JPS645695B2 - - Google Patents
Info
- Publication number
- JPS645695B2 JPS645695B2 JP5210781A JP5210781A JPS645695B2 JP S645695 B2 JPS645695 B2 JP S645695B2 JP 5210781 A JP5210781 A JP 5210781A JP 5210781 A JP5210781 A JP 5210781A JP S645695 B2 JPS645695 B2 JP S645695B2
- Authority
- JP
- Japan
- Prior art keywords
- water
- parts
- weight
- stripping
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000007788 liquid Substances 0.000 claims description 19
- -1 amine compound Chemical class 0.000 claims description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 17
- 239000000203 mixture Substances 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 14
- 239000003960 organic solvent Substances 0.000 claims description 11
- 239000007864 aqueous solution Substances 0.000 claims description 10
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical group CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 8
- 238000010030 laminating Methods 0.000 claims description 5
- 239000004698 Polyethylene Substances 0.000 claims description 4
- 150000002169 ethanolamines Chemical class 0.000 claims description 4
- 229920000768 polyamine Polymers 0.000 claims description 4
- 229920000573 polyethylene Polymers 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000000243 solution Substances 0.000 description 32
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 8
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000005342 ion exchange Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 235000011121 sodium hydroxide Nutrition 0.000 description 3
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 2
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 2
- 229960002887 deanol Drugs 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000008235 industrial water Substances 0.000 description 2
- 229920005684 linear copolymer Polymers 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000008399 tap water Substances 0.000 description 2
- 235000020679 tap water Nutrition 0.000 description 2
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 2
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- HHAPGMVKBLELOE-UHFFFAOYSA-N 2-(2-methylpropoxy)ethanol Chemical compound CC(C)COCCO HHAPGMVKBLELOE-UHFFFAOYSA-N 0.000 description 1
- HRWADRITRNUCIY-UHFFFAOYSA-N 2-(2-propan-2-yloxyethoxy)ethanol Chemical compound CC(C)OCCOCCO HRWADRITRNUCIY-UHFFFAOYSA-N 0.000 description 1
- DJCYDDALXPHSHR-UHFFFAOYSA-N 2-(2-propoxyethoxy)ethanol Chemical compound CCCOCCOCCO DJCYDDALXPHSHR-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- COBPKKZHLDDMTB-UHFFFAOYSA-N 2-[2-(2-butoxyethoxy)ethoxy]ethanol Chemical compound CCCCOCCOCCOCCO COBPKKZHLDDMTB-UHFFFAOYSA-N 0.000 description 1
- WFSMVVDJSNMRAR-UHFFFAOYSA-N 2-[2-(2-ethoxyethoxy)ethoxy]ethanol Chemical compound CCOCCOCCOCCO WFSMVVDJSNMRAR-UHFFFAOYSA-N 0.000 description 1
- YJTIFIMHZHDNQZ-UHFFFAOYSA-N 2-[2-(2-methylpropoxy)ethoxy]ethanol Chemical compound CC(C)COCCOCCO YJTIFIMHZHDNQZ-UHFFFAOYSA-N 0.000 description 1
