JPS637026B2 - - Google Patents
Info
- Publication number
- JPS637026B2 JPS637026B2 JP57129458A JP12945882A JPS637026B2 JP S637026 B2 JPS637026 B2 JP S637026B2 JP 57129458 A JP57129458 A JP 57129458A JP 12945882 A JP12945882 A JP 12945882A JP S637026 B2 JPS637026 B2 JP S637026B2
- Authority
- JP
- Japan
- Prior art keywords
- water
- cooling
- cooling water
- anion exchange
- cooled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F15/00—Other methods of preventing corrosion or incrustation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J39/00—Cation exchange; Use of material as cation exchangers; Treatment of material for improving the cation exchange properties
- B01J39/04—Processes using organic exchangers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
この発明は、冷却水を用いて水冷機器を冷却す
る水冷機器の冷却装置に関する。
サイリスタバルブなどの交直変換装置には、大
電力用の半導体素子が使用されるが、電力用の大
容量素子においては、電極面から発生する単位面
積当りの熱量が非常に大きいため、非常に熱密度
の高い熱量を短時間のうちに除去する必要があ
る。このため半導体素子に装着した銅の冷却フイ
ンに発生熱量を導き、フインを熱伝達率の高い水
で冷却し、温まつた水を別の熱交換器に通して空
気または水で冷却する方式が従来採用されている
が、交直変換装置においては、直流の課電部を通
して冷却水中に漏れ電流が流れると、冷却水系に
存在する金属材料は流電腐食を生じるので、冷却
水には、高度の絶縁性を有する水が要求されるた
め、一般に蒸溜水または予めイオン交換処理した
イオン交換水が使用されている。
第１図は、半導体素子を使用した水冷式交直変
換装置の従来の冷却装置を示したもので、図にお
いて１は図示されていない電力用大容量半導体素
子で構成された交直変換装置であつて、これが水
冷機器となるものである。２は交直変換装置１で
発生する熱を除去するための冷却水、３は蒸溜水
またはイオン交換水等の冷却水２を循環させるた
めのポンプ、４は冷却水２の絶縁性を良好に維持
させるために冷却水２を精製するイオン交換装
置、４１はイオン交換装置４に収納された陽イオ
ン交換樹脂、４２は陰イオン交換樹脂である。５
は交直変換装置１の発生熱を除去した冷却水２を
冷却するための熱交換器、６，７，８は冷却水２
を通すための非電導性材料でつくられた管で管
６，７は冷却水の主循環経路を形成し、８は主循
環経路から分岐したバイパス路を形成する。９，
１０は流量調節用のバルブ、１１は補給水タンク
である。
従来の水冷電気機器の冷却装置は、上記のよう
に構成され、ポンプ３を駆動させることにより、
冷却水２は管６を通つて交直変換装置１へ送ら
れ、交直変換装置１内を循環して、交直変換装置
を構成する図示されていない半導体素子を冷却す
る。温められた冷却水２は管７を通つて熱交換器
５へ送られ冷却され再びポンプ３および管６を通
つて循環される。冷却水２はこれらの冷却水系を
循環するうちに、冷却水系に存在する金属材料や
ロー付部および非電導性材料中の不純物成分を
徐々に溶解するため、冷却水の純度が次第に低下
する。このため、冷却水２の一部は管８によつて
形成されるバイパス路を通してイオン交換装置４
に送られ冷却水中に溶け込んだ不純物イオン成分
をイオン交換装置４によつて除去し、再び高絶縁
性の冷却水として流量調節バルブ１０、ポンプ
３、管６を通して交直変換装置１に送り込まれ
る。
交直変換装置のように直流回路を有する電気機
器を水で冷却する場合には、冷却水中に直流の漏
れ電流が流れると冷却水系に存在する金属は流電
腐食によつて腐食するが、金属の流電腐食による
腐食量は漏れ電流の大きさに比例する。一方、漏
れ電流の大きさは水の抵抗に反比例するため、イ
オン交換装置を用いて冷却水の絶縁性を高め、漏
れ電流を小さくして、腐食を防止することに従来
主眼がおかれてきた。しかし、冷却水による金属
の腐食は、流電腐食に加えて冷却水系に存在する
溶存酸素にもとずく腐食が生じるために、単に冷
却水の純度を高めるだけでは、腐食を完全に防止
することはできない。即ち、冷却水が接触して熱
交換が行われる交直変換装置１内の図示されてい
ない半導体素子に装着された放熱体の放熱面並び
に熱交換器５の放熱面は、放熱を有効に行わしめ
るために、非常に広い表面積を有しており、かつ
前記の放熱面は熱伝達率の大きい銅や黄銅などの
金属でつくられているため、冷却水中の溶存酸素
の作用によつて腐食される金属の総量はかなり大
きな値になる。腐食によつて冷却水中に溶け込ん
だ金属イオンは、イオン交換樹脂によつて取除か
れるが、冷却水中に溶出する金属イオンの量が多
