JPH0116037B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to improvements in board manufacturing equipment such as developing machines, etching machines, and peeling machines for forming circuit patterns and the like on printed wiring boards.

Recently, electronic parts and semiconductor parts have become smaller and lighter.
As the sophistication continues to advance, printed wiring boards are also required to be further miniaturized, more precise, and finely patterned. In other words, the width of circuits formed on printed wiring boards has increased from the conventional 2.5 mm.
The size of the circuit pattern has been reduced to 0.15mm and 0.1mm, and the circuit pattern that used to be passed between the pins of an IC has increased from one to two to three, and the diameter of the parts mounting part formed on the printed wiring board has also become smaller. The through holes and conduction diameters have been miniaturized from 2.5mm to 1.27mm, and from 0.8mm to 0.5mm to 0.2mm. This trend is expected to further develop in the future, with further miniaturization and miniaturization expected.

However, the manufacturing equipment such as developing machines, etching machines, peeling machines, etc. that spray various chemical solutions to form circuit patterns etc. of printed wiring boards are currently being used as they are with conventional structures. The situation of miniaturization and miniaturization has reached its limit, and the occurrence of defects has increased significantly.

For example, a conventional etching machine will be explained with reference to FIG. A printed wiring board (hereinafter simply referred to as the board) 2 has been transported in the transport direction A by the conveyor 1 from the development process, which is the previous process.
On the other hand, the chemical solution 4 is sprayed from a large number of nozzles 3,
A predetermined portion of the copper foil is etched to form a circuit pattern or the like.

Now, in order to accurately form a predetermined fine circuit pattern, etc., the most important issue is to uniformly and evenly spray the chemical solution 4 from the nozzle 3 onto the outer surface of the substrate 2. Therefore, in order to achieve this uniform spray, in the conventional example,
Transfer direction A of the substrate 2 without fixing the nozzle 3
The drive mechanism 5 was used to draw a trajectory that intersects with the one shown in FIG.

However, as shown in FIG. 2, in this conventional method, when etching the circuit pattern ₂₁ in the direction B that crosses the conveyance direction A of the substrate 2, it is necessary to spray the etching smoothly into the groove ₂₂ that is being formed. As a result of the flow of the chemical liquid 4, uniformity of the chemical liquid 4 is reliably maintained, but the etching of the circuit pattern ₂₃ along the conveyance direction A of the substrate 2 is affected by the sprayed chemical liquid as shown in FIG. A large amount of the chemical liquid 4 may bounce off the circuit pattern 2 ₃ which is a convex portion to be formed, or a large amount of liquid may remain in the groove 2 ₂ that is being formed between the circuit patterns 2 ₃ . As a result, the uniformity of the chemical liquid 4 described above cannot be ensured. In this way, if the uniformity of the chemical solution 4 is inhibited and uneven spraying occurs, residual corrosion of the copper foil will remain in the areas where the liquid pools have occurred. If conduction occurs between ₃ and 2 ₃ and a shot accident occurs, and secondly, especially if the chemical solution 4 is sprayed to remove the residue on the copper foil, the side surface of the circuit pattern 2 ₃ is eroded from the concave groove ₂ side, making it impossible to maintain the set pattern width, or causing damage to some parts, resulting in the current carrying capacity being reduced from the design value, and when used after the fact, at that part. There were problems such as heat generation.

For example, according to an experimental example using this conventional method, chloride When etched with 2 copper solution,
As the circuit pattern 2 ₃ along the conveyance direction A of the substrate 2 is eroded and becomes thinner, the error between the circuit pattern 2 ₁ and the circuit pattern 2 ₃ reaches 0.05 mm or more, and the formation of a fine pattern is significantly reduced. It was becoming difficult. As described above, in the substrate 2 which is becoming increasingly finer and miniaturized, these problems caused by insufficient or excessive amounts of the chemical solution 4 due to uneven spraying have even become fatal defects.

Although the problems with conventional etching machines have been described above, the same situation also applies to conventional developing machines that spray chemical solutions. That is, the uniformity of the developer sprayed from the nozzle is difficult to maintain when forming the circuit pattern ₂₃ along the transport direction A of the substrate 2, as described above, resulting in uneven spraying and liquid pooling. The cured film portion exposed to light is eroded, and some areas are left undeveloped due to sharpness, resulting in large positive and negative errors in circuit width due to development, and the above-mentioned problems in circuit pattern formation in the etching process. This was further amplified, causing problems such as shots and heat generation during subsequent use.

Furthermore, the same situation applies to a peeling machine that removes the photosensitive and cured film portion by spraying a chemical solution after the etching process.

Conventional board manufacturing equipment has been pointed out to have such problems.

In view of the above circumstances, the present invention has been made as a result of the inventor's earnest research efforts in order to solve the problems of the above-mentioned conventional example. An object of the present invention is to provide a substrate manufacturing apparatus in which uniformity of chemical spray is ensured by providing a first nozzle and a second nozzle.

The present invention will be explained below based on one embodiment shown in FIG.

First, the basic configuration that characterizes the present invention will be explained.

