JPS639727B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to an improvement of a conveying device in the manufacturing process of electronic components.

[Technical background of the invention and its problems]

As a means of processing electronic components by placing them on a conveyor such as a chain conveyor, it is possible to process the electronic components several times during the process, excluding those that require horizontal transportation, such as energizing the electronic components, inspection, and paint application. It has been desired to reduce the floor space occupied by the conveyor by vertically conveying long processes such as the drying process, which requires repetition, to shorten the length of the apparatus.

Therefore, as described in Japanese Patent Publication No. 52-21272, an attachment plate is attached to the chain to prevent the electronic components from falling even when transported vertically, and when changing the direction from horizontal to vertical, the link pieces of the chain are attached. A structure was adopted in which lead wires protruding from both ends of the electronic component were inserted between the drum and the link piece using the constriction to prevent the lead wires from being crushed and to support them.

However, with this structure, only one electronic component can be transported per link piece of the chain, so the number of electronic components to be dried in a certain period of time is increased by increasing the transport density of electronic components, such as in a drying oven. The drawback was that even if I wanted to, I couldn't do it.

Therefore, it may be possible to increase the conveyance density by making the link pieces of the chain smaller, but if the link pieces are made smaller, the strength of the chain will decrease, making it more likely to be damaged, and the electronic components will be placed between the chain and the drive gear. The disadvantage was that if a problem such as meshing occurred, the chain would stretch and the left and right attachment plates would become misaligned.

[Purpose of the invention]

The present invention does not reduce the strength of the chain,
The present invention provides a conveyance device for use in the manufacturing process of electronic components that has a high conveyance density.

[Summary of the invention]

The conveying device for the manufacturing process of electronic components of the present invention supports electronic components having lead wires at both ends with a pair of chains arranged in parallel at a constant interval and conveyed by drive gears. In a conveying device used in the manufacturing process of electronic components, in which direction change is performed by pressing the supporting side of the component against the outer circumferential surface of a drum, the inner surface of the link piece of each of the chains is
an attachment plate having a plurality of support recesses arranged at intervals to support the lead wires of the electronic components; and an attachment plate located between each of the attachment plates to support the lead wires of the electronic components at approximately the same position as the bottom of the support recesses of the attachment plate. A support plate having a support surface for support is provided, a pressure contact protrusion is provided on the outer peripheral surface of the drum to be pressed against the outer peripheral surface of the chain, and a pressure contact groove is provided into which the tip of the support recess of the attachment plate is inserted. It is characterized by this.

[Embodiments of the invention]

Next, one embodiment of the present invention will be described based on the drawings.

FIG. 1 is a diagram showing a conveying device, and in this figure, 1 indicates one of a pair of chains arranged in parallel, and the other is located at the back in FIG. This chain 1 is conveyed in the direction of the arrow by drive gears 2 and 3, converted from horizontal to vertical by one drum 4, reciprocated in a drying oven (not shown), and conveyed vertically again by the other drum 5. Converted from direction to horizontal.

The chain 1 is formed of an inner link piece 6 and an outer link piece 7, as shown in FIGS. 2 to 4.

This inner link piece 6 is formed to have an H-shaped cross section with flanges 8a and 8b on both sides. Further, the outer link piece 7 is formed into a flat plate shape and is located on the outer surface of the inner link piece 6. The inner link pieces 6 and the outer link pieces 7 are alternately arranged closely in a staggered manner,
It is supported by a support shaft 9.

A support plate 10 is formed into a plate shape with a narrow upper edge and a concave portion in the center, and is located on the inner surface of the inner link piece 6 and is supported by a support shaft 9.

Reference numeral 12 denotes an attachment plate, which is formed into a plate shape with a curved lower corner, and is provided with a plurality of, for example, two support recesses 14 that open upward and have narrow bottoms, and has an inclined front edge. A shaped support edge 15 is provided. The attachment plates 12 and the support plates 10 are alternately arranged closely in a staggered manner and are supported by a support shaft 9. Note that the upper edge of the support plate 10 is located flush with the bottom side 13 of the support recess 14 of the attachment plate 12.

