JPS637017B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a laminated composite electronic component, particularly an LC formed by combining an inductance L and a capacitor C.
Regarding composite electronic components.

In conventional composite parts, the dimensions of the inductor are large, and the manufacturing method for inductors is completely different from the manufacturing method for capacitors, so it has been difficult to make them more complex and smaller. Concerning capacitors, multilayer chip capacitors are known and are becoming thinner and smaller, but inductors require a conductor wire to be wound around a magnetic core, so it has been difficult to make them laminated and smaller.

In order to solve this problem, the inventor filed a patent application in 1973-
No. 161221 (Japanese Unexamined Patent Publication No. 55-91103) and other publications proposed chip-shaped laminated composite parts using a printing method. To explain the main point, conductor patterns for inductors, conductor patterns for capacitors, dielectric thin films, magnetic thin films, etc. are printed and laminated in an appropriate order on a thin insulating substrate to form a chip-shaped laminate. The external terminal was baked on the edge of the laminate so as to be connected to the end of the conductor pattern exposed on the edge of the laminate. This method offered benefits such as miniaturization of composite parts, mass production, and cost reduction. However, even with this method, the printed laminate is fired at a high temperature in a firing furnace, so an expensive heat-resistant material such as Pd or Ag-Pd is required as the conductive powder, and high-temperature treatment is required. becomes. Furthermore, since the laminated layers cannot be made very thin, the reduction in dimensions is still insufficient, and there are problems such as large L and C, and difficulty in obtaining uniform characteristics.

An object of the present invention is to provide a laminated LC composite component using vacuum thin film formation technology without relying on a printing method. Since the method of the present invention does not require a firing step and does not require the use of heat-resistant metals, any conductive material such as Cu, Al, Ag, etc. can be used. In addition, each layer has a uniform thickness, can be made thinner, and has good dimensional accuracy, making it possible to obtain an LC composite component with uniform characteristics.

The present invention includes sputtering method, ion plating method, thermal spraying method, ion beam method, vapor growth method,
It is carried out using a thin film forming method that applies vacuum technology such as vacuum evaporation. Formation of the inductor portion and the capacitor portion requires metal for the coil-shaped conductive pattern and capacitor electrode, and an insulator for insulating the conductive pattern and the electrode.

As an insulator, TiO ₂ is used in the capacitor part,
It is preferable to use dielectric materials such as Al ₂ O ₃ , BaTiO ₃ , SiO _{2 ,} etc., and MFe ₂ O ₄ in the inductor part.
It is preferable to use a ferrite magnetic material (M: metal). Alternatively, all may be made of magnetic material or dielectric material depending on the characteristics. All of the above thin film formation techniques can be used to form metal films. A sputtering method, a thermal spraying method, an ion plating method, etc. can be used to form the insulating film.
By using one or more of these methods, the desired laminated structure can be obtained. Therefore, according to the method of the present invention, there is no need for a firing step, and the object of the present invention can be sufficiently achieved using inexpensive metals.

A feature of the laminated LC composite component obtained by the method of the present invention is that the thickness of each layer can be close to the angstrom unit (10 ^-10 m), so it is possible to obtain large capacitance or inductance even with a relatively thin laminate. This also means that compact laminates with a very wide range of property values can be produced freely in an integrated process.

Among various thin film forming methods, the one recommended in the present invention is the sputtering method. Although this method has a slightly slower film formation rate than other methods, high-speed sputtering methods have recently been developed.
The sputtering method is a particularly preferred method because the composition of the insulator source or metal source can be transferred almost directly to the composition of the produced film, and the adhesion strength is high and the produced film is uniform.
Note that the mask is placed as close to the surface of the substrate as possible in order to avoid a wraparound phenomenon of atomic or molecular flow in the sputtering method.

Embodiments of the invention will now be described in detail with reference to the drawings.

FIG. 1 is a diagram showing the principle of the sputtering method. A negative electrode 1 and a ground electrode 5 are placed facing each other in a vacuum chamber filled with argon gas of about 10 ^-3 to ^{10 -2} Torr, and a high-frequency voltage ( ~10MHz, etc.). A plate 2 of a metal or oxide to be vapor-deposited is held on the surface of the negative electrode 1, a substrate 4 for vapor deposition is placed on the surface of the ground electrode 5, and a mask 3 is placed on the surface of the substrate 4. high frequency voltage
When RF is applied between the electrodes 1 and 5, the metal or oxide plate 2 is bombarded with positively ionized gas, causing metal or oxide atoms or molecules to be ejected from the surface of the plate 2 at a high rate. It is sputtered toward the substrate 4 to form a thin film. Incidentally, since the sputtering method is well known, there is no need for further detailed explanation.

2 to 12 show the manufacturing process of a laminated LC composite component according to a first embodiment of the present invention. Substrate D
The shape of the thin film formed on the mask 3 is determined by the shape of the opening provided in the mask 3, and multiple masks corresponding to the pattern to be deposited are prepared and used in an appropriate order. The metal source and the magnetic or dielectric oxide source located at the negative electrode shall also be used alternately in an appropriate order. In addition, each mask can be formed with a large number of identically shaped openings to simultaneously manufacture a large number of laminated LC composite parts. Note that as the substrate, it is also possible to use a metal plate having a removable surface or an insulator that becomes part of a laminate.

