JPS6362912B2 - - Google Patents

Description

[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a method of manufacturing a solar cell device, and particularly relates to a method of manufacturing a solar cell device suitable for connecting a solar cell element and a conductor lead in series at high speed. It is something.

[Background of the invention]

As shown in FIGS. 1 and 1, the conventional manufacturing method for this type of solar cell device involves manufacturing a plurality of solar cell elements 1, 1, . The conductor leads 3 on which a solder plating layer 4 etc. has been applied in advance are formed into a stepped shape, and the adjacent elements are connected from the back side of the solar cell element 1, on which a solder plating layer or a eutectic preliminary solder layer by dipping method has been applied on the front and back sides. Each conductor lead 3 is placed one after another in series so _that it faces the light receiving _surface of and conductive electrode patterns 2a and 2b were connected. Therefore, the time for melting the solder (its temperature is 183° C. or higher) ranges from several seconds to several tens of minutes.

Furthermore, as described above, since the conductor lead 3 has a structure spanning between the adjacent solar cell elements 1 and 1, it is difficult to adopt an automatic supply method, and there is a problem that mass productivity is poor. Ta. Furthermore, this method of heating the resistor requires an atmospheric furnace using H ₂ , N ₂ , or Ar gas, and is also a large conveyor furnace, which not only consumes a lot of energy such as gas and electricity, but also consumes a lot of energy, such as gas and electricity. However, there were problems in that it took a considerable amount of time to complete the connection, making it unsuitable for mass production.

FIG. 2 is a sectional view showing a method for manufacturing solar cells and devices obtained by a conventional manufacturing method that solves the above-mentioned problems. As shown in FIG. 2, the solar cell elements 1 are arranged in line with the conductors 6 of the substrate 5, and a copper foil conductor plated with solder from the upper surface is bonded to the film 7 to form a conductive pattern 8. The leads are arranged in accordance with the electrode pattern 2a of the solar cell element 1, and are bonded to the solar cell element 1 and the substrate 5 by heat and pressure. Both conductors 6 and 8 are brought into contact due to their properties, and the solder is melted by heating to connect both conductors 6 and 8, thereby manufacturing a solar cell device. Even in such conventional technology, since the heat capacity of the substrate 5 is large, it takes a considerable amount of time for the solder to melt and solidify, which is a problem in terms of high speed and mass productivity.

[Purpose of the invention]

It is an object of the present invention to solve the above-mentioned drawbacks of the prior art, to prevent peeling or cracking of the electrodes of solar cell elements, and to connect a plurality of solar cell elements in series on a plane at high speed. An object of the present invention is to provide a method for manufacturing a solar cell device that can perform the following steps.

[Summary of the invention]

In order to achieve the above object, the present invention arranges flexible conductor leads on both the front and back sides of a solar cell element, sandwiching them between transparent pressure structures from the outside, and generating a high-energy light and heat source from the outside. is applied to the electrodes and conductor lead portions of the solar cell elements, and to the upper and lower conductor lead portions between adjacent solar cell elements, which were previously cut by the light and heat source, through the pressurizing structure.

[Embodiments of the invention]

Hereinafter, one embodiment of the present invention will be described based on the drawings.

FIG. 3 to FIG. 6 are diagrams shown for explaining the method for manufacturing a solar cell device according to the present invention.

FIG. 3 is a cross-sectional view of the structure of the method for manufacturing a solar cell device of the present invention, FIG. 4 is an explanatory view of the same, and FIG. 5 is a cross-sectional view of FIG. 4.

In FIG. 3, the conductive pattern 2a is coated with a eutectic solder plating layer, a eutectic solder layer by dipping or reflow method, a paste solder layer by printing method, etc. on the light-receiving surface and the back electrode of the solar cell element 1,
Flexible leads 30 (hereinafter referred to as flexible leads) 30, which are formed by applying eutectic solder plating or the like 40 on metal foil leads 30a made of copper (Cu), etc., are aligned on both sides of the solar cell element 1 on which 2b is formed. do. Next, from the outside of the flexible lead 30,
The flexible leads 30 are sandwiched between transparent pressure structures (for example, quartz glass material) 9 and brought into close contact with the conductive patterns 2a and 2b of the solar cell element.

Furthermore, as shown in FIG.
A light heat source 13 from a high energy light heat source generator such as a YAG laser is passed through a glass fiber or the like 14 from the outside, and a flexible lead 30 and a quartz pressure structure 9 are mounted in this order on the head part 11
The light and heat sources are focused at a and 11b, transmitted through the pressurizing structure 9, and irradiated onto the flexible leads 30 on the conductive pattern of the solar cell element 1, thereby melting and connecting each solder layer.

Thereafter, for example, Cu,
A metal spacer 10 made of SuS or the like is inserted, and a light heat source is focused by the head parts 12a and 12b from above and below in the figure, and a part of the flexible lead 30 is irradiated and cut.

As shown in FIG. 6, the cut flexible leads 30 between the solar cell elements 1 and 1 are pressurized by a pressure structure 9a provided with a protrusion 9b. are brought into contact with each other, and a YAG laser beam 13, which is a high-energy light source, is irradiated from the outside through a quartz pressurized structure 9a to locally and instantly rapidly heat and solidify the solder layer at the contact portion, thereby establishing a connection. .

By irradiating it through the quartz pressurized structure using a high-energy photothermal source such as a YAG laser beam,
The solar cell element and the conductor lead can be connected at high speed and with high yield, and a highly reliable solar cell device can be manufactured.

According to this embodiment, there are effects in the following points.

(1) Conductive patterns 2a and 2b of each solar cell element 1
The connection of the flexible leads 30 and the cutting and connection of the leads between adjacent elements can be performed at high speed without any thermal influence on the surroundings of the conductive pattern because the solder layer can be rapidly heated and solidified locally and instantaneously.

(2) Continuously supply flexible conductor leads;
The cutting and connecting method simplifies the process of arranging solar cell elements and leads, and greatly reduces process time.

(3) Lead material can also be used as hoop material, significantly reducing costs.

(4) It is an energy-saving and low-cost process because it does not require atmospheric gas or electricity for a large furnace.

(5) It is highly mass-producible and can produce high-output solar panels at low cost and with high yield.

By the way, when connecting the flexible lead 30 and the conductive pattern 2, as shown in FIG.
A portion of the laser beam becomes reflected light 13a on the surface of the glossy solder plating layer 4a, and heat absorption may be hindered to some extent.

Therefore, the solder plating layer 40 is attached to the conductor lead 30.
A was formed. Later, one side is made into a matte solder plating layer 40b by anodizing. In this way, as shown in FIG. 8, there is no reflection. Here, the solder plating method is a two-layer plating method of lead (Pb) plating + tin (Sn) plating, or
Alternatively, an alloy plating method of lead (Pb) and tin (Sn) may be used. From this, the laser beam is not reflected and the matte solder plating layer 40b
Since the heat can be transferred to the surface of the solar cell and the heat can be connected efficiently, the solderability is also good and the connection between the solar cell element and the lead can be made at high speed, which is highly effective.

〔Effect of the invention〕

As described above, according to the present invention, mass production is possible and a high-output solar cell device can be provided.

[Brief explanation of drawings]

1I and 2 are block diagrams and cross-sectional views showing a conventional method for manufacturing a solar cell device, and FIGS. 3 to 6 show an example of a method for manufacturing a solar cell device according to the present invention. 3 is a sectional view, FIG. 4 is a plan view, FIG. 5 is a sectional view, FIG. 6 is a sectional view, and FIG. 7 is a sectional view for explaining the connection process. , FIG. 8 is a sectional view of the same. DESCRIPTION OF SYMBOLS 1... Solar cell element, 2, 2a, 2b... Conductive pattern, 3... Conductor lead, 30... Flexible lead, 30a... Metal foil lead, 4, 40... Solder plating layer, 5... Substrate, 6... Board conductor, 7... Film, 8... Film conductor, 9, 9a, 9b... Pressure structure, 10... Metal spacer, 11a, 11b, 1
2a, 12b...Head, 13...YAG laser beam,
14...Glass fiber.

Claims (1)

[Scope of Claims] 1. A method for manufacturing a solar cell device by connecting a plurality of solar cell elements in series with conductor leads, each having a conductive electrode pattern formed on a light-receiving surface and a back surface. A process of positioning conductor leads on the light-receiving surface side and the back side of the battery element, respectively,
irradiating the light receiving surface side and the back surface side with a light heat source to connect each conductor lead to the conductive electrode pattern;
A step of cutting a part of the light-receiving side conductor lead and a part of the back-side conductor lead between adjacent solar cell elements, and a part of the light-receiving side conductor lead and a part of the back-side conductor lead cut in the above step. A method for manufacturing a solar cell device, comprising the step of irradiating and connecting with a light source while applying pressure. 2 In claim 1, the step of cutting a part of the conductor lead is performed by inserting a metal spacer between the light-receiving side conductor lead and the back side conductor lead between adjacent solar cell elements. 1. A method of manufacturing a solar cell device, which comprises placing the solar cell device in the same position and then heating and cutting it using a light heat source. 3 In claim 1, the step of connecting the conductor lead and the conductive electrode pattern is performed by forming a solder layer on the metal foil lead and using a conductor lead that has been made matte by an anode arrangement method. 1. A method for manufacturing a solar cell device, characterized in that the solar cell device is connected to the solar cell device.