JPS6362014B2 - - Google Patents

Description

[Detailed description of the invention] The present invention relates to a small electronic device that is thin.

2. Description of the Related Art Recently, there has been a trend toward thinning of small electronic devices such as small electronic calculators, small electronic watches, and electronic game machines in order to improve portability.

Taking small electronic calculators as an example, the goal for portable calculators is to have a small and thin seed-like (card-like) shape, such as a credit card. That is, there is a demand for the development of a compact electronic calculator that is as thin as a sheet and has a flat outer surface with no protrusions.

However, this type of conventional small electronic calculator has a case made of a molded synthetic resin, or a combination of a metal plate and a wiring board, a display panel, etc. inside the case. Parts such as batteries are installed.

However, the case structure of such conventional small electronic calculators is based on the idea of increasing the thickness of the case to provide high rigidity in order to protect the parts inside the case from external forces. For this reason, it was not possible to make the wall thickness of the case very thin, and the thickness of the entire case was limited to about 1.6 mm at its thinnest part. This has led to the problem that the case of a small electronic calculator cannot be made extremely thin like a credit card.

Additionally, in many conventional small electronic calculators, the display and input keys protrude from the surface of the case, and the surface is not flat like a sheet, making it difficult to carry. It was hot too.

The present invention has been made in view of the above-mentioned circumstances, and provides a small electronic device in which a case in which an electronic component component is housed has a flat sheet structure, and the case is made thinner while maintaining its strength, thereby improving portability. It is something to do.

That is, in the small electronic device of the present invention, a solar cell and a display element are provided at a distance from each other on the side of a wiring board on which a switch element and a semiconductor integrated circuit element are provided, and the solar cell and display element are attached with conductive adhesive. a frame having an electronic component structure connected by a bonding agent, a frame portion surrounding the outer periphery of the electronic component structure, and a partition portion interposed between the solar cell and the display element; and a frame facing the display element. a lower case having a recessed part for the display element and laminated in close contact with the lower surface of the electronic component structure; an operation part for opening and closing each of the switch elements; a see-through key facing the display element and the solar cell; The device is characterized in that it has a window and a key display portion facing each of the switch elements, and an upper case that is adhered to the frame portion of the frame and the upper surface of the partition portion.

Embodiments of the present invention illustrated in the drawings will be described below.

An embodiment in which the small electronic device of the present invention is applied to a small electronic calculator will be described. 1 to 24 show one embodiment of the present invention.

FIG. 1 is an external view of the small electronic calculator of this embodiment. As shown in this figure, the small electronic calculator has a rectangular sheet shape. FIG. 2 is an exploded view of a small electronic calculator, in which 11 is an electronic component structure, 12 is a top sheet, 13 is an upper sheet,
14 is a bottom sheet, 15 is a lower sheet, and 16 is a frame. Each of these sheets 12, 13, 14, 15
The frame 16 and the frame 16 each have a rectangular outer shape with the same size. The frame 16 has a frame-shaped portion surrounding the outer periphery of the electronic component structure 11 and a partition portion interposed between the solar cell 43 and the display element 34, as will be described later. Then, the electronic component structure 11 is surrounded and supported by the frame 16, and the upper sheet 13 is closely laminated on the upper side of the electronic component structure 11, and the top sheet 12 is closely attached to the upper surface of the upper sheet 13. The lower sheet 15 is laminated in close contact with the lower side of the electronic component structure 11, and the lower sheet 1
A lower sheet 14 is laminated in close contact with the lower surface of 5. In this way, a small electronic calculator in the form of a rectangular sheet is assembled.

The configuration of each part of the small electronic calculator will be explained with reference to FIGS. 3 to 18. 3 to 9 are plan views showing each component. 10 to 13 are cross-sectional views showing the laminated structure, and FIG. 10 shows the boundary between the substrate and the frame (part A in FIG. 1),
Figure 11 shows the part where the operation switch is installed (Figure 1B
Fig. 12 shows the part with a display element (part C in Fig. 1), and Fig. 13 shows the part with a battery (part D in Fig. 1).
The cross-sections of each part) are shown. Electronic component structure 1
1 will be described with reference to FIG. 3 and FIGS. 14 to 18. As shown in FIG. 3, the substrate 21 is made of glass epoxy resin or bismaleimide-triazine resin and has a rectangular sheet shape with a thickness of about 190 μm, and a predetermined wiring pattern is formed on its upper and lower surfaces. Copper foil 2 with a thickness of about 35μ
2 are bonded together via an insulating adhesive 23 with a thickness of about 20 μm. The wiring patterns formed by the copper foil 22 on the upper and lower surfaces of the substrate 21 include wiring, contacts, and terminals, and each wiring pattern on the upper and lower surfaces is connected via through holes (not shown) formed at predetermined locations on the substrate 21. are doing. The wiring pattern on the upper surface of the substrate 21 is schematically shown in FIG. 3, and connects fixed contacts, capacitors, display elements, batteries, light emitting diodes, etc. around the integrated circuit element. A plurality of fixed contacts 24, which are switch elements, are arranged in a grid on one half of the upper surface of the substrate 21 as part of the wiring pattern.The fixed contacts 24 consist of a pair of contacts, and each contact is It is connected to an integrated circuit element 26, which will be described later, via a wiring pattern. As shown in FIG. 14, in the other half of the board 21, a hole 25 is formed leaving the wiring pattern (copper foil 22 and adhesive 23) on the lower surface side, and a predetermined calculation is performed by turning on and off the switch element. A semiconductor integrated circuit element 26, that is, a large-scale integrated circuit (LSI) that performs
The wiring pattern (copper foil 2
2), and is covered from above with an insulating resin 28 such as silicone rubber or epoxy resin to seal the entire body. The integrated circuit element 26 is made of a rectangular chip measuring, for example, 4 mm long x 4 mm wide x 200 μm thick, and the insulating resin 28 is, for example, 10 mm long x 10 mm wide x thickness from the top surface of the integrated circuit.
It has a diameter of 245μ. A first hole 29 is formed in the other half of the board 21 leaving the wiring pattern (copper foil 22 and adhesive 23) on the lower surface side.
As shown in FIG. 5C, a chip capacitor 30 is supported by the wiring pattern on the bottom side, and
This capacitor 30 has electrodes 30 formed at both ends.
The wiring pattern (copper foil 22) on the top surface of the board 21 is attached to the cream solder 31 applied to the hole 29 by a.
The periphery of the substrate 21 is covered with an insulating adhesive 32, such as ultraviolet curing ink, applied to the upper surface of the substrate 21. This capacitor 30 is connected to the integrated circuit element 26 via a wiring pattern. The corner of the other end of the board 21 is cut out leaving the wiring pattern (copper foil 22 and adhesive 23) on the bottom side, and this part is supported by the wiring pattern on the bottom side as shown in FIG. 16C. A light emitting diode 33 for voltage control is arranged, and the electrode 33a of the light emitting diode 33 is bonded to the cream solder 31 applied to the substrate 21 and connected to the wiring pattern (copper foil 22) on the upper surface side of the substrate 21. The periphery of the substrate 21 is sealed with an insulating adhesive 32 applied to the upper surface of the substrate 21, such as ultraviolet curable ink. The light emitting diode 33 is connected to the integrated circuit element 2 via the wiring pattern.
Connected to 6. A display element 34, ie, a liquid crystal panel, is arranged on one side edge of the substrate 21, and is connected to the wiring pattern on the upper surface side of the substrate 21. As shown in FIG. 17, the display element (liquid crystal panel) 34 is made of a transparent resin film such as polyester film with a polarizer layer therein, and a liquid crystal 37 is sealed between upper and lower substrates 35 and 36 provided with electrodes. Its periphery is sealed with a sheet 38, and a reflective plate 39 with a thickness of about 50 μm is adhered to the lower surface of the lower electrode base 35 via an adhesive with a thickness of about 15 μm. Lower base 3
A plurality of terminal electrodes 40 made of transparent conductive ink and connected to the electrodes of the electrode bases 35 and 36 are arranged in the longitudinal direction on the upper surface of the protrusion 5. The display element (liquid crystal panel) 34 has a total thickness of about 550 μm, and has elasticity (toughness) due to the use of a film base. Further, on one side edge of the upper surface of the board 21, a plurality of terminals 41 are formed by extending the copper foil 22 of the wiring pattern and arranged in the longitudinal direction, and these terminals 41 project laterally from the board 21. There is. The terminal electrodes 40 of the display element (liquid crystal panel) 34 and the terminals 41 of the substrate 21 are bonded and electrically connected to each other by applying a conductive adhesive 42 such as carbon ink to their respective contact surfaces. The surrounding area is coated with an insulating adhesive 32, such as ultraviolet curable ink. The display element 34 is connected to the integrated circuit element 26 via the wiring pattern of the substrate 21.
It is connected to the integrated circuit element 26 and displays predetermined information based on a signal from the integrated circuit element 26. On one side edge of the substrate 21, an integrated circuit element 2 is arranged along with a display element 34.
A battery 43, ie, a solar cell, for supplying driving voltage to the circuit board 6 is arranged and connected to the wiring pattern of the substrate 21. The battery (solar battery) 43 is the first
8 As shown in Figure 8, a metal substrate 4 such as stainless steel
An amorphous solar cell layer 46 is deposited on the upper surface of 4 through an insulating layer 45 with a thickness of about 25 μm, for example, polyimide, and a polyester film 47 with a thickness of about 175 μm is coated on the solar cell layer 46 as a protective layer. A pair of terminal electrodes 48, 48 are formed on the upper surface of a substrate 44 with an insulating layer 45 interposed therebetween. This battery (solar cell) 43 has an overall thickness of
It is approximately 300μ and has elasticity (toughness) as a whole. Further, on one side edge of the board 21, a copper foil 22 of a wiring pattern is made to protrude laterally at a location facing a battery (solar cell) 43, and a pair of terminals 4 are connected to the edge of the board 21.
9,49 are formed. Battery (solar battery) 43
The terminal electrodes 48 of the board 21 and the terminals 49 of the substrate 21 are electrically connected by applying a conductive adhesive 42, for example, carbon ink, and adhering them to each other. It is covered with ink. Therefore, the battery (solar cell) 43 is connected to the integrated circuit element 26 via the wiring pattern of the substrate 21.