- FETMDPWILVCFLL-UHFFFAOYSA-N 2-[2-(2-propan-2-yloxyethoxy)ethoxy]ethanol Chemical compound CC(C)OCCOCCOCCO FETMDPWILVCFLL-UHFFFAOYSA-N 0.000 description 1
- KCBPVRDDYVJQHA-UHFFFAOYSA-N 2-[2-(2-propoxyethoxy)ethoxy]ethanol Chemical compound CCCOCCOCCOCCO KCBPVRDDYVJQHA-UHFFFAOYSA-N 0.000 description 1
- GICQWELXXKHZIN-UHFFFAOYSA-N 2-[2-[(2-methylpropan-2-yl)oxy]ethoxy]ethanol Chemical compound CC(C)(C)OCCOCCO GICQWELXXKHZIN-UHFFFAOYSA-N 0.000 description 1
- AJSNIWUHRQAZOS-UHFFFAOYSA-N 2-[2-[2-(2-methylpropoxy)ethoxy]ethoxy]ethanol Chemical compound CC(C)COCCOCCOCCO AJSNIWUHRQAZOS-UHFFFAOYSA-N 0.000 description 1
- JSQCKFRRGUFBEE-UHFFFAOYSA-N 2-[2-[2-[(2-methylpropan-2-yl)oxy]ethoxy]ethoxy]ethanol Chemical compound CC(C)(C)OCCOCCOCCO JSQCKFRRGUFBEE-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- HCGFUIQPSOCUHI-UHFFFAOYSA-N 2-propan-2-yloxyethanol Chemical compound CC(C)OCCO HCGFUIQPSOCUHI-UHFFFAOYSA-N 0.000 description 1
- YEYKMVJDLWJFOA-UHFFFAOYSA-N 2-propoxyethanol Chemical compound CCCOCCO YEYKMVJDLWJFOA-UHFFFAOYSA-N 0.000 description 1
- FERWBXLFSBWTDE-UHFFFAOYSA-N 3-aminobutan-2-ol Chemical compound CC(N)C(C)O FERWBXLFSBWTDE-UHFFFAOYSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 1
- 229920001214 Polysorbate 60 Polymers 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- SLINHMUFWFWBMU-UHFFFAOYSA-N Triisopropanolamine Chemical compound CC(O)CN(CC(C)O)CC(C)O SLINHMUFWFWBMU-UHFFFAOYSA-N 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- LHIJANUOQQMGNT-UHFFFAOYSA-N aminoethylethanolamine Chemical compound NCCNCCO LHIJANUOQQMGNT-UHFFFAOYSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- AQEFLFZSWDEAIP-UHFFFAOYSA-N di-tert-butyl ether Chemical compound CC(C)(C)OC(C)(C)C AQEFLFZSWDEAIP-UHFFFAOYSA-N 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- LVTYICIALWPMFW-UHFFFAOYSA-N diisopropanolamine Chemical compound CC(O)CNCC(C)O LVTYICIALWPMFW-UHFFFAOYSA-N 0.000 description 1
- 229940043276 diisopropanolamine Drugs 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- XZUAPPXGIFNDRA-UHFFFAOYSA-N ethane-1,2-diamine;hydrate Chemical compound O.NCCN XZUAPPXGIFNDRA-UHFFFAOYSA-N 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- KMBPCQSCMCEPMU-UHFFFAOYSA-N n'-(3-aminopropyl)-n'-methylpropane-1,3-diamine Chemical compound NCCCN(C)CCCN KMBPCQSCMCEPMU-UHFFFAOYSA-N 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 235000011118 potassium hydroxide Nutrition 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Description
本発明は光照射により硬化し、基体上に接着し
ている光重合性組成物の硬化膜を基体上からはく
離するためのはく離液に関する。
配線板を作る場合、銅張積層板などの基体上
に、水性アルカリに可溶なアクリル系線状共重合
体と、末端エチレン性不飽和単量体と、光開始剤
とを含有する光重合性組成物いわゆるアルカリ水
溶液現像タイプのフオトレジスト組成物を塗被あ
るいはラミネートして接着させたのち、活性光線
により画像的に露光を行なつて該光重合性組成物
膜を画像的に硬化させ、未硬化部分を炭酸ソーダ
水溶液などにより除去して現像を行なつてから、
必要に応じ塩化第二鉄水溶液などによりエツチン
グなどの処理工程を経て不要となつた硬化膜をは
く離液で除去する工程がとられている。はく離液
としては苛性ソーダ、苛性カリなどのアルカリ金
属水酸化物の水溶液が使用されている。はく離液
ははく離能力が低下する直前まで何度も使用され
