JPS6362345B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for producing a polishing cloth that can effectively polish materials having high hardness and has excellent durability and flexibility.

Conventional techniques and their problems Flexible abrasive cloths and abrasive papers for polishing highly hard materials such as steel, cemented carbide, stone, and ceramics are made of silicon carbide (carbon random) on cloth or paper. It is known to be obtained by applying a mixture of fine particles such as diamond, glue, synthetic resin, etc., and drying the mixture. However, such a polishing cloth has the drawback that it lacks flexibility when the mixture is applied thickly, and it lacks durability when it is applied too thinly.

Furthermore, a method for manufacturing a polishing cloth that can polish highly hard substances and has excellent flexibility by subjecting the cloth to electroless plating is known. However, such a method has problems such as poor workability due to the slow deposition rate of electroless plating, and high cost due to the expensive electroless plating solution.

Means for Solving the Problems The present inventor has conducted extensive research in order to find a polishing cloth that can effectively polish substances with high hardness and has excellent durability and flexibility.
As a result, after applying electroless plating to the fabric to make it conductive, a partially cut out insulating sheet was pasted on the cloth, and then electroplating was performed, followed by using a nickel plating bath containing diamond. By performing eutectoid plating of diamond and then fixing the diamond by electroplating,
A plating film containing diamond particles can be formed on the cloth with good adhesion, and the polishing cloth thus obtained has excellent durability, can effectively polish materials with high hardness, and is flexible. I found it to be excellent.

That is, the present invention involves (a) applying electroless plating to a cloth, (b) attaching partially cut out insulating sheets to both sides of the cloth so that the cut out parts overlap, and (c) next, Applying electro-nickel plating or electro-nickel alloy plating to both sides of the fabric, (d) then diamond eutectoid plating, and (e) electro-nickel plating or electro-nickel alloy plating. The present invention relates to a method for manufacturing an abrasive cloth using diamond eutectoid plating.

In the present invention, first, electroless plating is applied to cloth.
Electroless plating can be done by following a conventional method. For example, after degreasing the cloth by immersing it in an alkaline solution, washing it with water, immersing it in an aqueous hydrochloric acid solution, and washing it with water, the cloth can be electrolessly plated. A suitable catalyst may be applied, and then electroless plating may be performed. The method for applying the catalyst may be any conventional method, such as a sensitizer activator method or a catalyst method.

There are no particular restrictions on electroless plating, and any known electroless plating bath can be used, for example,
Electroless copper plating, electroless nickel plating, electroless nickel alloy plating (Ni-Fe alloy, Ni-Co alloy, Ni-W alloy, etc.) may be used. The purpose of electroless plating is to impart conductivity to cloth, and the film thickness may normally be about 0.5 to 2 μm. If the film thickness is too thick, it is not preferable because the bath life of the electroless plating bath will be shortened.

After electroless plating, it is washed with water and dried, but if the electroless plating film is thin, some of the plating may peel off during the next step of attaching an insulating sheet. Therefore, for the purpose of preventing peeling of the plating film and improving the gloss of the electroless plating film, it is preferable to apply electroplating to a film thickness of about 0.5 to 3 μm on one side before drying. As the electroplating, ordinary copper plating, nickel plating, etc. may be used, and the plating may be performed under normal conditions.

After the plating film is dried, an insulating sheet is pasted on the plating film. The insulating sheet is cut out in advance only in the part where diamond eutectoid plating will be applied.The shape of the cutout of the insulating sheet is as follows:
Although not particularly limited, it is preferably circular or polygonal in order to increase the effective area for plating. The area of the cutouts and the interval between adjacent cutouts may be determined as appropriate depending on the degree of flexibility required of the polishing cloth. In addition, as the grain size of the diamond used increases, the plating thickness required to stably embed the diamond increases.
The wider the area of the cutout, the better the appearance. For example, when using diamond with a particle size of approximately 20 μm or less, the shape of the cutout should be approximately 0.015 μm in area.
When using diamonds with a particle size of approximately 40-60 μm, the shape of the cut ^- outs is
When using diamonds with a particle size of approximately 80 to 100 μm, the cutout shape should be a circle or polygon with an area of about 0.025 cm ² and the interval between the cutouts should be about ^0.1 cm. ,
The interval between the cutouts is about 0.12 cm, and the particle size is about 105.
When using ~125μm diamond,
The shape of the cutouts may be circular or polygonal with an area of approximately 0.03 cm ² and the interval between the cutouts may be approximately 0.15 cm.