いと、イオン交換樹脂の寿命が非常に短くなり、
イオン交換樹脂の再製や取替えに非常に手間を要
するという欠点があつた。
水に対する飽和溶存酸素濃度は、例えば25℃の
水中では約8.2ppmであるが25℃の水中における
銅の腐食量は、水中の溶存酸素が８、６、４、
2ppmのときに、0.4、0.33、0.25、0.14mg／ｄ
m2／日であり、銅の腐食量と溶存酸素濃度の間に
は、明らかに高度の相関がある。従つて冷却水中
における金属の腐食を軽減するためには、冷却水
の純度を高めると共に、水中の溶存酸素濃度を下
げることが重要である。
この発明は、水冷機器の放熱体や冷却管などの
腐食を軽減し、水冷機器の信頼性を高めると共
に、併せて冷却水の純度維持のために使用される
イオン交換樹脂の寿命延長を図ることを目的とす
るものである。
第２図は、この発明による水冷機器の冷却装置
の一実施例を示すもので１〜３，５〜１１は従来
装置と全く同一のものである。１２は管８によつ
て形成されるバイパス路に配設された脱酸素装
置、１２１はその容器、１２２は容器１２１内に
収納された水不溶性または水難溶性の脱酸素材で
ある。１３は脱酸素装置１２の前段に配設された
陰イオン交換装置、１３１はその容器、１３２は
容器１３１内に収納された陰イオン交換樹脂、１
４は脱酸素装置１２の後段に配設された陽イオン
交換装置、１４１はその容器、１４２は容器１４
１内に収納された陽イオン交換樹脂である。
このように構成された水冷機器の冷却装置にお
いては、蒸溜水またはイオン交換水等の冷却水２
は、バルブ９，１０を適当に調節し、ポンプ３を
駆動させることにより交直変換装置１へ送られ交
直変換装置内を循環して図示されていない半導体
素子を冷却する。温められた冷却水は管７を通し
て熱交換器５へ送られ、冷却され再びポンプ３お
よび管６を通つて循環するが、冷却水の一部はバ
ルブ９，１０の調節に応じた量が管８を通つて陰
イオン交換装置１３を通過することによつて水中
の不純物イオンの内、陰イオンのみが除去され、
冷却水中には陽イオンが過剰の状態になるため冷
却水は、弱アルカリ性となつて脱酸素装置１２を
通過する。脱酸素装置１２には脱酸素材として例
えば鉄粉が使用される。冷却水の脱酸素材として
は、通常亜硝酸ナトリウムやヒドラジンなどの無
機物質または有機物質が知られているが、これら
の物質は水に溶解して、水の電導度を高めるの
で、流電腐食が問題になるような冷却水系では使
用することができない。そのため、この発明では
水不溶性または水難溶性の脱酸素材を使用する。
溶存酸素を含んだ冷却水が鉄と接触するとFe＋
H2O＋１／２O2→Fe（OH）2並びにFe（OH）2＋１／２
H2O＋１／４O2→Fe（OH）3の反応がおこり冷却水中
の溶存酸素は水酸化鉄となつて除去される。弱ア
ルカリ性、例えばPH＝９におけるFe（OH）2およ
びFe（OH）3の溶解度積は、25℃のとき1.65×
10-15および４×10-38であり、鉄イオン溶出量は
中性の水における溶出量に比べて１万分の１以下
である。溶存酸素が除去された冷却水２は、次に
陽イオン交換装置１４を通過することによつて、
冷却水中に存在する極微量の銅イオンや鉄イオン
などの陽イオンが除去され、溶存酸素、不純物イ
オン共に除去された腐食性の極めて少ない冷却水
となつて再び交直変換装置１に送り込まれる。
次に示す表は、第２図に示した本発明装置、第
１図に示した従来装置、第１図の従来装置におい
てイオン交換装置４の後段に第２図の脱酸素装置
１２を配置したもの（比較例１）、および第１図
の従来装置においてイオン交換装置４の前段に第
２図の脱酸素装置１２を配置したもの（比較例
２）において、水冷電気機器を１カ月間運転した
ときイオン交換樹脂に吸着された金属イオン量お
よび冷却水中の溶存酸素濃度を示したものであ
る。試験は、冷却水と接触する放熱体の表面積１
m2、ステンレス製熱交換器並びに陽イオン交換樹
脂２、陰イオン交換樹脂１、脱酸素装置など
で構成される冷却水循環経路に予め窒素ガスを吹
込んで溶存酸素量を1ppm以下に脱気処理を行い
イオン交換処理を行つた純水を100封入して行
つた。脱酸素材には、鉄粉500grを使用した。い
ずれの場合にもイオン交換装置４，１３，１４に
循環させる冷却水の量は全体の10％とした。
The present invention relates to a cooling device for water-cooled equipment that cools the water-cooled equipment using cooling water. Semiconductor elements for high power are used in AC/DC converters such as thyristor valves, but large-capacity elements for electric power generate a very large amount of heat per unit area from the electrode surface, so they are extremely hot. It is necessary to remove a high density amount of heat in a short period of time. For this reason, there is a method in which the generated heat is guided to a copper cooling fin attached to the semiconductor element, the fin is cooled with water with a high heat transfer coefficient, and the warm water is passed through another heat exchanger and cooled with air or water. Although conventionally used in AC/DC converters, if a leakage current flows into the cooling water through the DC charging part, galvanic corrosion will occur on the metal materials present in the cooling water system. Since water with insulating properties is required, generally distilled water or ion-exchanged water that has been subjected to ion-exchange treatment is used. FIG. 1 shows a conventional cooling device for a water-cooled AC/DC converter using semiconductor elements. In the figure, numeral 1 indicates an AC/DC converter configured with a large-capacity power semiconductor element (not shown). , this is a water-cooled device. 2 is cooling water for removing heat generated in the AC/DC converter 1; 3 is a pump for circulating the cooling water 2 such as distilled water or ion-exchanged water; 4 is a pump for maintaining good insulation of the cooling water 2. 41 is a cation exchange resin housed in the ion exchange device 4, and 42 is an anion exchange resin. 5
is a heat exchanger for cooling the cooling water 2 from which the heat generated by the AC/DC converter 1 has been removed; 6, 7, and 8 are the cooling water 2;
The pipes 6 and 7 are made of a non-conductive material and form a main circulation path for cooling water, and the pipe 8 forms a bypass path branched from the main circulation path. 9,
10 is a valve for adjusting the flow rate, and 11 is a make-up water tank. The conventional cooling device for water-cooled electrical equipment is configured as described above, and by driving the pump 3,
The cooling water 2 is sent to the AC/DC converter 1 through a pipe 6, circulates within the AC/DC converter 1, and cools semiconductor elements (not shown) constituting the AC/DC converter. The heated cooling water 2 is sent to the heat exchanger 5 through the pipe 7, cooled, and circulated again through the pump 3 and the pipe 6. As the cooling water 2 circulates through these cooling water systems, it gradually dissolves impurity components in the metal materials, brazed parts, and non-conductive materials present in the cooling water system, so that the purity of the cooling water gradually decreases. For this reason, a part of the cooling water 2 passes through the bypass path formed by the pipe 8 to the ion exchange device 4.
