JPS639596B2 - - Google Patents
Info
- Publication number
- JPS639596B2 JPS639596B2 JP12205584A JP12205584A JPS639596B2 JP S639596 B2 JPS639596 B2 JP S639596B2 JP 12205584 A JP12205584 A JP 12205584A JP 12205584 A JP12205584 A JP 12205584A JP S639596 B2 JPS639596 B2 JP S639596B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- zinc
- hydroxyethane
- compound
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 14
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 claims description 12
- 150000001412 amines Chemical class 0.000 claims description 10
- 229910019142 PO4 Inorganic materials 0.000 claims description 9
- 238000009713 electroplating Methods 0.000 claims description 9
- 239000010452 phosphate Substances 0.000 claims description 8
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 claims description 8
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 claims description 6
- 150000001869 cobalt compounds Chemical class 0.000 claims description 5
- 150000002472 indium compounds Chemical class 0.000 claims description 5
- 150000002816 nickel compounds Chemical class 0.000 claims description 5
- 150000003606 tin compounds Chemical class 0.000 claims description 5
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 4
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 4
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 4
- RSJOBNMOMQFPKQ-UHFFFAOYSA-L copper;2,3-dihydroxybutanedioate Chemical compound [Cu+2].[O-]C(=O)C(O)C(O)C([O-])=O RSJOBNMOMQFPKQ-UHFFFAOYSA-L 0.000 claims description 4
- FWBOFUGDKHMVPI-UHFFFAOYSA-K dicopper;2-oxidopropane-1,2,3-tricarboxylate Chemical compound [Cu+2].[Cu+2].[O-]C(=O)CC([O-])(C([O-])=O)CC([O-])=O FWBOFUGDKHMVPI-UHFFFAOYSA-K 0.000 claims description 4
- 239000011592 zinc chloride Substances 0.000 claims description 4
- 235000005074 zinc chloride Nutrition 0.000 claims description 4
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 claims description 4
- 229910000368 zinc sulfate Inorganic materials 0.000 claims description 4
- 229960001763 zinc sulfate Drugs 0.000 claims description 4
- ZOIORXHNWRGPMV-UHFFFAOYSA-N acetic acid;zinc Chemical compound [Zn].CC(O)=O.CC(O)=O ZOIORXHNWRGPMV-UHFFFAOYSA-N 0.000 claims description 3
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 239000004246 zinc acetate Substances 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- QEVGZEDELICMKH-UHFFFAOYSA-N Diglycolic acid Chemical compound OC(=O)COCC(O)=O QEVGZEDELICMKH-UHFFFAOYSA-N 0.000 claims 1
- 238000007747 plating Methods 0.000 description 26
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 238000000576 coating method Methods 0.000 description 8
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 7
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 7
- -1 phosphate ester Chemical group 0.000 description 7
- 229910052725 zinc Inorganic materials 0.000 description 7
- 239000011701 zinc Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- 229910052737 gold Inorganic materials 0.000 description 6
- 235000021317 phosphate Nutrition 0.000 description 6
- 150000002148 esters Chemical class 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 239000005749 Copper compound Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 150000001880 copper compounds Chemical class 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 239000002244 precipitate Substances 0.000 description 4