The material of the insulating sheet may be any material that does not change or deteriorate when immersed in the acid aqueous solution, alkaline aqueous solution, plating bath, etc. used in the present invention, such as paper, vinyl, etc. etc. may be used. The thickness of the insulating sheet may be approximately 0.1 to 0.5 mm. The insulating sheet can be pasted on top of a plated surface with an adhesive such as acrylic or natural rubber. Usually, as an insulating sheet with an adhesive, commercially available paper adhesive tape or adhesive is used. You can use adhesive tape, etc. Insulating sheets having cutouts of the same shape are pasted on the front and back sides of the cloth so that the cutout positions match.

The cloth to which the insulating sheet has been pasted may be plated as is in the next step, but preferably the peripheral portion of the cloth is fixed with a frame and then plated. The purpose of fixing the periphery of the cloth with a frame is
A diamond layer is added in the next diamond eutectoid plating process to give strength to the cloth and prevent it from deforming during the plating process.It also improves electrical conductivity and makes it easier for a uniform current to flow over the entire surface of the cloth. These include making it easier to embed cloth inside, and making it easier to keep the distance between the cathode and anode (interelectrode distance) constant. The material of the frame is not particularly limited, and may be, for example, plastic. The frame may have a shape that corresponds to the shape of the cloth, and may be used as a set of two frames, which are fixed by sandwiching the periphery of the cloth. The part of the frame that comes into contact with the cloth should be made conductive using a metal plate or conductive paint, and the part around the cloth that will be fixed by the frame should be left with an exposed plating film without pasting an insulating sheet. preferable. In this way, by energizing the frame, the current can be applied uniformly to the entire surface of the cloth.

In the above case, the width of the area around the fabric where the insulating sheet is not attached and the plating film is exposed varies depending on the area of the fabric, etc., but usually,
It may be about 0.4 to 1.5 cm. The width and thickness of the frame
This can be determined appropriately depending on the area of the cloth, etc., but for example, if you use a frame with a width of 1 to 2.5 cm and a thickness of 0.1 to 0.3 cm, and the width of the part of the frame to be made into a conductor is about 0.3 to 1.5 cm. good.

Next, through the usual plating pretreatment processes such as degreasing with alkaline solution and acid immersion, nickel plating or nickel alloy plating (Ni-Fe, Ni-Co, Ni-P, etc.) is applied by electroplating. give Through this plating process, the deposits on the front and back surfaces of the polishing cloth grow and bind together between the fibers, forming a plating film with excellent adhesion sufficient to withstand use as a polishing cloth. Become. The plating film thickness may be approximately 5 to 30 μm on one side. On the other hand, if an insulating sheet is not used and the parts that do not require plating are covered by screen printing, plating with good adhesion is hardly obtained. This is because some organic matter contained in the liquid used for screen printing remains between the chemically plated fibers, which inhibits the wetting of the electrolyte and the fibers, and the growth of deposits between the fibers. This is thought to be due to the ability to prevent

Next, diamond eutectoid plating is performed. As a plating bath, a normal nickel plating bath, for example,
A deposited layer of diamond particles may be formed in a Watt bath, a nickel sulfamate bath, or the like. To adjust the plating bath, you can add the plating solution after creating a diamond particle deposit layer in the plating bath, or you can add the plating solution to the plating bath and then add the diamond particles to the plating bath. Particles may be added to form a deposited layer. The amount of plating liquid may be adjusted such that the liquid level is approximately 0.5 cm or more from the surface of the diamond layer. If the amount of plating solution is too small, water may evaporate, the electrolyte may be concentrated, and components of the plating bath may crystallize, which is undesirable. However, if the amount of plating solution is too large, There is no problem.

Diamond eutectoid plating may be performed by burying the treated cloth in a layer of diamond particles in a plating bath and applying current at a current density of about 3 to 8 A/ ^dm2 . do it. If the current density becomes too high, hydrogen gas is generated and the amount of diamond deposited decreases, which is not preferable. The plating time should be the time for the diamond to adhere sufficiently, for example, the current density
When plating is performed at 5 A/dm ² , plating may be performed for about 12 to 50 minutes. Generally, as the plating time increases, the amount of diamond deposited increases.
When plating is performed at 5 A/dm ² , even if plating is performed for 25 minutes or more, the amount of diamond adhesion does not increase much. However, increasing the plating time has the advantage of uniform diamond deposition distribution and improved adhesion. The temperature of the plating bath may be the same as that of a normal nickel plating bath, and is generally about 45 to 55°C.

The diamond used may be a general industrial diamond, and can range from a fine powder with a particle size of 3 μm or less to a particle size of about 100 to 125 μm.

