hinders stable pruning work, which poses a problem.

SUMMARY OF THE INVENTION An object of the present invention is to provide a basic metal ion replenishment device that solves the problems of the prior art described above and can perform stabilizing operations.

The gist of the present invention is as follows. That is, from the hopper to the conveyor, the weighing tank,
Screw feeder, electroplating with an insoluble anode that cuts the powdered basic compound into a dissolution tank through a charging tube, dissolves it in the plating solution in the dissolution tank, and exhausts it through an exhaust pipe and a wet dust collector. In the basic metal ion replenishment device for the circulating plating solution of the device, the plating solution overflow device is provided at the upper part of the charging tube, and the baffle has a through hole provided below the plating solution overflow device. A device for supplying basic metal ions to a plating solution, comprising a plate, and a plating solution spraying device and a passing device provided in the exhaust pipe.

The details of the present invention will be explained with reference to the embodiments shown in FIGS. 3 and 4. The electroplating line and the screw feeder 26 from the hopper 16 and the melting tank 14 body are the same as the conventional apparatus shown in FIG. Next, as a device featuring the present invention,
First, a tamping liquid overflow device 40 to which a liquid feeding pump 29 is attached is provided at the upper part of the powder input cylinder 28A. In addition, the plating liquid overflow device 4 of the input tube 28A
As shown in FIGS. 5A and 5B, there is a through hole 42 below the
A baffle plate 44 having a spiral shape or a cross shape is provided. On the other hand, a plating liquid spraying device 46 is provided in the exhaust pipe 36A, and a filtering device 48 is provided alternately therewith. A filling material 50 can be further placed on the filtering device 48 as required.

Next, the functions and effects of the basic metal ion replenishing device of the present invention having the above-described configuration will be explained. The liquid feed pump 29 is operated to cut out the powdered basic compound 16 while flowing the plating liquid 10 from the plating liquid overflow device 40 onto the inner surface of the input tube 28A, so that the plating liquid is not deposited on the inner surface of the input tube 28A. 10 films were formed, and no powder was deposited. Further, since the cut out powder is turned over many times while falling by the baffle plate 44, the plating liquid 10
thoroughly mixed and dissolved. Further, since the baffle plate 44 has the through hole 42, powder does not adhere to the back surface. Therefore, the tamping liquid 10 and the powder charged into the dissolving tank 14 from the charging tube 28A are sufficiently mixed, and unlike the conventional powder that falls directly onto the liquid surface of the dissolving tank 14, the powder is completely mixed in the dissolving tank 14. Since it is dissolved, it does not adhere or accumulate on the tank surface of the dissolving tank 14, and the plating liquid 10 returned to the plating tank 6 has no floating powder and has good plating quality. On the other hand, since the exhaust pipe 36A is provided with a plating liquid spraying device 46 and a filtering device 48, the dissolving tank 14
Since the exhaust gas sucked from the upper space of the exhaust pipe 36A traps dust and flows down with the plating liquid 10, the amount of dust in the exhaust gas is extremely small and does not adhere to the exhaust pipe 36A and block it.

As is clear from the above embodiments, the present invention includes a plating liquid overflow device and a baffle plate in the input tube from the screw feeder, and a plating liquid spraying device and a filter device in the exhaust pipe from the melting tank. By providing this, it was possible to prevent the basic compound powder from adhering to the apparatus, promote dissolution in the plating solution, and achieve the effect of enabling stable electroplating work.

[Brief explanation of drawings]

Figure 1 is a sectional view showing a conventional basic metal ion replenishment device, Figure 2 is a partially enlarged sectional view of Figure 1,
FIG. 3 is a sectional view showing a replenishment device according to an embodiment of the present invention;
Figure 4 is a partially enlarged sectional view of Figure 3, and Figures 5A and B.
2A and 2B are perspective views showing aspects of the baffle plate of the present invention. 2...Steel strip, 4...Insoluble anode, 6...Plating tank, 1
0... Plating liquid, 14... Dissolving tank, 16... Basic compound, 18... Hopper, 20... Conveyor, 22... Measuring tank, 26... Screw feeder, 28, 28A
...Charging tube, 36, 36A...Exhaust pipe, 38...Wet type dust collector, 40...Plating liquid overflow device, 42...Through hole,
44... Baffle plate, 46... Plating liquid spraying device, 48...
device.

Claims (1)

[Claims] 1 Cut the powdered basic compound from the hopper to the dissolution tank via the conveyor, measuring tank, screw feeder, and input tube, dissolve it in the plating solution in the dissolution tank, and exhaust it through the exhaust pipe and wet dust collector. In the basic metal ion replenishment device for the circulating plating solution of an electroplating device having an insoluble anode, the plating solution overflow device is provided at the top of the charging tube, and the plating solution overflow device is provided below the plating solution overflow device. 1. A basic metal ion replenishing device for a plating solution, comprising a baffle plate having a through hole provided therein, and a plating solution spraying device and a passing device provided in the exhaust pipe.