This board manufacturing apparatus has a circuit pattern 2 on a board 2.
₁ , 2, ₃ , etc. developing machine, etching machine,
Regarding peeling machines, etc. Then, a number of first nozzles arranged to spray the chemical liquid 4 onto the substrate 2 transported by the conveyor 1 are repeatedly operated by the drive mechanism 6 in a trajectory substantially along the transport direction A of the substrate 2. It consists of a nozzle 7 and a large number of second nozzles 9 that are repeatedly operated by a drive mechanism 8 in a trajectory that intersects the transport direction A of the substrate 2.

Next, regarding the details of the configuration of this board manufacturing equipment,
This will be explained using an example of the illustrated etching machine.

Reference numeral 1 denotes a conveyor such as a roll conveyor, which places and transfers the substrate 2 and conveys it in the conveyance direction A.

A large number of first nozzles 7 are arranged opposite to the outer surface of the substrate 2 being transported. This first nozzle 7 is repeatedly operated by the drive mechanism 6, tracing a trajectory exactly or approximately along the conveyance direction A. That is, in the illustrated example, a large number of first nozzles 7 are provided in series at the lower part of pipes 10, 10, . It is being One end of the pipes 10, 10, . . . is connected to a drive mechanism 6 connected to a swing motor 13 via a connecting rod 11, a crank 12, etc. The other end of the pipe 10, 10, ... is the pipe 1
4. It is communicated via a pump 15 to a chemical tank at the bottom of the etching chamber 16. In this illustrated example, since the pipe 10 is repeatedly rotated by the drive mechanism 6, the first nozzle 7 follows a predetermined trajectory and performs a repetitive rocking motion and neck vibration motion, as shown in FIG. 5a. However, as shown in FIG. 5b, the pipe 10, the first
By repeatedly sliding the nozzle 7 along the conveyance direction A using another drive mechanism,
A predetermined trajectory may be drawn.

Next, on the downstream side of the first nozzle 7 in the transport direction A of the substrate 2, a number of second nozzles 9 are arranged to face the outer surface of the substrate 2 that is also transported. This second nozzle 9 is repeatedly operated by the drive mechanism 8, tracing a linear locus that intersects the conveyance direction A at an angle of 90 degrees, for example. This cross angle is appropriately determined depending on the direction of the circuit pattern 2 ₁ formed on the substrate 2 . In the illustrated example, the large number of second nozzles 9 are provided in series at the lower portions of pipes 17, 17, . . . installed in parallel above the conveyor 1 along the conveyance direction A. One end of the pipes 17, 17, . . . is connected to a drive mechanism 8 connected to a swing motor 20 via a connecting rod 18, a crank 19, etc. The other end of the pipe 17, 17,...
Etching chamber 16 via piping 21 and pipe 22
It is connected to the chemical tank at the bottom. Note that the first
As in the case of nozzle 7, this second nozzle 9 also
In addition to the swinging motion as shown in the illustrated row, it may also be configured to draw a predetermined trajectory by sliding motion.

The substrate manufacturing apparatus according to the present invention is configured as described above.

Next, its operation will be explained.

The substrate 2 that has been developed in the pre-process development process and transported in the transport direction A by the conveyor 1 is
Etched in the etching process.

That is, first, a chemical solution 4 such as cupric chloride is sprayed onto the substrate 2 from a plurality of first nozzles 7 through a pipe 15, and the photoresist film on the outer surface of the substrate 2 is peeled off and exposed in the pre-development process. The copper foil portion is etched due to corrosion, while the photoresist film on the outer surface is hardened and the remaining copper foil portion is left as is, and the circuit pattern 2 ₃ along the conveyance direction A is formed.
is formed first and foremost. That is, at this time, since the first nozzle 7 is repeatedly operated by the drive mechanism 6 while tracing a trajectory substantially along the conveyance direction A of the substrate 2, the inside of the groove 2 ₂ being formed between the circuit patterns 2 ₃ is moved in the same manner. The chemical liquid 4 sprayed in the direction is flowed, there is no accumulation of liquid pools, and there is no large amount of the chemical liquid 4 splashing.
Uniform spraying of the chemical solution 4 is reliably achieved in this respect.

The substrate 2, on which the circuit pattern ₂₃ has been formed first in this way, is transferred to the second layer by the conveyor 1.
It is transported to an area facing the nozzle 9, and the chemical liquid 4 is injected from the second nozzle 9 by the pipe 22 to form a circuit pattern 2 ₁ in the direction B crossing the transport direction A in the same manner as described above. That is, at this time, since the second nozzle 9 is repeatedly operated by the drive mechanism 8 in a trajectory that crosses the transport direction A of the substrate 2, it moves in the same direction within the groove 2 ₂ that is being formed between the circuit patterns 2 ₁ . The injected chemical solution 4 is flowed away, there is no stagnation of the solution, and there is no large amount of the chemical solution 4 splashing back, and uniform spraying of the chemical solution 4 is reliably achieved in this respect.

Furthermore, the component mounting portion 2 ₄ (see FIG. 2) formed on the substrate 2 also has a uniform spray around it by ejecting the chemical solution 4 from two directions from the first nozzle 7 and the second nozzle 9. definitely achieved.