- 150000003839 salts Chemical group 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000002932 luster Substances 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- 150000003752 zinc compounds Chemical class 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 239000013522 chelant Substances 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 231100000331 toxic Toxicity 0.000 description 2
- 230000002588 toxic effect Effects 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- QXNVGIXVLWOKEQ-UHFFFAOYSA-N Disodium Chemical compound [Na][Na] QXNVGIXVLWOKEQ-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910021627 Tin(IV) chloride Inorganic materials 0.000 description 1
- PDYXSJSAMVACOH-UHFFFAOYSA-N [Cu].[Zn].[Sn] Chemical compound [Cu].[Zn].[Sn] PDYXSJSAMVACOH-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- 239000006258 conductive agent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- DOBRDRYODQBAMW-UHFFFAOYSA-N copper(i) cyanide Chemical compound [Cu+].N#[C-] DOBRDRYODQBAMW-UHFFFAOYSA-N 0.000 description 1
- TVQLLNFANZSCGY-UHFFFAOYSA-N disodium;dioxido(oxo)tin Chemical compound [Na+].[Na+].[O-][Sn]([O-])=O TVQLLNFANZSCGY-UHFFFAOYSA-N 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000002659 electrodeposit Substances 0.000 description 1
- 150000002344 gold compounds Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical group 0.000 description 1
- 150000003014 phosphoric acid esters Chemical group 0.000 description 1
- GGHDAUPFEBTORZ-UHFFFAOYSA-N propane-1,1-diamine Chemical compound CCC(N)N GGHDAUPFEBTORZ-UHFFFAOYSA-N 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 229940079864 sodium stannate Drugs 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- GTLDTDOJJJZVBW-UHFFFAOYSA-N zinc cyanide Chemical compound [Zn+2].N#[C-].N#[C-] GTLDTDOJJJZVBW-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Description
〈産業上の利用分野〉
本発明は金属面に金色の被覆を電気めつきによ
り形成させる電気めつき浴に関する。
〈従来の技術〉
金属の各種の日用品、装飾品に金色の被膜を形
成させ、それらの装飾的価値を増大させるため各
種のめつき方法が開発されている。
例えばもつとも一般的な方法としては青化物を
含むめつき浴を用いてめつきする方法がある。こ
の代表的な浴組成としては青化ソーダ50g/〜
150g/、青化第一銅30g/〜75g/、青
化亜鉛11g/〜30g/および炭酸ソーダ20
g/〜15g/を主要成分として含むものがあ
る。このような青化物含有浴を用いるめつき方法
は、有毒な青化物を使用するため安全上の厳重な
管理が必要であり、とくに作業温度が50〜65℃と
高温のため、猛毒である青酸ガスを発生し、労働
衛生上好ましくない。そして形成された被膜は色
調、光沢において実際の金とは大いに差があり、
平均的な色調としては青味を有する真ちゆう色で
あり、又温度の差、PHの変化、電流密度の変化等
によつて帯白黄色から帯赤黄色まで色調が変る等
の欠点がある。
本発明者はさきに1,1−ハイドロキシエタン
−1,1第2リン酸エステルあるいは該エステル
の塩を含有させた浴が電気めつき浴としておくれ
ていることを知り、昭和51年特許願第23151号と
して該めつき浴に関して特許出願を行い、従来の
方法に比してすぐれた金色の被膜が安全に得られ
ることを開示した。
〈発明が解決しようとする問題点〉
然しながらこれらの方法にもとづいて得られた
金色めつき被膜は、真の金めつき被膜に比べる
と、色感、色調のいずれの点においてもなお不充
分な点があつた。
本発明者はさらに研究の結果、グリコール酸を
1,1−ハイドロキシエタン−1,1第2リン酸
エステル類および又は有機アミンと共に存在させ
た浴を用い電気めつきすることにより従来みられ
なかつた色調と、光沢のある金色めつき被膜が得
られることを知り本発明を完成した。
〈問題点を解決するための手段〉
即ち、本発明はイ酢酸銅、塩化銅、酒石酸銅、
クエン酸銅および硫酸銅のいずれか少なくとも1
種、ロ酢酸亜鉛、塩化亜鉛および硫酸亜鉛のいず
れか少なくとも1種、ハグリコール酸、ニ1,1
−ハイドロキシエタン1,1−第2リン酸エステ
ル、1,1−ハイドロキシエタン1,1−第2リ
ン酸エステル塩および有機アミンの少なくとも1
種を主要成分として水に溶解しためつき浴および
前記めつき浴に更にスズ化合物、インジウム化合
物、ニツケル化合物およびコバルト化合物のいず
れか少なくとも1種を溶解しためつき浴に関す
る。
〈実施例〉
次に本発明の電気めつき浴を製造する際に、溶
解すべき各物質について詳述する。
金色被膜形成用物質は、青化物以外の銅化合
物、具体的には酢酸銅、塩化銅、酒石酸銅、クエ
ン酸銅および硫酸銅、青化物以外の亜鉛化合物、
具体的には酢酸亜鉛、塩化亜鉛および硫酸亜鉛で
ある。
又スズ化合物としては硫酸第二スズ、塩化第二
スズ、スズ酸ナトリウム等が好適であり、又イン
ジウム化合物、ニツケル化合物およびコバルト化
合物はいずれも塩化物、硫酸塩、醋酸塩等が好適
である。
これらは金色被膜の生成にそれぞれ寄与する
が、さらに前記銅化合物はキレート剤を用いた浴
に対してなじみが良く、めつき浴の調整を容易に
する効果があり、更に他の被膜形成物質はいずれ
も溶解度が高いため、容易にとけて均一なめつき
浴組成物を調整しうる。
本発明のめつき浴中の被膜形成物質として、前
記のように銅化合物および亜鉛化合物を必須成分
とするが、更に必要によりスズ化合物、インジウ
ム化合物、ニツケル化合物およびコバルト化合物
を含有する浴をも本発明にふくまれる。
本発明の大きな特徴は浴組成中にグリコール酸
と1,1−ハイドロキシエタン−1,1第2リン
酸エステル、同エステル塩および有機アミンの少
なくとも1種が含まれていることである。
グリコール酸の添加は必須であるが、1,1−
ハイドロキシエタン−1,1第2リン酸エステ
ル、同エステル塩、有機アミンはそれらの少なく
とも1種を含ませればよい。
1,1−ハイドロキシエタン1,1−第2リン
酸エステルは
で示される化合物であり、同エステルがアルカリ
金属、アルカリ土類金属と反応して生成する塩も
エステルと同様に用いられる。
又有機アミン類としてはエチレンジアミン、プ
ロパンジアミン、エチレンジアミンテトラ酢酸4
ナトリウム及び2ナトリウム等が好適である。
これらの存在により本発明のめつき浴を用いて
得られた被膜は実際の金化合物を用いて行つた金
めつき被膜に比して色調、光沢のいずれもが劣る
ことはない。
これは次のような理由にもとづく。即ち有機ア
ミン、前記エステル、エステル塩と共存する金属
がキレート化合物を生成し、これからの金属の離
脱が円滑に行なわれ、更に有機アミン等の素地金
属に対する吸着作用により、素地平面の凸部、即
ち電気の集中する部分に対する電析を抑止するこ
とによりめつき表面の平滑化が速やかに行なわれ
るためである。
次に本発明のめつき浴1000c.c.を製造するにあた
り、溶解すべき各成分の量についてのべる。
被膜形成成分としての銅化合物は金属銅として
1.0g〜5.0g、好ましくは2.0g〜3.5g、亜鉛化
合物は金属亜鉛として0.25g〜1.3g、好ましく
は0.5g〜0.9gである。
そしてスズ化合物、インジウム化合物、ニツケ
ル化合物およびコバルト化合物は、1種の場合は
金属として、スズ0.8g〜1.2g、好ましくは0.5g
〜1.0g、インジウム0.2g〜2.0g、好ましくは
0.3〜1.5g、ニツケル0.5g〜3.0g、好ましくは
0.7g〜2.0g、コバルト0.5g〜3.5g、好ましく
は0.7g〜2.0g、そして前記のスズ化合物、イン
ジウム化合物、ニツケル化合物およびコバルト化
合物が複数存在する場合は、合計で1.0g〜4.5
g、好ましくは1.2g〜4.0g存在することが必要
である。
上記の量を超過した場合は、高電流密度の部分
に灰白色の条痕もしくは粗雑な電析物を生じ、又
稍過剰の場合は銅の電析が促進され、めつき被膜
全体が帯桃黄色となる。又上記の量に達しない場
合は銅のみが析出して黄色を呈しない。
被膜形成用化合物の量は、目的とする形成被膜
の色調により定める。
一般的には亜鉛は青白色を強調するが本発明で
は適量存在の場合は黄色を、そして過剰の場合は
桃色を強調する。又スズは同様に適量の場合は黄
色を、過剰の場合は帯白黄色を強調することにな
る。そしてインジウムは亜鉛と、ニツケル、コバ
ルトはスズと同様の挙動を示す。
グルコール酸は20g〜60g、好ましくは15g〜
45gである。上限をこえると好ましい合金被膜を
うることができず、銅のみ析出する。又下限に達
しない場合は、被膜生成金属の各種の析出物、例
えば被膜生成金属が銅、亜鉛、スズの場合は、亜
鉛−銅、スズ−銅、もしくはスズ−亜鉛−銅と各
種の分離した析出物をうる。
1,1−ハイドロキシエタン−1,1第2リン
酸エステル又はその塩はエステルとして10g〜30
g、好ましくは18g〜25g、有機アミンは3g〜
12g、好ましくは6g〜10gである。
なお本発明のめつき浴には通常のめつき浴に用
いられる公知の添加剤、例えば炭酸ナトリウム等
の伝導剤等を必要に応じて添加することができ
る。なおアンモニア水は使用できない。
本発明の電気めつき浴を用いてめつきすべき対
象金属は、現在実施されている装飾めつきの対象
金属と全く同様である。又本発明を用いての電気
めつきは、公知の方法で行なうことができる。
次に本発明の実施例、比較例を示す。
実施例
第1表に実施例に用いた浴組成を、第2表にめ
つき条件、第3表にめつき結果を示す。
<Industrial Application Field> The present invention relates to an electroplating bath for forming a golden coating on a metal surface by electroplating. <Prior Art> Various plating methods have been developed to form golden coatings on various daily necessities and decorative items made of metal, thereby increasing their decorative value. For example, one of the most common methods is plating using a plating bath containing cyanide. A typical bath composition is cyanide soda 50g/~
150 g/, cuprous cyanide 30 g/~75 g/, zinc cyanide 11 g/~30 g/, and soda carbonate 20
g/~15g/ as a main component. This plating method using a cyanide-containing bath requires strict safety management because it uses a toxic cyanide, and in particular, the working temperature is as high as 50 to 65°C, so it does not contain cyanide, which is highly toxic. Generates gas and is not good for occupational health. The film that is formed is very different from actual gold in terms of color and luster.
The average color tone is a true color with a bluish tinge, but it also has drawbacks such as the color tone changing from whitish yellow to reddish yellow due to temperature differences, PH changes, changes in current density, etc. . The inventor of the present invention previously learned that a bath containing 1,1-hydroxyethane-1,1 secondary phosphate ester or a salt of the ester was used as an electroplating bath. No. 23151, he filed a patent application for this plating bath, disclosing that it was possible to safely obtain a golden coating that was better than conventional methods. <Problems to be Solved by the Invention> However, the gold-plated films obtained based on these methods are still insufficient in both color feel and tone compared to true gold-plated films. The dot was hot. As a result of further research, the present inventor found that by electroplating using a bath in which glycolic acid was present together with 1,1-hydroxyethane-1,1 secondary phosphates and/or organic amines, The present invention was completed after learning that a golden plating film with good color tone and luster could be obtained. <Means for solving the problems> That is, the present invention provides copper iacetate, copper chloride, copper tartrate,
At least one of copper citrate and copper sulfate
seeds, at least one of zinc roacetate, zinc chloride and zinc sulfate, haglycolic acid, di-1,1
- at least one of hydroxyethane 1,1-secondary phosphate, 1,1-hydroxyethane 1,1-secondary phosphate salt, and organic amine;
The present invention relates to a plating bath in which seeds are dissolved in water as a main component, and a plating bath in which at least one of a tin compound, an indium compound, a nickel compound, and a cobalt compound is further dissolved. <Example> Next, each substance to be dissolved when manufacturing the electroplating bath of the present invention will be described in detail. The substance for forming a golden film is a copper compound other than cyanide, specifically copper acetate, copper chloride, copper tartrate, copper citrate and copper sulfate, a zinc compound other than cyanide,
Specifically, zinc acetate, zinc chloride and zinc sulfate. As the tin compound, stannic sulfate, stannic chloride, sodium stannate, etc. are preferable, and as for the indium compound, nickel compound, and cobalt compound, chloride, sulfate, acetate, etc. are preferable. Each of these contributes to the formation of a golden film, but furthermore, the copper compound is compatible with a bath containing a chelating agent and has the effect of facilitating adjustment of the plating bath, and other film-forming substances Since both have high solubility, they can be easily dissolved to prepare a uniform plating bath composition. As described above, the coating forming substance in the plating bath of the present invention contains a copper compound and a zinc compound as essential components. Included in invention. A major feature of the present invention is that the bath composition contains at least one of glycolic acid, 1,1-hydroxyethane-1,1 diphosphoric acid ester, a salt of the same, and an organic amine. Although the addition of glycolic acid is essential, 1,1-
At least one of hydroxyethane-1,1 secondary phosphate ester, ester salt, and organic amine may be included. 1,1-hydroxyethane 1,1-secondary phosphate ester is It is a compound represented by , and the salt produced by the reaction of the same ester with an alkali metal or an alkaline earth metal can also be used in the same way as the ester. Also, examples of organic amines include ethylenediamine, propanediamine, and ethylenediaminetetraacetic acid4.
Sodium, disodium, etc. are preferred. Due to the presence of these, the coating obtained using the plating bath of the present invention is not inferior in color tone or gloss compared to a gold plating coating made using an actual gold compound. This is based on the following reasons. That is, the metal coexisting with the organic amine, the ester, and the ester salt forms a chelate compound, and the metal is smoothly removed from the chelate compound.Furthermore, due to the adsorption effect of the organic amine and the like on the base metal, the convex portions of the base plane, i.e. This is because the plated surface can be smoothed quickly by suppressing electrodeposition in areas where electricity is concentrated. Next, the amounts of each component to be dissolved in producing the 1000 c.c. plating bath of the present invention will be described. The copper compound as a film-forming component is used as metallic copper.
The amount of the zinc compound is 0.25 g to 1.3 g, preferably 0.5 g to 0.9 g as metal zinc. In the case of one type of tin compound, indium compound, nickel compound, and cobalt compound, the metal is 0.8 g to 1.2 g, preferably 0.5 g.
~1.0g, indium 0.2g~2.0g, preferably
0.3-1.5g, Nickel 0.5g-3.0g, preferably
0.7g to 2.0g, cobalt 0.5g to 3.5g, preferably 0.7g to 2.0g, and when a plurality of the above tin compounds, indium compounds, nickel compounds and cobalt compounds are present, a total of 1.0g to 4.5g.
g, preferably 1.2 g to 4.0 g. If the above amount is exceeded, grayish-white streaks or coarse electrodeposit will occur in areas of high current density, and if it is slightly excessive, copper electrodeposition will be accelerated and the entire plating film will become pinkish yellow. becomes. If the above amount is not reached, only copper will precipitate and the color will not turn yellow. The amount of the film-forming compound is determined depending on the desired color tone of the film to be formed. Generally, zinc emphasizes blue-white color, but in the present invention, when present in an appropriate amount, zinc emphasizes yellow, and when in excess, zinc emphasizes pink. Likewise, if tin is used in an appropriate amount, it will accentuate the yellow color, and if it is used in excess, it will emphasize the whitish yellow color. Indium behaves similarly to zinc, nickel, and cobalt to tin. Glycolic acid is 20g to 60g, preferably 15g to
It is 45g. If the upper limit is exceeded, a preferable alloy coating cannot be obtained, and only copper will precipitate. In addition, if the lower limit is not reached, various precipitates of the film-forming metal, for example, when the film-forming metal is copper, zinc, tin, zinc-copper, tin-copper, or tin-zinc-copper and various separated Collect the precipitate. 1,1-hydroxyethane-1,1 secondary phosphoric acid ester or its salt is 10g to 30g as ester
g, preferably 18g to 25g, organic amine 3g to
12 g, preferably 6 g to 10 g. Additionally, known additives used in ordinary plating baths, such as conductive agents such as sodium carbonate, can be added to the plating bath of the present invention, if necessary. Note that ammonia water cannot be used. The target metal to be plated using the electroplating bath of the present invention is exactly the same as the target metal for decorative plating currently practiced. Further, electroplating using the present invention can be performed by a known method. Next, examples of the present invention and comparative examples will be shown. Examples Table 1 shows the bath compositions used in the examples, Table 2 shows the plating conditions, and Table 3 shows the plating results.
