JPS6365002B2 - - Google Patents
Info
- Publication number
- JPS6365002B2 JPS6365002B2 JP19281682A JP19281682A JPS6365002B2 JP S6365002 B2 JPS6365002 B2 JP S6365002B2 JP 19281682 A JP19281682 A JP 19281682A JP 19281682 A JP19281682 A JP 19281682A JP S6365002 B2 JPS6365002 B2 JP S6365002B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- mounting
- guide plate
- mounting surface
- platen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/1756—Handling of moulds or mould parts, e.g. mould exchanging means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
- B29C31/006—Handling moulds, e.g. between a mould store and a moulding machine
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Robotics (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Description
【発明の詳細な説明】
この発明は射出成形機の固定盤と可動盤の両方
法に一対の分割金型を装着する方法に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for mounting a pair of split molds on both a fixed platen and a movable platen method of an injection molding machine.
従来の金型の装着では、金型の厚さに対応し
て、固定盤から可動盤の距離を予め設定して置く
必要があつた。また上方から吊り下した金型の取
付面と固定盤の型取付面とを平行に保つことが困
難で、位置合わせに手数を要し、金型の装着を自
動的に行うには特別な金型装着装置が必要とされ
ていた。 In conventional mold mounting, it was necessary to set the distance from the fixed platen to the movable platen in advance in accordance with the thickness of the mold. In addition, it is difficult to keep the mounting surface of the mold suspended from above parallel to the mold mounting surface of the stationary platen, and it takes time to align the molds. A mold setting device was required.
この発明は上記従来の問題点をきわめて簡単な
手段により解決しようとするものであり、また複
雑な装置を設けずに自動装着も可能とする新たな
金型装着方法を提供しようとするものである。 This invention attempts to solve the above-mentioned conventional problems by extremely simple means, and also provides a new mold mounting method that enables automatic mounting without the need for complicated equipment. .
上記目的によるこの発明は、固定盤の上部に案
内板を型取付面と同一面に設け、その案内板に上
方から吊り下げながら金型の取付面を当接して、
金型の取付姿勢を正したのち、その状態を保ちな
がら可動盤を金型近くまで移動し、しかるのち金
型を取付位置に降して装着を行うことを特徴とす
るものである。 The present invention according to the above object includes a guide plate provided on the upper part of the fixed plate on the same plane as the mold mounting surface, and a mold mounting surface abutted against the guide plate while being suspended from above.
After correcting the mounting posture of the mold, the movable platen is moved close to the mold while maintaining that state, and then the mold is lowered to the mounting position and mounted.
以下この発明を図示の例により詳細に説明す
る。 The present invention will be explained in detail below using illustrated examples.
図中1は固定盤、2は可動盤、3,3はタイバ
ーである。上記固定盤1の上部には型取付面1a
と同一面に案内板4が取付けてあり、かつ案内板
4の右側辺は左右の位置決め用の突縁5に形成し
てある。 In the figure, 1 is a fixed plate, 2 is a movable plate, and 3, 3 are tie bars. The upper part of the fixed platen 1 has a mold mounting surface 1a.
A guide plate 4 is attached to the same surface as the guide plate 4, and the right side of the guide plate 4 is formed with a protrusion 5 for left and right positioning.
6は金型当接確認用センサーで案内板4に設け
てあり、また7は可動盤2の上部に設けた移動位
置確認用のセンサーである。更にまた固定盤1と
可動盤2の型取付面1a,2aの下部には上下の
位置決め用ストツパー8,8が突設してあり、そ
の下側に温調媒体の自在継手9が配設してある。 6 is a sensor for confirming mold contact, which is provided on the guide plate 4; and 7 is a sensor provided on the upper part of the movable platen 2 for confirming the movement position. Furthermore, upper and lower positioning stoppers 8, 8 are protruded from the lower parts of the mold mounting surfaces 1a, 2a of the fixed platen 1 and the movable platen 2, and a temperature control medium universal joint 9 is arranged below them. There is.
10は上記タイバー3,3の内側に一対ごと対
向させて設けた油圧作動の金型固定装置であり、
一対の分割金型11,12はその金型固定装置1
0により固定盤1と、可動盤2の所定位置に装着
されるようになつている。 10 is a hydraulically operated mold fixing device provided in pairs facing each other inside the tie bars 3, 3;
A pair of split molds 11 and 12 have a mold fixing device 1
0 so that it can be mounted at predetermined positions on the fixed platen 1 and the movable platen 2.
上記金型11,12はそれぞれ取付板11a,
12aを有し、上部に突設した吊金具13を介し
て充分に開かれた上記固定盤1と可動盤2との間
の上部に、型閉じ状態にて旋回自在に吊り下げら
れている。この金型11,12をまず案内板4の
方向に移動する。この移動は金型吊持装置(図示
せず)を操作して行い、案内板4への取付面の当
接により金型11,12の取付姿勢を正す。この
確認は取付面が案内板面と全面的に接触した際に
動作する上記センサー6により行う。上記確認が
なされると、次に可動盤2を型閉方向に移動す
る。そして金型12の取付面近くまで可動盤2が
移動して来ると、センサー7の作動により位置が
確認され、金型11,12を下降するに充分な余
裕を残して可動盤2は停止する。 The molds 11 and 12 are mounted on mounting plates 11a and 11a, respectively.
12a, and is pivotally suspended in a closed state at the upper part between the fixed platen 1 and the movable platen 2, which are sufficiently opened, via a hanging fitting 13 protruding from the upper part. The molds 11 and 12 are first moved in the direction of the guide plate 4. This movement is performed by operating a mold lifting device (not shown), and the mounting postures of the molds 11 and 12 are corrected by bringing the mounting surfaces into contact with the guide plate 4. This confirmation is performed by the sensor 6, which is activated when the mounting surface fully contacts the guide plate surface. Once the above confirmation is made, the movable platen 2 is then moved in the mold closing direction. When the movable platen 2 moves close to the mounting surface of the mold 12, the position is confirmed by the operation of the sensor 7, and the movable platen 2 stops leaving enough room to lower the molds 11 and 12. .
次に金型11,12を固定盤1と可動盤2との
型取付面1a,2aを案内として下下方へと降す
る。金型11,12は両型取付面1a,2aに挾
まれた状態にあることから、下降途中で斜めに変
位することなく、上記位置決め用ストツパー8,
8に載る。そして上記自在継手9が接続され、金
型11,12に温調媒体が給送されるようにな
る。この上下位置の確認も図は省略したがセンサ
ーをもつて行うことができ、位置が確認されると
上記金型固定装置10,10が直ちに又は型締後
に作動して金型を設定位置にて保持する。 Next, the molds 11 and 12 are lowered using the mold mounting surfaces 1a and 2a of the fixed platen 1 and the movable platen 2 as guides. Since the molds 11 and 12 are held between the mold mounting surfaces 1a and 2a, the positioning stopper 8,
Listed on 8th. Then, the universal joint 9 is connected, and the temperature regulating medium is supplied to the molds 11 and 12. The vertical position can also be confirmed using a sensor (not shown in the figure), and when the position is confirmed, the mold fixing devices 10, 10 are activated immediately or after the mold is clamped to hold the mold at the set position. Hold.
この発明は上述のように、固定盤1の上部に型
取付面と同一面に案内板4を設け、この案内板4
に金型11の取付面を当接して、取付姿勢を正し
たのち、可動盤2を型閉方向に移動して金型1
1,12の変位を防止し、しかるのち金型11,
12を取付位置まで下降し、その上で装着を行う
ものであるから、金型の厚みに関係なく金型を設
定位置に取付けることができる。また装着に際し
て複雑な操作や装置を必要とせず、金型の吊り下
げにも厳密性を要しないため、吊持装置も簡単な
ものでよく、センサーなどの利用により自動装着
も行うことができるなどの特長を有する。 As described above, this invention provides a guide plate 4 on the same surface as the mold mounting surface on the upper part of the fixed platen 1, and this guide plate 4
After correcting the mounting posture by touching the mounting surface of the mold 11 to the mold 1, move the movable platen 2 in the mold closing direction and
1, 12 is prevented from being displaced, and then the mold 11,
12 is lowered to the mounting position and then mounted, so the mold can be mounted at the set position regardless of the thickness of the mold. In addition, no complicated operations or equipment are required for mounting, and no strict requirements are required for hanging the mold, so a simple hanging device is sufficient, and automatic mounting can be performed using sensors, etc. It has the following features.
図面はこの発明に係る金型装着方法を例示する
もので、第1図は型締機構の平面図、第2図は固
定盤の型取付面図、第3図は可動盤の型取付面
図、第4図及び第5図は装着工程を示す型締機構
の側面図である。
1…固定盤、1a,2a…型取付面、2…可動
盤、3…タイバー、4…案内板、8…位置決め用
ストツパー、10…金型固定装置、11,12…
金型。
The drawings illustrate the mold mounting method according to the present invention, and FIG. 1 is a plan view of the mold clamping mechanism, FIG. 2 is a mold mounting surface view of the fixed platen, and FIG. 3 is a mold mounting surface diagram of the movable platen. , 4 and 5 are side views of the mold clamping mechanism showing the mounting process. DESCRIPTION OF SYMBOLS 1... Fixed plate, 1a, 2a... Mold mounting surface, 2... Movable plate, 3... Tie bar, 4... Guide plate, 8... Positioning stopper, 10... Mold fixing device, 11, 12...
Mold.
Claims (1)
動盤との型取付面に装着するにあたり、上記固定
盤の上部に案内板を型取付面と同一面に設け、そ
の案内板に上方から吊り下げながら金型の取付面
を当接し、該当接により金型の取付姿勢を正した
のち、その状態を保ちながら可動盤を金型近くま
で移動し、しかるのち金型を取付位置に下降して
装着を行うことを特徴とする金型装着方法。1. When installing a pair of split molds on the mold mounting surfaces of a fixed plate and a movable plate in a closed state, a guide plate is provided on the upper part of the fixed plate on the same surface as the mold mounting surface, and the upper Touch the mounting surface of the mold while hanging from the mold, correct the mounting posture of the mold by the appropriate contact, then move the movable plate close to the mold while maintaining this state, and then lower the mold to the mounting position. A mold mounting method characterized in that the mold mounting method is performed by
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19281682A JPS5983611A (en) | 1982-11-02 | 1982-11-02 | Mold mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19281682A JPS5983611A (en) | 1982-11-02 | 1982-11-02 | Mold mounting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5983611A JPS5983611A (en) | 1984-05-15 |
| JPS6365002B2 true JPS6365002B2 (en) | 1988-12-14 |
Family
ID=16297458
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19281682A Granted JPS5983611A (en) | 1982-11-02 | 1982-11-02 | Mold mounting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5983611A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0615191B2 (en) * | 1986-11-06 | 1994-03-02 | マツダ株式会社 | Molding equipment using dies |
| EP3575058B1 (en) * | 2013-02-06 | 2022-08-10 | Husky Injection Molding Systems Ltd. | Mold positioning device |
-
1982
- 1982-11-02 JP JP19281682A patent/JPS5983611A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5983611A (en) | 1984-05-15 |
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