In this way, uniform spraying of the chemical solution 4 is achieved, and as a result, the circuit pattern 2 ₃ ,
₂₁ , no copper foil residue remains in the groove ₂₂ , and the side surfaces thereof are not eroded, making it possible to reliably obtain a predetermined circuit width. Furthermore, since the sprayed chemical liquid 4 is also uniformized on the circuit patterns 2 ₃ and 2 ₁ in each direction, etching of both the circuit patterns 2 ₃ and 2 ₁ can be achieved with the same precision.

The above is the explanation of the operation.

In the above embodiment, first the first nozzle 7 is disposed along the conveying direction A, and then the second nozzle 7 is disposed along the conveying direction A.
Although the nozzle 9 is disposed, the present invention is not limited thereto, and first the second nozzle 9 is disposed.
Then, the first nozzle 7 may be arranged.

Further, an appropriate number of first nozzles 7 and second nozzles 9 may be arranged alternately.

Furthermore, in the embodiment described above, the first nozzle 7 and the second nozzle 9 are arranged in one etching chamber 16, but they may be arranged in separate etching chambers.

Furthermore, in the above-described embodiment, the nozzle 3 sprays the chemical liquid 4 onto the substrate 2 from above, but the present invention is not limited thereto, and may be sprayed from below or from the left or right. good.

Further, although the above-mentioned embodiment is applied to an etching machine, the present invention is not limited thereto, and may be applied to a developing machine used in a pre-process.
That is, a photoresist film attached to the outer surface of the substrate 2 is exposed to light by applying a circuit photograph to it, leaving the exposed and hardened photoresist film part, and other parts of the photoresist film are melted by spraying a chemical solution through a nozzle. However, in this case, as in the previous embodiment, by providing the first nozzle 7 and the second nozzle 9, each of which operates repeatedly by tracing a predetermined trajectory, the splashing of the chemical liquid 4, The problem of liquid pooling is solved, a uniform spray of the chemical solution 4 is ensured, a predetermined circuit width is formed without eroding the cured photoresist film, and the circuit pattern in each direction can be developed with the same accuracy. It will be achieved.

Furthermore, the peeling machine used in the post-process also exhibits similar functions and effects.

As explained above, the board manufacturing apparatus according to the present invention includes the first nozzle and the second nozzle, each of which operates repeatedly by drawing a predetermined trajectory, so that the chemical solution sprayed from each nozzle can be applied to the printed wiring board. uniformity of spray on the outer surface of the
Each circuit pattern in both the vertical and horizontal directions is sprayed uniformly and finished with the same precision, and the circuit width is maintained at the specified size and will not be eroded, so there is no shortening or heat generation during use. Even with the recent miniaturization and miniaturization of circuit patterns, it is possible to obtain reliable products without defects, and to form printed wiring boards that are smaller, lighter, more precise, and finely patterned. It is expected that this will become a decisive factor in the dramatic miniaturization and weight reduction of electronic components in the future, and its effects will be significant, such as eliminating the problems that existed in conventional devices of this type. There is something big.

[Brief explanation of drawings]

FIG. 1 is a schematic front sectional view showing a conventional substrate manufacturing apparatus. FIG. 2 is an enlarged plan view showing an example of a printed wiring board. FIG. 3 is a side view of a main part showing a state in which a chemical solution is sprayed by a conventional substrate manufacturing apparatus. FIG. 4 is a schematic cross-sectional plan view showing one embodiment of the substrate manufacturing apparatus according to the present invention. FIG. 5 shows an example of the operation of the nozzle, and FIG. 5 is a front view of the main part of the nozzle, in which FIG. 5A shows a swinging type and FIG. 5B shows a sliding type. Brief explanation of symbols 1...conveyor, 2...printed wiring board, 2 ₁ ...circuit pattern, 2 ₂ ...concave groove,
2 ₃ ... circuit pattern, 2 ₄ ... component mounting section, 3 ... nozzle, 4 ... chemical solution, 5 ... drive mechanism, 6 ... drive mechanism, 7
...first nozzle, 8...drive mechanism, 9...second nozzle,
10...pipe, 11...connecting rod, 12...crank,
13... Swing motor, 14... Piping, 15... Pump, 16... Etching chamber, 17... Pipe, 18...
Connecting rod, 19... Crank, 20... Oscillating motor, 21... Piping, 22... Pump, A... Conveying direction,
B...Cross direction.

Claims (1)

[Scope of Claims] 1. In a board manufacturing apparatus used in the development and etching process for forming circuit patterns, etc. on printed wiring boards, a nozzle is provided to spray a chemical onto the printed wiring boards being conveyed by a conveyor. , a large number of first nozzles that are repeatedly operated by a drive mechanism by drawing a trajectory substantially along the conveyance direction of the printed wiring board, and a plurality of first nozzles that are repeatedly operated by the drive mechanism by drawing a trajectory that crosses the conveyance direction of the printed wiring board. A substrate manufacturing apparatus comprising: a plurality of second nozzles;