Impurity ion components dissolved in the cooling water are removed by the ion exchange device 4, and the cooling water is again sent to the AC/DC converter 1 through the flow control valve 10, pump 3, and pipe 6 as highly insulating cooling water. When electrical equipment with a DC circuit, such as an AC/DC converter, is cooled with water, if a DC leakage current flows into the cooling water, the metals present in the cooling water system will corrode due to galvanic corrosion. The amount of corrosion due to galvanic corrosion is proportional to the magnitude of leakage current. On the other hand, since the magnitude of leakage current is inversely proportional to water resistance, conventional efforts have focused on using ion exchange equipment to increase the insulation properties of cooling water, reduce leakage current, and prevent corrosion. . However, corrosion of metals caused by cooling water is caused by galvanic corrosion as well as corrosion caused by dissolved oxygen present in the cooling water system, so it is not possible to completely prevent corrosion by simply increasing the purity of the cooling water. I can't. That is, the heat dissipation surface of the heat dissipation body attached to the semiconductor element (not shown) in the AC/DC converter 1 and the heat dissipation surface of the heat exchanger 5, with which the cooling water comes into contact and heat exchange is performed, effectively dissipates heat. Therefore, it has a very large surface area, and the heat dissipation surface is made of metal such as copper or brass, which has a high heat transfer coefficient, so it is corroded by the action of dissolved oxygen in the cooling water. The total amount of metal is quite large. Metal ions dissolved into the cooling water due to corrosion are removed by the ion exchange resin, but if the amount of metal ions eluted into the cooling water is large, the life of the ion exchange resin will be extremely shortened.
The drawback was that it took a lot of effort to remanufacture or replace the ion exchange resin. The saturated dissolved oxygen concentration in water is, for example, about 8.2 ppm in water at 25°C, but the amount of corrosion of copper in water at 25°C is 8, 6, 4,
At 2ppm, 0.4, 0.33, 0.25, 0.14mg/d
m 2 /day, and there is clearly a high degree of correlation between the amount of copper corrosion and the dissolved oxygen concentration. Therefore, in order to reduce metal corrosion in cooling water, it is important to increase the purity of the cooling water and lower the dissolved oxygen concentration in the water. This invention aims to reduce corrosion of heat radiators and cooling pipes of water-cooled equipment, improve the reliability of water-cooled equipment, and extend the life of ion exchange resin used to maintain the purity of cooling water. The purpose is to FIG. 2 shows an embodiment of a cooling device for water-cooled equipment according to the present invention, in which numerals 1 to 3 and 5 to 11 are completely the same as the conventional device. Reference numeral 12 denotes a deoxidizing device disposed in the bypass path formed by the pipe 8, 121 a container thereof, and 122 a water-insoluble or slightly water-soluble deoxidizing material housed in the container 121. 13 is an anion exchange device disposed upstream of the oxygen removing device 12; 131 is its container; 132 is an anion exchange resin housed in the container 131;
4 is a cation exchange device arranged after the deoxidizer 12, 141 is its container, and 142 is the container 14.
This is a cation exchange resin housed in 1. In the cooling device for water-cooled equipment configured in this way, cooling water 2 such as distilled water or ion exchange water is used.
is sent to the AC/DC converter 1 by appropriately adjusting the valves 9, 10 and driving the pump 3, and is circulated within the AC/DC converter to cool semiconductor elements (not shown). The heated cooling water is sent to the heat exchanger 5 through the pipe 7, cooled and circulated again through the pump 3 and the pipe 6, but a portion of the cooling water is sent to the pipe in an amount according to the adjustment of the valves 9 and 10. 8 and an anion exchange device 13, only anions among impurity ions in the water are removed.
Since there are excessive cations in the cooling water, the cooling water becomes weakly alkaline and passes through the deoxidizer 12. For example, iron powder is used as a deoxidizing material in the deoxidizing device 12. Inorganic or organic substances such as sodium nitrite and hydrazine are generally known as cooling water deoxidizing materials, but these substances dissolve in water and increase the conductivity of the water, causing galvanic corrosion. It cannot be used in cooling water systems where this would be a problem. Therefore, in this invention, a water-insoluble or poorly water-soluble deoxidizing material is used.
When cooling water containing dissolved oxygen comes into contact with iron, Fe+
The reactions of H 2 O + 1/2O 2 →Fe (OH) 2 and Fe (OH) 2 + 1/2 H 2 O + 1/4O 2 →Fe (OH) 3 occur, and the dissolved oxygen in the cooling water becomes iron hydroxide and is removed. be done. The solubility product of Fe(OH) 2 and Fe(OH) 3 in weak alkalinity, e.g. PH=9, is 1.65× at 25°C.
10 -15 and 4 x 10 -38 , and the amount of iron ions eluted is less than 1/10,000 of the amount eluted in neutral water. The cooling water 2 from which dissolved oxygen has been removed is then passed through the cation exchange device 14 to
Very trace amounts of cations such as copper ions and iron ions present in the cooling water are removed, and the cooling water is sent back to the AC/DC converter 1 as extremely less corrosive cooling water with dissolved oxygen and impurity ions removed. The following table shows the device of the present invention shown in FIG. 2, the conventional device shown in FIG. 1, and the conventional device shown in FIG. The water-cooled electric equipment was operated for one month in the conventional device shown in FIG. 1 (Comparative Example 1) and the conventional device shown in FIG. It shows the amount of metal ions adsorbed on the ion exchange resin and the dissolved oxygen concentration in the cooling water. The test measures the surface area of the heat sink in contact with the cooling water.
m 2 , stainless steel heat exchanger, cation exchange resin 2, anion exchange resin 1, deoxidizer, etc. The cooling water circulation path is injected with nitrogen gas in advance to reduce the amount of dissolved oxygen to 1 ppm or less. The test was carried out by sealing 100 volumes of pure water that had been subjected to ion exchange treatment. 500gr iron powder was used as the deoxidizing material. In either case, the amount of cooling water circulated through the ion exchangers 4, 13, and 14 was 10% of the total.
【表】
この表からも明らかであるように、本発明によ
る水冷機器の冷却装置においては、脱酸素装置に
よつて冷却水中の溶存酸素濃度が低くなるため銅
製放熱体の腐食量を従来に比べて大幅に低減する
ことが可能であり、また、脱酸素装置の後段に陽
イオン交換装置を配置することによつて脱酸素材
の金属イオンが除去されるため冷却水中の鉄イオ
ンの量も小さくなり、ひいてはイオン交換樹脂の
寿命を大幅に延長することが可能である。
第３図は、この発明による水冷機器の冷却装置
の他の実施例を示したもので図中の番号は第２図
に示したものと全く同一である。この実施例は管
８によつて交直変換装置１の出口を陰イオン交換
装置１３に接続した点が第２図の実施例と異な
る。また、第２図に示した装置３，６，８〜１４
をそのまま管７に接続することもできる。
第２図および第３図の実施例では冷却水の一部
を管８によつて形成されるバイパス路に通してい
るが、第４図に示すようにバイパス路を設けずに
陰イオン交換装置１３、脱酸素装置１２、陽イオ
ン交換装置１４を管６に設けて冷却水全量をこれ
らの装置を通して循環させることもできる。
また、第５図に示すようにポンプ３の出口側に
バイパス路を設け、バイパス路と主循環経路にそ
れぞれバルブ１０，９を設けることにより、バル
ブ９を全閉にして冷却水の全量をバイパス路に流
したり、バルブ１０を全閉にしてバイパス路の流
量を零にすることもできる。勿論、バルブ９，１
０の適当な調節により、全量に対するバイパス路
の流量を任意に調整することができる。
更に、陰イオン交換装置、脱酸素装置、陽イオ
ン交換装置はそれぞれ個別の容器に陰イオン交換
樹脂、脱酸素材、陽イオン交換樹脂を収容して構
成したがこれを第６図に示すように単一の容器１
５を隔壁１５１，１５２、スクリーン１５３，１
５４，１５５，１５６で区切つてその中に陰イオ
ン交換樹脂１３２、脱酸素材１２２、陽イオン交
換樹脂１４２を冷却水の流動方向に見てこの順で
収容することによつて構成することもできる。
以上この発明を水冷電気機器を対象として説明
したが、この発明は電気機器に限られるものでは
なく、他の水冷機器一般に適用しても大きな効果
を上げうること明らかである。また、脱酸素材と
しては鉄以外に、コバルト、クロム、ニツケルお
よびこれらの合金等の粉末を使用することもでき
る。また、冷却水としては蒸溜水またはイオン交
換水以外に用途に応じて工業用水等の他の水を使
用することもできる。
本発明は、以上に述べた如く、水冷機器の腐食
を軽減することにより機器の寿命延長、信頼性向
上に大きな寄与をするばかりでなく冷却水の精製
に使用されるイオン交換樹脂の寿命を大幅に延長
させることができるのでイオン交換樹脂の取替え
などの機器の保守に要する時間を減少できる利点
を有しており工業的価値が非常に優れている。[Table] As is clear from this table, in the cooling system for water-cooled equipment according to the present invention, the dissolved oxygen concentration in the cooling water is lowered by the deoxidizer, so the amount of corrosion of the copper heat radiator is reduced compared to the conventional one. In addition, by placing a cation exchange device after the deoxidizer, metal ions from the deoxidizing material are removed, reducing the amount of iron ions in the cooling water. Therefore, it is possible to significantly extend the life of the ion exchange resin. FIG. 3 shows another embodiment of the cooling device for water-cooled equipment according to the present invention, and the numbers in the figure are exactly the same as those shown in FIG. 2. This embodiment differs from the embodiment shown in FIG. 2 in that the outlet of the AC/DC converter 1 is connected to an anion exchanger 13 by a pipe 8. In addition, the devices 3, 6, 8 to 14 shown in FIG.
