JPS6359926B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a take-out device for taking out a large number of laminated printed circuit boards one by one using suction pads (approximately bowl-shaped suction pads).

In a conventional take-out device, when trying to take out the top board of a group of stacked printed circuit boards using a suction pad, suction force is also applied to the second board from the top through the hole in the board. For this purpose, two substrates are attracted in an overlapping state, and one
It may not be possible to take out the boards one by one.

The present invention improves the suction mechanism so that the suction force can be reduced during the suction operation, so that even if two substrates are suctioned at the beginning of the suction operation, the second substrate will be removed during the suction operation. The board is separated from the first board,
It is structured as follows.

That is, in the present invention, a plurality of suction chambers that are open toward the printed circuit board are formed in a suction pad in a separated state, and a suction blower that exerts suction force on the suction chambers is connected to some of the suction chambers by a suction passage. , connect the other suction chambers and the suction blower with a separate suction passage,
A suction force release mechanism is provided in the suction passage to release the suction force, and a control mechanism is provided to control the operating state of the suction force release mechanism, so that the suction pad is in a lowered position (a position close to the printed circuit board). At the same time, the suction force of both suction passages is maintained, and after the suction pad suctions the printed circuit board in the lowered position,
It is characterized in that the suction force of one of both suction passages is released.

According to this configuration, when the suction pad descends and approaches the printed circuit board, the suction force of both suction passages is maintained, so each suction chamber is attached to the uppermost printed circuit board (first printed circuit board) of the printed circuit board group. A suction force is applied from the suction pad, and the first printed circuit board is suctioned to the suction pad.

In this state where suction is completed, there is a possibility that the printed circuit board (second printed circuit board) below the first printed circuit board will also be suctioned. This suction of the second printed circuit board is caused by the suction force being applied from the suction chamber to a small portion of the second printed circuit board through the hole in the first printed circuit board, as will be described in detail later. Therefore, the suction force (holding force) of the suction pad against the second printed circuit board is very small.

When the suction force of one of the suction passages is released after the suction is completed, only some of the suction chambers exert suction force on the printed circuit board, and the suction force on the second printed circuit board becomes significantly small.
Therefore, while the first printed circuit board is attracted to the suction pad, the second printed circuit board falls under the action of gravity. As a result, only the first printed circuit board (that is, one printed circuit board) can be attracted and carried by the suction pad.

Next, embodiments will be described with reference to the drawings.

In FIG. 1, which is a schematic vertical cross-sectional view, 1 and 2 are the first and second substrates from the top of a large number of substrate groups 3 stacked on a base 4. As shown in FIG. Substrate 1,
2 and the other substrates 5 are of the same type, and the holes 6, 7, 8... provided in the substrates 1, 2, 5...5...
...8 are generally arranged one above the other. Above the substrate group 3, a suction pad 10 (substantially bowl-shaped suction device) is arranged so as to be movable up and down and horizontally using a frame (not shown) or the like. The suction pad 10 is attached to the peripheral wall 1
1 and an upper wall 12, an internal suction chamber A,
B opens downward. As shown in FIG. 2, which is a view taken from the - arrow in FIG. ,1
6 are provided, and the interior of the peripheral wall 11 is equally divided into three chambers A and three chambers B by these partition walls 15 and 16. That is, the suction pad 10 includes two types of suction chambers A and B. Chambers A (and B) of the same type are diagonally adjacent to each other across the intersection of the partition walls 15 and 16 (for example, 17); in other words, chambers A and B of different types are adjacent to each other across the intersection of the partition walls 15 and 16. They are adjacent to each other with parts other than 17 in between. Each chamber A,
One ends of suction passages a and b are connected to B from above as shown in FIG. The other end of passage a that connects to chamber A is connected to one pipe 20, and the other end of passage b that connects to chamber B is connected to another pipe 21.
is connected to. Both pipes 20 and 21 are connected to a ring blower 22 that can generate a suction force of low pressure and large air volume, and an opening/closing mechanism 2 is installed in the middle of each pipe 20 and 21.
3 and 24 are provided. The opening/closing mechanisms 23, 24 are provided independently from each other, and therefore the opening/closing mechanisms 23, 2
4 is configured to be able to be selectively opened and closed as will be described later.

As shown in FIG. 3, which is an enlarged partially cutaway view of the opening/closing mechanism 23, there is a short pipe 25 in the middle of the piping 20.
is connected to the piping 20 at right angles, and the passage within the piping 20 can be connected to the atmosphere S via a pipe 25. A pad 27 faces the atmosphere side opening 26 of the pipe 25. The pad 27 is attached to the tip of a piston rod 30 of an air cylinder 29, and the cylinder 29 is fixed coaxially with the pipe 25 by a frame (not shown). The other opening/closing mechanism 24 (FIG. 1) also has the same structure as that in FIG. 3.

Explain its use. When taking out the substrate 1 shown in FIG. 1, the rod 30 is projected by the cylinder 29 shown in FIG.
It is moved to a position where the opening 26 is closed as shown at 7'. When the opening/closing mechanism 23 is closed in this way, and the opening/closing mechanism 24 shown in FIG. When the upper surface of the substrate 1 is brought close to the upper surface of the substrate 1 by a drive mechanism that is not equipped, the substrate 1 is reliably attracted to the suction pad 10 by the strong suction force from both chambers A and B, as shown by the two-dot chain line 1'. In that case, the substrate 2 may be attracted together with the substrate 1' as shown by the two-dot chain line 2', but since both the opening and closing mechanisms 23 and 24 are alternately opened and closed manually or by a control device such as a timer, the substrate 2' is removed from the substrate 1' as follows.

First, the reason why the substrate 2 is attracted will be explained. The holes 6 and 7 of both substrates 1 and 2 are generally arranged vertically, but there is a small gap between holes 6 and 7 due to processing errors of holes 6 and 7 and relative misalignment of both substrates 1 and 2 in the stacked state. A slight deviation l may occur, and the upper surface of the substrate 2 has a very small area 1 corresponding to the deviation l.
9 is exposed in the hole 6. Furthermore, since a large number of holes 6 are provided, a large number of exposed portions 19 are also formed. Therefore, the suction force from the suction pad 10 is applied to a large number of small area portions 19 of the substrate 2 through the holes 6, and the substrate 2 is suctioned together with the substrate 1 by the small suction force. In addition, the adsorption state in that case can be roughly divided into a case where the object is attracted to both chambers A and B almost equally, and a case where the object is mainly attracted to one chamber A or B. In other words, the positions of the holes 6 vary depending on the type of substrate 1, so if about half of the holes 6 face each chamber A and B, the substrate 2 , B, and most of the large number of holes 6 face one chamber A or B, the substrate 2 is mainly attracted by chamber A or B.

Next, the detachment operation of the substrate 2 will be specifically explained. The opening operation of the opening/closing mechanism 23 is performed by moving the pad 27 to the position shown by the solid line using the piston 29 in FIG. 3 to open the opening 26.
The same applies to the case where the opening/closing mechanism 24 is opened.
When one of the opening/closing mechanisms 23, 24 is opened in this way, the blower 22 will suck in the atmosphere in the opening/closing mechanism 23 or 24, so that the atmosphere that was previously drawn into the suction chamber A or B from the blower 22 will be removed. The suction force is almost completely released. Therefore, if the substrate 2' is equally attracted to both chambers A and B, or if it is mainly attracted to chamber A, when the opening/closing mechanism 23 opens and the attraction force of chamber A is released, , the adhesion force to the substrate 2' is reduced by half or less, and the substrate 2' is separated from the substrate 1'. Substrate 2'
If the substrate 2' is mainly attracted by chamber B, the substrate 2' may not come off even if the adsorption force of chamber A is released as described above. Since the adsorption force of the chamber B is released, most of the adsorption force on the substrate 2' is released, and the substrate 2' is detached by its own weight. Even if the board 2' remains attracted after this operation, both opening/closing mechanisms 23,
By repeating the opening/closing operation of 24 one or more times, the substrate 2' is reliably removed.

When the removal of the board 2' is completed, the pad 10 is
The substrate 1' is moved horizontally as shown by the dotted chain line 10' to carry it to the destination, and after dropping the substrate 1' at the destination, it returns to the substrate group 3 and repeats the above-mentioned operation. Note that the detachment operation of the board 1' is performed by both opening/closing mechanisms 23 and 24.
This is done by simultaneously opening the chambers A and B to release the suction force of both chambers A and B. Note that the substrate 2 separated from the substrate 1' returns to the substrate group 3, and is taken out in the same manner as the substrate 1 by the pad 10 during the next operation.

As explained above, according to the present invention, the suction force is reduced during the substrate removal operation, so even if two substrates 1 and 2 are suctioned, the second substrate 2 can be reliably removed. This allows the substrates 1 to be removed one by one without fail.

It is also possible to provide three or more types of chambers within the pad 10. In addition, the illustrated opening/closing mechanism 23, 2
4 (suction force release mechanism) may be replaced with a general-purpose valve.

[Brief explanation of the drawing]

Figure 1 is a schematic vertical cross section of the embodiment, Figure 2 is the first
3 is an enlarged partially cutaway view of the opening/closing mechanism. 1, 2, 5... Printed circuit board, 6, 7, 8... Hole, 10... Adsorption pad, 2
2...Ring blower, 23, 24...Opening/closing mechanism (suction force release mechanism), A, B...Adsorption chamber,
a, b... Suction passage.

Claims (1)

[Claims] 1. In a take-out device for suctioning and taking out a plurality of printed circuit boards with holes arranged in a generally horizontal and stacked state, starting from the uppermost printed circuit board, using a suction pad, the suction pad is lowered close to the printed circuit board. A drive mechanism is provided for raising and lowering between the position and the raised position above the suction pad, and the suction pad has a plurality of suction chambers that are open toward the printed circuit board and are separated from each other. The blower and some of the suction chambers are connected by a suction passage, and the other suction chambers and the suction blower are connected by another suction passage, and a suction force release mechanism is provided to release the suction force to the suction passage. A control mechanism is provided to control the operating state of the opening mechanism, whereby the suction force of both suction passages is maintained when the suction pad is in the lowered position, and after the suction pad has suctioned the printed circuit board in the lowered position, both suction forces are maintained. A printed circuit board extractor characterized in that the suction force on one side of the passage is released.