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JPS6362886B2 - - Google Patents
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JPS6362886B2 - - Google Patents

Info

Publication number
JPS6362886B2
JPS6362886B2 JP56190224A JP19022481A JPS6362886B2 JP S6362886 B2 JPS6362886 B2 JP S6362886B2 JP 56190224 A JP56190224 A JP 56190224A JP 19022481 A JP19022481 A JP 19022481A JP S6362886 B2 JPS6362886 B2 JP S6362886B2
Authority
JP
Japan
Prior art keywords
coil
insulating layer
terminal board
resin
outermost
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56190224A
Other languages
Japanese (ja)
Other versions
JPS5891614A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP56190224A priority Critical patent/JPS5891614A/en
Publication of JPS5891614A publication Critical patent/JPS5891614A/en
Publication of JPS6362886B2 publication Critical patent/JPS6362886B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/12Insulating of windings
    • H01F41/127Encapsulating or impregnating

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Insulating Of Coils (AREA)

Description

【発明の詳細な説明】 この発明は樹脂モールドコイルの製造方法に関
するものであり、特に注型用金型を用いない樹脂
モールドコイルの製造方法に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a resin molded coil, and particularly to a method for manufacturing a resin molded coil without using a casting mold.

第1図は従来の樹脂モールドコイルの製造方法
を示すコイルの部分側断面図である。第1図にお
いて、まず巻芯1に基材と導体とを交互に巻回し
てコイル2を形成する。次に、ガラスエポキシ樹
脂積層板からなる端子板3にねじ穴401を有す
る端子4を取付け、この端子4にコイル2の端部
であるリード5を接続した後、リード5の周辺に
充填材6を隙間のないように詰め込み、例えばポ
リエチレンテレフタレートからなる不織布を数回
巻回して外周絶縁層7とし、外周絶縁層7の上か
ら浸透性の悪い不織布、例えば芳香族ポリアミド
不織布等を少なくとも一回以上巻いて最外周絶縁
層8を形成し、その巻き終り部をシールして、シ
ール部9を形成し素コイル10を構成する。次い
で素コイル10に光硬化性樹脂を含む熱硬化性樹
脂を含浸させた後、コイル周面に紫外線を照射し
て皮膜形成による漏れ止め処置を施した後、これ
を加熱硬化させて徐冷後巻芯1を抜き、端子4の
ねじ穴401に達する貫通孔を外周絶縁層7およ
び最外周絶縁層8にドリル等で明け、端子ねじ
(図示せず)および化粧ナツト(図示せず)を取
付けて製造を完了する。
FIG. 1 is a partial side sectional view of a coil showing a conventional method of manufacturing a resin molded coil. In FIG. 1, first, a coil 2 is formed by alternately winding a base material and a conductor around a winding core 1. Next, a terminal 4 having a screw hole 401 is attached to the terminal board 3 made of a glass epoxy resin laminate, and after connecting the lead 5, which is the end of the coil 2, to this terminal 4, a filler material 6 is placed around the lead 5. The outer insulating layer 7 is formed by wrapping a nonwoven fabric made of, for example, polyethylene terephthalate several times, and wrapping a nonwoven fabric with poor permeability, such as an aromatic polyamide nonwoven fabric, at least once over the outer insulating layer 7. The coil is wound to form an outermost insulating layer 8, and the end of the winding is sealed to form a sealed portion 9 to form an elementary coil 10. Next, the bare coil 10 is impregnated with a thermosetting resin including a photocurable resin, and the circumferential surface of the coil is irradiated with ultraviolet rays to form a film to prevent leakage, and then this is heated and cured, and then slowly cooled. Remove the winding core 1, drill a through hole in the outer insulating layer 7 and the outermost insulating layer 8 to reach the screw hole 401 of the terminal 4, and attach a terminal screw (not shown) and a decorative nut (not shown). to complete manufacturing.

しかしながら、上記従来の方法で製造された樹
脂モールドコイルでは、コイル外周の一部にシー
ル部9が段差となつて残り、金型を使用して製造
したコイルと比べて美観を損ね、商品価値を低く
する。また外周絶縁層7および最外周絶縁層8は
コイル円周面では巻きテンシヨンが均一にかか
り、密に巻くことができるが、端子板3上部では
端子板コーナー301にテンシヨンがかかり、端
子板3上は外周絶縁層7および最外周絶縁層8が
浮いた状態となつて隙間11が生じる。従つて、
素コイル10に樹脂を含浸させる樹脂含浸時に隙
間11に樹脂が侵入し、製造完了後にクリヤーレ
ジン層となつて残りクラツクの原因となる。さら
に、端子板3上の外周絶縁層7および最外周絶縁
層8並びに隙間11に樹脂が侵入して形成された
クリヤーレジン層は、端子4上部にドリル等によ
つて貫通孔を明ける際にクラツクを生じやすく、
化粧ナツト(図示せず)を取付ける際にもクラツ
クが発生する恐れがある。さらにまた、ねじ穴4
01と同軸に貫通孔を明けるための位置決めが難
しい欠点があつた。
However, in the resin molded coil manufactured by the above-mentioned conventional method, the seal portion 9 remains as a step on a part of the outer periphery of the coil, which impairs the aesthetic appearance and reduces the product value compared to a coil manufactured using a mold. make low. In addition, the outer circumferential insulating layer 7 and the outermost insulating layer 8 are evenly wound around the circumferential surface of the coil and can be wound tightly, but at the top of the terminal board 3, tension is applied to the terminal board corners 301 and In this case, the outer peripheral insulating layer 7 and the outermost peripheral insulating layer 8 are in a floating state, and a gap 11 is created. Therefore,
When impregnating the bare coil 10 with resin, the resin enters the gap 11 and becomes a clear resin layer after the manufacturing is completed, causing residual cracks. Furthermore, the clear resin layer formed by resin entering the outer peripheral insulating layer 7, the outermost peripheral insulating layer 8, and the gap 11 on the terminal board 3 will crack when drilling a through hole in the upper part of the terminal 4 with a drill or the like. tend to occur,
Cracks may also occur when attaching a cosmetic nut (not shown). Furthermore, screw hole 4
There was a drawback that it was difficult to position the through hole coaxially with 01.

この発明は上記のような従来のものの欠点を除
去するためになされたものである。以下図面によ
つてこの発明の一実施例を説明する。
This invention was made in order to eliminate the drawbacks of the conventional ones as described above. An embodiment of the present invention will be described below with reference to the drawings.

第2図はこの発明に係る樹脂モールドコイルの
製造方法の一実施例を示すコイルの部分側断面図
である。図中第1図と同一部分には同一符号を付
している。第2図において、巻芯1に基材と導体
とを交互に巻回してコイル2を形成する。次にガ
ラスエポキシ樹脂積層板からなる端子板3にねじ
穴401を有する端子4を取付け、端子板3およ
び端子4の上面に離型処置部12を形成する。離
型処置部12は例えばシリコーン系のグリス状の
離型剤を塗布して形成されており、その他耐熱性
が130℃を越える離型剤であればどのようなもの
であつてもよい。次に端子4にリード5を接続し
た後、リード5周辺に充填材6を隙間のないよう
に詰め込み、例えばポリエチレンテレフタレート
からなる不織布を数回巻回して外周絶縁層7と
し、外周絶縁層7の上から浸透性の悪い不織布、
例えば芳香族ポリアミド不織布等を少なくとも一
回以上巻いて最外周絶縁層8とし、その巻き終り
部を端子板3上の中心付近に位置させて巻き終り
部をシールしてシール部9を形成した後、コイル
端面の一方をシールして素コイル10を構成す
る。次に素コイル10をコイル端面がシールされ
ていない方を上にして、立てた状態で、光硬化性
樹脂を含む熱硬化性樹脂を含浸させた後、コイル
周面に紫外線を照射して皮膜形成による漏れ止め
処置を施し、これを乾燥炉に入れて加熱硬化させ
るが、完全硬化させる前、約70%〜80%の硬化時
点で例えばナイフ等を使用して端子板コーナー3
01が全周、すなわち四角形の四辺とも45度の角
度で端子板3が見えるまで、外周絶縁層7および
最外周絶縁層8を削り取り、端子板3上の外周絶
縁層7および最外周絶縁層8を除去して端子板3
の外側表面を露出させ、続いて樹脂を完全に加熱
硬化させる。この加熱硬化後徐冷して、巻芯1を
抜いて樹脂モールドコイルの製造を終了する。
FIG. 2 is a partial side sectional view of a coil showing an embodiment of the method for manufacturing a resin molded coil according to the present invention. In the figure, the same parts as in FIG. 1 are given the same reference numerals. In FIG. 2, a coil 2 is formed by alternately winding a base material and a conductor around a winding core 1. Next, the terminals 4 having screw holes 401 are attached to the terminal board 3 made of a glass epoxy resin laminate, and the mold release treatment portions 12 are formed on the upper surfaces of the terminal board 3 and the terminals 4. The mold release treatment section 12 is formed by applying, for example, a silicone-based grease-like mold release agent, and any other mold release agent having heat resistance exceeding 130° C. may be used. Next, after connecting the lead 5 to the terminal 4, filler material 6 is packed around the lead 5 without any gaps, and a nonwoven fabric made of, for example, polyethylene terephthalate is wound several times to form the outer insulating layer 7. Non-woven fabric with poor permeability from above,
For example, after wrapping an aromatic polyamide nonwoven fabric or the like at least once to form the outermost insulating layer 8, the end of the winding is positioned near the center of the terminal board 3, and the end of the winding is sealed to form the seal portion 9. , one of the end faces of the coil is sealed to form an elementary coil 10. Next, the bare coil 10 is held upright with the unsealed end of the coil facing up, and after being impregnated with a thermosetting resin including a photocurable resin, the circumferential surface of the coil is irradiated with ultraviolet rays to form a coating. After applying leak-proofing treatment by forming, it is placed in a drying oven and cured by heating, but before it is completely cured, when it is about 70% to 80% cured, use a knife etc. to cut the corner 3 of the terminal board.
The outer insulating layer 7 and the outermost insulating layer 8 on the terminal board 3 are scraped off until the terminal board 3 is visible on the entire periphery, that is, at an angle of 45 degrees on all four sides of the rectangle. Remove terminal board 3
The outer surface of the resin is exposed and the resin is then completely heated and cured. After this heating and curing, it is slowly cooled and the winding core 1 is removed to complete the production of the resin molded coil.

ここで一般的な熱硬化型の樹脂の性状は、一般
的に樹脂は完全重合を終え100%硬化していても、
そのものが高温に保たれておれば可とう性をも
ち、容易にナイフ等で切ることができる。特に上
記実施例のように70%〜80%の硬化時点での切断
作業は、実験の結果最も容易に切断できることが
判明した。
The properties of general thermosetting resins are that even if the resin has completed polymerization and is 100% cured,
If it is kept at a high temperature, it becomes flexible and can be easily cut with a knife. In particular, it has been found through experiments that the cutting operation at the point of 70% to 80% hardening, as in the above example, is the easiest to cut.

なお、端子板3への端子4の取付け方法、端子
板3とリード5との接続方法、並びに離型後の仕
上、塗装等の工程についての説明は、本発明の要
旨でないため省略する。
Note that descriptions of the method of attaching the terminals 4 to the terminal board 3, the method of connecting the terminal board 3 and the leads 5, and processes such as finishing and painting after release are omitted because they are not the gist of the present invention.

この発明は以上のようになされ、端子板3をコ
イル表面に出すことによつて端子板3上の外周絶
縁層7および最外周絶縁層8との間のクリヤーレ
ジン層によつて起因するクラツク発生の心配がな
くなり、製品特性上の信頼性が向上し、端子穴を
ドリル等によつて明ける作業と位置決め作業が省
略されて作業時間が短縮される。また最外周絶縁
層8の巻き終り部であるシール部9を端子板3上
に位置させ、最終的にシール部9を除去すること
によつて、コイル外周曲線部は平滑で継ぎ目のな
い表面を得ることができ、美観を向上させること
ができる。
This invention has been made as described above, and by exposing the terminal board 3 to the coil surface, cracks caused by the clear resin layer between the outer peripheral insulating layer 7 and the outermost peripheral insulating layer 8 on the terminal board 3 can be prevented. There is no need to worry about this, the reliability of product characteristics is improved, and the work of drilling terminal holes and positioning work is omitted, reducing work time. In addition, by positioning the seal portion 9, which is the end of the winding of the outermost insulating layer 8, on the terminal plate 3 and finally removing the seal portion 9, the outer curved portion of the coil has a smooth and seamless surface. can be obtained, and the aesthetic appearance can be improved.

以上のようにこの発明によれば、クラツクの発
生がなく、信頼性が向上し、作業時間が短縮で
き、かつ美観が向上する等の諸効果を有する。
As described above, the present invention has various effects such as no occurrence of cracks, improved reliability, reduced working time, and improved appearance.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来の樹脂モールドコイルの製造方法
を示すコイルの部分側断面図、第2図はこの発明
に係る樹脂モールドコイルの製造方法の一実施例
を示すコイルの部分側断面図である。 図において、1は巻芯、2はコイル、3は端子
板、301は端子板コーナー、4は端子、5はリ
ード、6は充填材、7は外周絶縁層、8は最外周
絶縁層、9はシール部、10は素コイル、12は
離型処置部である。なお各図中同一部分には同一
符号を付している。
FIG. 1 is a partial side sectional view of a coil showing a conventional method for manufacturing a resin molded coil, and FIG. 2 is a partial side sectional view of a coil showing an embodiment of the method for manufacturing a resin molded coil according to the present invention. In the figure, 1 is a winding core, 2 is a coil, 3 is a terminal board, 301 is a terminal board corner, 4 is a terminal, 5 is a lead, 6 is a filler material, 7 is an outer peripheral insulating layer, 8 is an outermost peripheral insulating layer, 9 10 is a sealing portion, 10 is an elementary coil, and 12 is a mold release treatment portion. Note that the same parts in each figure are given the same reference numerals.

Claims (1)

【特許請求の範囲】 1 巻枠に導体を巻回してコイルを作成する第1
の工程、前記コイルに接続される端子板の外側表
面に離型剤を塗布する第2の工程、前記コイルと
前記端子板との周囲に外周絶縁層および最外周絶
縁層を施して素コイルを構成し、前記最外周絶縁
層の巻き終り部を前記端子板の上部とする第3の
工程、および前記素コイルに樹脂を含浸させて加
熱硬化させ、加熱硬化中に前記端子板上の前記外
周絶縁層および前記最外周絶縁層を取り除き前記
端子板の外側表面を露出させる第4の工程からな
ることを特徴とする樹脂モールドコイルの製造方
法。 2 外周絶縁層および最外周絶縁層の除去は、樹
脂の70%〜80%硬化時に行う特許請求の範囲第1
項記載の樹脂モールドコイルの製造方法。
[Claims] 1. A first method for creating a coil by winding a conductor around a winding frame.
a second step of applying a mold release agent to the outer surface of the terminal board to be connected to the coil, and applying an outer peripheral insulating layer and an outermost peripheral insulating layer around the coil and the terminal board to form a bare coil. a third step in which the winding end portion of the outermost insulating layer is the upper part of the terminal board; and a third step in which the coil is impregnated with a resin and heated and cured, and the outer periphery on the terminal board is heated and cured during heat curing. A method for manufacturing a resin molded coil, comprising a fourth step of removing an insulating layer and the outermost insulating layer to expose the outer surface of the terminal board. 2 The removal of the outer peripheral insulating layer and the outermost peripheral insulating layer is performed when the resin is cured by 70% to 80%.
2. Method for manufacturing a resin molded coil as described in Section 1.
JP56190224A 1981-11-26 1981-11-26 Manufacture of resin molded coil Granted JPS5891614A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56190224A JPS5891614A (en) 1981-11-26 1981-11-26 Manufacture of resin molded coil

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56190224A JPS5891614A (en) 1981-11-26 1981-11-26 Manufacture of resin molded coil

Publications (2)

Publication Number Publication Date
JPS5891614A JPS5891614A (en) 1983-05-31
JPS6362886B2 true JPS6362886B2 (en) 1988-12-05

Family

ID=16254542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56190224A Granted JPS5891614A (en) 1981-11-26 1981-11-26 Manufacture of resin molded coil

Country Status (1)

Country Link
JP (1) JPS5891614A (en)

Also Published As

Publication number Publication date
JPS5891614A (en) 1983-05-31

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