can also be connected to the pipe 7 as is. In the embodiments shown in FIGS. 2 and 3, part of the cooling water is passed through the bypass path formed by the pipe 8, but as shown in FIG. 13. A deoxidizer 12 and a cation exchanger 14 can also be provided in the tube 6 and the entire amount of cooling water can be circulated through these devices. In addition, as shown in Fig. 5, a bypass path is provided on the outlet side of the pump 3, and valves 10 and 9 are provided in the bypass path and the main circulation path, respectively, so that the entire amount of cooling water is bypassed by fully closing valve 9. It is also possible to completely close the valve 10 to make the flow rate in the bypass path zero. Of course, valve 9,1
By appropriate adjustment of 0, the flow rate of the bypass path relative to the total amount can be adjusted as desired. Furthermore, the anion exchange device, deoxidation device, and cation exchange device each contained an anion exchange resin, a deoxidizing material, and a cation exchange resin in separate containers, as shown in Figure 6. single container 1
5 to partition walls 151, 152, screens 153, 1
54, 155, and 156, and the anion exchange resin 132, deoxidizing material 122, and cation exchange resin 142 are housed in this order in the cooling water flow direction. . Although the present invention has been described above with reference to water-cooled electrical equipment, it is clear that the present invention is not limited to electrical equipment and can be applied to other water-cooled equipment in general with great effects. In addition to iron, powders of cobalt, chromium, nickel, and alloys thereof can also be used as the deoxidizing material. In addition to distilled water or ion-exchanged water, other water such as industrial water may be used as the cooling water depending on the purpose. As described above, the present invention not only significantly contributes to extending the life of water cooling equipment and improving reliability by reducing corrosion of the equipment, but also significantly extends the life of the ion exchange resin used for purifying cooling water. This has the advantage of reducing the time required for equipment maintenance such as replacing ion exchange resins, and has great industrial value.
第１図は水冷機器の従来の冷却装置を示す図、
第２図は本発明による冷却装置の一実施例を示す
図、第３図乃至第６図はそれぞれ本発明の他の実
施例を示す図であり、図中同一符号は同一部また
は相当部を示す。
図において２は冷却水、１２は脱酸素装置、１
３は陰イオン交換装置、１４は陽イオン交換装置
である。
Figure 1 is a diagram showing a conventional cooling device for water-cooled equipment.
FIG. 2 is a diagram showing one embodiment of the cooling device according to the present invention, and FIGS. 3 to 6 are diagrams each showing other embodiments of the present invention, and the same reference numerals in the figures indicate the same or equivalent parts. show. In the figure, 2 is cooling water, 12 is a deoxidizer, 1
3 is an anion exchange device, and 14 is a cation exchange device.