【表】【table】
【表】【table】
【表】【table】
【表】【table】
【表】
比較例
第4表に示すように、各実施例とめつき浴中の
被膜形成物組成は全く同じで、グリコール酸を含
有せず、かつ1,1−ハイドロキシエタン−第2
リン酸エステルの含有量の異つためつき液を作成
し、めつきを行つた。第5表にめつき結果を示
す。なおめつき条件は実施例と比較例と同一番号
のものは同一条件である。[Table] Comparative Examples As shown in Table 4, the composition of the film forming material in the plating bath was exactly the same as in each example, containing no glycolic acid and containing 1,1-hydroxyethane-2
Plating solutions were prepared with different phosphate ester contents and used for plating. Table 5 shows the plating results. It should be noted that the glazing conditions are the same for the examples and comparative examples with the same numbers.
【表】【table】
【表】【table】
【表】
第3表、第5表の判定の基準を次に示す。
第1列の判定は、肉眼で観察して欠点がなく、
美麗なものを〇、条痕等の欠点のあるものを△、
光沢のない粗雑なものを×とした。
第2列は本発明の目的である被膜の金の色度に
関するもので色差計(千代田光学製)を用いて判
定した。
色度L、a、bの三つの要素により定められ
る。それらの関係を図面に示す。
Lは全体の明るさを示し、数値が100に近いほ
ど白色に、0に近いほど黒色に近いことを示す。
aの値は(+)の数値が大きいほど赤色、(−)
の数値が大きいほど緑色、又bの値は(+)の数
値が大きいほど黄色、(−)の数値が大きいほど
青色を示することになる。
純金の場合 L:70.2、a:2.0、b:36.8
真ちゆうの場合 L:69.5、a:−0.1、b:28.9
以上よりL、a、bのすべてが純金と真ちゆう
との間のものを甲、bが28.0以下又はaが−0.1
以下のものを乙、aが2.5以上のものを丙とした。
そして前記2つの判定より、第3列の綜合判定
を行つた。即ち欠点のないものを〇、色度は良い
が条痕等の欠点のあるものを△、肉眼観察も良く
なく、色度の悪いものを×とした。
〈発明の効果〉
第3表、第5表よりあきらかな如く本発明のめ
つき浴を用いた場合、生成せるめつき被膜は一見
して金との差は殆んどなく、実用的価値は極めて
大である。[Table] The criteria for judgment in Tables 3 and 5 are shown below. Judgments in the first column indicate that there are no defects when observed with the naked eye.
○ for beautiful items, △ for items with defects such as streaks.
Poor quality with no luster was marked as ×. The second column relates to the chromaticity of gold in the coating, which is the object of the present invention, and was determined using a color difference meter (manufactured by Chiyoda Kogaku). It is determined by three elements: chromaticity L, a, and b. Their relationship is shown in the drawing. L indicates the overall brightness; the closer the value is to 100, the whiter the color, and the closer the value is to 0, the closer the color is to black.
For the value of a, the larger the (+) value, the redder the color, and (-)
The larger the b value, the greener the color, the larger the (+) value of b, the more yellow the color, and the larger the (-) value, the bluer the color. For pure gold L: 70.2, a: 2.0, b: 36.8 For brass L: 69.5, a: -0.1, b: 28.9 From the above, L, a, and b are all between pure gold and brass. A, b is 28.0 or less or a is -0.1
The following were designated as B, and those with a of 2.5 or higher were designated as C. Then, from the above two determinations, a third column comprehensive determination was made. That is, those with no defects were rated as ○, those with good chromaticity but with defects such as streaks were rated as △, and those with poor visual observation and poor chromaticity were rated as ×. <Effects of the Invention> As is clear from Tables 3 and 5, when the plating bath of the present invention is used, the plating film produced is at first glance hardly different from gold, and has no practical value. It is extremely large.
図面は色度のL、a、bの関係を示す図面であ
る。
The drawing shows the relationship between chromaticity L, a, and b.
