JPS646158B2 - - Google Patents
Info
- Publication number
- JPS646158B2 JPS646158B2 JP25185683A JP25185683A JPS646158B2 JP S646158 B2 JPS646158 B2 JP S646158B2 JP 25185683 A JP25185683 A JP 25185683A JP 25185683 A JP25185683 A JP 25185683A JP S646158 B2 JPS646158 B2 JP S646158B2
- Authority
- JP
- Japan
- Prior art keywords
- crucible
- silicon single
- silicon
- quartz glass
- glass crucible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 35
- 229910052710 silicon Inorganic materials 0.000 claims description 35
- 239000010703 silicon Substances 0.000 claims description 35
- 239000013078 crystal Substances 0.000 claims description 24
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 16
- 229910052783 alkali metal Inorganic materials 0.000 claims description 9
- 150000001340 alkali metals Chemical class 0.000 claims description 9
- 229910052744 lithium Inorganic materials 0.000 claims description 4
- 229910052700 potassium Inorganic materials 0.000 claims description 4
- 229910052708 sodium Inorganic materials 0.000 claims description 4
- 238000000034 method Methods 0.000 description 9
- 239000010949 copper Substances 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 238000005188 flotation Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910001413 alkali metal ion Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/10—Crucibles or containers for supporting the melt
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Glass Melting And Manufacturing (AREA)
- Glass Compositions (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Description
本発明は石英ガラスルツボに関し、特にシリコ
ン単結晶の引上げに用いられるものである。
シリコン単結晶の引上げは通常以下のようにし
て行なわれている。すなわち、石英ガラスルツボ
内にシリコン多結晶を装填し、黒鉛製ルツボに内
装する。このルツボを周囲から加熱して約1450℃
に維持してシリコン多結晶を溶融し、シリコン単
結晶の種結晶を浸漬し、これを引上げつつ徐冷す
ることによりシリコン単結晶インゴツトを得てい
る。
しかしながら、この方法では溶融シリコンと接
触している石英ガラスルツボの浸蝕が避けられ
ず、引上げられたシリコン単結晶中にルツボの不
純物が混入してしまう。特に、第1族アルカリ金
属や銅の濃度が高い場合にはシリコン単結晶に格
子欠陥が発生し、製造歩留りを下げる一因となつ
ていた。
また、約1450℃という高温で使用されるため、
石英ガラスルツボの粘性が低いとルツボのたわみ
やゆがみが激しくなつて溶融シリコンの流れが不
規則になり、またルツボの浸蝕量が多くなるた
め、高品質のシリコン単結晶を引上げることが困
難であつた。
本発明は上記欠点を解消するためになされたも
のであり、高品質のシリコン単結晶を製造し得る
石英ガラスルツボを提供しようとするものであ
る。
すなわち本発明の石英ガラスルツボは、溶融シ
リコンに磁場を印加してシリコン単結晶引上げを
行う場合に使用する石英ガラスルツボにおいて、
Na、K、Liのアルカリ金属含有量がそれぞれ
0.2ppm以下、Cuの含有量が0.02ppm以下であり、
かつ1450℃における粘性が1010ポイズ以上、1200
℃における電気抵抗が1.4×107Ω・m以上である
ことを特徴とするものである。
本発明の石英ガラスルツボにおいて、Na、Li、
K及びCuの含有量を上記数値以下に限定したの
は、これらの数値を越えると引上げられるシリコ
ン単結晶中のアルカリ金属及び銅の含有量が多く
なり、超LSIの製造に使用される高品質のシリコ
ン単結晶を製造できなくなるためである。また、
1450℃における粘性を上記数値以上に限定したの
は、この数値未満では引上げ時に変形し易くなる
うえに石英ガラスルツボの浸蝕量も多くなり、や
はり高品質のシリコン単結晶を製造できなくなる
ためである。更に、1200℃における電気抵抗を上
記数値以上に限定したのは、上記数値未満では溶
融シリコンに磁場を印加して引上げを行なう場合
(いわゆるMCZ法)において、アルカリ金属等の
移動を起こしたり、溶融シリコンの対流を起こし
易くするためである。
以下、本発明の実施例を説明する。
まず、天然水晶を粉砕して50〜80#に調整し、
浮遊選鉱法により精製した。この精製粉をアーク
回転溶融で成形し、石英ガラスルツボを製造し
た。次に、1300℃の炉内でこのルツボの上下に
10kVの直流を通電し、5分間以上電解し、アル
カリ金属及び銅を移動させた。このルツボの化学
分析値、粘性及び電気抵抗値を下記第1表に示
す。
また、比較例として天然水晶を粉砕して50〜80
#に調整し、浮遊選鉱法により精製した後、この
精製粉をアーク回転溶融で成形し、従来の2種の
石英ガラスルツボを製造した。これらのルツボの
化学分析値、粘性及び電気抵抗値を下記第1表に
併記する。
更に、上記方法にて製造した石英ガラスルツボ
を実際に溶融シリコンに磁場を印加するMCZ法
でのシリコン単結晶の引上げに使用し、その結果
得られたシリコン単結晶の化学分析値を下記第2
表に示す。