The electronic component assembly 11 configured in this manner is placed inside the frame 16. The frame 16 is made of, for example, hard vinyl chloride and has a thickness of about 300μ, and has a rectangular frame shape as shown in FIG. Depending on the arrangement, it has a shape that runs along and surrounds the periphery of the component. That is, frame 1
6 surrounds and holds one outer side of each of the substrate 21, display element 34, and battery 43 that constitute the electronic component structure 11, as shown in FIGS. Frame-shaped portion and display element 34
It has a partition section interposed between the spacer and the battery 43, so that the substrate 21, the display element 34, and the battery 43 of the electronic component assembly 11 are held down by the frame 16 to prevent them from moving laterally. The time is maintained.

The top sheet 12 and the top sheet 13 will be described with reference to FIGS. 4 to 6 and 10 to 13. The top sheet 12 is a rectangular sheet with excellent strength (toughness) made of a transparent resin sheet such as a polyester film with a thickness of about 80 μm, and has an electronic component configuration as shown in FIGS. 4 and 5. An operating section 50 is provided at a location corresponding to the fixed contact forming section of the substrate 21 of the body 11. This operation section 50 has a plurality of key name printing sections 51 on the bottom surface of the top sheet 12 corresponding to each of the fixed contacts 24 of the board 21.
are printed in a grid pattern, and a plurality of movable contacts 52 with a thickness of approximately 15 to 30 μm are lined up and printed with carbon ink, etc., corresponding to the lower side of each key name printing portion 51. It is. A frame-shaped display window printing section 53 forming a display window is printed on the lower surface of the top sheet 12 to face the display element 34 of the electronic component structure 11, and a frame-shaped display window printing section 53 forming a battery window corresponding to the battery 43 is printed. A battery window printed portion 54 is printed. In addition, numeral 55 in the figure is a blind printing section. The upper sheet 13 is a rectangular sheet made of a synthetic resin having excellent strength (toughness) and having a thickness of about 180 μm, such as hard vinyl chloride. As shown in FIG. 6, the upper sheet 13 is provided with a plurality of openings 56, which are vertically penetrating holes, arranged in correspondence with the fixed contacts 24 of the substrate 21. Holes 57 and 58 are formed side by side and vertically penetrating in correspondence with each other. Note that 59 in the figure indicates the integrated circuit element 2 on the substrate 21.
6. A hole for escaping the capacitor 30 and the light emitting diode 33.

The lower sheet 14 and the lower sheet 15 will be described with reference to FIGS. 7 and 8, and FIGS. 10 to 13. The lower sheet 14 is made of a synthetic resin such as a polyester film with a thickness of about 80 μm, and has a rectangular sheet shape with excellent strength (toughness). As shown in FIG. 7, a blind printed portion 61 is printed on the upper surface. has been done. The lower sheet 15 is a rectangular sheet with a thickness of about 80μ made of a synthetic resin with excellent strength (toughness) such as hard vinyl chloride.
As shown in the figure, the display element 3 of the electronic component structure 11
A hole 62 for escaping 4 is formed.

