JPS6410093B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Technical Field of the Invention The present invention relates to a wire bonding apparatus used in the assembly process of high-precision parts such as semiconductor parts, such as LSIs.

TECHNICAL BACKGROUND OF THE INVENTION In the assembly of semiconductor components, wire bonding is performed to electrically connect semiconductor pellets and lead frames. Conventionally, devices used for this wire bonding have various structures, but Japanese Patent Laid-Open No. 56-30735 discloses a wire bonding device that has a function of detecting the swing speed and swing angle of a swing arm. Public notice is known. This is constructed as shown in FIG. That is, a capillary 2 is provided at the distal end of a swinging arm 1 that is freely swingable about a support shaft 1a, and a moving coil 3 is provided at its base end. The moving coil 3 is located within a gap in a magnetic circuit 6 made up of a permanent magnet 4 and a yoke 5, and the swing arm 1 is driven by passing a current through the moving coil 3. Further, a position detector 7 is provided at one end of the support shaft 1a, and a speed detector 8 is provided at the other end to detect the swing angle and swing speed of the swing arm 1. By controlling the current of the moving coil 3 while detecting the position and speed of the capillary 1, the locus of the capillary 2 and the bonding pressure can be controlled. In addition, 9
is a gold wire, and 10 is a semiconductor pellet.

Problems with the Background Art Since the position detector 7 and speed detector 8 are attached to the spindle 1a of the swing arm 1 to detect the angle and speed, sufficient detection accuracy cannot be obtained, and soft bonding, that is, bonding condition There are disadvantages in that fine adjustment is not possible and the structure is large. Furthermore, the circuit is complicated because the capillary is directly fixed to the swing arm and the bonding pressure is controlled by controlling the current of the moving coil.

OBJECTS OF THE INVENTION It is an object of the invention to provide a wire bonding device that can detect the speed and angle of a capillary arm with high accuracy using only a position detector, and can be made smaller.

Summary of the Invention The swing arm is driven by a linear motor, and a position detector is provided at the base end of the swing arm to detect the speed and angle of the capillary arm.

Embodiment of the invention FIG. 2 shows an embodiment of the invention.
1 is a frame. A swinging arm 13 that is swingable about a support shaft 12 is pivotally supported on the frame 11 . A clamper 15 for clamping the gold wire 14 is provided at the tip of the swing arm 13. Further, a capillary arm 17 having a capillary 16 at its tip is provided on the lower side of the distal end of the swinging arm 13, and the base end of the capillary arm 17 is supported by the swinging arm 13 via a leaf spring 18. Further, an arm bracket 19 is provided at the base end of the capillary arm 17, and this arm bracket 19 and the pin 2 of the swing arm 13 are connected to each other.
0, a coil spring 21 is stretched between the coil spring 21 and the coil spring 21. The coil spring 21 urges the capillary arm 17 in a counterclockwise direction, and these constitute a bonding pressure adjustment mechanism 22 that can be mechanically finely adjusted.

Further, a linear motor 23 is provided at the base end of the swing arm 13 to swing the swing arm. Moving coil 24 that constitutes the linear motor 23
The moving coil 24 is located within a gap in a magnetic circuit composed of a permanent magnet (not shown) and a yoke 25, and the swinging arm 13 can be driven by passing a current through the moving coil 24. Further, a bracket 26 is fixed to the moving coil 24, and a measuring element 28 which is movable back and forth in the axial direction of a position detector 27 fixed to the frame 11 is in contact with the tip of the bracket 26. This position detector 27 is connected to a differential circuit (not shown), and the velocity can be determined by differentially converting the output thereof.

When a current is applied to the moving coil 24, the swing arm 13 swings about the support shaft 12. Therefore, the capillary arm 17 attached to the swing arm 13 also swings at the same time, and the tip of the gold wire 14 inserted through the capillary 16 is pressed against the bonding pad of the semiconductor pellet 29 for bonding. At this time, the swing arm 1
3, the bracket 26 moves up and down, and its stroke is detected by a position detector 27. As a result, the position detector 27 is connected to the capillary 1.
By detecting the position of 6 and converting the output with a differential circuit, the speed is also detected. Moreover, with this structure, the distance L between the support shaft 12 and the position detector 27 can be lengthened to increase the amount of displacement, and since almost linear displacement can be obtained thereby, high detection accuracy can be obtained. Therefore, by controlling the current of the moving coil 24 using the detection signal from the position detector 27, the displacement of the capillary 16 and the bonding speed can be set arbitrarily.

Effects of the Invention Since the capillary arm is provided on the swing arm so that the bonding pressure force can be adjusted, the bonding pressure can be set arbitrarily, and the distance between the swing arm support shaft and the position detector can be lengthened, and the capillary arm can be adjusted. displacement can be detected with high precision. Furthermore, since the position and speed can be detected using only the position detector, the structure is simpler and more compact than the conventional system in which a position detector and a speed detector are installed at both ends of the spindle. be able to.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a conventional wire bonding apparatus, and FIG. 2 is a side view showing an embodiment of the present invention. 12... Support shaft, 13... Swinging arm, 17...
Capillary arm, 23...Linear motor, 27
...Position detector.

Claims (1)

[Claims] 1. A swinging arm that can swing freely around a support shaft,
A capillary arm is provided on the tip side of the swinging arm so that the bonding pressure force can be adjusted, a linear motor is provided on the base end side of the swinging arm and drives the swinging arm, and a linear motor is also provided on the base end side of the swinging arm. A wire bonding apparatus characterized by comprising a position detector that detects the displacement of the capillary arm and the speed from this displacement.