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JPH0113177B2 - - Google Patents
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JPH0113177B2 - - Google Patents

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Publication number
JPH0113177B2
JPH0113177B2 JP17890082A JP17890082A JPH0113177B2 JP H0113177 B2 JPH0113177 B2 JP H0113177B2 JP 17890082 A JP17890082 A JP 17890082A JP 17890082 A JP17890082 A JP 17890082A JP H0113177 B2 JPH0113177 B2 JP H0113177B2
Authority
JP
Japan
Prior art keywords
alloy
contact
reed
piece
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP17890082A
Other languages
Japanese (ja)
Other versions
JPS5968117A (en
Inventor
Akira Tanaka
Shigeru Saito
Masanori Baba
Toshiro Oguma
Shuichi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP17890082A priority Critical patent/JPS5968117A/en
Publication of JPS5968117A publication Critical patent/JPS5968117A/en
Publication of JPH0113177B2 publication Critical patent/JPH0113177B2/ja
Granted legal-status Critical Current

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  • Contacts (AREA)
  • Manufacture Of Switches (AREA)
  • Switches That Are Operated By Magnetic Or Electric Fields (AREA)

Description

【発明の詳細な説明】[Detailed description of the invention]

(a) 発明の技術分野 本発明はガラス管の中に両端から磁性材料のリ
ード片を封入し、リード片の互いにオーバラツプ
する部分で接点の開閉を行なわせるリードスイツ
チの製造方法に関する。 (b) 技術の背景 通常のリードスイツチは第1図イに示すよう
に、ガラス管1の両端から1対のリード片2′,
3′が挿入され、不活性ガスの雰囲気中で封止さ
れている。そしてガラス管1の外部に配置された
励磁コイル4に通電すると、両リード片2′,
3′を通る磁束で、リード片のオーバラツプした
接点部分のギヤツプ5が閉じてスイツチオンす
る。次に励磁コイル4を導電通状態にすると、接
点ギヤツプ5の磁気吸引力が消失して接点ギヤツ
プ5が開き、スイツチオフとなる。 リード片の内端の接点部は、ロのようにリード
片3′,2′の先端に貴金属材料からなる接点6′
を設けて、接触低抗が小さくなるようにしてい
る。リード片の磁性材料としては、通常パーマロ
イ特に52アロイと呼ばれる52%ニツケルと48%鉄
の合金材が広く用いられる。接点材料としては
金、銀、ロジウム、銅または金系合金(Au−
Co,Au−Ni)などの材料が用いられる。 (c) 従来技術とその問題点 ところが金や銀などのような軟い材料を接点材
料として用いた場合、接点材料同士の粘着現象に
よつて、励磁コイル4を非通電状態にして励磁磁
界を取り去つても、接点ギヤツプ5が閉じたまま
となり易い。これを防止するために、リード片に
接点材料をメツキした後、水素雰囲気の電気炉中
で20分程度の熱処理を行ない、下地金属と接点材
料を拡散して、下地金属が接点の表面に一部析出
するようにしている。 ところがこの方法は、粘着は多少軽減される反
面次のような欠点が生じる。 (1) パーマロイ中のFeのために接点の表面が酸
化し易く、接触抵抗が不安定になり易い。即ち
Fe−Niの酸化皮膜が形成され鉄と酸素が共存
するため境界抵抗(皮膜抵抗)が高くなり、ロ
ジウム(Rh)接点に比べて接触抵抗のレベル
が高くなる。 (2) リードスイツチのガラス管内の微量の残留酸
素によつて、無負荷動作の場合に接点閉止時の
衝突エネルギーで酸化皮膜が形成され、かつ動
作回数と共に増大する。つまり動作回数の増大
と共に、ブリツジ消耗即ちpip&craterを生成
し、接触抵抗増大、粘着(sticking)などの接
触障害を引き起す。その理由は、閉じた接点間
に電流が流れると、そのときのジユール熱で温
度が上昇し、接点表面が軟化して粘性が低下す
る。しかも正側が負側より高温になるため、正
側の軟化した接点材料が低温の負側の接点に粘
着し、正側がブリツジ消耗して窪みができる。
また通電時のシヨート・アークによつて負側に
発生したイオンが正側の接点表面に衝突し、そ
のとき発生した粉末が負側の接点表面に堆積
し、窪みと隆起を更に促進する。そしてこの窪
みに隆起が嵌入するとロツクされると共に粘着
し、励磁磁界を取り去つたときの接点の開離が
困難になる。これらの現象は特に50V、100m
A程度の領域で発生し易い。 このような拡散処理を行なう方法のほかに、金
のメツキ液に3%程度のCoを混入して合金メツ
キを行なうことにより、接点材料の金表面に3%
のCoが混在したいわゆる硬質金が得られ、耐粘
着性が向上する。しかも接点表面に酸化しやすい
Feが現れないので、52アロイと金メツキ間を拡
散処理したものより、接触抵抗も改善される。 しかしながら拡散処理したものと違つて、合金
メツキされた接点と下地の52アロイとの結合が弱
く、温度変化を繰り返し受けることによつて、接
点の剥離が起きやすい。特に52アロイの電気抵抗
率は、35μΩ・cmと高いため、接点を通る電流に
よる発熱が大きく、高温の温度サイクルを受ける
ことになり、一層剥離し易い。 本発明の出願人は、このような問題を解消する
ために、下地自身が多量のCoを含むリード片材
料としてFe(10〜18%)−Co(残)合金を提案し
た。この磁性材料を用いるとCoが82〜90%含ま
れているため、接点材料として金メツキを行なつ
た後拡散処理すれば、酸化し易いFeは析出せず
Coが析出するので、酸化して接触抵抗を高くす
ることはなく、かつ接点材料とリード片との密着
性も向上する。 しかしながらFe(10〜18%)−Co(残)合金を用
いた場合、別の問題として、メツキ処理の前段階
で行なわれるバリ取りを電解研摩で行なつた場合
は、接点材料とリード片との密着が悪化し、期待
した効果が得られない。即ちリード片は第2図に
示すように、丸棒7の一部をプレスで平に潰して
板状に形成し、この板状部71の先端に接点を設
けるが、プレス加工時や切断時に発生したバリ7
2やカエリがリード片先端に残つていると、接点
の開閉動作に支障をきたし、接点動作の信頼性が
低下する。このバリを除去するために、機械的方
法として、研摩材と一緒に掻きまぜるバレル研摩
があるが、この方法ではリード片自体が変形する
恐れがある。またバレル研摩時はリード片がバラ
バラになつており且つ研摩材と混合されているの
で、バレル研摩からメツキ工程へ移行する際のハ
ンドリングが困難で作業性が悪い。これに対し電
解研摩法は、電解液中に浸漬するだけでよいので
機械的に撹拌するバレル研摩のようにリード片同
士が衝突して変形をきたすことはなく、且つ一定
の状態で保持できるので、次のメツキ工程へ移行
する際のハンドリングは容易で作業性も優れてい
る。 ところで52アロイの電解研摩は、リン酸濃度が
50〜70%のリン酸液(H3PO4)が電解研摩液と
して行なわれるが、同様のリン酸液でFeが20%
以下のFe(10〜18%)−Co(残)合金を電解研摩す
ると、研摩面が荒れやすく、電解ピツト即ち微小
な窪みが生じやすい。そのため折角Coを多く含
有したFe(10〜18%)−Co(残)合金を利用して
も、次のメツキ処理における接点材料とリード片
との密着性を阻害し、所期の目的を達成できな
い。 (d) 発明の目的 本発明は、従来のリードスイツチにおけるこの
ような問題を解消し、リード片と接点との密着性
が良く、且つ粘着が発生しにくく、接触抵抗も低
いリードスイツチを実現することを目的とする。 (e) 発明の構成 本発明はこの目的を達成するために、Fe(10〜
18%)−Co(残)合金の強磁性材料からなるリー
ド片を、リン酸濃度が90%以上のリン酸液で電解
研摩してバリ取りを行なつた後、該リード片の接
点部に接点を被着して、密封容器に封入する方法
を採つている。 (f) 発明の実施例 次に本発明によるリードスイツチが実際上どの
ように具体化されるかを実施例で説明する。第3
図は本発明により製造されるリードスイツチを示
した断面図である。リード片2,3は、52アロイ
に代えてFe(10〜18%)−Co(残)合金で構成し
た。そしてこのリード片2,3は、プレス加工後
に、リン酸濃度が90%以上のリン酸液で電解研摩
してバリ取りして表面状態を良くしてから、接点
材料をメツキし、且つ拡散されている。6はこの
ようにしてFe(10〜18%)−Co(残)合金のリード
片2,3の先端に金メツキと拡散処理で作成され
た接点である。またガラス管1中には、不活性ガ
スとしてアルゴンが封入されている。 第4図はこのリードスイツチの製造方法を工程
順に示すブロツク図である。まずFe(10〜18%)
−Co(残)合金の丸棒をプレスして、ガラス管1
内に封入される部分を平に潰して所定の弾性特性
を得る。次に所定の長さに切断した後、プレスに
よる磁気特性の劣化を回復するために、所定の条
件で熱処理(アニール)を行なう。 そして本発明の方法でリード片2,3の電解研
摩を行なう。電解研摩の条件は、リン酸濃度が90
%以上のリン酸液を用いて行なう。 即ち52アロイと同じ条件で電解研摩すると表面
状態が悪化するのは、Fe−Co合金が、52アロイ
に比べて陽極酸化によつて生じる酸化膜の均一性
が劣り、Coの溶出が激しくなるためと考えられ
る。そこで電解研摩液の組成を、リン酸濃度が90
%以上の濃リン酸液(H3PO4)とし、更に必要
に応じてエチレングリコール等を主成分とする添
加剤を加える。そしてリード片を陽極にして、電
解研摩を行なう。 このような濃リン酸液でFe(10〜18%)−Co
(残)合金を電解研摩してバリ取りしたところ、
従来の電解研摩液で電解研摩したものに比べて、
ピツトは発生せず表面荒れのない均一な状態が得
られた。 こうしてバリ取りしたリード片に、金などの接
点材料をメツキする。前記のようにリード片は濃
リン酸液によつて表面状態が均一になつているの
で、メツキの密着性は充分である。接点材料がメ
ツキされたリード片を更に熱処理して、接点材料
とリード片間の拡散を行なう。即ち接点材料がメ
ツキされたリード片2,3を、炉に入れて800±
100℃の温度で、15〜60分間、水素(H2)中で熱
処理し、接点表面にCoを3〜10%原子量拡散さ
せる。前記のように濃リン酸液でバリ取りしたこ
とによりメツキの密着が向上し、更にリード片と
接点材料間が拡散処理されるので、リード片と接
点材料との密着は一層確実となる。 最後にアルゴンガスの雰囲気中でガラス管中に
封着し、検査を行なうことによつて、全製造工程
が終了する。 前記のようにしてリード片中のCoを金接点の
表面まで拡散させたときの、Co析出量との粘着
特性および接触抵抗との関係を第5図に示す。横
軸は金接点表面へのCo析出量(%)、縦軸は粘着
特性(磁歪試験開放値変化率)と接触抵抗値であ
る。Coの拡散量が3%以上になると磁歪試験開
放値変化率が20%以下になり、粘着性が非常に向
上する。一方接触抵抗は、Coの拡散量が少なく
て全部金の方が好ましいが、析出量が6%以下で
あれば金のみの場合の30Ωと殆ど変わらない。10
%程度までは60Ω以下となり、実用上さほど支障
はない。 第6図はFe(10〜18%)−Co(残)合金の拡散処
理温度、時間とCoの析出量との関係を示す図で、
横軸はアニール温度、縦軸はCo析出量である。
前記のように粘着性も接触抵抗も許容値を示す
Co析出量は3〜10%程度であるが、この程度の
Co析出量を得るには、アニール時間が15分の場
合は、700〜900℃程度の温度が適当で、60分の場
合は、760℃以下が適当である。 第7図はFe−Co合金の熱膨張率を示す図で、
横軸はコバルト(Co)中の鉄(Fe)の含有率、
縦軸は熱膨張率である。Fe−Co合金のリード片
2,3を直接ガラス管1に封着するため、該リー
ド片2,3を従来の52アロイなどと同様にガラス
管1に封着した場合にガラス管にクラツクが発生
したりしないように、リード片2,3とガラス管
1との熱膨張率が等しいことが要求される。Fe
−Co合金の場合は、Feの含有率によつて、ガラ
ス管とほぼ等しい熱膨張率が得られる。 即ちガラス管の熱膨張率は117.5±2.5×10-7
℃程度であるが、本発明で用いられるFe−Co合
金は、Feの含有率が8.5〜20%の領域では、ガラ
スと同程度の熱膨張率となつている。 第8図はFe−Co合金の電気抵抗率を示す図で、
横軸はコバルト(Co)中の鉄(Fe)の含有率、
縦軸は電気抵抗率である。ガラスとの熱膨張率が
等しい8.5〜20%Feの領域では、電気抵抗率は12
〜14μΩcm程度で、従来最も多く使用されている
リード片材料である52アロイの電気抵抗率の
35μΩcmよりはるかに優れている。このようにFe
−Co合金は電気抵抗率も低いため、通電した際
の温度上昇が小さく、52アロイより優れているこ
とが確認された。 第9図は12%Fe−88%Co合金と52アロイとの、
電流値に対する抵抗変化率を示す図で、12%Fe
−88%Co合金の方が52アロイより優れている。
第10図は12%Fe−88%Co合金の磁気特性を示
すヒステリシスカーブである。 以上の各特性をまとめると表・1の通りであ
る。
(a) Technical Field of the Invention The present invention relates to a method for manufacturing a reed switch in which reed pieces made of magnetic material are enclosed in a glass tube from both ends, and contacts are opened and closed at mutually overlapping portions of the reed pieces. (b) Background of the technology As shown in Figure 1A, a typical reed switch has a pair of reed pieces 2',
3' is inserted and sealed in an inert gas atmosphere. When the excitation coil 4 placed outside the glass tube 1 is energized, both lead pieces 2',
The magnetic flux passing through 3' closes the gap 5 at the overlapping contact portion of the reed piece and turns on the switch. Next, when the excitation coil 4 is made conductive, the magnetic attraction force of the contact gap 5 disappears, the contact gap 5 opens, and the switch is turned off. The contact portion at the inner end of the lead piece is a contact point 6' made of a noble metal material at the tip of the lead piece 3', 2' as shown in FIG.
is provided to reduce the contact resistance. As the magnetic material for the reed piece, permalloy, especially an alloy of 52% nickel and 48% iron called 52 alloy, is widely used. Contact materials include gold, silver, rhodium, copper, or gold-based alloys (Au-
Materials such as Co, Au-Ni) are used. (c) Prior art and its problems However, when a soft material such as gold or silver is used as a contact material, the excitation coil 4 is de-energized and the excitation magnetic field is turned off due to the adhesion phenomenon between the contact materials. Even if removed, the contact gap 5 tends to remain closed. To prevent this, after plating the contact material on the lead piece, heat treatment is performed for about 20 minutes in an electric furnace in a hydrogen atmosphere to diffuse the base metal and contact material, so that the base metal is uniformly coated on the surface of the contact. I try to separate the parts. However, although this method reduces adhesion to some extent, it has the following drawbacks. (1) Due to the Fe in permalloy, the surface of the contact is easily oxidized and the contact resistance is likely to become unstable. That is,
Since a Fe-Ni oxide film is formed and iron and oxygen coexist, the boundary resistance (film resistance) increases, resulting in a higher level of contact resistance than rhodium (Rh) contacts. (2) Due to the small amount of residual oxygen in the glass tube of the reed switch, an oxide film is formed due to the collision energy when the contact closes during no-load operation, and increases with the number of operations. In other words, as the number of operations increases, bridge wear, or pips and craters, occur, causing contact failures such as increased contact resistance and sticking. The reason is that when current flows between closed contacts, the temperature rises due to Joule heat, softening the contact surface and reducing viscosity. Moreover, since the positive side becomes hotter than the negative side, the softened contact material on the positive side sticks to the cold negative side contact, causing bridge wear on the positive side and creating a depression.
In addition, ions generated on the negative side by shot arc during energization collide with the positive side contact surface, and the powder generated at that time is deposited on the negative side contact surface, further promoting depressions and protrusions. If the protuberance fits into this recess, it becomes locked and adheres, making it difficult to separate the contacts when the excitation magnetic field is removed. These phenomena are especially noticeable at 50V and 100m.
It is likely to occur in the area of A level. In addition to this method of diffusion treatment, by mixing approximately 3% Co into the gold plating solution and performing alloy plating, 3% Co will be added to the gold surface of the contact material.
So-called hard gold mixed with Co is obtained, and the adhesion resistance is improved. Moreover, the contact surface is easily oxidized.
Since Fe does not appear, the contact resistance is also improved compared to the case where diffusion treatment is performed between the 52 alloy and the gold plating. However, unlike the diffusion-treated contacts, the bond between the alloy-plated contacts and the underlying 52 alloy is weak, and the contacts tend to peel off due to repeated temperature changes. In particular, the electrical resistivity of 52 alloy is as high as 35 μΩ·cm, so the current passing through the contacts generates a large amount of heat and is subjected to high temperature cycles, making it even more likely to peel off. In order to solve this problem, the applicant of the present invention proposed an Fe (10-18%)-Co (remainder) alloy as a lead piece material in which the base itself contains a large amount of Co. Since this magnetic material contains 82 to 90% Co, if it is gold-plated as a contact material and then subjected to diffusion treatment, Fe, which is easily oxidized, will not precipitate.
Since Co precipitates, it does not oxidize and increase the contact resistance, and the adhesion between the contact material and the lead piece also improves. However, when Fe (10-18%) - Co (remainder) alloy is used, another problem is that if the deburring performed before the plating process is done by electrolytic polishing, the contact material and lead piece The adhesion of the product deteriorates, and the desired effect cannot be obtained. That is, as shown in FIG. 2, the lead piece is formed into a plate by flattening a part of the round bar 7 with a press, and a contact point is provided at the tip of this plate-shaped part 71. Burr generated 7
If 2 or burrs remain on the tip of the lead piece, it will interfere with the opening/closing operation of the contact, reducing the reliability of the contact operation. In order to remove this burr, there is a barrel polishing method in which the burr is stirred together with an abrasive, but this method may cause the reed piece itself to be deformed. Furthermore, during barrel polishing, the reed pieces are broken up and mixed with the abrasive material, making it difficult to handle during the transition from barrel polishing to the plating process, resulting in poor workability. On the other hand, the electrolytic polishing method requires only immersion in an electrolytic solution, so the reed pieces do not collide with each other and deform, unlike barrel polishing that uses mechanical stirring, and can be held in a constant state. It is easy to handle and has excellent workability when moving on to the next plating process. By the way, when electropolishing 52 alloy, the phosphoric acid concentration is
A 50-70% phosphoric acid solution (H 3 PO 4 ) is used as an electrolytic polishing solution, but a similar phosphoric acid solution with 20% Fe
When the following Fe (10-18%)-Co (remainder) alloy is electrolytically polished, the polished surface tends to be rough and electrolytic pits, that is, minute depressions, are likely to occur. Therefore, even if a Fe (10-18%)-Co (remainder) alloy containing a large amount of Co is used, it will inhibit the adhesion between the contact material and the lead piece during the next plating process, and the intended purpose will not be achieved. Can not. (d) Purpose of the Invention The present invention solves these problems in conventional reed switches, and realizes a reed switch that has good adhesion between the reed piece and the contact, is less prone to adhesion, and has low contact resistance. The purpose is to (e) Structure of the invention In order to achieve this object, the present invention
After deburring a lead piece made of a ferromagnetic material of 18%)-Co (residual) alloy by electrolytic polishing with a phosphoric acid solution with a phosphoric acid concentration of 90% or more, the contact part of the lead piece is A method is used in which the contacts are attached and sealed in a sealed container. (f) Embodiments of the Invention Next, examples will explain how the reed switch according to the present invention is actually implemented. Third
The figure is a sectional view showing a reed switch manufactured according to the present invention. The lead pieces 2 and 3 were made of Fe (10 to 18%)-Co (remainder) alloy instead of 52 alloy. After pressing, these lead pieces 2 and 3 are electrolytically polished using a phosphoric acid solution with a phosphoric acid concentration of 90% or more to remove burrs and improve the surface condition, and then the contact material is plated and diffused. ing. Reference numeral 6 denotes a contact point made by gold plating and diffusion treatment at the tips of the lead pieces 2 and 3 of Fe (10 to 18%)-Co (remainder) alloy. Furthermore, argon is sealed in the glass tube 1 as an inert gas. FIG. 4 is a block diagram showing the method for manufacturing this reed switch in the order of steps. Firstly, Fe (10-18%)
-Press a round bar of Co (residual) alloy to create a glass tube 1.
The portion enclosed within is flattened to obtain predetermined elastic properties. Next, after cutting to a predetermined length, heat treatment (annealing) is performed under predetermined conditions in order to recover the deterioration of magnetic properties caused by pressing. Then, the lead pieces 2 and 3 are electrolytically polished using the method of the present invention. The conditions for electrolytic polishing are a phosphoric acid concentration of 90
% or more of phosphoric acid solution. In other words, the reason why the surface condition deteriorates when electrolytically polished under the same conditions as 52 alloy is that the oxide film produced by anodizing is less uniform in Fe-Co alloy than in 52 alloy, and the elution of Co becomes more intense. it is conceivable that. Therefore, the composition of the electrolytic polishing solution was changed to a phosphoric acid concentration of 90%.
% or more concentrated phosphoric acid solution (H 3 PO 4 ), and if necessary, add additives whose main component is ethylene glycol or the like. Electrolytic polishing is then performed using the lead piece as an anode. Fe (10-18%) - Co with such concentrated phosphoric acid solution
When the (remaining) alloy was electrolytically polished to remove burrs,
Compared to those electrolytically polished using conventional electrolytic polishing liquid,
A uniform condition with no pits and no surface roughness was obtained. The deburred lead pieces are then plated with a contact material such as gold. As mentioned above, since the surface of the reed piece is made uniform by the concentrated phosphoric acid solution, the adhesion of the plating is sufficient. The lead piece plated with the contact material is further heat treated to cause diffusion between the contact material and the lead piece. That is, the lead pieces 2 and 3 plated with contact material are placed in a furnace and heated to 800±
Heat treatment is performed in hydrogen (H 2 ) at a temperature of 100° C. for 15 to 60 minutes to diffuse 3 to 10% atomic weight of Co onto the contact surface. Deburring with a concentrated phosphoric acid solution as described above improves the adhesion of the plating, and since the space between the lead piece and the contact material is subjected to diffusion treatment, the adhesion between the lead piece and the contact material becomes even more reliable. Finally, the entire manufacturing process is completed by sealing in a glass tube in an argon gas atmosphere and inspecting it. FIG. 5 shows the relationship between the amount of Co precipitated, the adhesion properties, and the contact resistance when the Co in the lead piece is diffused to the surface of the gold contact as described above. The horizontal axis is the amount of Co deposited on the gold contact surface (%), and the vertical axis is the adhesive property (magnetostriction test open value change rate) and contact resistance value. When the Co diffusion amount is 3% or more, the magnetostriction test open value change rate is 20% or less, and the adhesiveness is greatly improved. On the other hand, the contact resistance is preferably all gold because the amount of Co diffused is small, but if the amount of precipitation is 6% or less, the contact resistance is almost the same as 30Ω in the case of only gold. Ten
% or less, it is less than 60Ω, which does not pose much of a problem in practice. Figure 6 is a diagram showing the relationship between the diffusion treatment temperature and time of Fe (10 to 18%) - Co (remainder) alloy and the amount of Co precipitation.
The horizontal axis is the annealing temperature, and the vertical axis is the Co precipitation amount.
As mentioned above, both adhesion and contact resistance show acceptable values.
The amount of Co precipitated is about 3 to 10%;
In order to obtain the amount of Co precipitated, a temperature of approximately 700 to 900°C is appropriate when the annealing time is 15 minutes, and a temperature of 760°C or less is appropriate when the annealing time is 60 minutes. Figure 7 is a diagram showing the coefficient of thermal expansion of Fe-Co alloy.
The horizontal axis is the content of iron (Fe) in cobalt (Co),
The vertical axis is the coefficient of thermal expansion. Since the Fe-Co alloy lead pieces 2 and 3 are directly sealed to the glass tube 1, cracks will not occur in the glass tube when the lead pieces 2 and 3 are sealed to the glass tube 1 in the same way as conventional 52 alloy. In order to prevent this from occurring, it is required that the coefficients of thermal expansion of the lead pieces 2 and 3 and the glass tube 1 be equal. Fe
In the case of a -Co alloy, a coefficient of thermal expansion approximately equal to that of a glass tube can be obtained depending on the Fe content. In other words, the coefficient of thermal expansion of the glass tube is 117.5±2.5×10 -7 /
℃, but the Fe-Co alloy used in the present invention has a coefficient of thermal expansion comparable to that of glass in the range of Fe content of 8.5 to 20%. Figure 8 is a diagram showing the electrical resistivity of Fe-Co alloy.
The horizontal axis is the content of iron (Fe) in cobalt (Co),
The vertical axis is electrical resistivity. In the region of 8.5-20% Fe, where the coefficient of thermal expansion is equal to that of glass, the electrical resistivity is 12
~14 μΩcm, which is the electrical resistivity of 52 alloy, the most commonly used lead material.
Much better than 35μΩcm. In this way Fe
-Co alloy has low electrical resistivity, so the temperature rise when electricity is applied is small, and it was confirmed that it is superior to 52 alloy. Figure 9 shows the combination of 12%Fe-88%Co alloy and 52 alloy.
This is a diagram showing the rate of change in resistance with respect to the current value.
-88% Co alloy is better than 52 alloy.
FIG. 10 is a hysteresis curve showing the magnetic properties of a 12%Fe-88%Co alloy. The above characteristics are summarized in Table 1.

【表】 第11図は従来の52アロイと本発明によるFe
(10〜18%)−Co(残)合金のリード片との寿命特
性を、窒素(N2)封入の場合と本発明によるア
ルゴン(Ar)封入の場合を比較する図である。
この図から明らかなように、本発明のFe(10〜18
%)−Co(残)合金を用いたリードスイツチは、
窒素封止した場合でも従来のアルゴン封止したも
のより優れており、Fe(10〜18%)−Co(残)合金
の諸特性の効果が現れている。またアルゴン封止
したFe(10〜18%)−Co(残)合金のリードスイツ
チは、窒素封止したものより更に寿命が向上して
いる。 (g) 発明の効果 以上の各特性図からも明らかなように、Fe(10
〜18%)−Co(残)合金はガラス管との封着性、
電気的特性および磁気特性などのいずれも極めて
優れており、リード片としての特性は、52アロイ
よりも有望である。本発明はこのようなFe(10〜
18%)−Co(残)合金のリード片のバリ取りを濃
リン酸液の電解研摩で行ない、表面状態を均一に
したリード片に接点材料をメツキし拡散処理した
構成になつている。そのため、52アロイなどと違
つて、接触抵抗を悪化させるFeの析出量が少な
く酸化に対し安定なCoが析出するので、接触抵
抗は極めて低く、且つアルゴン封止により酸化が
一層抑制され極めて長寿命となる。また接点表面
までコバルトが析出しているので接点の粘着性も
改善され、リード片のバリ取り時の表面荒れが改
善され、且つリード片と接点材料とが拡散される
ので、接点材料とリード片との密着性も極めて優
れ、一層長寿命となる。
[Table] Figure 11 shows the conventional 52 alloy and the Fe according to the present invention.
FIG. 3 is a diagram comparing the life characteristics of lead pieces made of (10 to 18%)-Co (remainder) alloy in the case of nitrogen (N 2 ) encapsulation and the case of argon (Ar) encapsulation according to the present invention.
As is clear from this figure, Fe (10-18
%) - Reed switch using Co (remainder) alloy,
Even when sealed with nitrogen, it is superior to the conventional one sealed with argon, demonstrating the effects of the various properties of the Fe (10-18%)-Co (balance) alloy. Also, reed switches made of Fe (10-18%)-Co (remainder) alloy sealed with argon have a longer lifespan than those sealed with nitrogen. (g) Effect of the invention As is clear from the above characteristic diagrams, Fe(10
~18%) - Co (remainder) alloy has good sealing properties with glass tubes,
It has extremely excellent electrical and magnetic properties, and its properties as a lead piece are more promising than 52 alloy. The present invention utilizes such Fe (10~
18%) - Co (residual) alloy lead piece is deburred by electrolytic polishing with concentrated phosphoric acid solution, and the contact material is plated and diffused on the lead piece with a uniform surface condition. Therefore, unlike 52 alloy, the amount of precipitated Fe that worsens contact resistance is small, and Co, which is stable against oxidation, is precipitated, so contact resistance is extremely low, and oxidation is further suppressed by argon sealing, resulting in an extremely long life. becomes. In addition, since cobalt is precipitated to the contact surface, the adhesion of the contact is improved, the surface roughness during deburring of the lead piece is improved, and the lead piece and the contact material are diffused, so the contact material and the lead piece are It also has excellent adhesion with other materials, resulting in an even longer lifespan.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は通常のリードスイツチの全体構成と接
点部を示す断面図、第2図はリード片のバリ取り
工程を示す図、第3図は本発明方法により製造さ
れるリードスイツチを示す断面図、第4図は本発
明によるリードスイツチの製造工程を示す工程図
である。第5図以下は本発明によるリードスイツ
チの諸特性を示すもので、第5図は粘着特性と接
触抵抗特性を示す図、第6図はアニール温度・時
間とCo析出量の関係を示す図、第7図はFe含有
量と熱膨張率との関係を示す図、第8図はFe含
有率と電気抵抗率との関係を示す図、第9図は
12Fe,Co合金の抵抗変化率を示す図、第10図
は12Fe,Co合金のヒステリシスカーブを示す図、
第11図は封入ガスの違いによる寿命特性を示す
図である。 図において、1はガラス管、2,3はリード
片、4は励磁コイル、5は接点ギヤツプ、6は金
接点、71はリード片の平板状部、72はバリを
それぞれ示す。
Fig. 1 is a sectional view showing the general structure and contact portion of a conventional reed switch, Fig. 2 is a sectional view showing the deburring process of the reed piece, and Fig. 3 is a sectional view showing a reed switch manufactured by the method of the present invention. , FIG. 4 is a process diagram showing the manufacturing process of the reed switch according to the present invention. Figure 5 and subsequent figures show various characteristics of the reed switch according to the present invention. Figure 5 is a diagram showing adhesive properties and contact resistance characteristics, Figure 6 is a diagram showing the relationship between annealing temperature and time and Co precipitation amount, Figure 7 is a diagram showing the relationship between Fe content and thermal expansion coefficient, Figure 8 is a diagram showing the relationship between Fe content and electrical resistivity, and Figure 9 is a diagram showing the relationship between Fe content and electrical resistivity.
A diagram showing the resistance change rate of 12Fe, Co alloy, Figure 10 is a diagram showing the hysteresis curve of 12Fe, Co alloy,
FIG. 11 is a diagram showing the life characteristics depending on the difference in filler gas. In the figure, 1 is a glass tube, 2 and 3 are lead pieces, 4 is an excitation coil, 5 is a contact gap, 6 is a gold contact, 71 is a flat plate portion of the lead piece, and 72 is a burr.

Claims (1)

【特許請求の範囲】 1 Fe(10〜18%)−Co(残)合金の強磁性材料か
らなるリード片を、リン酸濃度が90%以上のリン
酸液で電解研摩してバリ取りを行なつた後、該リ
ード片の接点部に接点を被着して、密封容器に封
入することを特徴としたリードスイツチの製造方
法。 2 前記密封容器にリード片を封入する際にアル
ゴンガスを封入することを特徴とした特許請求の
範囲第1項記載のリードスイツチの製造方法。
[Claims] 1. A lead piece made of a ferromagnetic material of Fe (10 to 18%)-Co (remainder) alloy is deburred by electrolytic polishing with a phosphoric acid solution having a phosphoric acid concentration of 90% or more. 1. A method for manufacturing a reed switch, characterized in that after the reed piece has aged, a contact is attached to the contact part of the reed piece, and the reed piece is sealed in a sealed container. 2. The method for manufacturing a reed switch according to claim 1, wherein argon gas is sealed when the reed piece is sealed in the sealed container.
JP17890082A 1982-10-12 1982-10-12 Lead switch Granted JPS5968117A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17890082A JPS5968117A (en) 1982-10-12 1982-10-12 Lead switch

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17890082A JPS5968117A (en) 1982-10-12 1982-10-12 Lead switch

Publications (2)

Publication Number Publication Date
JPS5968117A JPS5968117A (en) 1984-04-18
JPH0113177B2 true JPH0113177B2 (en) 1989-03-03

Family

ID=16056645

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17890082A Granted JPS5968117A (en) 1982-10-12 1982-10-12 Lead switch

Country Status (1)

Country Link
JP (1) JPS5968117A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6601031B2 (en) 2015-07-17 2019-11-06 住友電気工業株式会社 Reed switch wire, reed switch lead piece and reed switch

Also Published As

Publication number Publication date
JPS5968117A (en) 1984-04-18

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