The present invention relates to a silica glass crucible, and is particularly used for pulling silicon single crystals. Silicon single crystals are usually pulled in the following manner. That is, silicon polycrystals are loaded into a quartz glass crucible and placed inside a graphite crucible. This crucible is heated from the surroundings to approximately 1450℃.
A silicon single crystal ingot is obtained by melting a silicon polycrystal while maintaining the same temperature, dipping a silicon single crystal seed crystal, and slowly cooling it while pulling it up. However, with this method, corrosion of the quartz glass crucible that is in contact with molten silicon cannot be avoided, and impurities from the crucible are mixed into the pulled silicon single crystal. In particular, when the concentration of Group 1 alkali metals or copper is high, lattice defects occur in silicon single crystals, which is one of the causes of lower manufacturing yields. In addition, since it is used at a high temperature of approximately 1450℃,
If the viscosity of the quartz glass crucible is low, the crucible will bend and distort violently, making the flow of molten silicon irregular and increasing the amount of erosion of the crucible, making it difficult to pull high-quality silicon single crystals. It was hot. The present invention has been made in order to eliminate the above-mentioned drawbacks, and aims to provide a quartz glass crucible that can produce high quality silicon single crystals. That is, the quartz glass crucible of the present invention is used when pulling a silicon single crystal by applying a magnetic field to molten silicon.
The alkali metal content of Na, K, and Li is
0.2ppm or less, Cu content is 0.02ppm or less,
And the viscosity at 1450℃ is 10 to 10 poise or more, 1200
It is characterized by an electrical resistance of 1.4×10 7 Ω·m or more at °C. In the quartz glass crucible of the present invention, Na, Li,
The reason why the content of K and Cu is limited to below the above values is that when these values are exceeded, the content of alkali metals and copper in the silicon single crystal that is pulled increases, and the high quality used for manufacturing VLSI is This is because it becomes impossible to manufacture silicon single crystals. Also,
The reason why the viscosity at 1450°C was limited to the value above is that if it is less than this value, it will be easily deformed during pulling and the quartz glass crucible will be eroded to a large extent, making it impossible to produce high quality silicon single crystals. . Furthermore, the electrical resistance at 1200℃ was limited to the value above, because if it is less than the above value, when pulling the molten silicon by applying a magnetic field (the so-called MCZ method), it may cause the movement of alkali metals, etc. This is to facilitate silicon convection. Examples of the present invention will be described below. First, crush the natural crystal and adjust it to 50~80#,
Refined by flotation method. This refined powder was molded by arc rotation melting to produce a quartz glass crucible. Next, the top and bottom of this crucible are placed in a 1300℃ furnace.
