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JPS6359085B2 - - Google Patents
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JPS6359085B2 - - Google Patents

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Publication number
JPS6359085B2
JPS6359085B2 JP13066682A JP13066682A JPS6359085B2 JP S6359085 B2 JPS6359085 B2 JP S6359085B2 JP 13066682 A JP13066682 A JP 13066682A JP 13066682 A JP13066682 A JP 13066682A JP S6359085 B2 JPS6359085 B2 JP S6359085B2
Authority
JP
Japan
Prior art keywords
lead wire
temperature sensor
thin film
film thermistor
thermistor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP13066682A
Other languages
Japanese (ja)
Other versions
JPS5919827A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP57130666A priority Critical patent/JPS5919827A/en
Publication of JPS5919827A publication Critical patent/JPS5919827A/en
Publication of JPS6359085B2 publication Critical patent/JPS6359085B2/ja
Granted legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/22Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
    • G01K7/223Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor characterised by the shape of the resistive element

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Electric Ovens (AREA)

Description

【発明の詳細な説明】 産業上の利用分野 本発明は調理器具、燃焼用器具等に使用される
温度センサに関するもので、簡単な構造でしかも
汚れ、結露に強い温度センサを提供するものであ
る。
[Detailed Description of the Invention] Industrial Application Field The present invention relates to a temperature sensor used in cooking utensils, combustion equipment, etc., and provides a temperature sensor that has a simple structure and is resistant to dirt and condensation. .

従来例の構成とその問題点 従来の温度センサは第1図に示す如く、器具に
取付ける取付け金具1を設けたセラミツク絶縁体
2の中間部に一対の相対する棒状リード線(コバ
ール棒:φ1.6)3よりなるリード線接続端子が用
いられ、薄膜サーミスタチツプは平板状絶縁基板
の表面に形成された感温抵抗体膜を含む感温素体
4と一対の内部リード線5(φ0.15程度)の白金
Pt細線または金Au細線で構成され、硝子管6内
に封入し、さらにコバール線(φ0.5程度)などの
外部リード線7と内部リード線5とを接続し、外
部リード線7は硝子管6と強固に封着され、さら
に外部リード線7は棒状リード線接続端子3に強
固に接続されている構成である。
Structure of the conventional example and its problems As shown in Fig. 1, the conventional temperature sensor has a pair of opposing rod-shaped lead wires (Kovar rod: φ1. 6) A lead wire connection terminal consisting of 3 is used, and the thin film thermistor chip is connected to a temperature sensing element body 4 including a temperature sensing resistor film formed on the surface of a flat insulating substrate and a pair of internal lead wires 5 (about φ0.15). platinum
It is composed of a thin Pt wire or a thin gold-Au wire, and is sealed inside a glass tube 6. Furthermore, an external lead wire 7 such as a Kovar wire (about φ0.5) and an internal lead wire 5 are connected. 6 and the external lead wire 7 is firmly connected to the rod-shaped lead wire connection terminal 3.

硝子管6で薄膜サーミスタチツプを内部リード
線5、外部リード線7を強固に封入着したのは、
薄膜サーミスタチツプを内部リード線5の金属細
線でリード線接続端子3に接続したのでは、機械
的強度が小さいという欠点があつたためである。
よつて前記硝子管6の構成では内部リード線5は
外部の機械的応力から保護され、金属細線でも十
分な実用性を有している。
The reason why the thin film thermistor chip is tightly sealed with the internal lead wire 5 and the external lead wire 7 in the glass tube 6 is as follows.
This is because connecting the thin film thermistor chip to the lead wire connection terminal 3 using the thin metal wire of the internal lead wire 5 had the drawback of low mechanical strength.
Therefore, in the structure of the glass tube 6, the internal lead wire 5 is protected from external mechanical stress, and even a thin metal wire has sufficient practicality.