Claims (1)
および硫酸銅のいずれか少なくとも一種、 ロ 酢酸亜鉛、塩化亜鉛、および硫酸亜鉛のいず
れか少なくとも一種、 ハ グリコール酸、 ニ 1,1−ハイドロキシエタン1,1−第2リ
ン酸エステル、1,1−ハイドロキシエタン
1,1−第2リン酸エステル塩および有機アミ
ンの少なくとも1種 を主要成分として水に溶解してなる金色被膜生成
用電気めつき浴。 2 イ 酢酸銅、塩化銅、酒石酸銅、クエン酸銅
および硫酸銅のいずれか少なくとも一種、 ロ 酢酸亜鉛、塩化亜鉛および硫酸亜鉛のいずれ
か少なくとも一種、 ハ スズ化合物、インジウム化合物、ニツケル化
合物およびコバルト化合物のいずれか少なくと
も一種、 ニ グリコール酸、 ホ 1,1−ハイドロキシエタン1,1−第2リ
ン酸エステル、1,1−ハイドロキシエタン
1,1−第2リン酸エステル塩および有機アミ
ンの少なくとも一種 を主要成分として水に溶解してなる金色被膜生成
用電気めつき浴。[Scope of Claims] 1. At least one of copper acetate, copper chloride, copper tartrate, copper citrate, and copper sulfate; (b) At least one of zinc acetate, zinc chloride, and zinc sulfate; (c) Glycolic acid; A golden color obtained by dissolving in water the main components of at least one of 1,1-hydroxyethane 1,1-secondary phosphate, 1,1-hydroxyethane 1,1-secondary phosphate, and organic amine. Electroplating bath for film formation. (2) At least one of copper acetate, copper chloride, copper tartrate, copper citrate, and copper sulfate; (b) At least one of zinc acetate, zinc chloride, and zinc sulfate; Tin compounds, indium compounds, nickel compounds, and cobalt compounds at least one of diglycolic acid, 1,1-hydroxyethane 1,1-secondary phosphate, 1,1-hydroxyethane 1,1-secondary phosphate salt, and at least one of organic amines. An electroplating bath for producing a golden film, which is dissolved in water as the main component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12205584A JPS613896A (en) | 1984-06-15 | 1984-06-15 | Electroplating bath for forming golden film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12205584A JPS613896A (en) | 1984-06-15 | 1984-06-15 | Electroplating bath for forming golden film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS613896A JPS613896A (en) | 1986-01-09 |
| JPS639596B2 true JPS639596B2 (en) | 1988-02-29 |
Family
ID=14826497
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12205584A Granted JPS613896A (en) | 1984-06-15 | 1984-06-15 | Electroplating bath for forming golden film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS613896A (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62164888A (en) * | 1986-01-14 | 1987-07-21 | Mitsubishi Chem Ind Ltd | Copper-zinc-nickel alloy electroplating bath composition |
| EP0247973B1 (en) * | 1986-05-28 | 1995-08-02 | Howa Machinery Limited | Apparatus for preventing unwinding of roving end applied to roving bobbin transporting system |
| US4904354A (en) * | 1987-04-08 | 1990-02-27 | Learonal Inc. | Akaline cyanide-free Cu-Zu strike baths and electrodepositing processes for the use thereof |
| CN101709494B (en) | 2009-12-14 | 2012-07-04 | 昆明理工大学 | Cu-Zn-Sn ternary alloy cyanide-free imitation gold plating solution and use method thereof |
| JP5566743B2 (en) * | 2010-03-26 | 2014-08-06 | 古河電気工業株式会社 | Method for producing copper alloy fine particles |
| CN105132973A (en) * | 2015-09-22 | 2015-12-09 | 太原工业学院 | Environment-friendly type non-cyanide electroplating copper-zinc alloy solution and electroplating copper-zinc alloy process thereof |
| CN105502947A (en) * | 2015-12-17 | 2016-04-20 | 安徽省含山民生瓷业有限责任公司 | Fruit-green glaze and preparation method thereof |
| FR3112559A1 (en) * | 2020-07-17 | 2022-01-21 | Aveni | Electrolyte and deposition of a copper barrier layer in a Damascene process |
-
1984
- 1984-06-15 JP JP12205584A patent/JPS613896A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS613896A (en) | 1986-01-09 |
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