JPS637875B2 - - Google Patents
Info
- Publication number
- JPS637875B2 JPS637875B2 JP58050359A JP5035983A JPS637875B2 JP S637875 B2 JPS637875 B2 JP S637875B2 JP 58050359 A JP58050359 A JP 58050359A JP 5035983 A JP5035983 A JP 5035983A JP S637875 B2 JPS637875 B2 JP S637875B2
- Authority
- JP
- Japan
- Prior art keywords
- laser
- processing
- workpiece
- machining
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure
- B23K26/127—Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure in an enclosure
- B23K26/128—Laser beam path enclosures
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はレーザ加工方法に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a laser processing method.
レーザ光を集束レンズによつて集束し被加工体
に照射しつゝ加工を行なうレーザ加工方法は公知
であり、広く利用されている。
2. Description of the Related Art A laser processing method in which a workpiece is processed by focusing a laser beam using a focusing lens and irradiating the laser beam onto a workpiece is well known and widely used.
また、レーザとプラズマを併用し、加工効率を
一層向上させる試みもなされている。 Attempts have also been made to further improve processing efficiency by using a laser and plasma in combination.
その他様々な改善によりレーザ加工における加
工効率及び加工速度は従来に比べて大幅に向上し
てきたが、被加工体の材質等によつては加工がし
にくいものもあり、特に石英ガラス等は加工が困
難であるという問題があつた。 Due to various other improvements, the processing efficiency and processing speed of laser processing have improved significantly compared to the past, but some materials are difficult to process, especially materials such as quartz glass. The problem was that it was difficult.
このように加工が困難な石英ガラス等をレーザ
加工する場合には、従来、上記石英ガラスを加工
液中に納め、上記石英ガラスに加工液を介してレ
ーザ光を照射しつゝ加工を行なつていた。然しな
がら、レーザ光が適正な波長のものでないと、上
記レーザ光の殆どが上記加工液に吸収されてしま
い、また、たとえレーザ光の波長が適正であつた
としても加工に時間がかゝるという問題点があつ
た。 Conventionally, when processing difficult-to-process quartz glass or the like with a laser, the quartz glass is placed in a processing liquid and the quartz glass is irradiated with laser light through the processing liquid. was. However, if the laser beam is not of an appropriate wavelength, most of the laser beam will be absorbed by the processing fluid, and even if the laser beam is of an appropriate wavelength, processing will take time. There was a problem.
本発明は上記の問題点を解決するためなされた
ものであり、その目的とするところは、加工効率
及び加工速度が極めて高く、被加工体の材質等に
は左右されず、どのような材質の被加工体であつ
ても確実に加工することができるレーザ加工方法
を提供することにある。
The present invention has been made to solve the above problems, and its purpose is to achieve extremely high processing efficiency and processing speed, and to achieve extremely high processing efficiency and processing speed, regardless of the material of the workpiece. An object of the present invention is to provide a laser processing method that can reliably process even a workpiece.
上記の目的は、レーザ発振器から発振されたレ
ーザ光を集束レンズによつて集束し、被加工体に
上記レーザ光を照射しつゝ加工を行なうレーザ加
工方法において、上記被加工体表面に酸又はアル
カリ液等の加工液を供給して加工液層を形成し、
当該加工液の80％以上を上記レーザ光により蒸発
させつゝ加工を行なうことを特徴とする上記のレ
ーザ加工方法によつて達成し得る。
The above purpose is to provide a laser processing method in which a laser beam oscillated from a laser oscillator is focused by a focusing lens, and a workpiece is processed while being irradiated with the laser beam. A machining liquid layer is formed by supplying machining liquid such as alkaline liquid,
This can be achieved by the laser processing method described above, which is characterized in that processing is performed while 80% or more of the processing liquid is evaporated by the laser beam.
上記加工液としては、HCl、H2SO4、KOH水
溶液、HF水溶液、炭化水素等が用いられる。 As the processing liquid, HCl, H 2 SO 4 , KOH aqueous solution, HF aqueous solution, hydrocarbon, etc. are used.
上記の如き加工方法であると、加工液が加工面
上で濃縮されるので、加工の効率が高められ、し
かも被加工部以外の面が腐蝕されることが少ない
から、繊細な加工を効率よく遂行し得るものであ
る。
With the above-mentioned machining method, the machining fluid is concentrated on the machining surface, increasing machining efficiency, and surfaces other than the workpiece are less likely to be corroded, making delicate machining more efficient. It is something that can be accomplished.
以下、図面を参照しつゝ本発明の詳細を具体的
に説明する。
Hereinafter, details of the present invention will be specifically explained with reference to the drawings.
図面は、本発明にかゝるレーザ加工方法を実施
するための装置の一例を示す説明図である。 The drawing is an explanatory diagram showing an example of an apparatus for carrying out the laser processing method according to the present invention.
図中、１及び２はレーザ発振装置、３，４，５
及び６は反射鏡、７，８，９及び１０は上記反射
鏡３，４，５及び６が取り付けられる反射鏡固定
部材、１１及び１２はハウジング、１２ａは上記
ハウジング１２に形成されている出力孔、１２ｂ
は上記ハウジング１２と一体的に形成されている
固定部材、１３は集束レンズ、１４は上記集束レ
ンズ１３を固定する集束レンズ固定部材、１５は
モータ、１５ａは上記モータ１５のシヤフト、１
６は加工液供給装置、１６ａは上記加工液供給装
置１６のノズル、１７は回転盤、１８は回転盤取
付座、１９はクランクギア、２０はモータ、２１
は上記モータ２０のシヤフトに取り付けられ上記
クランクギア１９と噛み合つているピニオンギ
ア、２２は被加工体、２３及び２４は上記被加工
体２２をそれぞれＸ軸及びＹ軸方向へ移動させる
クロススライドテーブル、２５は上記被加工体２
２に回転運動を与えるため上記クロススライドテ
ーブル２３上に設けられたターンテーブル、２
６，２７及び２８はそれぞれクロススライドテー
ブル２３及び２４、ターンテーブル２５を駆動す
るモータ、２９は加工用ガス供給管、３０はハロ
ゲン等の加工用ガス供給装置である。 In the figure, 1 and 2 are laser oscillation devices, 3, 4, 5
and 6 are reflecting mirrors, 7, 8, 9, and 10 are reflecting mirror fixing members to which the reflecting mirrors 3, 4, 5, and 6 are attached, 11 and 12 are housings, and 12a is an output hole formed in the housing 12. , 12b
1 is a fixing member integrally formed with the housing 12; 13 is a focusing lens; 14 is a focusing lens fixing member for fixing the focusing lens 13; 15 is a motor; 15a is a shaft of the motor 15;
6 is a machining fluid supply device, 16a is a nozzle of the machining fluid supply device 16, 17 is a rotary disk, 18 is a rotary disk mounting seat, 19 is a crank gear, 20 is a motor, 21
is a pinion gear attached to the shaft of the motor 20 and meshes with the crank gear 19, 22 is a workpiece, and 23 and 24 are cross slide tables that move the workpiece 22 in the X-axis and Y-axis directions, respectively. , 25 is the workpiece 2
a turntable provided on the cross slide table 23 to give rotational motion to the cross slide table 2;
6, 27, and 28 are motors that drive the cross slide tables 23 and 24 and the turntable 25, respectively; 29 is a processing gas supply pipe; and 30 is a processing gas supply device such as halogen.
而して、レーザ発振装置１及び２はハウジング
１１内に取り付けられ、上記レーザ発振装置１及
び２としては、CO2レーザやHe−Neレーザ等の
気体レーザ、ルビーレーザやYAGレーザ等の固
体レーザその他を用い、また必要に応じてはＱス
イツチ法等によつて出力を一層高め得るように構
成されている。なお、図示した例においては、２
個のレーザ発振装置を設けたものを示してある
が、上記レーザ発振装置の数は被加工体２２の材
質、形状及び大きさ等に応じて任意に変更するこ
とができるものである。 The laser oscillation devices 1 and 2 are installed in the housing 11, and the laser oscillation devices 1 and 2 include a gas laser such as a CO 2 laser or a He-Ne laser, or a solid laser such as a ruby laser or a YAG laser. It is constructed so that the output can be further increased by using the Q-switch method or the like if necessary. In addition, in the illustrated example, 2
Although a laser oscillation device is shown, the number of laser oscillation devices can be changed arbitrarily depending on the material, shape, size, etc. of the workpiece 22.
反射鏡３，４，５及び６はハウジング１１内に
反射鏡固定部材７，８，９及び１０を介して取り
付けられている。なお、上記反射鏡のうち反射鏡
４は半透明鏡であり、他の反射鏡３，５及び６は
全反射鏡である。 The reflecting mirrors 3, 4, 5 and 6 are attached within the housing 11 via reflecting mirror fixing members 7, 8, 9 and 10. Incidentally, among the above-mentioned reflecting mirrors, the reflecting mirror 4 is a semi-transparent mirror, and the other reflecting mirrors 3, 5 and 6 are total reflecting mirrors.
而して、反射鏡４はレーザ発振装置２から発射
されたレーザ光を反射して光路を変更せしめると
共に、レーザ光線発振装置１から発射され、反射
鏡３によつて反射されたレーザ光を透過する。従
つて、上記レーザ光線発振装置１及び２から発射
されたレーザ光は、反射鏡４を通過した後一本の
ビームとなる。 The reflecting mirror 4 reflects the laser beam emitted from the laser oscillation device 2 to change the optical path, and also transmits the laser beam emitted from the laser beam oscillation device 1 and reflected by the reflecting mirror 3. do. Therefore, the laser beams emitted from the laser beam oscillation devices 1 and 2 become one beam after passing through the reflecting mirror 4.
反射鏡５及び６は上記一本になつたビームを反
射して光路変更せしめ、然る後、この光路変更せ
しめられた上記ビームは、固定部材１４によつて
ハウジング１２の内壁面に固定された集束レンズ
１３によつて集束され、被加工体２２の加工点に
照射せしめられる。 The reflecting mirrors 5 and 6 reflect the combined beam to change the optical path, and then the beam with the changed optical path is fixed to the inner wall surface of the housing 12 by the fixing member 14. The light is focused by the focusing lens 13 and irradiated onto the processing point of the workpiece 22.
ハウジング１１と１２の接合部において、ハウ
ジング１２の外径はハウジング１１の内径と略等
しく設定され、ハウジング１２はハウジング１１
に対して摺動自在に取り付けられている。また、
上記ハウジング１１の外周壁面の一端にはモータ
１５が取り付けられ、そのシヤフト１５ａには雄
ネジが形成、若しくは取り付けられ、当該雄ネジ
がハウジング１２の固定部材１２ｂに形成されて
いる雌ネジと噛み合つている。従つて、上記ハウ
ジング１２はモータ１５の回転に応じて図中Ｚ軸
方向に移動するようになつている。 At the joint between housings 11 and 12, the outer diameter of housing 12 is set to be approximately equal to the inner diameter of housing 11, and housing 12 is
It is slidably attached to the Also,
A motor 15 is attached to one end of the outer peripheral wall surface of the housing 11, and a male screw is formed or attached to the shaft 15a, and the male screw meshes with a female screw formed on the fixing member 12b of the housing 12. It's on. Therefore, the housing 12 is adapted to move in the Z-axis direction in the figure in accordance with the rotation of the motor 15.
また、回転盤１７は上記ハウジング１２の外周
壁を囲むよう円環状に形成されており、その一端
には加工液供給装置１６が取り付けられ、ハウジ
ング１２に固定された回転盤取付座１８上に回動
自在に取り付けられている。また、クランクギア
１９はモータ２０のシヤフトに固定されたピニオ
ンギア２１と噛み合うと共に、上記回転盤１７に
その回転軸と同軸に固定されていて、上記モータ
２０の回動に伴つて回転する。 Further, the rotary disk 17 is formed in an annular shape so as to surround the outer circumferential wall of the housing 12, and a machining fluid supply device 16 is attached to one end of the rotary disk 17. It is attached so that it can move freely. Further, the crank gear 19 meshes with a pinion gear 21 fixed to the shaft of the motor 20, and is fixed to the rotary disk 17 coaxially with the rotary shaft thereof, and rotates as the motor 20 rotates.
なお、上記ハウジング１２を図中Ｚ軸方向に移
動させるモータ１５、回転盤１７に回転運動を与
えるモータ２０、クロススライドテーブル２３及
び２４、ターンテーブル２５をそれぞれ移動せし
めるモータ２６，２７及び２８、加工液供給装置
１６から供給する加工液の供給位置、供給量及び
加工用ガスの供給量等は、予め定められたプログ
ラムに従つて、図示されていない数値制御装置に
よつて一括制御されるようになつている。 In addition, the motor 15 that moves the housing 12 in the Z-axis direction in the figure, the motor 20 that provides rotational motion to the rotary disk 17, the motors 26, 27, and 28 that move the cross slide tables 23 and 24, and the turntable 25, respectively, are processed. The supply position and amount of machining fluid supplied from the liquid supply device 16, the supply amount of machining gas, etc. are collectively controlled by a numerical control device (not shown) according to a predetermined program. It's summery.
而して、上記の装置を用いて本発明にかゝる方
法を実施する場合には、回転盤１７の一端に取り
付けられた加工液供給装置１６から被加工体２２
の加工すべき部分に、上記被加工体２２の材質、
加工条件等に適合した加工液、例えば、HCl、希
H2SO4、KOH水溶液、HF水溶液、炭化水素等
の酸又はアルカリの加工液を、加工液供給装置１
６の先端のノズル１６ａから細い噴射液流又は霧
滴として少量づつ噴出せしめ、、或いは更に不活
性ガス等適宜のガスによるスプレー噴霧として所
定の制限されただけ供給する。なお、上記加工液
供給装置１６による加工液の供給は、レーザ光の
照射点の加工進行方向において先行するように行
なわれる。 When carrying out the method according to the present invention using the above-mentioned apparatus, the workpiece 22 is supplied from the machining fluid supply device 16 attached to one end of the rotary disk 17.
The material of the workpiece 22,
Processing fluid that matches the processing conditions, such as HCl, diluted
Acid or alkali machining fluid such as H 2 SO 4 , KOH aqueous solution, HF aqueous solution, hydrocarbon etc. is supplied to machining fluid supply device 1
The liquid is ejected little by little from the nozzle 16a at the tip of the nozzle 6 as a thin jet liquid stream or mist droplets, or furthermore, a predetermined limited amount is supplied as a spray using an appropriate gas such as an inert gas. The machining fluid is supplied by the machining fluid supply device 16 in advance in the machining progress direction of the laser beam irradiation point.
然る後、レーザ発振装置１及び２からレーザ光
が発射され、反射鏡４により一本のビームとさ
れ、更に上記集束レンズ１３によつて充分に集束
されて上記被加工体２２の加工部分に照射され
る。 After that, laser beams are emitted from the laser oscillation devices 1 and 2, converted into a single beam by the reflecting mirror 4, and sufficiently focused by the focusing lens 13 to reach the processing portion of the workpiece 22. irradiated.
而して、被加工体２２の加工部分に供給された
上記の加工液は、上記レーザビームによつて熱せ
られ、その約80％以上が蒸発せしめられつゝ加工
が行なわれる。そして更に、被加工体２２の材質
等によつては上記加工液に加えて加工用ガス供給
装置３０，３０から加工用ガス供給管２９，２９
を介して、ハロゲンガス、各種のフロン系ガス、
水蒸気、酸素ガス等又はこれらの適宜の混合ガス
が加工用ガスとしてハウジング１２内に導入さ
れ、その先端の孔１２ａから上記被加工体２２の
加工部分に供給されるものである。 The processing liquid supplied to the processing portion of the workpiece 22 is heated by the laser beam, and about 80% or more of it is evaporated while processing is performed. Furthermore, depending on the material of the workpiece 22, etc., in addition to the above-mentioned machining liquid, the machining gas supply pipes 29, 29 may be supplied from the machining gas supply devices 30, 30.
Through halogen gas, various fluorocarbon gases,
Water vapor, oxygen gas, or an appropriate mixed gas thereof is introduced into the housing 12 as a processing gas, and is supplied to the processing portion of the workpiece 22 through the hole 12a at the tip thereof.
而して、上記の如き加工においては、被加工体
２２の加工部分に供給された上記の加工液が加工
面上で濃縮されるので、加工の効率が高められ、
しかも加工部以外の面が腐蝕されることが少ない
から、繊細な加工を効率よく遂行し得るものであ
る。 Therefore, in the above-described processing, the processing liquid supplied to the processing portion of the workpiece 22 is concentrated on the processing surface, so that the processing efficiency is increased.
Furthermore, since surfaces other than the processed portion are less likely to be corroded, delicate processing can be carried out efficiently.
例えば、外径38mm、内径４mmの石英ガラスを、
100WのCO2レーザを使用すると共に、加工液と
してはHFの水溶液を0.02c.c.／minで供給し、加
工送り速度を35mm／minとして加工を行なつたと
ころ、上記石英ガラスを162mm／minで切断する
ことができた。一方、従来の加工装置を利用して
同様の石英ガラスを加工したところ、本発明の方
法による場合の数倍の時間を要した。 For example, quartz glass with an outer diameter of 38 mm and an inner diameter of 4 mm,
When machining was performed using a 100W CO 2 laser, an aqueous HF solution was supplied at a rate of 0.02cc/min as the machining fluid, and the machining feed rate was 35mm/min, the quartz glass was cut at a rate of 162mm/min. We were able to. On the other hand, when similar quartz glass was processed using conventional processing equipment, it took several times as long as the method of the present invention.
本発明は叙上の如く構成されるので、本発明に
かゝるレーザ加工方法によるときは、加工液が加
工面上で濃縮されるので、加工の効率が高めら
れ、しかも被加工面が腐蝕されることが少ないか
ら、加工が困難な石英ガラス等のようなものであ
つても繊細な加工を効率よく遂行し得るものであ
る。
Since the present invention is configured as described above, when using the laser processing method according to the present invention, the processing fluid is concentrated on the processing surface, so processing efficiency is increased, and the processing surface is not corroded. Since it is difficult to process, delicate processing can be performed efficiently even on materials such as quartz glass, which are difficult to process.
なお、本発明は上記の実施例に限定されるもの
ではなく、例えば上記の実施例では被加工体をク
ロススライドテーブル上に設けられたターンテー
ブルに搭載して加工するようにしたが、被加工体
を作業台に固定し、ハウジングを移動させつゝ加
工を行なうことも可能であり、本発明はその目的
の範囲内において上記の説明から当業者が容易に
想到し得るすべての変更実施例を包摂するもので
ある。 Note that the present invention is not limited to the above-described embodiments; for example, in the above embodiments, the workpiece is mounted on a turntable provided on a cross slide table, and the workpiece is It is also possible to perform processing by fixing the body to a workbench and moving the housing, and the present invention covers all modifications that can be easily conceived by a person skilled in the art from the above description within the scope of its purpose. It is inclusive.