On the outer peripheral surface of the drum 4, as shown in FIG.
A press-contact groove 17 is formed into which the upper part of the support recess 14 is inserted and which closes the opening of the support recess 14 .

Note that the drum 5 also has the same configuration of the pressure contact protrusion 16 and the pressure contact groove 17, except that the outer diameter is smaller.

Next, the operation of this embodiment will be explained.

As shown in FIG. 5, one lead wire 21 protruding from both ends of an electronic component, such as a resistor 20, is supported in the support recess 14 of the attachment plate 12 and the recess in the upper edge of the support plate 10. Then, when the chain 1 changes direction from the horizontal direction to the vertical direction and from the vertical direction to the horizontal direction, the drums 4,
5 presses the outer surface flange 8a of the inner link piece 6 with the pressure contact protrusion 16 on the outside of the outer circumferential edge, and also presses the upper edge of the attachment plate 12 with the bottom surface of the pressure contact groove 17 to control the conveyance direction of the chain 1. However, at this time, since the pressure contact groove 17 is shallower than the support recess 14, a gap is created between the drum 4, the bottom side 13 of the support recess 14, and the upper edge of the support plate 10, and the lead of the resistor 20 is inserted into this gap. Since the wire 21 is housed, the drums 4, 5 and the chain 1 can be brought into pressure contact without damaging the lead wire 21.

Also, one inner link piece 6 of chain 1 and 1
One attachment plate 12 and one support plate 10 are attached to each outer link piece 7, so that a total of three resistors 20 can be transported. Therefore, compared to the conventional method that carries one resistor for each link piece, the
Can be transported at twice the density, and resistors 20 can be transported into the drying path.
The storage capacity can also be increased by 1.5 times. Furthermore, since the conveyance speed of the chain 1 does not change, the same drying time as before can be secured.

In the above embodiment, since the attachment plate 12 has two support recesses 14, the amount of resistors 20 that can be stored in the drying path is 1.5 times larger, but by increasing the number of support recesses 14, the amount of storage can be further increased. This can speed up the drying process.

Note that the electronic component is not limited to the resistor 20, and can also be used to transport anything having lead wires at both ends, such as a capacitor or a coil.

Furthermore, in the embodiment described above, the width of the bottom of the support recess 14 of the attachment plate 12 is made narrow, in order to securely hold the electronic component when the conveyance direction changes from a vertical upward movement to a downward movement.

〔Effect of the invention〕

According to the present invention, it is possible to increase the transportation density of electronic components without reducing the size of each chain plate. As a result, there is no risk of chain damage or attachment plate misalignment, and the amount of product stored in the drying oven can be increased without fail. As a result, the speed of various processes such as drying can be increased.

[Brief explanation of the drawing]

FIG. 1 is a side view showing an embodiment of the conveyance device in the manufacturing process of electronic components of the present invention, FIG. 2 is an outside view showing a part of the same chain, FIG. 3 is an inside view of the same, and This figure is a cross-sectional view of the same as above, and FIG. 5 is a cross-sectional view showing the conveyance state. 1... Chain, 2, 3... Drive gear, 4, 5
... Drum, 6, 7 ... Link piece, 10 ... Support plate, 12 ... Attachment plate, 14 ... Support recess, 16 ... Pressure contact protrusion, 17 ... Pressure contact groove, 20
...Electronic parts, 21...Lead wire.

Claims (1)

[Claims] 1 Electronic components having lead wires at both ends are supported by a pair of chains arranged side by side at a constant interval and conveyed by drive gears, and the supporting side of the electronic components of this chain is pressed against the outer peripheral surface of the drum. In a conveying device used in the manufacturing process of electronic components that changes direction by
an attachment plate having a plurality of support recesses provided at intervals to support the lead wires of the electronic components; and an attachment plate located between each of the attachment plates to support the lead wires of the electronic components at approximately the same position as the bottom of the support recesses of the attachment plate. A support plate having a support surface for support is provided, a pressure contact protrusion that is pressed against the outer peripheral surface of the chain is provided on the outer peripheral surface of the drum, and a pressure contact groove is provided into which the tip of the support recess of the attachment plate is inserted. A conveyance device in an electronic component manufacturing process, characterized by: