JPS6358910B2 - - Google Patents
Info
- Publication number
- JPS6358910B2 JPS6358910B2 JP9352484A JP9352484A JPS6358910B2 JP S6358910 B2 JPS6358910 B2 JP S6358910B2 JP 9352484 A JP9352484 A JP 9352484A JP 9352484 A JP9352484 A JP 9352484A JP S6358910 B2 JPS6358910 B2 JP S6358910B2
- Authority
- JP
- Japan
- Prior art keywords
- molten metal
- wire
- plating
- stranded wire
- bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims description 5
- 238000007711 solidification Methods 0.000 claims description 2
- 230000008023 solidification Effects 0.000 claims description 2
- 230000004907 flux Effects 0.000 description 7
- 238000001816 cooling Methods 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000007788 liquid Substances 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 235000021110 pickles Nutrition 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/34—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the shape of the material to be treated
- C23C2/36—Elongated material
- C23C2/38—Wires; Tubes
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Coating With Molten Metal (AREA)
- Manufacturing Of Electric Cables (AREA)
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は、成形撚線に低融点金属をめつきす
る方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) This invention relates to a method of plating formed stranded wire with a low melting point metal.
（従来技術）
従来、例えば撚線を長方形の断面形状に成形し
た成形撚線に半田等の低融点金属をめつきするこ
とが行われている。このような平角成形撚線は、
多数の細径の線材を撚り合せて占積率が75〜95％
に、かつ所定の断面形状に成形したものである。
この断面の残部５〜25％の空間を埋めるように半
田を含浸させるが、従来の方法ではボイドや表面
の凹凸が発生することが避けられなかつた。この
ようなボイドや凹凸は、例えばめつき線を超電導
導休として使用する時には有害な熱拡散障壁とし
て作用するために、これを完全に無くすことが望
しい。(Prior Art) Conventionally, for example, a formed stranded wire formed into a rectangular cross-sectional shape is plated with a low melting point metal such as solder. Such rectangular shaped stranded wire is
A space factor of 75 to 95% is achieved by twisting many small diameter wire rods together.
It is molded into a predetermined cross-sectional shape.
Solder is impregnated to fill the remaining 5 to 25% of the space in this cross section, but with conventional methods, voids and surface irregularities are unavoidable. Since such voids and irregularities act as a harmful thermal diffusion barrier when the plated wire is used as a superconducting conductor, it is desirable to completely eliminate them.
（発明の目的）
この発明は、このような従来の課題の解決のた
めになされたものであり、簡単な方法でボイドや
表面の凹凸の生じないめつき方法を提供するもの
である。(Object of the Invention) The present invention has been made to solve the above-mentioned conventional problems, and provides a simple plating method that does not generate voids or surface irregularities.
（発明の構成）
この発明は、溶融めつき槽の相対向する両側壁
にそれぞれ溶融金属浴中に開口するように設けた
絞り治具の一方を通して成形撚線を溶融金属浴中
に引込み、溶融金属浴中で成形撚線の撚りを一時
的に戻すように成形撚線にねじれを付与してその
内部に溶融金属を含浸させた後、他方の絞り治具
から引出すようにし、かつ出口側の絞り治具内に
おいて、溶融金属の凝固を完了させるようにした
ものである。(Structure of the Invention) This invention draws a forming stranded wire into a molten metal bath through one side of a drawing jig provided on each opposite side wall of a molten metal bath so as to open into the molten metal bath. After giving a twist to the forming stranded wire so as to temporarily untwist it in the metal bath and impregnating the inside with molten metal, it is pulled out from the other drawing jig, and The solidification of the molten metal is completed within the drawing jig.