Claims (1)
いて、前記冷却水の循環経路中に、陰イオン交換
装置、水不溶性または水難溶性の脱酸素材を有す
る脱酸素装置および陽イオン交換装置をこの順番
に配置し、前記冷却水の一部または全部を前記の
陰イオン交換装置、脱酸素装置、陽イオン交換装
置の順に循環させるようにしたことを特徴とする
水冷機器の冷却装置。 ２ 冷却水の循環経路中に主循環経路から分岐し
たバイパス路を設け、このバイパス路に陰イオン
交換装置、脱酸素装置および陽イオン交換装置を
設け、前記バイパス路に冷却水の一部を通すよう
にした特許請求の範囲第１項記載の水冷機器の冷
却装置。 ３ 冷却水の循環経路中に主循環経路から分岐し
たバイパス路を設け、このバイパス路に陰イオン
交換装置、脱酸素装置および陽イオン交換装置を
設け、前記バイパス路に冷却水の一部または全部
を通しうるようにした特許請求の範囲第１項記載
の水冷機器の冷却装置。 ４ 陰イオン交換装置、脱酸素装置および陽イオ
ン交換装置をそれぞれ個々の容器に陰イオン交換
樹脂、脱酸素材、陽イオン交換樹脂を個別に収容
して構成した特許請求の範囲第１項記載の水冷機
器の冷却装置。 ５ 陰イオン交換装置、脱酸素装置および陽イオ
ン交換装置を単一の容器に陰イオン交換樹脂、脱
酸素材および陽イオン交換樹脂をこの順で収容し
て構成した特許請求の範囲第１項記載の水冷機器
の冷却装置。 ６ 脱酸素材が鉄粉である特許請求の範囲第１項
記載の水冷機器の冷却装置。 ７ 冷却水が蒸溜水またはイオン交換水である特
許請求の範囲第１項記載の水冷機器の冷却装置。[Scope of Claims] 1. In a device that uses cooling water to cool a water-cooled device, an anion exchange device, an oxygen deoxidizing device having a water-insoluble or poorly water-soluble deoxidizing material, and an oxygen deoxidizing device are provided in the cooling water circulation path. Cooling of water cooling equipment, characterized in that ion exchange devices are arranged in this order, and part or all of the cooling water is circulated in the order of the anion exchange device, the deoxidizer, and the cation exchange device. Device. 2 A bypass path branching from the main circulation path is provided in the cooling water circulation path, an anion exchange device, an oxygen removal device, and a cation exchange device are provided in this bypass path, and a portion of the cooling water is passed through the bypass path. A cooling device for water-cooled equipment according to claim 1. 3. A bypass path branching from the main circulation path is provided in the cooling water circulation path, an anion exchange device, an oxygen removal device, and a cation exchange device are provided in this bypass path, and part or all of the cooling water is provided in the bypass path. 2. A cooling device for water-cooled equipment according to claim 1, wherein the cooling device is configured to allow water to pass therethrough. 4. An anion exchange device, an oxygen deoxidation device, and a cation exchange device configured by individually housing an anion exchange resin, a deoxidizing material, and a cation exchange resin in individual containers, respectively, according to claim 1. Cooling device for water-cooled equipment. 5. Claim 1 describes an anion exchange device, an oxygen deoxidation device, and a cation exchange device configured by housing an anion exchange resin, a deoxidizing material, and a cation exchange resin in this order in a single container. cooling equipment for water-cooled equipment. 6. The cooling device for water-cooled equipment according to claim 1, wherein the deoxidizing material is iron powder. 7. The cooling device for water-cooled equipment according to claim 1, wherein the cooling water is distilled water or ion-exchanged water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57129458A JPS5918666A (en) | 1982-07-22 | 1982-07-22 | Cooling device for water cooled apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57129458A JPS5918666A (en) | 1982-07-22 | 1982-07-22 | Cooling device for water cooled apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5918666A JPS5918666A (en) | 1984-01-31 |
| JPS637026B2 true JPS637026B2 (en) | 1988-02-15 |
Family
ID=15009984
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57129458A Granted JPS5918666A (en) | 1982-07-22 | 1982-07-22 | Cooling device for water cooled apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5918666A (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4647862A (en) * | 1984-09-04 | 1987-03-03 | Tektronix, Inc. | Trigger holdoff system for a digital oscilloscope |
| JPS61239166A (en) * | 1985-04-16 | 1986-10-24 | Kikusui Denshi Kogyo Kk | Digital oscilloscope |
| JPS6397864U (en) * | 1986-12-17 | 1988-06-24 | ||
| JPS63185569U (en) * | 1987-05-22 | 1988-11-29 | ||
| JP5678568B2 (en) * | 2010-10-18 | 2015-03-04 | 富士通株式会社 | Electronics |
| DE102017204732A1 (en) | 2017-03-21 | 2018-09-27 | Siemens Aktiengesellschaft | Method for operating a cooling device |
| WO2019167232A1 (en) * | 2018-03-01 | 2019-09-06 | 東芝三菱電機産業システム株式会社 | Cooling device and method for treating cooling water |
| CN112921333B (en) * | 2021-01-21 | 2022-02-01 | 武汉大学 | Internal-cooling water ion exchange slow-release micro-acidification flexible online cleaning system and method for failure passivation film of hollow copper conductor of generator |
-
1982
- 1982-07-22 JP JP57129458A patent/JPS5918666A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5918666A (en) | 1984-01-31 |
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