また、外部リード線7もリード線接続端子3と
機械的に強固に接続されており実用状問題はな
い。しかし、この構成は複雑な構造で作業性が悪
く、よつて価格は高くなり、また熱容量が大きい
ため、熱応答性が遅いという欠点をもつている。
Further, the external lead wire 7 is also mechanically and firmly connected to the lead wire connecting terminal 3, and there is no problem in practical use. However, this configuration has the drawbacks of a complicated structure, poor workability, high cost, and slow thermal response due to its large heat capacity.

第2図は第1図に示した従来の温度センサを電
子レンジとオーブンレンジの複合商品に取り付け
た断面図である。第3図は温度センサ部の拡大断
面図である。
FIG. 2 is a sectional view of the conventional temperature sensor shown in FIG. 1 attached to a combination product of a microwave oven and a microwave oven. FIG. 3 is an enlarged sectional view of the temperature sensor section.

8は底板、9は前面開口が前面ドア10で開閉
される焙焼箱、その奥壁11に循環流入口12が
形成されている。13は焙焼箱9と別体でこの焙
焼箱9の背部にビスを介した取り付けた熱源ケー
スでありシーズヒータ14およびフアン15が収
納されている。16はフアンを駆動するモータ、
17は冷却フアン、18はフアン15をモータ軸
に取り付けるネジである。19は焙焼箱10の外
に設けられたマグネトロン、20は導波管、21
は電子レンジ用セラミツク皿、22は調理物をそ
れぞれ示す。温度センサは取付け金具1にビスを
介して焙焼箱9の天面に取り付けられており、空
気孔23を有するセンサカバー24で覆われてい
る構成である。その他制御部品等については省略
する。
8 is a bottom plate, 9 is a roasting box whose front opening is opened and closed by a front door 10, and a circulation inlet 12 is formed in the back wall 11 of the roasting box. A heat source case 13 is separate from the roasting box 9 and is attached to the back of the roasting box 9 via screws, in which a sheathed heater 14 and a fan 15 are housed. 16 is a motor that drives the fan;
17 is a cooling fan, and 18 is a screw for attaching the fan 15 to the motor shaft. 19 is a magnetron provided outside the roasting box 10; 20 is a waveguide; 21
2 shows a ceramic dish for microwave oven, and 22 shows a cooked food. The temperature sensor is attached to the top surface of the roasting box 9 through screws to the mounting bracket 1, and is covered with a sensor cover 24 having an air hole 23. Other control parts etc. are omitted.

温度センサのリード線接続端子3はリード線を
介して制御回路(図示せず)に至つている。焙焼
箱9の庫内温度は温度センサの薄膜サーミスタチ
ツプの抵抗変化を検知して制御するもので、特に
電子レンジの使用後にオーブンを使用する場合に
誤動作を生じる問題がある。
The lead wire connection terminal 3 of the temperature sensor is connected to a control circuit (not shown) via a lead wire. The internal temperature of the roasting box 9 is controlled by detecting a change in resistance of a thin film thermistor chip of a temperature sensor, which poses a problem of malfunction, especially when the oven is used after the microwave oven has been used.

これは器具を使用していると食品からの油、醤
油、食品かす等25が温度センサのセラミツク絶
縁体2、取付け金具1、リード線接続端子3、硝
子管6、外部リード線7に付着する。
This is because when the device is used, oil, soy sauce, food scraps, etc. 25 from food adhere to the temperature sensor's ceramic insulator 2, mounting bracket 1, lead wire connection terminal 3, glass tube 6, and external lead wire 7. .

電子レンジにて調理物22を加熱すると焙焼箱
9の庫内は調理物22の蒸気で充満し結露する。
上記温度センサの各部も結露水26にて覆われて
しまい、リード線接続端子3が結露水26でつな
がり、またリード線接続端子3と焙焼箱9、外部
リード線7間が結露水26でつながつてしまう。
When the food 22 is heated in a microwave oven, the inside of the roasting box 9 is filled with steam from the food 22 and condenses.
Each part of the temperature sensor is also covered with condensed water 26, the lead wire connecting terminal 3 is connected with the dew condensed water 26, and the lead wire connecting terminal 3, the roasting box 9, and the external lead wire 7 are connected with the dew condensed water 26. It's connected.

オーブンとして使用する場合、薄膜サーミスタ
チツプが正常な抵抗値を検知しても、結露水26
により制御回路へ行く抵抗値は大幅に変化した非
常に小さい抵抗値となつてしまう。つまり、誤動
作を行なつてしまう。
When used as an oven, even if the thin film thermistor chip detects a normal resistance value, condensation water
As a result, the resistance value going to the control circuit changes significantly and becomes a very small resistance value. In other words, a malfunction will occur.

従来の温度センサは汚れに弱く(食品からの
油、醤油、塩分、食品かす等25が付着しやす
い)。また結露水26がつきやすい(水滴がつな
がりやすい)汚れと結露に対して弱い欠点を有し
ている。
Conventional temperature sensors are susceptible to dirt (oil from food, soy sauce, salt, food particles, etc. 25 tend to adhere to them). It also has the disadvantage of being weak against dirt and dew condensation (water droplets tend to connect) easily.

発明の目的 本発明は従来の構成上の欠点を解決するととも
に、汚れと結露に強い、温度センサを提供するも
のである。
OBJECTS OF THE INVENTION The present invention provides a temperature sensor that overcomes the drawbacks of conventional constructions and is resistant to dirt and condensation.

発明の構成 上記目的を達するため、本発明は中間部を絶縁
体で固定された一対の相対する平板状のリード線
接続端子を有し、前記相対するリード線接続端子
間に薄膜サーミスタチツプの端部を収納する凹部
を備え前記薄膜サーミスタチツプ部をアルミナ系
接着剤で包みこむ構成であり、汚れに対して耐久
性のある温度センサを提供するものである。
Structure of the Invention In order to achieve the above object, the present invention has a pair of opposing flat lead wire connection terminals whose intermediate portions are fixed with an insulator, and an end of a thin film thermistor chip between the opposing lead wire connection terminals. The thin-film thermistor chip is wrapped in an alumina adhesive with a recess for accommodating the thin film thermistor chip, thereby providing a temperature sensor that is resistant to dirt.

実施例の説明 以下本発明の一実施例について図面に基づき説
明する。
DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

第4図は本発明の一実施例で温度センサの斜視
図を示す。第5図は薄膜サーミスタ部の拡大斜視
図を、第6図は同センサを機器に取付けた拡大部
分断面図である。
FIG. 4 shows a perspective view of a temperature sensor according to an embodiment of the present invention. FIG. 5 is an enlarged perspective view of the thin film thermistor section, and FIG. 6 is an enlarged partial sectional view of the sensor attached to a device.

取付け金具1を備えたセラミツク絶縁体27で
中間部を固定された一対の相対する平板状のリー
ド線接続端子(SOS430−0.6)28で相対する側
のリード線接続端子部に凹部29を設けている。
薄膜サーミスタチツプは感温素体4(2mmW×7
mmL×0.8t)と内部リード線5とからなる。凹部
29は薄膜サーミスタチツプの端部を収納できる
ように(2.5mmW×3mmL×0.8mmt)とした。こ
の凹部29は絞り加工により容易に形成できる。
内部リード線5と平板状リード線接続端子28と
はスポツト溶接により接続されている。さらに凹
部29にアルミナ系補強剤30を塗布し薄膜サー
ミスタチツプおよび内部リード線5を覆い、強固
に固定している。また、薄膜サーミスタチツプ
部、リード線接続端子28および取付け金具1、
セラミツク絶縁体27の全体を四弗化エチレン
(商標名テフロンなど)系樹脂31でコーテイン
グしている。このコーテイング剤としては撥水性
を有するものを使用している。
A pair of opposing flat lead wire connection terminals (SOS430-0.6) 28 are fixed in the middle with a ceramic insulator 27 equipped with a mounting bracket 1, and a recess 29 is provided in the lead wire connection terminal portion on the opposite side. There is.
The thin film thermistor chip has a temperature sensing element of 4 (2 mmW x 7
mmL×0.8t) and an internal lead wire 5. The recess 29 was designed to accommodate the end of the thin film thermistor chip (2.5 mmW x 3mmL x 0.8mmt). This recess 29 can be easily formed by drawing.
The internal lead wire 5 and the flat lead wire connection terminal 28 are connected by spot welding. Further, an alumina-based reinforcing agent 30 is applied to the recess 29 to cover the thin film thermistor chip and internal lead wire 5 and firmly fix them. In addition, the thin film thermistor chip part, the lead wire connection terminal 28 and the mounting bracket 1,
The entire ceramic insulator 27 is coated with a tetrafluoroethylene (trade name: Teflon, etc.) based resin 31. As this coating agent, one having water repellency is used.

この本発明の一実施例について落下試験(1m
の高さからSPタイル上に自由落下)を10回およ
び振動試験を行なつたが薄膜サーミスタチツプお
よび内部のリード線5をアルミナ系補強剤30に
て固めているため、強度的に十分に強く、まつた
く問題はない。
A drop test (1 m
We conducted a vibration test (free fall from a height of , there is no problem at all.

また、アルミナ系補強剤30で薄膜サーミスタ
チツプ全体を包みこんでしまうと熱応答性を遅く
することが出来、任意に熱応答性を決めることが
できる。
Furthermore, if the thin film thermistor chip is entirely wrapped in the alumina reinforcing agent 30, the thermal response can be slowed down, and the thermal response can be arbitrarily determined.

次に汚れと結露について述べる。本実施例の温
度センサには撥水性の表面処理コーテイングをほ
どこしているため、食品からの油、醤油、塩分、
食品かす等25が不着しにくい。また、焙焼箱9
内が水蒸気で充満しても、温度センサには撥水性
の表面処理コーテイングをしているため、水をは
じく状態となり、水は水玉32として存在するも
ので水が中に浸入することがない。つまり温度セ
ンサのセラミツク絶縁体27のリード線接続端子
28間、薄膜サーミスタチツプ間およびリード線
接続端子11と焙焼箱9間は水がつながらず、薄
膜サーミスタチツプで正常に抵抗を検知し、制御
回路へ伝えるものであり、誤動作の問題は全くな
い。また、四弗化エチレン系であり高温度に耐
え、実使用において全く問題ない。
Next, let's talk about dirt and condensation. The temperature sensor of this example is coated with a water-repellent surface treatment, so it is free from oil, soy sauce, and salt from food.
Food scraps etc. 25 are less likely to stick. Also, roasting box 9
Even if the inside is filled with water vapor, the temperature sensor is coated with a water-repellent surface treatment, so it will repel water, and the water will exist as water beads 32, so water will not seep into the inside. In other words, water is not connected between the lead wire connection terminals 28 of the ceramic insulator 27 of the temperature sensor, between the thin film thermistor chip, and between the lead wire connection terminal 11 and the roasting box 9, and the thin film thermistor chip normally detects resistance and controls the temperature sensor. It is transmitted to the circuit, so there is no problem of malfunction. In addition, it is made of tetrafluoroethylene and can withstand high temperatures, causing no problems in actual use.

発明の効果 本発明によれば、構造が簡単で、作業性が良く
安価な熱応答性の良い温度センサを提供すること
ができ、しかも、熱応答性を任意に決めることが
でき、さらに汚れに対して強く、結露に対して強
い温度センサを提供することができるもので従来
の温度センサに対しても、撥水性のコーテイング
を行なえば、汚れと結露に強い温度センサができ
る。
Effects of the Invention According to the present invention, it is possible to provide a temperature sensor with a simple structure, good workability, low cost, and good thermal responsiveness.Moreover, the thermal responsiveness can be arbitrarily determined, and it is also resistant to dirt. By applying a water-repellent coating to a conventional temperature sensor, a temperature sensor that is resistant to dirt and condensation can be provided.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の温度センサの外観斜視図、第2
図は同センサを加熱調理器に取付けた断面図、第
3図は同センサ取付け部の拡大断面図、第4図は
本発明の一実施例である温度センサの外観斜視
図、第5図は同センサの薄膜サーミスタ部の拡大
斜視図、第6図は同センサを加熱調理器に取付け
た状態を示す要部拡大断面図である。 4……感温素体(薄膜サーミスタチツプ)、2
7……セラミツク絶縁体、28……リード線接続
端子、29……凹部、30……アルミナ系接着
剤、31……撥水性を有する四弗化エチレン系樹
脂。
Figure 1 is an external perspective view of a conventional temperature sensor;
The figure is a cross-sectional view of the sensor attached to a heating cooker, FIG. 3 is an enlarged cross-sectional view of the sensor attachment part, FIG. 4 is an external perspective view of a temperature sensor that is an embodiment of the present invention, and FIG. FIG. 6 is an enlarged perspective view of the thin film thermistor portion of the sensor, and FIG. 6 is an enlarged sectional view of the main part showing the sensor attached to a cooking appliance. 4... Temperature sensitive element (thin film thermistor chip), 2
7... Ceramic insulator, 28... Lead wire connection terminal, 29... Recessed portion, 30... Alumina adhesive, 31... Tetrafluoroethylene resin having water repellency.

Claims (1)

【特許請求の範囲】 1 中間部を絶縁体で固定された一対の相対する
平板状のリード線接続端子を有し、前記相対する
リード線接続端子間に薄膜サーミスタチツプの端
部を収納する凹部を備え、前記薄膜サーミスタチ
ツプ部をアルミナ系接着剤で包みこむ構成とした
温度センサ。 2 薄膜サーミスタチツプとリード線接続端子と
絶縁体等を樹脂コーテイングした特許請求の範囲
第1項記載の温度センサ。 3 樹脂コーテイングに撥水性を有する四弗化エ
チレン系樹脂とした特許請求の範囲第2項記載の
温度センサ。
[Scope of Claims] 1. A recessed portion having a pair of opposing flat lead wire connecting terminals whose intermediate portions are fixed with an insulator, and storing an end portion of a thin film thermistor chip between the opposing lead wire connecting terminals. A temperature sensor having a structure in which the thin film thermistor chip is wrapped with an alumina adhesive. 2. The temperature sensor according to claim 1, in which the thin film thermistor chip, lead wire connection terminal, insulator, etc. are coated with resin. 3. The temperature sensor according to claim 2, wherein the resin coating is made of a tetrafluoroethylene resin having water repellency.
JP57130666A 1982-07-26 1982-07-26 Temperature sensor Granted JPS5919827A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57130666A JPS5919827A (en) 1982-07-26 1982-07-26 Temperature sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57130666A JPS5919827A (en) 1982-07-26 1982-07-26 Temperature sensor

Publications (2)

Publication Number Publication Date
JPS5919827A JPS5919827A (en) 1984-02-01
JPS6359085B2 true JPS6359085B2 (en) 1988-11-17

Family

ID=15039702

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57130666A Granted JPS5919827A (en) 1982-07-26 1982-07-26 Temperature sensor

Country Status (1)

Country Link
JP (1) JPS5919827A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8228160B2 (en) 2008-11-14 2012-07-24 Epcos Ag Sensor element and process for assembling a sensor element
JP6822334B2 (en) * 2017-07-04 2021-01-27 株式会社デンソー Temperature sensor

Also Published As

Publication number Publication date
JPS5919827A (en) 1984-02-01

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