（実施例）
以下、この発明の実施例を図面によつて説明す
る。第１図において、サプライスタンド１から繰
出された成形撚線からなる被めつき線（成形撚
線）２は、洗浄槽３を通されて洗浄されることに
より油分や潤滑剤の残渣が除去され、ついでフラ
ツクス処理槽４で処理されて溶融めつき槽５に送
り込まれ、ここで後述するめつきを行つた後、冷
却装置６を通してめつき線材２０をテイクアツプ
スタンド１１により巻取る。上記洗浄槽３では、
アルカリ洗浄、電解洗浄、有機溶剤脱脂等のいず
れかの方法で完全に洗浄することが必要である。
また必要に応じ酸洗も行い、十分に乾燥させる。
また、フラツクス処理槽４では半田用フラツクス
に浸漬または塗布し、乾燥させる。フラツクスの
種類は半田用フラツクスであればとくに限定はな
いが、例えば市販のロジン系フラツクスを用いれ
ばよい。(Example) Hereinafter, an example of the present invention will be described with reference to the drawings. In FIG. 1, a plated wire (formed stranded wire) 2 consisting of a formed stranded wire fed out from a supply stand 1 is passed through a cleaning tank 3 and washed to remove oil and lubricant residues. The wire rod 20 is then treated in a flux treatment tank 4 and fed into a melt-plating tank 5, where it undergoes plating to be described later.The wire rod 20 is then passed through a cooling device 6 and wound up by a take-up stand 11. In the cleaning tank 3,
It is necessary to completely clean it by any method such as alkaline cleaning, electrolytic cleaning, or organic solvent degreasing.
Also, if necessary, pickle the material and dry it thoroughly.
Further, in the flux treatment tank 4, the solder flux is dipped or applied and dried. The type of flux is not particularly limited as long as it is a soldering flux, but for example, a commercially available rosin-based flux may be used.
溶融めつき槽５は、第２図に示すように、めつ
き槽５１と、その側壁に設けられた入口用ダイス
（絞り治具）８と、出口用絞りダイス（絞り治具）
９と、出口側に断熱層１５とを有し、冷却装置６
と接続されている。出口用絞りダイス９は冷却装
置６中まで延び、溶融めつき浴１０中から送り出
される被めつき線２がこの出口用絞りダイス９を
通過する間に溶融金属が凝固するように冷却を行
つている。例えばめつき浴を60Sn／40Pb半田と
した場合、出口用絞りダイス９の入口部直前で
260℃、出口用絞りダイス９の出口部で160℃程度
になるように設定すればよい。めつき槽５１中に
は溶融めつき浴１０が貯留され、冷却装置６中に
は冷却水１２が貯留されている。溶融めつき浴１
０の液面上には酸化防止剤の層が形成され、また
液面上から液面調整部材７２が挿入されている。 As shown in FIG. 2, the melt plating tank 5 includes a plating tank 51, an inlet die (drawing jig) 8 provided on its side wall, and an exit drawing die (drawing jig).
9 and a heat insulating layer 15 on the outlet side, the cooling device 6
is connected to. The exit drawing die 9 extends into the cooling device 6, and cools the molten metal so that it solidifies while the plated wire 2 sent out from the molten plating bath 10 passes through the exit drawing die 9. There is. For example, if the plating bath is 60Sn/40Pb solder, just before the entrance of the exit drawing die 9,
It is sufficient to set the temperature to 260°C, and the temperature at the outlet of the exit drawing die 9 to be about 160°C. A molten plating bath 10 is stored in the plating tank 51, and cooling water 12 is stored in the cooling device 6. Melt plating bath 1
An antioxidant layer is formed on the liquid level of 0, and a liquid level adjusting member 72 is inserted from above the liquid level.
さらに溶融めつき浴１０中には、第３図に示す
ように、複数枚の治具７１，７２，７３が配置さ
れ、それらには被めつき線２を通過させる貫通穴
７４，７５，７６がそれぞれ形成されている。貫
通穴７４と７６とはダイス８，９の貫通穴と同様
に垂直方向に形成されているが、貫通穴７５はこ
れらに対して所定量傾斜して形成されている。仮
想線７７は垂直状態の位置を示し、これに対し貫
通穴７５は実線で示すように傾斜し、この傾斜方
向は、被めつき線２の撚りが戻される方向に設定
されている。また傾斜角度は、例えば治具７１，
７２，７３の間隔を、被めつき線２を構成する素
線の撚りピツチの1/2に設定して、貫通穴７５を
垂直状態７７から40゜傾斜させればよい。 Further, in the melt plating bath 10, as shown in FIG. are formed respectively. The through holes 74 and 76 are formed in the vertical direction like the through holes of the dies 8 and 9, but the through hole 75 is formed to be inclined by a predetermined amount with respect to these. The imaginary line 77 indicates the vertical position, whereas the through hole 75 is inclined as shown by the solid line, and the direction of this inclination is set in the direction in which the twisted wire 2 is untwisted. Further, the inclination angle is determined by, for example, the jig 71,
The interval between the wires 72 and 73 may be set to 1/2 of the twist pitch of the wires constituting the plated wire 2, and the through hole 75 may be inclined at 40 degrees from the vertical state 77.
上記のように治具７１，７２，７３を設置して
被めつき線２をその貫通穴７４，７５，７６を通
過させるようにすると、貫通穴７４と７５との間
で撚りが戻されることにより溶融めつきが被めつ
き線２の内部に含浸され、その後元の状態に戻さ
れ、出口用絞りダイス９を通過する間に凝固さ
れ、これによつて内部まで完全に溶融金属が含浸
した状態のめつき線２０が形成される。 When the jigs 71, 72, and 73 are installed as described above and the wire to be plated 2 is passed through the through holes 74, 75, and 76, the twist is untwisted between the through holes 74 and 75. The inside of the plated wire 2 is impregnated with molten metal, which is then returned to its original state and solidified while passing through the outlet drawing die 9, thereby completely impregnating the inside with molten metal. A plating line 20 is then formed.
なお、被めつき線２としては、銅線、銅合金、
鉄、鉄合金、ニツケル、アルミニウム等の線状体
がいずれも採用可能であり、また溶融めつき浴を
構成する金属としては錫、鉛、亜鉛、アルミニウ
ム等が採用可能である。 In addition, as the coated wire 2, copper wire, copper alloy,
Any linear material such as iron, iron alloy, nickel, or aluminum can be used, and tin, lead, zinc, aluminum, or the like can be used as the metal constituting the molten plating bath.
実施例
直径1.70mmの銅被覆の超電導線11本を、3.07×
9.40mmの長方形断面の成形撚線にしたものをこの
発明の方法によりめつきを行つた。脱脂はトリク
ロロエタンによる洗浄で行い、フラツクスは市販
のロジン系フラツクスを用い、半田浴はSn―37
％Pbで構成し、被めつき線２の送り速度は10
ｍ／minに設定した。これによつて得られためつ
き線材２０は第４図に示すような断面状態のも
の、すなわち素線２１を包むめつき金属２２の外
表面に凹凸がなく、しかも素線２１間の間隙部に
もボイドがほとんどないものが約2500ｍにわたり
形成された。Example 11 copper-coated superconducting wires with a diameter of 1.70 mm were
A formed stranded wire with a rectangular cross section of 9.40 mm was plated by the method of the present invention. Degreasing was done by cleaning with trichloroethane, a commercially available rosin flux was used, and the solder bath was Sn-37.
%Pb, and the feeding speed of the coated wire 2 is 10
It was set at m/min. The tamped wire 20 thus obtained has a cross-sectional state as shown in FIG. A gap with almost no voids was formed over a distance of approximately 2,500 m.
（発明の効果）
以上説明したように、この発明は成形撚線をめ
つきするに際し、溶融めつき浴中で一時的に撚り
を戻して内部まで完全にめつき金属が含浸するよ
うにしたものであり、簡単方法で表面の凹凸がな
く内部にもボイドが生じないめつき線を製造する
ことが可能なものである。(Effects of the Invention) As explained above, in this invention, when plating a formed stranded wire, the twist is temporarily untwisted in a molten plating bath so that the inside is completely impregnated with the plating metal. This makes it possible to produce a plated wire with no surface irregularities and no internal voids using a simple method.
第１図はこの発明を実施する装置の１例を示す
全体側面図、第２図はそのめつき槽および冷却装
置の断面図、第３図はめつき槽内の治具の斜視
図、第４図はこの発明により製造されためつき線
の横断面図である。
２…被めつき線（成形撚線）、５…溶融めつき
槽、６…冷却装置、８…入口用絞りダイス、９…
出口用絞りダイス、１０…溶融めつき浴、２０…
めつき線、２１…素線、２２…めつき金属、７
１，７２，７３…治具、７４，７５，７６…貫通
穴。
Fig. 1 is an overall side view showing one example of an apparatus for carrying out the present invention, Fig. 2 is a sectional view of the plating tank and cooling device, Fig. 3 is a perspective view of a jig in the plating tank, and Fig. 4 is a perspective view of a jig in the plating tank. The figure is a cross-sectional view of a threaded wire manufactured according to the invention. 2... Plated wire (molded stranded wire), 5... Melting plating tank, 6... Cooling device, 8... Inlet drawing die, 9...
Exit drawing die, 10... Melting bath, 20...
Plated wire, 21... Element wire, 22... Plated metal, 7
1, 72, 73... jig, 74, 75, 76... through hole.