図面は本発明にかゝる方法を実施するための装
置の一例を示す説面図である。
１，２……レーザ発振装置、３，４，５，６…
…反射鏡、７，８，９，１０……反射鏡固定部
材、１１，１２……ハウジング、１２ａ……孔、
１３……集束レンズ、１４……集束レンズ固定部
材、１５……モータ、１５ａ……シヤフト、１６
……加工液供給装置、１７……回転盤、１８……
回転盤取付座、１９……クランクギア、２１……
ピニオンギア、２２……被加工体、２３，２４…
…クロススライドテーブル、２５……ターンテー
ブル、２６，２７，２８……モータ、２９……加
工用ガス供給管、３０……加工用ガス供給装置。
The drawing is an explanatory diagram showing an example of an apparatus for carrying out the method according to the present invention. 1, 2... Laser oscillation device, 3, 4, 5, 6...
... Reflector, 7, 8, 9, 10... Reflector fixing member, 11, 12... Housing, 12a... Hole,
13... Focusing lens, 14... Focusing lens fixing member, 15... Motor, 15a... Shaft, 16
... Machining liquid supply device, 17 ... Turning plate, 18 ...
Turntable mounting seat, 19... Crank gear, 21...
Pinion gear, 22... Workpiece, 23, 24...
...Cross slide table, 25...Turntable, 26, 27, 28...Motor, 29...Processing gas supply pipe, 30...Processing gas supply device.
Claims (1)
レンズによつて集束し、被加工体に上記レーザ光
を照射しつゝ加工を行なうレーザ加工方法におい
て、上記被加工体表面に酸又はアルカリ液等の加
工液を供給して加工液層を形成し、当該加工液の
80％以上を上記レーザ光により蒸発させつゝ加工
を行なうことを特徴とする上記のレーザ加工方
法。 ２ 上記加工液としてHClを用いる特許請求の範
囲第１項記載のレーザ加工方法。 ３ 上記加工液としてH2SO4を用いる特許請求
の範囲第１項記載のレーザ加工方法。 ４ 上記加工液としてKOH水溶液を用いる特許
請求の範囲第１項記載のレーザ加工方法。 ５ 上記加工液としてHF水溶液を用いる特許請
求の範囲第１項記載のレーザ加工方法。 ６ 上記加工液として炭化水素を用いる特許請求
の範囲第１項記載のレーザ加工方法。[Claims] 1. A laser processing method in which a laser beam oscillated from a laser oscillator is focused by a focusing lens, and a workpiece is processed while being irradiated with the laser light, in which the surface of the workpiece is A machining fluid layer is formed by supplying a machining fluid such as acid or alkaline liquid, and the machining fluid is
The laser processing method described above is characterized in that processing is performed while 80% or more of the material is evaporated by the laser beam. 2. The laser processing method according to claim 1, in which HCl is used as the processing liquid. 3. The laser processing method according to claim 1, wherein H 2 SO 4 is used as the processing liquid. 4. The laser processing method according to claim 1, wherein a KOH aqueous solution is used as the processing liquid. 5. The laser processing method according to claim 1, wherein an HF aqueous solution is used as the processing liquid. 6. The laser machining method according to claim 1, wherein a hydrocarbon is used as the machining fluid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58050359A JPS59178192A (en) | 1983-03-28 | 1983-03-28 | Laser working device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58050359A JPS59178192A (en) | 1983-03-28 | 1983-03-28 | Laser working device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59178192A JPS59178192A (en) | 1984-10-09 |
| JPS637875B2 true JPS637875B2 (en) | 1988-02-18 |
Family
ID=12856695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58050359A Granted JPS59178192A (en) | 1983-03-28 | 1983-03-28 | Laser working device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59178192A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3801068A1 (en) * | 1988-01-15 | 1989-07-27 | Maho Ag | Method and apparatus for stock removal by means of bundled energy beams |
| TW200726566A (en) * | 2006-01-10 | 2007-07-16 | Li Bing Huan | Laser processing machine |
| CN109514081B (en) * | 2018-12-11 | 2021-06-01 | 中国科学院宁波材料技术与工程研究所 | A water-guided laser processing device and processing system |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5582780A (en) * | 1978-12-16 | 1980-06-21 | Toshiba Corp | Surface processing method for metal or the like article |
-
1983
- 1983-03-28 JP JP58050359A patent/JPS59178192A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59178192A (en) | 1984-10-09 |
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