JPS637015B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a solid composite component, and more particularly to a solid composite component that has convenient means for attaching various components and also has a capacitor function.

Generally, a printed wiring board has a conductive pattern formed on the surface of an insulating base, and various components are attached and soldered to the surface of the printed wiring board. However, in this method, a large number of capacitor parts and resistor parts must be individually attached, which makes the construction of the electronic circuit complicated and the space occupied by the parts increases.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a solid composite component which has a built-in capacitor function and has a concave portion on its surface convenient for mounting electronic components such as semiconductors such as transistors and diodes.

A preferred embodiment of the invention further provides a solid composite component having printed and baked resistors.

Next, to briefly describe the manufacturing method of the present invention, the present invention includes a raw sheet formed by alternately laminating ceramic sheets and electrode films, and a second raw ceramic sheet in which holes are formed in which semiconductors and the like are embedded. This is a method of manufacturing a solid composite part by overlapping and combining, firing, baking a resistor if necessary, and further baking a metal film for an external terminal around the periphery of the fired body, and the composite part manufactured in this way.

According to the present invention, the solid composite component is monolithic and has high mechanical strength, has a built-in multilayer capacitor, and has a recess on the surface for mounting semiconductors, etc., so that these components can be easily mounted. Moreover, benefits such as overall miniaturization of composite parts can be obtained.

Embodiments of the present invention will be described in detail below with reference to the drawings. This example shows an application to a band switching circuit for a television tuner.

1 to 3 show the manufacturing process of the solid composite part according to the first embodiment, and FIG. 3 also shows the finished product. In FIG. 1, A indicates a multilayer capacitor portion (before firing) with an area that allows a predetermined electronic circuit to be constructed;
Prepared by a known method. For example, ceramic powder such as barium titanate or titanium oxide is mixed with a binder to form a paste, while Ag-Pd or Pd
A metal powder such as powder is mixed with a binder to form a paste, and these pastes are alternately printed or laminated as sheets to obtain a laminate as shown. In the illustrated example, a pair of electrode layers are printed and laminated on a ceramic layer to obtain two laminated capacitors. A in the figure shows the thus obtained laminate, which consists of a ceramic 1 and counter electrode layers C ₁ , C ₁ ′ and C ₂ , C ₂ ′, with the lead-out portions of the electrode layers C ₁ and C ₂ on one side of the laminate. ,
The lead-out portions of the electrode layers C ₁ ′ and C ₂ ′ are exposed on the other side of the laminate.

Next, B in FIG. 1 is a surface layer made of ceramic, and its material may be the same as the ceramic in the laminate for a capacitor, or it may be different. In either case, it is desirable that the material and the laminate for a capacitor have substantially the same thermal shrinkage rate when fired together. The ceramic surface layer B is formed by punching holes 3 and 4 at predetermined locations on a sheet 2 made by rolling out a ceramic powder paste. The sizes of the holes 3 and 4 are made slightly larger than the external dimensions of the semiconductor or other component.

Note that both sheets 1 and 2 are constructed with a large area, and a large number of electrodes and holes are formed on them with the sizes of A and B in FIG. Although it is practical to cut it, for the sake of simplicity, only one section will be described.

As shown in FIG. 2, the capacitor laminate A and the surface layer B are overlapped, pressure is applied in the direction of the arrow to combine them, and then firing is performed at a high temperature. External terminals 5 (for C ₁ ) and 6 (for C 2) are electrically connected to the capacitor electrodes C ₁ , C ₂ , C ₁ ′, and C _{2 ′ exposed} on the two sides of the laminate thus obtained. ),
7 (for C ₁ ′, C ₂ ′) is formed by baking conductive paste (Ag powder, Cu powder, etc.), and further external electrodes 8, 9, 10, 11, etc. are baked in the same way on the other sides, Further, printed wirings 12, 13, etc. are provided on the front and back sides of the laminate. Further, if necessary, a resistor paste such as a paste of fretyl oxide powder is baked to form the resistor films R ₁ and R ₂ . Semiconductor elements D ₁ and D ₂ are inserted into the holes 3 and 4, and their terminals are appropriately soldered to printed wirings 12 and 13, etc. In this case, the semiconductor elements D ₁ and D ₂ are conveniently positioned by the recesses 3 and 4, making the work easier, and since the semiconductors can be inserted into the recesses, the finished solid composite The parts have a flat plate shape, allowing the overall thickness to be kept small.

4 and 5 show other examples of the present invention.
However, the main parts of the present invention are the same as those in the example shown in FIGS. 1 to 3, and the only difference is the means of attachment to the printed circuit board, so corresponding parts are designated by the same reference numerals and a description thereof will be omitted. As shown in FIG. 5, the lower portion of the solid composite component of this example has downwardly tapered tapers 14, 15, and all the printed wiring leads are led out to the lower side. As shown in FIG. 6, a printed wiring board 17 having an opening 16 of a size corresponding to the horizontal cross section of the tapered part of the composite component is prepared, and various wiring lines 1 connected to the opening 16 are provided on the surface of the printed wiring board 17.
8 has been applied. Therefore, when the solid composite component of this example is inserted into the opening 16, the tapered portions 14, 15
serves as a stop and positioning means, and then an electrical connection can be made between the composite component and the printed circuit board by soldering.

FIG. 6 shows an equivalent circuit of the composite parts of FIGS. 3 and 4.

As described above, according to the present invention, a solid composite component with a recessed hole for receiving an electronic component such as a semiconductor is provided, so that the composite component can be made smaller and flat, and assembly is facilitated. Benefits such as the ability to integrate capacitors, which have been difficult to integrate, can be obtained.

[Brief explanation of the drawing]

1 to 3 are perspective views showing a solid composite part according to a first embodiment of the present invention and its manufacturing method, FIG. 4 is a perspective view of a solid composite part according to another embodiment, and FIG. 5 is a perspective view of the same part. FIG. 2 is a perspective view showing the state of use.
FIG. 6 shows an equivalent circuit of the composite parts of FIGS. 3 and 4. The main parts in the diagram are as follows. A: Laminated body for capacitor, 1: Ceramic layer laminate, C ₁ , C ₂ , C ₁ ′, C ₂ ′: Electrode for capacitor,
B: Upper layer, 2: Ceramic, 3, 4: Hole (recess).

Claims (1)

[Claims] 1 A raw first ceramic sheet containing multiple multilayer capacitors and a raw second ceramic sheet with through holes formed therein.
A method for producing a solid electronic component, which comprises superimposing and sintering ceramic sheets, forming a conductive pattern such as an external electrode on the outer surface, and then inserting and fixing an electronic component into the hole. .