Claims (1)
溶融金属浴中に開口するように設けた絞り治具の
一方を通して成形撚線を溶融金属浴中に引込み、
溶融金属浴中で成形撚線の撚りを一時的に戻すよ
うに成形撚線にねじれを付与してその内部に溶融
金属を含浸させた後、他方の絞り治具から引出す
ようにし、かつ出口側の絞り治具内において、溶
融金属の凝固を完了させるようにしたことを特徴
とする成形撚線の低融点金属めつき方法。1. Draw the forming stranded wire into the molten metal bath through one of the drawing jigs installed on the opposite side walls of the molten metal bath so as to open into the molten metal bath,
After giving a twist to the forming stranded wire so as to temporarily untwist it in the molten metal bath and impregnating the inside with molten metal, it is pulled out from the other drawing jig, and the exit side 1. A method for plating formed stranded wire with a low melting point metal, characterized in that solidification of the molten metal is completed in a drawing jig.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9352484A JPS60238467A (en) | 1984-05-09 | 1984-05-09 | Method of plating formed stranded wire with low melting point metal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9352484A JPS60238467A (en) | 1984-05-09 | 1984-05-09 | Method of plating formed stranded wire with low melting point metal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60238467A JPS60238467A (en) | 1985-11-27 |
| JPS6358910B2 true JPS6358910B2 (en) | 1988-11-17 |
Family
ID=14084705
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9352484A Granted JPS60238467A (en) | 1984-05-09 | 1984-05-09 | Method of plating formed stranded wire with low melting point metal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60238467A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002348652A (en) * | 2001-05-23 | 2002-12-04 | Kokoku Kousensaku Kk | Plated strand wire |
| JP4792713B2 (en) * | 2004-06-14 | 2011-10-12 | 日立電線株式会社 | Lead wire, manufacturing method thereof, and solar cell assembly |
| US9887025B2 (en) * | 2015-09-30 | 2018-02-06 | American Superconductor Corporation | High temperature superconductor wire bundling system and method |
| WO2022085207A1 (en) * | 2020-10-24 | 2022-04-28 | アートビーム有限会社 | Solder coating device and solder coating method |
-
1984
- 1984-05-09 JP JP9352484A patent/JPS60238467A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60238467A (en) | 1985-11-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3895851A (en) | Brittle-surfaced connector | |
| KR100518731B1 (en) | Porous electrode wire manufacturing method for use in electrical discharge machine | |
| US3359132A (en) | Method of coating circuit paths on printed circuit boards with solder | |
| US3842487A (en) | Terminating of electrical conductors | |
| EP0001921B1 (en) | Tinned copper braid for solder removing and method of manufacturing the same | |
| JPS5861505A (en) | Manufacturing method of inorganic insulated electric cable | |
| JPS6358910B2 (en) | ||
| JPS583348B2 (en) | Aluminum terminal and its manufacturing method | |
| GB2112417A (en) | Solderable iron wire and method for its production | |
| JP3243195B2 (en) | Reflow solder plating material and method of manufacturing the same | |
| US4497867A (en) | Multiwire twisted conductor and device for coating twisted conductor wires | |
| JP4269374B2 (en) | Tin-plated flat conductor manufacturing method and flat cable manufacturing method | |
| US2984903A (en) | Brazing alloy and ultrasonic process for using the same | |
| US4427469A (en) | Methods of and apparatus for controlling plastic-to-conductor adhesion of plastic-insulated, tinned conductors | |
| JPS628888B2 (en) | ||
| JPS6232022B2 (en) | ||
| JPH02204919A (en) | Conductor for coil | |
| DE2250836C3 (en) | Process for the production of an end piece of an electrical conductor made of aluminum cores that can be connected to a connecting terminal | |
| DE102010053768B4 (en) | Method for connecting an aluminum cable to a connection part | |
| JPS59126765A (en) | Hot dipping method of twisted wire | |
| KR100253313B1 (en) | Manufacturing method of insulation coating gold wire | |
| SU1099343A1 (en) | Process for stripping and servicing leads of wires with fluoroplastic insulation | |
| JP4296733B2 (en) | Sn-plated ultrafine copper wire, stranded wire using the same, and method for producing Sn-plated ultrafine copper wire | |
| JPS59226194A (en) | Manufacturing method for materials for electronic components | |
| JPS59145768A (en) | Method for hot dipping twisted wire |