JPS649734B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (1) Technical Field of the Invention The present invention relates to improvements in semiconductor devices having ceramic packages.

(2) Background of the Technology Semiconductor devices usually have a structure in which a semiconductor chip is hermetically sealed within a ceramic package, as shown in FIG. In the figure, 1a, 1b, and 1c are semiconductor chips, and 2a, 2b, and 2c are base members 2.
1 and the lid member 22 are airtightly bonded to each other via an adhesive layer, and 3 includes a plurality of lead pieces (the first (Only figure a is shown, the others are omitted), and 4 is a bonding wire that electrically connects the bonding pad of the semiconductor chip 1 and the lead piece 3.

Such a semiconductor device includes semiconductor chips 1a,
If the sizes of 1b and 1c are different, the first
Ceramic packages 2a, 2b, and 2c of various shapes as shown in Figures a, b, and c are used.
However, in order to deal with the recent diversification of semiconductor chip sizes, there is a need to improve ceramic packages and create highly reliable ceramic packages that can be mounted even with different semiconductor chip sizes.

(3) Conventional technology and problems Conventional ceramic packages 2a, 2b, 2c
Now, when a semiconductor chip 1a with a small chip size is mounted on a large ceramic package 2c, the length of the bonding wire 4 stretched in the space becomes long, which has the drawback that a shoot accident due to contact between the wires or the wire sagging is likely to occur. Ta.

(4) Purpose of the Invention It is an object of the present invention to eliminate the above-mentioned conventional drawbacks and to make it possible to mount many types of semiconductor chips using one type of standardized package.

(5) Structure of the Device According to the present invention, a semiconductor device is provided in which a plurality of electrodes on a semiconductor chip disposed in a recess in a package are wire-bonded to corresponding pads of a conductive member at an end of the package. , a die attach portion disposed in the center portion of the recess to which the semiconductor chip is fixed; and a die attach portion located in the recess between the die attach portion and the pad at the end of the package along the pad at the end of the package. and a plurality of auxiliary pads arranged in a plurality of rows, and the semiconductor chip can be disposed on the plurality of auxiliary pads arranged in a row inside the plurality of auxiliary pads arranged in a plurality of rows. , and the plurality of electrodes on the semiconductor chip and the corresponding pads of the conductive member at the end of the package are each configured to be wire bonded via a plurality of auxiliary pads arranged in an outer row. This is achieved by providing a semiconductor device characterized by the following.

(6) Examples of the invention Embodiments of the present invention will be described in detail below with reference to the drawings.

FIG. 2 is a sectional view showing the base member 21 of the package according to the present invention and the mounted semiconductor chip 1, and FIG. 3 is a top view of the base member 21.

Figure 2 shows the recess 21 that fits the maximum chip size.
1 shows the base member 21 of the package with 1. Figure 2a shows the case where the chip size is small.
In this case, the bonding wire 4 from the bonding pad of the semiconductor chip 1 to the lead piece is wired while connecting the wire bonding auxiliary pad 6 disposed in the recess of the base member 21 at the shortest distance. Since the auxiliary pad 6 is used, the length of each wire stretched in the space can be shortened, and it is possible to eliminate shoot accidents caused by wire gaps or wires hanging down.

In the embodiment shown in FIG. 3, two rows of wire bonding auxiliary pads 6 are arranged on each side.

In the figure, 31 is a bonding pad of a lead piece fixed to the package, and 5 is a die attach portion for fixing the semiconductor chip 1 to the package. The number of auxiliary pads 6 arranged in two rows on each side is the same as the number of bonding pads 31 on the lead piece, but the number is not limited to this. Further, in the case of the semiconductor chip 1 as shown in FIG. 2B, the auxiliary pad 61 can be a die attach like the die attach section 5 disposed in the center of the package recess 211.

Note that the present invention relates to a package mounting method, for example,
DIP (Dual in package), FP (Flat package),
PAP (Pin array package), LCC (Leadless
It is applicable to any method such as chip carrier).

(7) Effects of the invention According to the present invention, the allowable width of the semiconductor chip size that can be conventionally mounted with one type of package is approximately 2 at most.
mm, but this can be expanded to more than three times, making it possible to unify package types by standardizing them, and also having the effect of achieving high reliability by eliminating shot accidents.

[Brief explanation of drawings]

FIG. 1 is a sectional view of a package for explaining the prior art, FIG. 2 is a sectional view of a package according to the present invention, and FIG. 3 is a top view of a package base according to the present invention. In the figure, 1, 1a, 1b, 1c are semiconductor chips, 2, 2a, 2b, 2c are packages, and 21
2 is a package base member, 22 is a package lid member, 211 is a package recess, 3 is a lead piece,
31 is a bonding pad of a lead piece, 4 is a bonding wire, 5 is a die attachment part, 6, 6
Reference numerals 1 and 62 indicate auxiliary pads.

Claims (1)

[Scope of Claims] 1. A semiconductor device in which a plurality of electrodes on a semiconductor chip arranged in a recess in a package are wire-bonded to corresponding pads of a conductive member at an end of the package, comprising: a die attach portion to which the semiconductor chip is fixed; and a plurality of pads arranged in a plurality of rows along the pad at the end of the package in the recess between the die attach portion and the pad at the end of the package. auxiliary pads, the semiconductor chips can be disposed on the plurality of auxiliary pads arranged in a row inside the plurality of auxiliary pads arranged in the plurality of rows, and the plurality of auxiliary pads on the semiconductor chips 1. A semiconductor device characterized in that the electrodes and the corresponding pads of the conductive member at the ends of the package can be wire-bonded via a plurality of auxiliary pads arranged in outer rows.