Then, the upper sheet 13 is the electronic component structure 11
The lower sheet 15 is laminated in close contact with the entire upper surface of the frame 16 using an insulating adhesive 60 with a thickness of approximately 20 μm.
is the thickness of the entire bottom surface of the electronic component structure 11 and the frame 16.
They are laminated in close contact with an adhesive 60 of about 20 μm. Therefore, the upper sheet 13 covers and supports the substrate 21, integrated circuit element 26, capacitor 30, display element 34, and battery 43 of the electronic component structure 11 on the upper side. The lower sheet 15 covers and supports the substrate 21, display element 34, and battery 43 from below. Further, the frame 16 is clamped between the upper sheet 13 and the lower sheet 15 at a position surrounding the electronic component structure 11. Further, the top sheet 12 is closely laminated on the top surface of the top sheet 13 with an adhesive 60 having a thickness of about 20 μm, and covers the top surface (front surface) of the top sheet 13 . The lower sheet 14 is closely laminated on the lower surface of the lower sheet 15 with an adhesive 60 having a thickness of about 20 μm, and covers the lower surface of the lower sheet 15.

Furthermore, a description will be added of a structure in which a top sheet 12 and an upper sheet 13, and a bottom sheet and a bottom sheet 15 are laminated on the upper and lower parts of the electronic component structure 11. The top sheet 12 covers the top surface of the top sheet 13, so that the key name printed portions 51 of the top sheet 12 are aligned with the holes 5 of the top sheet 13.
6..., and the movable contact 52... covers the hole 56...
Located within. The display window printed part 53 and the battery window printed part 54 of the top sheet 12 are located above the periphery of the holes 57 and 58 of the top sheet 13 to hide them,
The transparent sheet portion surrounded by these printed parts 53 and 54, that is, the display window and the battery window, are formed by the holes 57 and 5.
8 from above. In addition, the lower sheet 14
By covering the lower surface of the lower sheet 15, the blindfold printing portion 61 covers the hole portion 62 of the lower sheet 15 from below, thereby blindfolding the hole portion 62 of the lower sheet 15. Further, as shown in FIG. 11, the holes 56 of the upper sheet 13 are positioned so as to surround each of the fixed contacts 24 of the substrate 21 on the upper side, and each movable contact 52 of the upper sheet 12 is located in the hole 5.
6 and above the fixed contacts 24. Key name printing section 51 on top sheet 12, movable contact 5
2. An operation switch element is constituted by the hole 56 of the upper sheet 13 and the fixed contact 24 of the board 21, and the fixed contact 52 is inserted into the hole 56 of the upper sheet 13 by pressing the key name printed part 61 of the upper sheet 12 from above. It is possible to contact the fixed contact 24 of the push-down board 21 via the contact point 21 and turn it on. As shown in FIG. 12, the display element (liquid crystal panel) 34 is connected to the sheet 12 surrounded by the display window printed portion 53 of the top sheet 12 through the hole 57 of the top sheet 13 in the top case 1.
part, that is, facing the display window, and the display element 34
The display can be viewed from outside the upper case 1 through the display window. As shown in FIG. 13, the battery (solar cell) 43 faces a portion of the sheet 12 surrounded by the battery window printed portion 53 of the top sheet 12, that is, the battery window, through the hole 58 of the top sheet 13. External light such as sunlight can be received from outside the upper case 1 through the window. Note that, for example, ultraviolet curable ink 32 is applied as a spacer and adhesive between the upper surface of the display element 34 and the battery 43 and the upper sheet 12, respectively.

In this way, the electronic component structure 11
is surrounded and supported by a frame 16, and an upper sheet 13 and a lower sheet 15 are laminated in close contact with each other on the upper and lower sides of the electronic component structure 11 and the frame 16, and on the upper and lower sides of the upper and lower sheets 13, 15. By closely stacking the top sheet 12 and the bottom sheet 14, a compact electronic calculator having an integral sheet shape is constructed. This small electronic calculator has a top sheet of 12 (80μ) and an adhesive of 60
(20μ), top sheet 13 (180μ), adhesive 60
(20μ), substrate 21 (300μ), adhesive 60 (20μ),
The combination of the lower sheet 15 (80μ), the adhesive 60 (20μ), and the lower sheet 14 (80μ) forms a very thin sheet with a total thickness of 800μ (0.8mm). Each sheet 12, 13, 14, 15 and frame 16
The substrate 21 has sufficient mechanical strength and elasticity to withstand bending with a radius of curvature of about 40 mm, and the small electronic calculator as a whole has excellent toughness. The display element (liquid crystal panel) 34 and battery 43 of the electronic component structure 11 also have sufficient toughness against bending with a radius of curvature of about 40 mm. By interposing the frame 16 between the upper sheet 13 and the lower sheet 15, the electronic component structure 11
In addition to being able to reliably support the surroundings of the upper sheet 13 and increase its strength by being integrated with the upper and lower sheets 13 and 15, the upper sheet 13
By providing a space close to the thickness of the electronic component structure 11 between the frame 16 and the peripheral edge of the lower sheet 15, the peripheral edge of each of the sheets 13 and 15 can be easily and reliably sealed. Further, in this small electronic calculator, the electronic component structure 11, particularly the substrate 21, is formed from the upper and lower sides by an upper sheet 13 and a lower sheet 15 (in this embodiment, the sheets 13 and 15 are made of a synthetic resin having higher strength than the substrate 21). Since it has a sandwich structure in which the sheets 13 and 15 are sandwiched between the substrate 21 and the upper and lower sheets 13 and 15, when bending force is applied, the stress is dispersed between the substrate 21 and the upper and lower sheets 13 and 15, respectively. , 15 have high strength, both sheets 13 and 15 absorb a large amount of bending force, so that the substrate 21 can be protected and the sheet has excellent strength. Further, the top sheet 12 and the bottom sheet 14 enhance the aesthetic value of the computer's appearance, prevent the top sheet 13 and the bottom sheet 15 from being scratched, and also provide a sanderch structure to the top sheet 13 and bottom sheet 15. This increases the strength against bending stress. Moreover,
The upper sheet 12 is provided with an operating section 50 that can be pressed from the outside by utilizing the elasticity of the sheet.
6, the fixed contact 22 of the board 21 can be turned on and off. That is, the top sheet 12
and the upper sheet 13, the upper sheet 12
A flat operation part 50 that does not protrude from the surface is provided, and together with the fact that the top sheet 12 covers the surface of the upper sheet 13, a flat sheet-like case with no protrusion on the case surface can be obtained. .

Next, an embodiment of the method for manufacturing this small electronic calculator will be described with reference to FIGS. 19 to 24. The basic manufacturing process consists of assembling the electronic component structure 11, molding the sheets 12 to 15 and the frame 16, and then laminating the upper and lower sheets 13 and 15 in close contact with the upper and lower sides of the electronic component structure 11. At the same time, the upper and lower sheets 13,
The upper and lower sheets 12 and 14 are laminated in close contact with each other on the laminate 15, and the periphery of the obtained laminate is cut into a predetermined external shape.

The case of assembling the electronic component structure 11 will be described with reference to the process diagram of FIG. 19. Each hole 25, 29
A roll film made of glass epoxy resin or the like is prepared by continuously winding a large number of films of the substrate 21 formed with A predetermined wiring pattern is formed on the lower surface using copper foil 22, and then holes 2 of each board 21 are formed.
After bonding an integrated circuit element (LSI) 26 to 5 and performing wire bonding and sealing with resin 28 to this integrated circuit element 26,
The rolled film is cut into individual substrates 21. Then, solder 31 is applied to the holes 29 and notches of the cut substrate 21 as shown in FIGS. 15a and 16a, and then as shown in FIGS.
As shown in Figure 6 b and c, the capacitor 30 is inserted into the hole 2.
9, light emitting diodes (LEDs) 33 are placed in the notches, and the solder 31 is melted and the capacitor 30 and the light emitting diodes 33 are pressurized to fix them together. Next, a display element (liquid crystal panel) 34 and a battery (solar cell) are placed adjacent to the substrate 21.
43 and forming each terminal (finger lead) 41, 49 on the board 21,
A conductive adhesive 42, for example, carbon ink, is applied to each terminal 41, 49, and the terminals 41, 49 are semi-dried by hot air drying (temperature 120°C, time 4 seconds).Then, the board 21 is positioned and the terminals 4
1 and 49 are bonded under pressure to the display element 34 and the terminal electrodes 40 and 48 of the battery 43, and the bonded portions are completely dried and fixed by hot air drying (temperature: 120° C., time: 60 seconds). Finally, an insulating adhesive 32 such as an ultraviolet curable ink is applied to the terminal connection portions of the capacitor 30, light emitting diode 33, display element 34, and battery 43, and is cured by irradiating ultraviolet rays. Note that the substrate 21, display element 34, and battery 4
3 has positioning holes 6 for assembly jigs at predetermined positions, respectively.
form 3.