るが、作業性を低下させないためにははく離した
はく離片を除去しなければならない。はく離片の
除去は金網などを用いて行なわれており、アルカ
リ金属水酸化物の水溶液ではく離した場合ははく
離片はほぼもとの硬化膜の形状を保つており、金
網等の穴をふさぎやすく過作業性が悪く、取扱
が甚だやつかいである。またはく離装置の配管パ
イプに詰りやすいという欠点も有している。本発
明者らは、かかる欠点のないはく離液を提供せん
と鋭意検討を行なつた結果、本発明にいたつたも
のである。
本発明はアルカリ水溶液現像タイプの光重合性
組成物を塗被あるいはラミネートして基体上に接
着させたのち活性光線により該組成物を硬化させ
て得られる光重合性組成物の硬化膜を基体上から
はく離する際に用いられるはく離液であつて、(a)
水50〜95重量部、(b)水混和性有機溶剤2〜40重量
部および(c)水に可溶なアミン化合物0.5〜40重量
部を含有する光重合性組成物の硬化膜用はく離液
に関する。
本発明になるはく離液に使用される水は水道
水、蒸留水、イオン交換水、工業用水などで、こ
れらは単独でもしくは混合して使用される。
本発明のはく離液中の水の量は50〜97重量部の
範囲であるが70〜95重量部の範囲が好ましい。
本発明のはく離液中の水の量が97重量部を越え
ると、はく離中のアミン化合物および水混和性有
機溶剤の含有量が少なくなるため、はく離時間が
長くなり、また水の量が50重量部未満になると、
はく離液のコストが高くなるばかりでなく、同様
にはく離時間も長くなるからである。
本発明に使用される水混和性有機溶剤はエチレ
ングリコールモノエーテル、ジエチレングリコー
ルモノエーテルおよびトリエチレングリコールモ
ノエーテル等が単独でもしくは混合して使用され
る。エチレングリコールモノエーテルの例として
はエチレングリコールモノメチルエーテル、エチ
レングリコールモノエチルエーテル、エチレング
リコールモノ―n―ブチルエーテル、エチレング
リコール―モノ―n―プロピルエーテル、エチレ
ングリコール―イソプロピルエーテル、エチレン
グリコール―イソブチルエーテル、エチレングリ
コールモノ―ターシヤリブチルエーテルなどがあ
る。ジエチレングリコールモノエーテルの例とし
てはジエチレングリコールモノメチルエーテル、
ジエチレングリコールモノエチルエーテル、ジエ
チレングリコール―n―プロピルエーテル、ジエ
チレングリコールイソ―プロピルエーテル、ジエ
チレングリコール―n―ブチルエーテル、ジエチ
レングリコール―イソブチルエーテル、ジエチレ
ングリコール―tert―ブチルエーテル等がある。
トリエチレングリコールモノエーテルの例として
はトリエチレングリコールモノメチルエーテル、
トリエチレングリコールモノエチルエーテル、ト
リエチレングリコール―n―プロピルエーテル、
トリエチレングリコールイソプロピルエーテル、
トリエチレングリコール―n―ブチルエーテル、
トリエチレングリコールイソブチルエーテル、ト
リエチレングリコール―tertブチルエーテル等が
ある。エチレングリコールモノブチルエーテルが
剥離時間が短く剥離片が丸まりやすく好ましい。
本発明のはく離液中の水混和性有機溶剤の量は
2〜40重量部の範囲であるが好ましくは2.5〜20
重量部の範囲である。はく離液中の水混和性有機
溶剤の量が40重量部を越えるとはく離液のコスト
が高くなり、しかもはく離時間も長くなり2重量
部未満では、はく離時間が長くなりかつはく離片
が小さくならないからである。
本発明に使用される水に可溶なアミン化合物と
してはエタノールアミン系化合物、ポリエチレン
ポリアミン系化合物、アルキルアミノエタノール
系化合物、N―メチル―N,N―ジエタノールア
ミン、ジイソプロパノールアミン、トリイソプロ
パノールアミン、メチルイミノ―ビスプロピルア
ミン、エチレンジアミンヒドラート、n―プロピ
ルアミン、2―アミノ―1―メチルプロパノー
ル、モルフオリン、アミノエチルエタノールアミ
ン、N―アミノプロピル―2―ピペコリンなどが
単独でもしくは混合して使用される。
本発明に使用されるエタノールアミン系化合物
の例としては、モノエタノールアミン、ジエタノ
ールアミン、トリエタノールアミン等がある。
本発明に使用されるポリエチレンポリアミン系
化合物の例としてはエチレンジアミン、ジエチレ
ントリアミン、トリエチレンテトラミン、テトラ
エチレンペンタミン等がある。
本発明に使用されるアルキルアミノエタノール
系化合物の例としてはN,N′―ジメチルアミノ
エタノール、N,N′―ジエチルアミノエタノー
ル等がある。エタノールアミン系化合物、ポリエ
チレンポリアミン系化合物およびアルキルアミノ
エタノール系化合物が、はく離時間が短いため好
ましい。
本発明に使用される水に可溶なアミン化合物の
量は0.5〜40重量部の範囲とされるが、好ましく
は0.5〜10重量部の範囲である。
本発明のはく離液中のアミン化合物の量が40重
量部を越えるとはく離液のコストが高くなりか
つ、はく離時間が長くなり、0.5重量部未満では、
はく離時間が長くなるからである。
本発明になるはく離液には、上記の成分以外に
メチルエチルケトン、メタノール、エタノール、
イソプロピルアルコール、エチレングリコールモ
ノブチルエーテルアセテート等の有機溶剤、アル
キル硫酸エステルナトリウム、ポリオキシエチレ
ンソルビタン脂肪酸エステル等の消泡剤、界面活
性剤などを含んでもよい。
本発明のはく離液は水、水混和性有機溶剤およ
び水に可溶なアミン化合物を均一に混合すること
によつて得られるが、水混和性有機溶剤と水に可
溶なアミン化合物をあらかじめ混合しておき、は
く離液を使用するときに所定量の水に混合して使
用することもできる。
本発明になるはく離液を用いて基体上に接着し
た光重合性組成物の硬化膜をはく離する方法とし
ては単にはく離液に前記基体を浸漬しておく方
法、前記基体はく離液に浸漬し、エアーバブリン
グ、撹拌羽根、超音波振動等の撹拌によつてはく
離液を揺動する方法、はく離液を前記基体上に流
下させる方法、はく離液を前記基体上にスプレー
する方法などがあるがスプレーする方法、浸漬し
てはく離する方法が特に好ましい。
本発明になるはく離液を用いて、基体上に接着
した硬化膜をはく離する場合のはく離液の温度は
30〜70℃の範囲が好ましく、40〜60℃が特に好ま
しい。はく離液の温度が30℃未満の場合ははく離
時間が長くなり好ましくなく、70℃を越えると水
混和性有機溶剤およびアミン化合物が揮発しやす
くなり好ましくない。
本発明になる硬化膜のはく離液を使用して該硬
化膜をはく離した場合、はく離片はもとの形状よ
りも細分化されて小さくなり、かつはく離片が丸
まるので、金網などではく離片を分別する場合、
目詰りすることが少なく、容易に分別することが
できる。
本発明は、例えば特願昭54―96570号に記載さ
れたような光重合性組成物を基体上に接着し、活
性光線により硬化した硬化膜をはく離するための
はく離液として好適である。上記特願昭54―
96570号にはカルボキシル基含有量が20〜50モル
%のアルカリ水溶液に可溶なアクリル系線状共重
合体と、末端エチレン性不飽和基を有する非気体
状単量体と、活性光線照射により遊離ラジカルを
発生する光開始剤とを含有するアルカリ水溶液現
像タイプの光重合性組成物が提案されている。
次に本発明を実施例により説明する。
実施例 1
銅面を研摩し、清浄化したタテ200mm、ヨコ100
mm、厚さ1mmの銅張積層板の銅面にアルカリ水現
像タイプの感光性フイルムフオテツク(photec)
―860AFX(日立化成工業株式会社製商標)を保
護フイルムを剥離して支持フイルムを上側にして
160℃で積層し、水銀ランプを用いて全面を露光
(120mJ/cm2)して試験板を作製した。水道水
2100g、モノエタノールアミン30g、ブチルセロ
ソルブ140gおよびエチレングリコールモノブチ
ルエーテルアセテート60gのはく離液約1を超
音波洗浄機(ブラソン社製BRANSONIC32)中
にとり、液温を50℃にしたのち、超音波を発振さ
せつつ、前記試験板から支持フイルムを除去し
て、これを垂直にしてはく離液に浸漬しはく離状
態を観察した。浸漬後1分30秒ではく離が開始し
2分10秒ではく離が完了したが、はく離片は小さ
く細分化され、しかも丸まつており過されやす
い状態であつた。一方、50℃の5%苛性ソーダ水
溶液を用いて同様の試験を行なつたが、はく離片
はほとんど細分化されず、丸まることもなかつ
た。3mm格子の金網を用い過性を比較してみた
ところ本発明になるはく離液を用いてはく離した
ものは金網の上に小さく丸まつて残り、簡単に炉
過することができた。一方、苛性ソーダ水溶液で
はく離したものははく離片が大きく、金網の穴を
ふさぎ炉過性は非常に悪かつた。
実施例 2
銅面を研摩し、清浄化したタテ200mm、ヨコ100
mm、厚さ1mmの銅張積層板の銅面にアルカリ水現
像タイプの感光性フイルムフオテツク(photec)
―860AFX(日立化成工業株式会社製商標)を保
護フイルムを剥離して支持フイルムを上側にして
160℃で積層したのち、感光面に、50mm間隔の格
子上に直径40mmの活性光線に透明な穴を有する画
像フイルムを当て、水銀ランプを用いて露光
(120mJ/cm2)して試験板を100枚作製した。前
記試験板から支持フイルムを除去して、これを、
超音波洗浄機(ブランソン社製
BRANSONIC32)中の36℃の2%炭酸ソーダ水
溶液に60秒間浸漬現像し、水浄してからハンダメ
ツキを行ない水洗した。地下より揚水した工業用
水80Kg、エチレングリコールモノブチル―エーテ
ル11Kg、ジエチレングリコールモノブチルエーテ
ル3Kg、エチレングリコールモノエチルエーテル
0.8Kg、エチレングリコールモノエチルエーテル
アセテート0.2Kg、モノエタノールアミン3Kg、
ジエタノールアミン1Kg、ジメチルアミノエタノ
ール1Kgをタンクに取り、佐竹式撹拌機を用いて
5分間混合し本発明のはく離液を調製した。スプ
レー式はく離機(CHEMCUT社製エツチングマ
シンSYSTEM547を改造したもの)に前述のは
く離液を入れはく離液の温度を50℃に調節してか
ら前記のハンダメツキを行なつた試験板100枚を
連続して投入し、はく離を行なつた(所要スプレ
ー時間2分)。はく離液は2mm格子の金網でろ過
しながら循環させて再使用したがはく離片は細分
化し、丸まつておりろ過は容易であつた。
実施例 3
実施例1と同様にして試験板を3枚作成した。
はく離液として下記の溶液A,B及びCを作成し
た。溶液Aは本発明の態様を示し、溶液B及びC
は比較例(アミン化合物不使用及び有機溶剤未使
用)を示す。部とあるのは重量部である。
溶液 A
イオン交換水 50部
モノエタノールアミン 2部
エチレングリコールモノブチルエーテル 2部
溶液 B
イオン交換水 50部
モノエタノールアミン 4部
溶液 C
イオン交換水 50部
エチレングリコールモノブチルエーテル 4部
溶液A,B及びCを各々ビーカーに1とり50
℃に加温し、マグネチツクスターラーで撹拌し
た。その中に試験板を垂直に浸漬し、はく離状態
を観察した。結果を表1に示す。
The present invention relates to a release liquid that is cured by light irradiation and is used to peel off a cured film of a photopolymerizable composition adhered to a substrate from the substrate. When making wiring boards, photopolymerization containing an aqueous alkali-soluble acrylic linear copolymer, a terminal ethylenically unsaturated monomer, and a photoinitiator is carried out on a substrate such as a copper-clad laminate. After coating or laminating and adhering a photoresist composition of the so-called alkaline aqueous solution development type, the photopolymerizable composition film is imagewise cured by imagewise exposure to actinic light; After removing the uncured portion with a sodium carbonate aqueous solution and developing it,
If necessary, a process such as etching with an aqueous ferric chloride solution is performed to remove the unnecessary cured film using a stripping solution. As the stripping liquid, an aqueous solution of an alkali metal hydroxide such as caustic soda or caustic potash is used. The stripping liquid is used many times until the stripping ability decreases, but in order to prevent the workability from decreasing, it is necessary to remove the flakes that have flaked off. Removal of flakes is carried out using a wire mesh, etc., and when removed with an aqueous solution of alkali metal hydroxide, the flakes retain almost the original shape of the cured film, making it easier to plug holes in the wire mesh, etc. It has poor overworkability and is extremely difficult to handle. Another drawback is that it tends to clog the piping of the stripping device. The present inventors have conducted intensive studies to provide a stripping solution that does not have these drawbacks, and have arrived at the present invention. In the present invention, a cured film of the photopolymerizable composition obtained by coating or laminating a photopolymerizable composition developed with an alkaline aqueous solution onto a substrate and then curing the composition with actinic rays is applied onto the substrate. A stripping liquid used when stripping from (a)
Release agent for cured films of photopolymerizable compositions containing 50 to 95 parts by weight of water, (b) 2 to 40 parts by weight of a water-miscible organic solvent, and (c) 0.5 to 40 parts by weight of a water-soluble amine compound. Regarding. The water used in the stripping solution of the present invention may be tap water, distilled water, ion exchange water, industrial water, etc., and these may be used alone or in combination. The amount of water in the stripping solution of the present invention ranges from 50 to 97 parts by weight, preferably from 70 to 95 parts by weight. If the amount of water in the stripping solution of the present invention exceeds 97 parts by weight, the content of the amine compound and water-miscible organic solvent in the stripping solution will decrease, resulting in a longer stripping time, and if the amount of water exceeds 50 parts by weight. When it becomes less than
This is because not only the cost of the stripping solution becomes high, but also the stripping time becomes long. The water-miscible organic solvent used in the present invention includes ethylene glycol monoether, diethylene glycol monoether, and triethylene glycol monoether, either singly or in combination. Examples of ethylene glycol monoethers include ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol mono-n-butyl ether, ethylene glycol-mono-n-propyl ether, ethylene glycol-isopropyl ether, ethylene glycol-isobutyl ether, and ethylene. Examples include glycol monotertiary butyl ether. Examples of diethylene glycol monoether include diethylene glycol monomethyl ether,
Examples include diethylene glycol monoethyl ether, diethylene glycol-n-propyl ether, diethylene glycol iso-propyl ether, diethylene glycol-n-butyl ether, diethylene glycol-isobutyl ether, diethylene glycol-tert-butyl ether, and the like.
Examples of triethylene glycol monoether include triethylene glycol monomethyl ether,
Triethylene glycol monoethyl ether, triethylene glycol-n-propyl ether,
triethylene glycol isopropyl ether,
triethylene glycol-n-butyl ether,
Examples include triethylene glycol isobutyl ether and triethylene glycol-tert-butyl ether. Ethylene glycol monobutyl ether is preferable because the peeling time is short and the peeling pieces are easy to curl. The amount of water-miscible organic solvent in the stripping solution of the present invention ranges from 2 to 40 parts by weight, preferably from 2.5 to 20 parts by weight.
Parts by weight range. If the amount of the water-miscible organic solvent in the stripping solution exceeds 40 parts by weight, the cost of the stripping solution will increase and the stripping time will also become longer; if it is less than 2 parts by weight, the stripping time will become longer and the strips will not become smaller. It is. The water-soluble amine compounds used in the present invention include ethanolamine compounds, polyethylene polyamine compounds, alkylaminoethanol compounds, N-methyl-N,N-diethanolamine, diisopropanolamine, triisopropanolamine, methylimino -Bispropylamine, ethylenediamine hydrate, n-propylamine, 2-amino-1-methylpropanol, morpholine, aminoethylethanolamine, N-aminopropyl-2-pipecoline, etc. are used alone or in combination. Examples of ethanolamine compounds used in the present invention include monoethanolamine, diethanolamine, triethanolamine, and the like. Examples of polyethylene polyamine compounds used in the present invention include ethylenediamine, diethylenetriamine, triethylenetetramine, and tetraethylenepentamine. Examples of alkylaminoethanol compounds used in the present invention include N,N'-dimethylaminoethanol and N,N'-diethylaminoethanol. Ethanolamine compounds, polyethylene polyamine compounds, and alkylaminoethanol compounds are preferred because they have short peeling times. The amount of water-soluble amine compound used in the present invention ranges from 0.5 to 40 parts by weight, preferably from 0.5 to 10 parts by weight. If the amount of the amine compound in the stripping solution of the present invention exceeds 40 parts by weight, the cost of the stripping solution will increase and the stripping time will become longer; if it is less than 0.5 parts by weight,
This is because the peeling time becomes longer. In addition to the above-mentioned components, the stripping solution of the present invention includes methyl ethyl ketone, methanol, ethanol,
It may also contain organic solvents such as isopropyl alcohol and ethylene glycol monobutyl ether acetate, antifoaming agents such as sodium alkyl sulfate and polyoxyethylene sorbitan fatty acid ester, and surfactants. The stripping solution of the present invention can be obtained by uniformly mixing water, a water-miscible organic solvent, and a water-soluble amine compound. It can also be used by mixing it with a predetermined amount of water when using the stripping liquid. Methods for peeling off a cured film of a photopolymerizable composition adhered to a substrate using the stripping solution of the present invention include simply immersing the substrate in the stripping solution, and dipping the substrate in the stripping solution and then blowing air. There are methods of shaking the release liquid by stirring such as bubbling, stirring blades, and ultrasonic vibrations, methods of causing the release liquid to flow down onto the substrate, and methods of spraying the release liquid onto the substrate. A method of dipping and peeling is particularly preferred. When the cured film adhered to the substrate is peeled off using the release liquid of the present invention, the temperature of the release liquid is
The temperature range is preferably from 30 to 70°C, particularly preferably from 40 to 60°C. If the temperature of the stripping liquid is less than 30°C, the stripping time will be undesirably long, and if it exceeds 70°C, the water-miscible organic solvent and the amine compound will easily volatilize, which is undesirable. When the cured film is peeled off using the cured film release liquid of the present invention, the peeled pieces become fragmented and smaller than their original shape, and the peeled pieces become rounded, so remove the peeled pieces with a wire mesh or the like. When separating,
It is less prone to clogging and can be easily separated. The present invention is suitable as a release liquid for adhering a photopolymerizable composition such as that described in Japanese Patent Application No. 54-96570 onto a substrate and peeling off a cured film cured by actinic rays. The above patent application 1977-
No. 96570 contains an acrylic linear copolymer soluble in aqueous alkaline solution with a carboxyl group content of 20 to 50 mol%, a non-gaseous monomer having a terminal ethylenically unsaturated group, and a Alkaline aqueous solution development type photopolymerizable compositions containing a photoinitiator that generates free radicals have been proposed. Next, the present invention will be explained by examples. Example 1 Copper surface polished and cleaned; length 200mm, width 100mm
mm, an alkaline water developable type photosensitive film phototec on the copper surface of a copper-clad laminate with a thickness of 1 mm.
- Peel off the protective film from 860AFX (trademark manufactured by Hitachi Chemical Co., Ltd.) and place the support film on top.
A test plate was prepared by laminating the layers at 160° C. and exposing the entire surface to light (120 mJ/cm 2 ) using a mercury lamp. Tap water
2100g of monoethanolamine, 30g of butyl cellosolve, 140g of butyl cellosolve, and 60g of ethylene glycol monobutyl ether acetate were placed in an ultrasonic cleaner (BRANSONIC32 manufactured by Brason), and after the temperature of the liquid was 50℃, while oscillating ultrasonic waves. The support film was removed from the test plate, and the test plate was immersed in a peeling solution vertically to observe the peeling state. Peeling started 1 minute and 30 seconds after immersion and was completed in 2 minutes and 10 seconds, but the peeled pieces were broken into small pieces and were in a balled state, making them easy to pass through. On the other hand, a similar test was conducted using a 5% caustic soda aqueous solution at 50°C, but the flakes were hardly divided into pieces and did not curl up. When we compared the susceptibility using a wire mesh with a 3 mm grid, we found that the material that was removed using the stripping liquid of the present invention remained in small circles on the wire mesh and could be easily filtered through a furnace. On the other hand, the flakes removed with a caustic soda aqueous solution had large flakes, and the holes in the wire mesh were blocked, resulting in very poor furnace resistance. Example 2 Polished and cleaned copper surface 200mm vertically and 100mm horizontally
mm, an alkaline water developable type photosensitive film phototec on the copper surface of a copper-clad laminate with a thickness of 1 mm.
- Peel off the protective film from 860AFX (trademark manufactured by Hitachi Chemical Co., Ltd.) and place the support film on top.
After laminating at 160°C, an image film with transparent holes of 40 mm in diameter for actinic light was placed on the photosensitive surface on a grid of 50 mm intervals, and exposed using a mercury lamp (120 mJ/cm 2 ) to form a test plate. 100 pieces were made. Remove the support film from the test plate and
Ultrasonic cleaning machine (manufactured by Branson)
The film was developed by immersion in a 2% sodium carbonate aqueous solution in BRANSONIC32) at 36°C for 60 seconds, cleaned with water, solder-plated, and washed with water. 80 kg of industrial water pumped from underground, 11 kg of ethylene glycol monobutyl ether, 3 kg of diethylene glycol monobutyl ether, ethylene glycol monoethyl ether
0.8Kg, ethylene glycol monoethyl ether acetate 0.2Kg, monoethanolamine 3Kg,
1 kg of diethanolamine and 1 kg of dimethylaminoethanol were placed in a tank and mixed for 5 minutes using a Satake stirrer to prepare a stripping solution of the present invention. The above-mentioned stripping solution was put into a spray stripper (a modified version of the etching machine SYSTEM547 manufactured by CHEMCUT), the temperature of the stripping solution was adjusted to 50℃, and 100 test plates were solder-plated as described above in succession. and peeling was performed (required spray time: 2 minutes). The stripping solution was filtered through a wire mesh with a 2 mm lattice and circulated for reuse, but the strips were broken up into small pieces and rolled into balls, making it easy to filter. Example 3 Three test plates were prepared in the same manner as in Example 1.
