JPS6366078B2 - - Google Patents
Info
- Publication number
- JPS6366078B2 JPS6366078B2 JP9453483A JP9453483A JPS6366078B2 JP S6366078 B2 JPS6366078 B2 JP S6366078B2 JP 9453483 A JP9453483 A JP 9453483A JP 9453483 A JP9453483 A JP 9453483A JP S6366078 B2 JPS6366078 B2 JP S6366078B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- nozzle
- circuit board
- printed circuit
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000853 adhesive Substances 0.000 claims description 42
- 230000001070 adhesive effect Effects 0.000 claims description 42
- 238000000034 method Methods 0.000 claims description 16
- 238000004140 cleaning Methods 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 238000007664 blowing Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000006071 cream Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】
(イ) 産業上の利用分野
本発明はチツプ部品即ちチツプ状の抵抗、コン
デンサ等のリードレスの電子部品をプリント基板
に装着する際に、仮固定用の接着剤を予め塗布す
る場合、該接着剤の塗布に先立ち塗布部としての
ノズルを高圧エアーにてクリーニングするチツプ
部品用の接着剤塗布装置の塗布部クリーニング方
法に関する。[Detailed Description of the Invention] (a) Industrial Application Field The present invention provides a method for temporarily fixing adhesives when mounting chip components, that is, leadless electronic components such as chip-shaped resistors and capacitors, on a printed circuit board. The present invention relates to a method for cleaning an application section of an adhesive application device for chip parts, in which a nozzle serving as an application section is cleaned with high-pressure air prior to application of the adhesive when the adhesive is applied in advance.
(ロ) 従来例
一般にチツプ部品をプリント基板に取付けるチ
ツプマウント装置と呼ばれる自動装着装置におい
て、前記チツプ部品をプリント基板に仮固定する
ために接着剤をチツプ部品の取付側に塗布する主
な方式として、ピン転写、スクリーン印刷又はデ
イスペンサ方式のいずれかが採用されている。(b) Conventional Example In an automatic mounting device generally called a chip mount device that attaches chip components to a printed circuit board, the main method is to apply adhesive to the mounting side of the chip component in order to temporarily fix the chip component to the printed circuit board. , pin transfer, screen printing or dispenser methods are employed.
この中で特にデイスペンサ方式においては、塗
布部として設けられたノズルから接着剤を吐出さ
せて、プリント基板に塗布する際に、該ノズル周
辺が接着剤のはみ出しにより汚れてしまう。現在
前述の様にノズル周辺が汚れてくると、作業者が
前記ノズルを接着剤塗布装置から取外して掃除
（クリーニング）するか、あるいは取付けたまま
で、布などで掃除する必要があり、作業の手間を
要していた。 Among these, especially in the dispenser method, when adhesive is discharged from a nozzle provided as an applicator and applied to a printed circuit board, the area around the nozzle becomes dirty due to adhesive extrusion. Currently, as mentioned above, when the area around the nozzle becomes dirty, the operator must either remove the nozzle from the adhesive applicator and clean it, or leave it attached and clean it with a cloth, which is a time-consuming process. It required
(ハ) 発明の目的
本発明は前記欠点を除去した作業者による接着
剤塗布装置のノズルのクリーニングを不要にし、
同塗布装置の連続運転を可能にすることを目的と
する。(c) Purpose of the invention The present invention eliminates the need for cleaning the nozzle of the adhesive applicator by an operator by eliminating the above-mentioned drawbacks.
The purpose is to enable continuous operation of the coating equipment.
(ニ) 発明の構成
本発明は、プリント基板にチツプ部品を仮固定
する接着剤塗布装置において、接着剤を供給する
デイスペンサの塗布部を高圧エアーにてクリーニ
ングするチツプ部品用の接着剤塗布装置の塗布部
クリーニング方法を提案するものである。(d) Structure of the Invention The present invention provides an adhesive applicator for chip components that temporarily fixes chip components to a printed circuit board, and in which the application section of a dispenser that supplies adhesive is cleaned with high-pressure air. This paper proposes a method for cleaning the application section.
(ホ) 実施例
図面はいずれもデイスペンサ方式のチツプ部品
の仮固定用接着剤の塗布に係り、第１図はチツプ
部品用の接着剤塗布装置の斜視図、第２図は第１
図におけるヘツド部分の要部拡大側面図、第３図
は第２図に示したデイスペンサ部分の要部拡大正
面図、第４図はプリント基板にチツプ部品を接着
剤にて仮固定した状態の斜視図、第５図はプリン
ト基板に所定個所にクリーム半田を塗布後接着剤
にてチツプ部品を仮固定した状態の斜視図、第６
図及び第７図は本発明の塗布部クリーニング方法
を用いた実施例を示す接着剤塗布装置の側面図で
ある。(e) Examples The drawings all relate to the dispenser-type application of adhesive for temporary fixing of chip parts, and FIG. 1 is a perspective view of an adhesive applicator for chip parts, and FIG.
Figure 3 is an enlarged side view of the main parts of the head part shown in Figure 2, Figure 3 is an enlarged front view of the main parts of the dispenser part shown in Figure 2, and Figure 4 is a perspective view of the chip parts temporarily fixed to the printed circuit board with adhesive. Figure 5 is a perspective view of the printed circuit board with cream solder applied to predetermined locations and chip components temporarily fixed with adhesive;
7 and 7 are side views of an adhesive coating device showing an embodiment using the coating section cleaning method of the present invention.
次に第１図について説明すると、プリント基板
１はコンベア２により、矢印Ａ方向に送られ、
XYテーブル３上で図示の状態に固定される。 Next, referring to FIG. 1, the printed circuit board 1 is sent in the direction of arrow A by the conveyor 2 .
It is fixed on the XY table 3 in the state shown in the figure.
一方接着剤はタンク４に貯蔵されており、塗布
部としてのヘツド５の下限位置において、前記プ
リント基板に前記接着剤を塗布する。 On the other hand, the adhesive is stored in a tank 4, and is applied to the printed circuit board at the lower limit position of a head 5 serving as an application section.
そこで所定位置に接着剤の塗布されたプリント
基板１は、コンベア２′に移され、矢印Ａ方向に
搬送されて、次の工程即チツプ部品の装着工程に
送られる。図中６はフレーム、７はガイドレール
を示す。 Thereupon, the printed circuit board 1 with the adhesive applied at a predetermined position is transferred to a conveyor 2 ', conveyed in the direction of arrow A, and sent to the next process, that is, the chip component mounting process. In the figure, 6 indicates a frame, and 7 indicates a guide rail.
第２図はプリント基板１に対して接着剤を塗布
している状態で、ヘツド５の先端のノズル８から
接着剤９が吐出され、このときプリント基板１に
対してギヤツプｄを保つためにヘツド５に設けた
ストッパピン１０の先端がプリント基板１に当接
している。 Figure 2 shows a state in which adhesive is being applied to the printed circuit board 1, and adhesive 9 is discharged from the nozzle 8 at the tip of the head 5 . The tip of a stopper pin 10 provided at 5 is in contact with the printed circuit board 1.
第４図及び第５図は第１図の接着剤塗布装置に
よつてプリント基板１に接着剤を塗布後、チツプ
部品１１を前記プリント基板１の銅箔１２上に載
置した状態の斜視図で、第４図はチツプ部品１１
のプリント基板１に対する仮固定用として接着剤
９を用い加熱等にて接着剤９を硬化させこの次の
工程で半田デイツピングを行う例、第５図はチツ
プ部品１１のプリント基板１に対する仮固定用と
して接着剤９を用い、予め前述と同様加熱等によ
り接着剤９を硬化させ更にクリーム半田１３を銅
箔１２，１２に塗布した上にチツプ部品１１を装
着し、次の工程で該クリーム半田１３，１３を溶
融して前記チツプ部品１１の電極１４，１４を前
記銅箔１２，１２に電気的かつ機械的に結合する
例である。 4 and 5 are perspective views of the state in which the chip component 11 is placed on the copper foil 12 of the printed circuit board 1 after applying adhesive to the printed circuit board 1 using the adhesive coating device shown in FIG. So, Figure 4 shows the chip part 11.
An example of using an adhesive 9 for temporarily fixing a chip component 11 to a printed circuit board 1, hardening the adhesive 9 by heating, etc., and applying solder dipping in the next step. The adhesive 9 is used as the adhesive 9, and the adhesive 9 is hardened by heating etc. in the same manner as described above, and then the cream solder 13 is applied to the copper foils 12, 12, and then the chip part 11 is attached, and in the next step, the cream solder 13 is applied. , 13 are melted to electrically and mechanically connect the electrodes 14, 14 of the chip component 11 to the copper foils 12, 12.
第６図は本発明方法を用いた一実施例で、XY
テーブル３に載置されたプリント基板１の所定個
所にノズル８から接着剤を供給、塗布する際にエ
アー吹出しノズル１５から前記ノズル８に対して
側面方向（矢印方向Ｂ）にエアーを吹出させ、排
気ダクト１６によつて不要な接着剤をノズル周面
から取去る構成である。第７図はノズル８の軸方
向（矢印Ｃ方向）にエアーを吹出させる実施例
で、エアガイド部１７の下方間隙１８，１８から
エアーを吹き出させる。前述の第６図又は第７図
において、前記エアーの吹出しは次のいずれかの
方式が使用できる。 Figure 6 shows an example using the method of the present invention, in which XY
When supplying and applying the adhesive from the nozzle 8 to a predetermined location of the printed circuit board 1 placed on the table 3, air is blown out from the air blowing nozzle 15 in the side direction (arrow direction B) toward the nozzle 8, The exhaust duct 16 removes unnecessary adhesive from the nozzle peripheral surface. FIG. 7 shows an embodiment in which air is blown out in the axial direction of the nozzle 8 (in the direction of arrow C), and the air is blown out from the lower gaps 18, 18 of the air guide portion 17 . In the above-mentioned FIG. 6 or FIG. 7, any of the following methods can be used for blowing out the air.
プリント基板１毎に前記ノズル８に対してエ
アー吹出しを行う。 Air is blown to the nozzle 8 for each printed circuit board 1.
前記ノズル８からの接着剤の吐出量に応じて
エアー吹出しを行う。 Air is blown out according to the amount of adhesive discharged from the nozzle 8.
チツプ部品の取付個所への接着剤の塗布の所
定回数に応じて前記ノズル８に対してエアー吹
出しを行う。 Air is blown from the nozzle 8 in accordance with a predetermined number of times the adhesive is applied to the mounting location of the chip component.
これらのタイミング制御については、マイクロ
コンピユータ（CPU）等を用いて、予め設定し
たプログラムに従つて電磁弁（図示せず）を動作
させることができる。 Regarding these timing controls, a microcomputer (CPU) or the like can be used to operate a solenoid valve (not shown) according to a preset program.
(ヘ) 発明の効果
本発明のチツプ部品用の接着剤塗布装置の塗布
部クリーニング方法によれば、塗布部に設けたノ
ズル部分の不要な接着剤を除去できるので、チツ
プ部品が装着されるプリント基板上に所定個所以
外の接着剤の塗布を未然に防止でき、更に前記ノ
ズル近傍に設けてストツパピンへの不要な接着剤
を除去できる利点が得られる。(F) Effects of the Invention According to the method for cleaning the application section of the adhesive applicator for chip parts of the present invention, unnecessary adhesive can be removed from the nozzle part provided in the application section, so that the print to which the chip parts are attached can be cleaned. Advantages are obtained in that it is possible to prevent the adhesive from being applied to areas other than predetermined locations on the substrate, and that unnecessary adhesive can be removed from the stopper pin by providing it near the nozzle.
前記ノズルの側方からエアー吹出しを行えば、
前述の第２の効果が容易に得られ、ノズルの軸方
向へのエアー吹出しを行えば、全体の構成がコン
パクトにまとめられる副効果も得られる。 If air is blown from the side of the nozzle,
The second effect mentioned above can be easily obtained, and by blowing air in the axial direction of the nozzle, a side effect of making the entire structure more compact can also be obtained.
第１図はチツプ部品用の接着剤塗布装置の斜視
図、第２図は第１図におけるヘツド部分の要部拡
大側面図、第３図は第２図に示したデイスペンサ
部分の要部拡大正面図、第４図及び第５図はプリ
ント基板の所定個所にチツプ部品を仮固定した状
態の斜視図、第６図及び第７図は本発明の塗布部
クリーニング方法を用いた実施例を示す接着剤塗
布装置の側面図である。
主な図番の説明、１…プリント基板、３…XY
テーブル、５…ヘツド、８…ノズル、９…接着
剤、１１…チツプ部品、１２…銅箔、１４…電
極、１５…エアー吹出ノズル。
Figure 1 is a perspective view of the adhesive applicator for chip parts, Figure 2 is an enlarged side view of the main part of the head part in Figure 1, and Figure 3 is an enlarged front view of the main part of the dispenser part shown in Figure 2. Figures 4 and 5 are perspective views of chip components temporarily fixed to predetermined locations on a printed circuit board, and Figures 6 and 7 are adhesive bonding examples using the method of cleaning the application area of the present invention. FIG. 3 is a side view of the agent application device. Explanation of main drawing numbers, 1...Printed circuit board, 3...XY
Table, 5 ... Head, 8... Nozzle, 9... Adhesive, 11... Chip parts, 12... Copper foil, 14... Electrode, 15... Air blowing nozzle.
Claims (1)
剤塗布装置において、接着剤を供給するデイスペ
ンサの塗布部を高圧エアーにてクリーニングする
ことを特徴としたチツプ部品用の接着剤塗布装置
の塗布部クリーニング方法。 ２ 前記高圧エアーを前記デイスペンサの塗布部
に対し側方から吹付けることを特徴とした特許請
求の範囲第１項記載のチツプ部品用の接着剤塗布
装置の塗布部クリーニング方法。 ３ 前記高圧エアーを前記デイスペンサの塗布部
方向に吹付けることを特徴とした特許請求の範囲
第１項記載のチツプ部品用の接着剤塗布装置の塗
布部クリーニング方法。[Scope of Claims] 1. Adhesive application for chip parts, characterized in that in an adhesive application device for temporarily fixing chip parts to a printed circuit board, the application part of a dispenser that supplies adhesive is cleaned with high-pressure air. How to clean the application section of the device. 2. A method for cleaning an application section of an adhesive application device for chip parts according to claim 1, characterized in that the high-pressure air is blown from the side to the application section of the dispenser. 3. A method of cleaning an application section of an adhesive application device for chip parts according to claim 1, characterized in that the high-pressure air is blown in the direction of the application section of the dispenser.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9453483A JPS59219983A (en) | 1983-05-27 | 1983-05-27 | Method of cleaning coated part of adhesive coating device for chip part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9453483A JPS59219983A (en) | 1983-05-27 | 1983-05-27 | Method of cleaning coated part of adhesive coating device for chip part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59219983A JPS59219983A (en) | 1984-12-11 |
| JPS6366078B2 true JPS6366078B2 (en) | 1988-12-19 |
Family
ID=14112992
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9453483A Granted JPS59219983A (en) | 1983-05-27 | 1983-05-27 | Method of cleaning coated part of adhesive coating device for chip part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59219983A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS603200A (en) * | 1983-06-20 | 1985-01-09 | 松下電器産業株式会社 | Automatic part assembling machine |
| JPS61159073U (en) * | 1985-03-23 | 1986-10-02 | ||
| JPH01317567A (en) * | 1988-06-20 | 1989-12-22 | Miura Kogyo Kk | Hermetic sealant coating method and apparatus |
| JP2595493B2 (en) * | 1993-03-04 | 1997-04-02 | セイコープレシジョン株式会社 | Liquid discharge device |
-
1983
- 1983-05-27 JP JP9453483A patent/JPS59219983A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59219983A (en) | 1984-12-11 |
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