The case of manufacturing the upper and lower sheets 12 and 14 will be described. Both sheets 12 and 14 are roll films made of, for example, polyester and have a predetermined thickness (80 μm). In the case of the top sheet 12, the roll film is fed out, and after printing the key name printing section 51, display window printing section 53, and battery window printing section 54 on each sheet 12 and applying carbon ink, Cut into a predetermined shape. The lower sheet 14 is cut by each sheet 14 after a blind printing part 61 is printed on each sheet 14 while the roll film is fed and fed. When cutting, the top sheet 12 has external dimensions larger than the external dimensions of the final product, as shown by the two-dot chain line in FIGS. 4 and 5, and the bottom sheet 14, as shown by the two-dot chain line in FIG. Cut. Further, during this cutting, positioning holes 63 for assembly jigs are punched out in portions of the upper sheet 12 and lower sheet 14 located outside the external dimensions of the final product. That is, the reason why each sheet 12, 14 is cut to have an outer dimension larger than that of the final product is to maintain positioning during the manufacturing process.

The case of manufacturing the upper and lower sheets 13, 15 and the frame 16 will be described. Each sheet 13, 15
A roll film in which a film made of synthetic resin, for example, hard vinyl chloride, having a thickness corresponding to the thickness of the frame 16 is wound, is prepared according to the manufacturing process of each sheet 13, 15 and the frame 16, and this roll film is The sheets 13 and 15 and the frame 16 are formed by sequentially feeding out the sheets and cutting and punching them into a predetermined shape. The upper sheet 13 is cut into a larger outer size than the final product as shown by the two-dot chain line in FIG. 6, and holes 56 to 59 are punched out. The lower sheet 15 is cut to have a larger external dimension than the final product as shown by the two-dot chain line in FIG. 8, and holes 62 are punched out. The frame 16 is cut to have an outer dimension larger than that of the final product as shown by the two-dot chain line in FIG. 9, and the inside is punched into the frame shape shown. Further, as shown in FIGS. 6, 8, and 9, positioning holes 63 are provided in the upper and lower sheets 13, 15 and the frame 16 at predetermined positions in the portion that will become the final product and in the outer portion of the final product. Form by punching.

Furthermore, each part manufactured in this way is
It is assembled using the steps shown in the process diagram in Figure 0.
In this assembly, an assembly jig 64 shown in FIG. 21 and an assembly jig 65 shown in FIG. 22 are used, respectively. The assembly jig 64 has positioning pins 67 protruding from the upper surface of a table 66 at predetermined positions on the inner side of the external shape of the final product and at predetermined positions on the outer side. The assembly jig 65 has positioning pins 67 protruding from the upper surface of a table 66 at predetermined positions on the outside of the external shape of the final product. Note that the stand 66 has a larger external dimension than the final product, and the position of each positioning pin 67 corresponds to the positioning hole 63 formed in each component. and,
First, an insulating adhesive 60 is applied to the upper surface of the lower sheet 15, and the lower sheet 15 is positioned and held using an assembly jig 64. In this case, the positioning pins 67 of the assembly jig 64 are inserted into the positioning holes 63 of the lower sheet 15, and the lower sheet 15 is placed on the upper surface of the table 66. Next, the substrate 21 and the display element 34
and an assembly jig 64 in the positioning hole 63 of the battery 43.
By inserting the positioning pin 67 , the electronic component structure 11 is positioned and placed on the upper surface of the lower sheet 15 held on the stand 66 . In this state, the electronic component structure 11 and the lower sheet 15 are pressed and heated to be pressed together. Then,
The frame 16 is positioned using the positioning holes 63 and the positioning pins 67 of the assembly jig 64 in the same manner as in the above-described operation, and is placed over the upper peripheral edge of the lower sheet 15, and the frame 16 is pressed and heated to form the lower part. sheet 1
Crimp to 5. In this case, the frame 16 will surround the electronic component structure 11. Next, an insulating adhesive 60 is applied to the lower surface of the upper sheet 13, and the upper sheet 13 is positioned using an assembly jig 64 and placed on top of the electronic component assembly 11 and the upper surface of the frame 16, and is pressed. , the upper sheet 13 is pressed onto the electronic component structure 11 and the frame 16 by applying heat. In this way, the electronic component structure 11, the upper sheet 13,
A laminate is obtained in which the lower sheet 15 and the frame 16 are combined and laminated in close contact. FIG. 23 shows this laminate.

Next, an adhesive 60 is applied to the upper surface of this laminate, that is, the upper surface of the upper sheet 13, and the display element 34 and battery 4 in the electronic component structure 11 are bonded together.
UV curable ink, i.e. adhesive 3, on the top surface of 3.
Apply 2. At this stage, an assembly jig 65 is used in place of the assembly jig 64. The laminate is positioned and placed on the upper surface of the stand 66 of the assembly jig 65 by passing the positioning pin 67 of the assembly jig 65 through the positioning hole 63 formed in the outer part of the final product in the laminate. . Next, top sheet 1
2 is positioned by an assembly jig 65 and placed on top of the upper surface of the upper sheet 13 in the laminate, and the upper sheet 12 is attached to the upper sheet 13 by applying pressure and heating.
Crimp. After that, UV curable ink 32 on display element 34 and battery 43 is irradiated with UV rays.
harden. Next, the laminate is turned upside down so that its vertical position is reversed, and positioned and held in the assembly jig 65 again, and the adhesive 60 is applied to the surface (lower surface) of the lower sheet 15, which is now the upper side. Next, the lower sheet 14 is positioned and held by the assembly jig 65 and placed over the surface (lower surface) of the lower sheet 15, and the lower sheet 14 is pressed onto the lower sheet 15 by pressure and heating. Through the manufacturing process up to this point, as shown in FIG. 24, the upper and lower sheets 1
A laminate is obtained in which upper and lower sheets 12 and 14 are closely laminated on sheets 3 and 15. That is, the electronic component structure 11, the top sheet 12, the top sheet 1
3. A laminate is obtained in which the lower sheet 14 and the lower sheet 15 are laminated in close contact with each other.

Furthermore, a portion of this laminate on the outer peripheral side that is larger than the outer shape of the final product is cut and molded into the outer shape of the final product shown in FIG. Top sheet 1
2. The upper sheet 13, the lower sheet 14, the lower sheet 15, and the frame 16 are formed to have a larger outer shape than the final product, and the excess outer peripheral portion is cut off. That is, the outer circumferential portion of the laminate where the frame 16 surrounding the electronic component structure 11 is interposed is cut out to give the final product shape.

In this way, as shown in FIG. 1, the electronic component structure 11 is supported by the frame 16, and the electronic component structure 11
A sheet-like small electronic calculator can be manufactured by laminating an upper sheet 13 and a lower sheet 15 on top of each other, and laminating the upper sheet 12 and the lower sheet 14 on both sheets 13 and 15.

Note that the materials and thicknesses of the upper and lower sheets and the upper and lower sheets are not limited to those in the above-described embodiments. For example, the top sheet and bottom sheet can be formed from vinyl chloride. The frame 16 is not limited to being formed separately from the upper sheet 13 and the lower sheet 15, but may be formed integrally with either or both of the upper sheet 12 and the lower sheet 15. For example, as shown in FIGS. 25 and 26, a frame 16 is formed integrally with the lower sheet 15 at the periphery of the upper surface of the lower sheet 15, and the electronic component structure 11 is arranged in a portion surrounded by this frame 16. Alternatively, the upper sheet 12 and the lower sheet 15 may be laminated in close contact with each other with the frame 16 in between. The configuration of the operating section 50 provided on the top sheet 12 is not limited to the embodiment, and for example, piezoelectric rubber may be provided in the hole section of the top sheet 13 instead of the movable contact. The electronic component structure 11 also electrically connects each electronic component, and its configuration is not limited to the embodiment, and the board 21 may be divided, for example, as shown in FIG. 27. Further, the battery 43 is not limited to a solar battery, and a button type battery can also be used.

Furthermore, when manufacturing the small electronic device of the present invention, as another embodiment, as shown in FIGS. A boss 69 made of hard vinyl chloride with a height corresponding to the height is formed by a printing method and protruded, and the boss 69 of the lower sheet 15 is used to connect the lower sheet 15, the electronic component structure 11, and the upper By adhering and laminating the sheets 13 while positioning and holding them, there is no need to use the assembly jig 64 during the manufacturing process, and it is possible to save labor and reduce manufacturing costs. In addition, the method is not limited to bonding and laminating each sheet with the adhesive 60 as shown in the above-mentioned embodiment, but also a thermocompression bonding method in which each sheet is melted and bonded together by heat, as shown in FIG. 30. It is also possible to laminate them in close contact using the same method. In this case, the layer thickness of each sheet is set to include the adhesive layer thickness of the above-mentioned embodiment. In addition, upper sheet 1
3 and the lower sheet 15 are bonded to the upper and lower surfaces of the substrate by using an adhesive 60 instead of by thermocompression bonding.

Note that the present invention is not limited to small electronic calculators, but can be widely applied to small electronic devices such as sheet-shaped electronic watches and electronic game machines.

As explained above, according to the small electronic device of the present invention, the outer periphery of the electronic component structure, which is provided by arranging the solar cell and the display element on the side of the wiring board equipped with the switch element and the integrated circuit element, is surrounded by a frame. At the same time, a partition formed in a frame is interposed between the display element and the solar cell, and a lower case having a recessed part for the display element is laminated and adhered to the lower surface of the electronic component structure. The upper case that will be laminated on the top of the body was glued to the top of the frame, so
It has a flat sheet structure and can be significantly thinned to 1 mm or less while maintaining sufficient mechanical strength.

[Brief explanation of drawings]

1 to 18 show an embodiment of a small electronic calculator to which the present invention is applied. FIG. 1 is a perspective view showing the external appearance of the small electronic calculator, FIG. 2 is an exploded perspective view, and FIG. Figure 3 shows the electronic component structure, where a is a plan view, b is an exploded perspective view, Figure 4 is a top plan view of the top sheet, Figure 5 is a bottom plan view of the top sheet, and Figure 6 is the upper part. A plan view of the seat, FIG. 7 is a plan view of the lower sheet, FIG. 8 is a plan view of the lower sheet,
FIG. 9 is a plan view of the frame, FIGS. 10 to 13 are partial cross-sectional views of the small electronic calculator, FIG. 14 is a cross-sectional view showing the mounting portion between the integrated circuit element and the board, and FIG. 15 a, b, c are cross-sectional views showing the case where the chip capacitor is attached to the board, Fig. 17 a, b
18A and 18B are sectional views each showing a case in which a display element is attached to a substrate, FIGS. 19 to 24 are sectional views each showing a case in which a battery is attached to a substrate, and FIGS. 19 to 24 are a manufacturing method for manufacturing a small electronic calculator. Fig. 19 is a process explanatory diagram showing the assembly process of an electronic component component, Fig. 20 is a process explanatory diagram showing the entire assembly process, and Figs. 21 and 22 are assembly diagrams, respectively. Perspective view showing the jig, Fig. 23 and Fig. 2
4 is a perspective view showing an intermediate assembly product, FIGS. 25 and 26 are a sectional view and a perspective view showing another example of the structure of the frame, respectively, and FIG. 27 is another example of the electronic component structure. 28 and 29 respectively show other embodiments of the manufacturing method, and FIG. 28 is a sectional view showing the assembled state, and FIG.
The figure is a perspective view showing the lower sheet, and FIG. 30 is a sectional view of a small electronic calculator manufactured by a still different embodiment of the manufacturing method. 11...Electronic component structure, 12...Top sheet, 1
3...Top sheet, 14...Bottom sheet, 15...Lower sheet, frame...16, 21...Substrate, 22...Copper foil, 2
4... Fixed contact, 26... Integrated circuit element, 30... Capacitor, 33... Light emitting diode, 34... Display element (liquid crystal panel), 43... Battery (solar cell), 50...
Operation section, 51...Key name printing section, 52...Movable contact, 53...Display window printing section, 54...Battery window printing section,
57-59...Hole part, 61...Blind printing part, 62...
Hole portion, 63... Positioning hole, 64, 65... Assembly jig, 66... Stand, 67... Positioning pin.

Claims (1)

[Scope of Claims] 1. A wiring board in which a large number of switch elements are arranged in a grid on one side of one half, and a semiconductor integrated circuit element is connected to the other half, the side of one half of the wiring board. a solar cell disposed on the other half side of the wiring board, and a display element disposed in parallel with the solar cell at a distance from the solar cell on the side of the other half of the wiring board, and the solar cell and the display element are connected by conductive adhesive. an electronic component component that is electrically connected to a predetermined connection portion of the wiring board by an agent; a frame-like portion surrounding the outer periphery of the electronic component component; and a spaced portion between the solar cell and the display element. a lower case having a display element recessed part facing the display element and laminated in close contact with the lower surface of the electronic component structure; and an operation part for opening and closing each of the switch elements. , an upper case that has a see-through window facing the display element and the solar cell, and a key display part facing each of the switch elements, and is adhered to the upper surface of the frame-shaped part of the frame and the partition part; A small electronic device. 2. The small electronic device according to claim 1, wherein the frame is formed as a frame member separate from the case member. 3. The small electronic device according to claim 1, wherein the frame is a frame portion integrally formed with the lower case.