The following solutions A, B and C were prepared as stripping solutions. Solution A represents an embodiment of the invention, solutions B and C
indicates a comparative example (no amine compound and no organic solvent used). Parts are by weight. Solution A Ion exchange water 50 parts Monoethanolamine 2 parts Ethylene glycol monobutyl ether 2 parts Solution B Ion exchange water 50 parts Monoethanolamine 4 parts Solution C Ion exchange water 50 parts Ethylene glycol monobutyl ether 4 parts Solution A, B and C 50 per beaker each
The mixture was warmed to ℃ and stirred using a magnetic stirrer. A test plate was immersed vertically in the solution, and the state of peeling was observed. The results are shown in Table 1.
【表】
以上の例で示したように、本発明の実施例にな
るはく離液ははく離片を細分化し、かつはく離片
が丸まるという点ではく離作業性を容易にすると
いう利点を有している。[Table] As shown in the above examples, the stripping liquid according to the embodiment of the present invention has the advantage of making the stripping work easier in that it divides the strips into smaller pieces and the strips become rounded. .
Claims (1)
を塗被あるいはラミネートして基体上に接着させ
たのち、活性光線により該組成物を硬化させて得
られる光重合性組成物の硬化膜を基体上からはく
離する際に用いられるはく離液であつて、(a)水50
〜97重量部、(b)水混和性有機溶剤2〜40重量部お
よび(c)水に可溶なアミン化合物0.5〜40重量部を
含有する光重合性組成物の硬化膜用はく離液。 2 水混和性有機溶剤がエチレングリコールモノ
ブチルエーテルである特許請求の範囲第1項記載
の光重合性組成物の硬化膜用はく離液。 3 水に可溶なアミン化合物がエタノールアミン
系化合物、ポリエチレンポリアミン系化合物、ア
ルキルアミノエタノール系化合物の群の中から選
ばれる1種または2種以上のアミン化合物である
特許請求の範囲第1項又は第2項記載の光重合性
組成物の硬化膜用はく離液。[Claims] 1. A photopolymerizable composition obtained by coating or laminating a photopolymerizable composition of an alkaline aqueous solution development type onto a substrate, and then curing the composition with actinic rays. A release liquid used when peeling off a cured film from a substrate, comprising: (a) 50% water;
97 parts by weight, (b) 2 to 40 parts by weight of a water-miscible organic solvent, and (c) 0.5 to 40 parts by weight of a water-soluble amine compound. 2. A release liquid for a cured film of a photopolymerizable composition according to claim 1, wherein the water-miscible organic solvent is ethylene glycol monobutyl ether. 3. Claim 1, wherein the water-soluble amine compound is one or more amine compounds selected from the group of ethanolamine compounds, polyethylene polyamine compounds, and alkylaminoethanol compounds. A release liquid for a cured film of the photopolymerizable composition according to item 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5210781A JPS57165834A (en) | 1981-04-06 | 1981-04-06 | Peeling solution for cured film of photopolymerizing composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5210781A JPS57165834A (en) | 1981-04-06 | 1981-04-06 | Peeling solution for cured film of photopolymerizing composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57165834A JPS57165834A (en) | 1982-10-13 |
| JPS645695B2 true JPS645695B2 (en) | 1989-01-31 |
Family
ID=12905629
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5210781A Granted JPS57165834A (en) | 1981-04-06 | 1981-04-06 | Peeling solution for cured film of photopolymerizing composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57165834A (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2578821B2 (en) * | 1987-08-10 | 1997-02-05 | 東京応化工業株式会社 | Stripper for positive photoresist |
| JPH0769618B2 (en) * | 1987-09-25 | 1995-07-31 | 旭化成工業株式会社 | Stripping agent for photoresist |
| JPH0769619B2 (en) * | 1987-09-25 | 1995-07-31 | 旭化成工業株式会社 | Photoresist remover |
| JP2631849B2 (en) * | 1987-09-30 | 1997-07-16 | ナガセ電子化学 株式会社 | Release agent composition |
| JP2759462B2 (en) * | 1988-11-11 | 1998-05-28 | ナガセ電子化学株式会社 | Aqueous release agent composition |
| AU2494092A (en) * | 1992-09-03 | 1994-03-29 | Circuit Chemical Products Gmbh | Cleaning-agent mixture for cleaning printed circuits and a method of cleaning such circuits |
| JP2010109396A (en) * | 2010-02-17 | 2010-05-13 | Ibiden Co Ltd | Method of manufacturing printed circuit board |
| JP6772080B2 (en) * | 2016-03-28 | 2020-10-21 | 三菱製紙株式会社 | Peeling method |
-
1981
- 1981-04-06 JP JP5210781A patent/JPS57165834A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57165834A (en) | 1982-10-13 |
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