First, refer to FIG. First, an oxide film 10 is formed using an oxide source made of an oxide insulator such as Al ₂ O ₃ or SiO ₂ , more preferably an insulating magnetic ferrite.
is deposited on the surface of the substrate 4. Next, the metal source such as Al, Ag, Ni or Cu was replaced with an oxide source, the mask was replaced, and the oxide film 1 was removed as shown in Figure 3.
A conductor 11 is formed at a position to the right of 0 so that its end is exposed on the lower side of the oxide film 10. Next, as shown in FIG. 4, an oxide film 12 made of the same material as the film 10 is formed to cover the lower part of the oxide film 10, leaving only the upper end of the conductor 11. Next, a conductor 13 made of the same material as the conductor 11 is connected to the end of the conductor 11 so as to extend toward the left side of the laminate. Next, as shown in FIG. 6, the conductor 13 is formed so as to cover the upper part of the laminate, leaving only one end of the conductor 13. Next, as shown in FIG. 7, a conductor 1 extends from the end of the conductor 13 to the right side of the laminate.
form 5. The ends of the conductors 15 are exposed on the upper side of the laminate. Next, as shown in FIG. 8, an insulator 16 similar to that shown in FIG. 2 is applied over the entire surface of the laminate. Next, we move on to the process of forming the capacitor part, and as shown in FIG.
An electrode film 17 of Ni, Cu, Ag, etc. is formed, and a dielectric film 1 of TiO ₂ , BaTiO ₃ , etc. is formed thereon as shown in FIG.
8 is formed, and further an electrode film 19 is formed which overlaps the lower electrode 17 and exposes the lower side of the stacked body as shown in FIG. After the lamination is completed, take out the laminate from the vacuum chamber and bake conductive paste (paste containing any metal powder suitable for soldering) on the upper and lower sides as shown in Figures 12-13 to attach external terminals 21 and 22. A laminated LC composite component having the equivalent circuit shown in FIG. 14 is thereby obtained.

Figures 15-22 show a second embodiment of the invention.
As shown in FIG. 15, an insulating magnetic film 31 is first formed on the substrate by sputtering, and then a first
As shown in FIG. 6, a coil/capacitor conductor 32 and a capacitor conductor 33 are deposited by sputtering. At this time, one end 34 of the conductor 35 is exposed on the right side of the magnetic film 31, and the other end is curved into a hook shape.
terminates in On the other hand, the conductor 33 has a portion 37 extending along the conductor 35 so as to form a capacitance with the linear portion 35 of the conductor 32, and a lead-out end 38 exposed on the upper side of the magnetic film 31. Next, as shown in FIG. 17, a dielectric or magnetic film 39 is deposited on the entire surface of the magnetic film 31, leaving one end 36 of the conductor 35, and then a conductor 40 continuous to one end 36 of the conductor 35 is deposited. do. At this time, the end portion 41 of the magnetic or dielectric film 3
Extends to above 9. Next, as shown in Figure 19, conductor 4
A magnetic film 42 is placed in the lower half of the figure, leaving the edge 41 of 0.
Further, conductors 43 and 45 similar to that shown in FIG. 16 are formed as shown in FIG. 20. At this time, the conductor 43
is led out to 46, and the left end of the conductor 43 is led out to the left side of the laminate. As shown in FIG. 21, a magnetic film 50 is deposited on the entire surface to complete the lamination. Next, the laminate is taken out of the vacuum chamber, and as shown in FIG. 22, external terminals 46, 47, and 48 are formed by baking conductive paste to be connected to both ends of the coil conductor and the capacitor conductor, respectively. The equivalent circuit of the laminated LC composite component thus obtained is shown in FIG. This part can be used as a filter, etc.

As described above, the present invention provides the advantage that a composite part having LC composite functions can be manufactured in a consistent process using thin film forming technology. Since each layer of the laminate is extremely thin, the dimensions of the product can be reduced, and desired characteristics can be freely obtained by increasing or decreasing the number of laminated layers. This laminated LC composite component is suitable for direct attachment to printed circuit boards and automatic soldering.

[Brief explanation of the drawing]

FIG. 1 is a front view showing an example of an apparatus for carrying out the method of the present invention, FIGS. 2 to 12 are plan views showing sequential steps of the first embodiment of the present invention, and FIG.
The figure is a vertical cross-sectional view of Figure 12, and Figure 14 is a vertical cross-sectional view of Figure 12-1.
3 is an equivalent circuit diagram of the laminated LC composite component, FIGS. 15 to 21 are plan views showing the sequential steps of the second embodiment of the present invention, FIG. 22 is a perspective view of the completed laminated LC composite component, and FIG. 23 is an equivalent circuit diagram of the components shown in FIG. 22. The main parts in the figure are as follows. 10, 12, 14, 16, 18, 20: Insulator film, 11, 13, 15: Conductor, 17, 19: Electrode film, 31, 39, 42, 50: Insulator film, 46,
47, 48: External terminals.

Claims (1)

[Scope of Claims] 1. A vacuum technique comprising a step A of alternately laminating insulator layers and a conductor pattern for forming a coil, and a step B of alternately laminating an insulator layer and an electrode pattern for forming a capacitor in any order. In the method for manufacturing a laminated composite component by a thin film forming means using the method, the coil forming pattern in the step A is a conductor for about half a turn, and the half turn of the conductor between the insulating layers overlaps the ends. A laminated LC composite characterized in that, after lamination in steps A and B, external connection means for connecting to the conductor patterns and electrode patterns in A and B are formed in a part of the laminated body. How the parts are manufactured. 2. The lamination according to claim 1, wherein the thin film forming means is a sputtering method.
Method of manufacturing LC composite parts.