JPS6410599B2 - - Google Patents

Description

[Detailed description of the invention] The present invention relates to an apparatus for simultaneously and continuously plating both sides.

Conventionally, equipment for continuous plating of metal plates is
Various devices are known. For example, (1) an electrode having a plating liquid jetting hole is arranged opposite to the plating surface of the metal plate held in space and at a distance from the plating surface, and the plating liquid is sprayed from the spouting hole onto the support roll. A device that performs electrolysis while spouting onto a supported metal plate (for example, see Japanese Patent Application Laid-Open No. 138831/1983); (2) a storage chamber for plating liquid inside an electrode disposed opposite to the metal plate; (3) A method of simultaneously plating both sides of the metal plate by jetting the plating liquid onto the metal plate being transported through a small hole or slit provided in the storage chamber (for example, see Japanese Patent Application Laid-Open No. 50-57928); (3) Rolls are installed on both sides of the top of the electroplating tank to guide the metal plate into the plating tank and to supply electricity to the metal plate at the same time as it is discharged. The plating device consists of a counter electrode and a plating liquid circulation device that guides the material in a non-contact state and changes direction by 180 degrees.The plating device is equipped with a built-in land portion, a flat land portion, a pocket portion, a pressure chamber, and multiple liquid supply holes. A continuous plating device (for example, see Japanese Patent Application Laid-Open No. 1438/1983) is known which has a structure that also has the function of a non-contact type immersion roll electrode.

However, in the device (1) above, although it is possible to reduce the gap between the electrode and the metal plate using the support roll, the gap varies depending on the span of the support roll, making it difficult to achieve uniform plating. Furthermore, when plating both sides, it is necessary to add similar equipment, which increases the size of the equipment and limits the installation location.

Although method (2) above is reasonable, it causes variations in the gap due to bending of the metal plate, and fluttering of the metal plate due to high-speed conveyance, making it impossible to make the gap between the electrode and the metal plate extremely close. Gap 3
The limit is mm. Furthermore, in order to prevent the flapping of the metal plate from coming into contact with the electrodes, an enormous amount of tension and a large pressure pump are required, resulting in the disadvantage that the equipment is large and expensive.

The device described in (3) above has a pocket portion and a flat land portion, and is configured to utilize liquid cushion pressure from a pressure chamber in order to equalize the pressure on the metal plate. This is difficult, and there are limits to the ability to create a high-speed jet of plating liquid.

SUMMARY OF THE INVENTION The present invention aims to eliminate the drawbacks of the conventional methods and devices described above, and to provide a simultaneous continuous plating device for both sides that is fast, efficient, requires a small installation area, and can perform stable and uniform plating. .

The continuous plating device of the present invention will be explained based on the drawings. FIG. 1 is a partial view of the continuous plating apparatus of the present invention.

1 is a metal plate to be plated;
is negatively charged by the power supply rolls 2 provided on both sides of the upper part of the plating tank 8, and is guided into the plating tank 8 and discharged. The plating liquid is supplied by a pump 6 through a tube 5 into a positive electrode guide 7 whose lower part is semi-cylindrical. The semi-cylindrical wall of the positive electrode guide 7 is provided with a large number of plating liquid spouting holes 3 arranged in a certain pattern, and the supplied plating liquid blows the metal plate at a higher speed than the spouting holes 3. It is configured to eject toward 1. The metal plate 1 is lifted up by the pressure of the sprayed plating liquid, and is held at the point where the tension of the metal plate 1 matches the pressure of the plating liquid. That is, the floating amount of the metal plate 1 is determined by the relationship between tension and pressure, and the pressure is adjusted so that there is no contact between the metal plate 1 and the electrode guide 7. Reference numeral 4 denotes a counter electrode, and the counter electrode 4 is arranged at a constant narrow gap from the surface of the electrode guide 7. Therefore, when the distance between the metal plate 1 and the electrode guide is maintained by the jetting of the plating liquid, the gap between the metal plate 1 and the counter electrode 4 is also maintained at a constant distance.

Figure 2 shows the gap between the electrode guide and the metal plate depending on the amount of plating liquid ejected and the tension of the metal plate, and it is possible to make the gap between the electrode guide and the metal plate 0.2 mm. According to the device of the present invention, (1) by appropriately adjusting the relationship between the amount of plating liquid ejected from the electrode guide, the ejection pressure, and the tension of the metal plate, the distance between the electrodes can be significantly reduced compared to the conventional method. It can be made small, requires less electricity, and can be plated efficiently. (2) Since the plating liquid can be ejected at high speed, the stirring action of the plating liquid is large, and a uniform plating layer can be obtained by optimizing the pattern of the ejection holes. (3) Because of the jetting plating liquid, there is no contact between the metal plate and the electrode guide, and the metal plate can be transported smoothly. (4) Both sides of the metal plate can be plated at the same time using the counter electrode and the electrode guide. (5) Less space is required for equipment. Excellent effects such as these can be achieved.

In addition, in the device of the present invention, the structure of the electrode guide is required to have a semi-cylindrical lower part as shown in FIG. . Also, depending on the case,
Single-sided plating can also be performed by applying no voltage to the counter electrode or by applying a voltage of the same polarity as that of the metal plate.

FIG. 4 shows that the tension of the metal plate 1 sent between the electrode guide 7 and the counter electrode 4 is detected by a tension meter 9, and the pressure of the plating liquid sent to the electrode guide 7 from the pump 6 is controlled based on the information. An example of a plating device according to the present invention, which is constructed as described above, is shown below, and an example of continuous plating performed using this device is shown below.

Example metal plate: Cold rolled steel plate, thickness 0.2mm, width 914mm Plating liquid: Chrome plating liquid Electrode guide: Diameter, D = 600φ Injection hole pattern: d = 2mmφ, spacing 50-53mm, Open area ratio, 0.13% , Material: cast iron coated with lead, Effective width: 900mm, Conveying speed: 100m/min, Electrode guide injection liquid pressure: 2Kg/ ^cm2 , Tension: 100Kg, Buoyancy: 0.4mm, and when plating was performed continuously under the above conditions, the results were as follows: In comparison, even though the plating thickness was thicker and more uniform, the voltage between electrodes was reduced to 1/5 to 1/7, and power consumption was significantly reduced.

[Brief explanation of the drawing]

1 and 3 are partial views of the plating device of the present invention,
Fig. 4 is an embodiment of the plating device of the present invention, and Fig. 2 shows that the amount by which the metal plate floats from the electrode guide changes depending on the flow rate of the plating liquid ejected from the electrode guide and the tension of the metal plate. It is a relationship diagram. 1: Metal plate, 2: Power supply roll, 3: Nozzle hole,
4: counter electrode, 5: tube, 6: pump, 7: electrode guide, 8: plating tank, 9: tension meter.

Claims (1)

[Claims] 1. A plating tank, at least the lower part of which is formed in a semi-cylindrical shape with a large number of holes in the cylindrical wall, is installed in a state where it is immersed in the plating solution of the plating layer, and the plating solution is fed into the interior to close the holes in the cylindrical wall. an electrode guide whose cylindrical wall also functions as an electrode, a counter electrode provided facing the surface of the electrode guide with a narrow gap so as to cover at least the plating liquid spouting surface of the electrode guide, and a plating liquid in a plating tank. The plating liquid circulation means is equipped with a plating liquid circulation means for feeding the liquid into the electrode guide, and a metal plate conveying means for passing the metal plate between the electrode guide and the counter electrode. A double-sided simultaneous continuous plating device characterized in that pressure and tension of a metal plate passed between an electrode guide and a counter electrode are controlled in relation to each other by means of a conveying means.