After performing diamond eutectoid plating, the eutectoid diamond is fixed by electronickel plating or electronickel alloy plating (Ni-Fe, Ni-Co, Ni-P, etc.). By performing electric nickel plating or electric nickel alloy plating, the diamond particles are strongly fixed to the plating film, and a highly durable polishing cloth can be obtained. The rough guideline for plating film thickness is 40 to 40% of the eutectoid diamond particle size.
It may be about 80%, and plating may be performed according to a conventional method.

In the present invention, the following treatments can also be performed for the purpose of further improving the flexibility and deformability of the polishing cloth that has been subjected to the above-described treatments.

First, after final nickel plating or nickel alloy plating, chrome plating is applied to a thickness of 0.3 mm.
Approximately 3 μm thick. Chrome plating may be performed by a known method. After removing the insulating sheet, the plated film is immersed in a 10% or more nitric acid aqueous solution to dissolve and remove the plating film under the insulating sheet that is not coated with diamond eutectoid plating.
Since chromium plating does not dissolve in nitric acid, only the chromium-plated parts remain, and the polishing cloth is exposed in other parts, resulting in a polishing cloth with excellent flexibility and deformability.

The cloth to which the present invention can be applied may be any cloth that does not easily swell, hydrolyze, saponify, deteriorate, etc. when immersed in an acid or alkaline aqueous solution, and can withstand normal use as a polishing cloth. , for example, acetate, nylon, acrylic, vinyl, polyester, cotton, etc. Also,
The fineness and density of the cloth are not particularly limited and can be used in a wide range.

Effects of the Invention The polishing cloth obtained by the production method of the present invention has excellent adhesion of the plating film, can effectively polish materials having high hardness, and has excellent flexibility. Furthermore, since the adhesion of the diamond particles is good, it has excellent durability.

Examples Hereinafter, the present invention will be explained in more detail with reference to Examples.

Example 1 Polyester cloth (fineness: 150d x 250d, d:
Denier, density, 73×56) was used to perform the following processing.

Catalyst application: After degreasing by immersing in an alkaline solution, immersing in an aqueous hydrochloric acid solution, and then adding 23 g of stannous chloride and 10 g of hydrochloric acid.
After 5 minutes of immersion in a mixed aqueous solution of 0.3 g of palladium chloride and 1.3 ml of hydrochloric acid for 5 minutes.

Electroless nickel plating Electroless nickel plating bath (nickel chloride 30g/
, citric acid 60g/, ammonium chloride 50g/
, sodium hypophosphite (20 g/approx., and sodium hydroxide (approx. 40 g/approx.)), plating was carried out at 50° C. for 30 minutes to form a nickel plating film with a thickness of 1.2 μm on one side.

Electric nickel plating Nickel sulfamic acid plating bath (nickel sulfamic acid 400g/, nickel chloride 10g/,
One side was plated with nickel to a thickness of 1 μm using 30 g of boric acid and 1.5 g of saccharin at a bath temperature of 50°C and a current density of 5 A/dm ² , washed with water, and dried. .

Attaching an insulating sheet Use double-sided adhesive tape (trade name: Nice Stack, manufactured by Nichiban Co., Ltd.) as an insulating sheet.
A large number of cutouts were made so that the edges of the circle were spaced approximately 0.15 cm apart. This double-sided paper adhesive tape was attached to the front and back sides of the electroplated cloth so that the cutout positions overlapped. However, the double-sided adhesive tape was not applied to the approximately 0.5 cm wide area around the fabric.

The periphery of the cloth to which the double-sided adhesive tape was pasted using the method described above was placed in an ABS resin frame (1 cm wide,
0.15cm thick) and fixed it in place. On the side of the frame that was in contact with the fabric, a width of about 0.5 cm at the center line of the frame was made conductive.

Electric nickel plating After alkaline degreasing, water washing, and immersion in an aqueous hydrochloric acid solution, the sulfamic acid nickel plating bath, which is the same as that used in the above electric nickel process, is used to
Plating was carried out for about 25 minutes at a bath temperature of about 50° C. and a current density of about 5 A/dm ² to form a plated film with a thickness of about 25 μm on one side.

Diamond eutectoid plating Diamond particles with a particle size of 105 to 125 μm are deposited in a plating tank, and a high concentration nickel sulfamate plating bath (bath composition: 460 g of nickel sulfamate, 15 g of nickel bromide, boric acid) is applied to the plating bath. 30
g/, 1.5 g/) of saccharin was added so that the liquid level was about 0.8 cm higher than the surface of the diamond layer. The fabric, fixed by the frame, was then embedded in the diamond layer. The anodes were placed on both sides of the cloth so as to be parallel to the cloth. The liquid temperature of the plating bath is approximately 55
℃ and a current density of 5 A/dm ² for about 37 minutes to form a diamond eutectoid plating film on both sides of the cloth. The plating film thickness is approx.
It was 37 μm.

Electric nickel plating Using the same sulfamic acid nickel plating bath as in the above electric nickel plating process, the plating solution was heated at a bath temperature of 53℃ without stirring at a current density of 3A/dm2 ^.
Plating was performed for 10 minutes (the plating thickness was approximately 6 μm on one side), and then the current density was approximately 6 A/dm ² under stirring.
Plating was carried out for about 50 minutes (the plating thickness was about 60 μm on one side) to form an electric nickel plating film.

After completing the above-described treatment, the cloth was washed with water, the insulating sheet was removed, and then dried to produce a polishing cloth. The resulting polishing cloth had excellent flexibility, and when used for a long period of time, few diamond particles fell off, and excellent grinding performance was maintained until the polishing cloth itself deteriorated.

Example 2 The steps of Example 1 were carried out except that plating was performed by placing a plastic plate on one side of the cloth fixed in a frame to cut off the flow of current to one side of the cloth. A polishing cloth in which diamond particles were eutectoided only on one side of the cloth was produced in the same manner as in Example 1.

The resulting polishing cloth had excellent flexibility, and even when used for a long period of time, few diamond particles fell off.

Example 3 Polyester cloth (fineness 150d x 250d, density 190
×66) in the same manner as in Example 1, electroless nickel plating was applied to one side to a thickness of approximately 1.6 μm, and after washing with water, the same process as in Example 1 was performed to a thickness of approximately 1.5 μm to one side. A nickel plating film was formed to a certain thickness.

Next, a double-sided paper adhesive tape (trade name: Nicetack, manufactured by Nichiban Co., Ltd.) with many circular cutouts with an area of approximately 0.03 cm ² and an interval of 0.18 cm between adjacent circles was plated as described above. On both sides of the cloth,
I pasted them together so that the cutouts overlapped. However, the double-sided adhesive tape was not applied to the approximately 0.5 cm wide area around the fabric.

Next, the periphery of the cloth to which the above-mentioned double-sided adhesive tape was attached was fixed between frames made of vinyl chloride resin (width: 1 cm, thickness: 0.2 cm). On the side of the frame that was in contact with the cloth, a width of about 0.5 cm at the center line of the frame was made conductive.

Next, alkaline degreasing, water washing, hydrochloric acid aqueous solution immersion,
After the water washing step, a nickel plating film was formed on the cutout portion in the same manner as in Example 1 to a thickness of about 30 μm on one side.

Subsequently, in the same manner as in Example 1, eutectoid plating of diamond particles was performed using a high concentration nickel sulfamic acid plating bath containing diamond particles. However, the anode was installed parallel to the sample only on one side of the sample, and diamond eutectoid plating was performed only on one side of the cloth. Bath temperature approximately 55℃,
Plating was carried out for about 33 minutes at a current density of 6 A/dm ² to form a diamond eutectoid plating film with a thickness of about 40 μm.

Next, a Watts bath (bath composition: nickel sulfate 300
g/, nickel chloride 30g/, boric acid 30g/
, Satucalin (1.0 g/), and an anode was installed only on the side facing the sample surface to which diamond eutectoid plating was applied. The plating method is as follows: First, the plating bath is energized at a current density of 2 A/dm ² for 15 minutes without stirring (plating thickness on one side is about 6 μm), and then the current density is 5 A/dm ² with stirring.
energize for about 50 minutes (approximately 50μ plating thickness on one side)
A method called m) was used.

Next, after washing with water, chrome plating bath (bath composition:
Chromium plating was carried out on both sides of the sample using 200 g of chromic anhydride and 2.5 g of sulfuric acid at a bath temperature of 50° C. and a current density of 25 A/dm ² . The plating thickness was approximately 0.5 μm on one side. Thereafter, the fabric was washed with water to remove the insulating sheet, and then immersed in a nitric acid aqueous solution to dissolve the non-chromium plated areas (other than the cutouts) and expose the fabric. Next, it was washed with water and dried to produce a polishing cloth.

The resulting abrasive cloth had excellent flexibility and showed excellent durability with few diamond particles falling off even when used for a long period of time.

Claims (1)

[Claims] 1 (a) Electroless plating is applied to a cloth, (b) partially cut out insulating sheets are pasted on both sides of the cloth so that the cut out parts overlap, (c) then , electrolytic nickel plating or electrolytic nickel alloy plating is applied to both sides of the cloth, (d) diamond eutectoid plating is then performed, and (e) electrolytic nickel plating or electrolytic nickel alloy plating is performed. A manufacturing method of polishing cloth using diamond eutectoid plating.