A direct current of 10 kV was applied to electrolyze for 5 minutes or more, and the alkali metal and copper were transferred. The chemical analysis values, viscosity and electrical resistance values of this crucible are shown in Table 1 below. In addition, as a comparative example, we crushed natural crystal and
After adjusting the powder to # and refining it by the flotation method, this refined powder was molded by arc rotation melting to produce two types of conventional silica glass crucibles. The chemical analysis values, viscosity, and electrical resistance values of these crucibles are also listed in Table 1 below. Furthermore, the silica glass crucible manufactured by the above method was actually used to pull silicon single crystals by the MCZ method, which applies a magnetic field to molten silicon, and the chemical analysis values of the silicon single crystals obtained as a result are shown in the second section below.
Shown in the table.
【表】【table】
【表】
第1表から明らかなように、実施例のルツボは
Na、Li、Kのアルカリ金属含有量が0.2ppm以
下、Cuの含有量が0.02ppm以下であり、かつ1450
℃における粘性が1010ポイズ以上、1200℃におけ
る電気抵抗が1.4×107Ω・m以上となつている。
すなわち、実施例のルツボはアルカリ金属及び
銅の含有量が低くなつているため高品質のシリコ
ン単結晶を引上げることができる。また、実施例
のルツボは石英ガラスの網目修飾イオンであるア
ルカリ金属が除去されているため粘性が高く、高
温下でも変形しにくいうえに浸蝕されにくくなつ
ている。このため、シリコン単結晶引上げ時に溶
融シリコンの流れを阻害することがなく、高品質
のシリコン単結晶を引上げることができる。
更に、溶融シリコンに磁場を印加する方法
(MCZ法)ではルツボの電気抵抗が高いほど溶融
シリコン中に溶込む量を減少させることができ
る。つまり、1450℃の高温では溶融シリコンだけ
でなく、石英ガラスルツボ自体も電気伝導性を有
し、強磁場の存在化では電流が両者に発生して複
雑な対流を起こすが、本発明の石英ガラスルツボ
のように電気抵抗が高い場合には溶融シリコンの
対流を抑制することができるため、ルツボ内面の
溶損量が減少し、溶け込む酸素量を低下させるこ
とができる。また、アルカリ金属等の移動が起こ
らず、シリコン単結晶中の各種金属含有量を低く
することができる。
事実、MCZ法によりシリコン単結晶を引上げ
た結果を示す第2表から上述した効果が得られる
ことがわかる。
以上詳述した如く、本発明の石英ガラスルツボ
によれば、極めて高品質のシリコン単結晶を引上
げることができ、半導体素子の製造歩留りを向上
できる等顕著な効果を奏するものである。[Table] As is clear from Table 1, the crucible in the example was
The alkali metal content of Na, Li, and K is 0.2 ppm or less, the Cu content is 0.02 ppm or less, and 1450
The viscosity at ℃ is 10 10 poise or more, and the electrical resistance at 1200 ℃ is 1.4×10 7 Ω・m or more. That is, since the crucible of the example has a low content of alkali metal and copper, it is possible to pull a high quality silicon single crystal. Furthermore, since the alkali metal ions that modify the network of silica glass have been removed from the crucible of the example, it has a high viscosity and is not easily deformed even at high temperatures, and is also resistant to corrosion. Therefore, the flow of molten silicon is not obstructed when pulling a silicon single crystal, and a high quality silicon single crystal can be pulled. Furthermore, in the method of applying a magnetic field to molten silicon (MCZ method), the higher the electrical resistance of the crucible, the more the amount dissolved into molten silicon can be reduced. In other words, at a high temperature of 1450°C, not only the molten silicon but also the silica glass crucible itself has electrical conductivity, and in the presence of a strong magnetic field, current is generated in both, causing complex convection. When the electrical resistance is high as in a crucible, convection of molten silicon can be suppressed, so the amount of erosion on the inner surface of the crucible is reduced, and the amount of dissolved oxygen can be reduced. In addition, migration of alkali metals and the like does not occur, and the content of various metals in the silicon single crystal can be reduced. In fact, it can be seen from Table 2 showing the results of pulling silicon single crystals by the MCZ method that the above-mentioned effects can be obtained. As described in detail above, the quartz glass crucible of the present invention can pull silicon single crystals of extremely high quality, and has remarkable effects such as being able to improve the manufacturing yield of semiconductor devices.
Claims (1)
晶引上げを行う場合に使用する石英ガラスルツボ
において、Na、K、Liのアルカリ金属含有量が
それぞれ0.2ppm以下、Cuの含有量が0.02ppm以
下であり、かつ1450℃における粘性が1010ポイズ
以上、1200℃における電気抵抗が1.4×107Ω・m
以上であることを特徴とする石英ガラスルツボ。1. In the quartz glass crucible used when pulling a silicon single crystal by applying a magnetic field to molten silicon, the alkali metal content of Na, K, and Li is 0.2 ppm or less, and the Cu content is 0.02 ppm or less. , and the viscosity at 1450℃ is 10 10 poise or more, and the electrical resistance at 1200℃ is 1.4×10 7 Ω・m
A quartz glass crucible characterized by the above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25185683A JPS60137892A (en) | 1983-12-26 | 1983-12-26 | Quartz glass crucible |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25185683A JPS60137892A (en) | 1983-12-26 | 1983-12-26 | Quartz glass crucible |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60137892A JPS60137892A (en) | 1985-07-22 |
| JPS646158B2 true JPS646158B2 (en) | 1989-02-02 |
Family
ID=17228935
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25185683A Granted JPS60137892A (en) | 1983-12-26 | 1983-12-26 | Quartz glass crucible |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60137892A (en) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0643277B2 (en) * | 1988-03-18 | 1994-06-08 | コマツ電子金属株式会社 | Quartz crucible manufacturing method |
| JPH0226031A (en) * | 1988-07-14 | 1990-01-29 | Toshiba Ceramics Co Ltd | Silicon wafer |
| JPH0825835B2 (en) * | 1988-09-20 | 1996-03-13 | 東芝セラミックス株式会社 | Single crystal pulling device |
| JPH0394843A (en) * | 1989-09-04 | 1991-04-19 | Shin Etsu Chem Co Ltd | Synthetic quartz glass crucible and its production |
| JPH02229735A (en) * | 1989-02-28 | 1990-09-12 | Shin Etsu Chem Co Ltd | quartz glass parts |
| JP2631321B2 (en) * | 1989-10-31 | 1997-07-16 | 信越石英株式会社 | Silica glass crucible for pulling silicon single crystal |
| JP2709644B2 (en) * | 1990-04-25 | 1998-02-04 | 東芝セラミックス 株式会社 | Method for producing quartz crucible for producing silicon single crystal |
| JPH0725561B2 (en) * | 1990-08-28 | 1995-03-22 | 信越半導体株式会社 | Quartz glass crucible |
| JPH0780716B2 (en) * | 1991-02-08 | 1995-08-30 | 東芝セラミックス株式会社 | Quartz glass crucible manufacturing method |
| JP2811290B2 (en) * | 1995-04-04 | 1998-10-15 | 信越石英株式会社 | Quartz glass crucible for pulling silicon single crystal |
| US5980629A (en) * | 1995-06-14 | 1999-11-09 | Memc Electronic Materials, Inc. | Methods for improving zero dislocation yield of single crystals |
| US5976247A (en) * | 1995-06-14 | 1999-11-02 | Memc Electronic Materials, Inc. | Surface-treated crucibles for improved zero dislocation performance |
| AU2001288566A1 (en) | 2000-11-15 | 2002-05-27 | Gt Equipment Technologies Inc. | A protective layer for quartz crucibles used for silicon crystallization |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4028124A (en) * | 1976-04-26 | 1977-06-07 | Corning Glass Works | Method of enhancing the refractoriness of high purity fused silica |
| JPS5849519A (en) * | 1981-09-07 | 1983-03-23 | Toyota Motor Corp | Body floor structure of automobile |
| JPS6058657B2 (en) * | 1981-09-24 | 1985-12-20 | 株式会社ナシヨナル技研 | artificial teeth |
| JPH0244799B2 (en) * | 1981-10-26 | 1990-10-05 | Sony Corp | KETSUSHOSEICHOHOHO |
-
1983
- 1983-12-26 JP JP25185683A patent/JPS60137892A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60137892A (en) | 1985-07-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |