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JPH0117748B2 - - Google Patents
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JPH0117748B2 - - Google Patents

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Publication number
JPH0117748B2
JPH0117748B2 JP56047525A JP4752581A JPH0117748B2 JP H0117748 B2 JPH0117748 B2 JP H0117748B2 JP 56047525 A JP56047525 A JP 56047525A JP 4752581 A JP4752581 A JP 4752581A JP H0117748 B2 JPH0117748 B2 JP H0117748B2
Authority
JP
Japan
Prior art keywords
nozzle
solvent
shielding
solution
side wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56047525A
Other languages
Japanese (ja)
Other versions
JPS57162666A (en
Inventor
Muneo Nakayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Priority to JP4752581A priority Critical patent/JPS57162666A/en
Publication of JPS57162666A publication Critical patent/JPS57162666A/en
Publication of JPH0117748B2 publication Critical patent/JPH0117748B2/ja
Granted legal-status Critical Current

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  • Coating Apparatus (AREA)

Description

【発明の詳細な説明】 本発明は被処理物の表面に溶液を滴下するノズ
ルを備えた液滴下装置に関し、特にノズル先端の
周縁部において溶液が濃縮されたり、溶質が析出
しないようにした液滴下装置に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a liquid dropping device equipped with a nozzle for dropping a solution onto the surface of a workpiece, and in particular to a liquid dropping device that prevents the solution from concentrating or solute from precipitating at the periphery of the nozzle tip. Regarding a dropping device.

ノズルを用いて被処理物表面に溶液を滴下する
装置は、ホトレジスト或いは金属酸化膜形成用の
溶液、若しくは拡散剤を含んだ溶液などを被処理
物表面に塗布する場合に広く用いられる。
2. Description of the Related Art An apparatus that uses a nozzle to drop a solution onto the surface of a workpiece is widely used when applying a solution for forming a photoresist or a metal oxide film, a solution containing a diffusing agent, or the like onto the surface of a workpiece.

例えばIC,LSI等の製作過程において、ホトレ
ジスト或いは拡散剤等の塗布液をウエハー上に塗
布するには第2図に示す如き装置を用いている。
即ち、斯る装置は上面を開口した円筒状のケース
20内に、スピンナー21を回転自在に配し、こ
のスピンナー21上に載置したウエハー22の表
面中心部にノズル23から塗布液を数滴滴下せし
めた後、スピンナー21によつてウエハー22を
高速回転せしめ、遠心力により塗布液をウエハー
22表面に均等に塗布するようにしたものであ
る。
For example, in the manufacturing process of ICs, LSIs, etc., an apparatus as shown in FIG. 2 is used to apply a coating liquid such as photoresist or a diffusion agent onto a wafer.
That is, in such an apparatus, a spinner 21 is rotatably arranged in a cylindrical case 20 with an open top, and several drops of a coating liquid are applied from a nozzle 23 to the center of the surface of a wafer 22 placed on the spinner 21. After dropping, the wafer 22 is rotated at high speed by a spinner 21, and the coating liquid is evenly applied to the surface of the wafer 22 by centrifugal force.

そしてノズル23から塗布液を滴下すると、表
面張力などの影響によつて若干の溶液がノズル先
端周縁部23aに残留することになる。ここで塗
布液は樹脂又は拡散剤等を有機溶媒等の溶剤で溶
解した溶液からなつており、且つ該溶剤は揮発度
が高いため、ノズル先端周縁部に残留した塗布液
は、時間の経過につれて溶剤のみが揮散して徐々
に濃縮され、最終的には溶質たる樹脂又は拡散剤
等を析出する。
When the coating liquid is dripped from the nozzle 23, some of the solution remains on the nozzle tip periphery 23a due to the influence of surface tension and the like. The coating liquid here consists of a solution in which a resin or a diffusing agent, etc. is dissolved in a solvent such as an organic solvent, and since the solvent has a high volatility, the coating liquid remaining on the periphery of the nozzle tip will dissolve over time. Only the solvent is volatilized and gradually concentrated, and finally the solute, such as the resin or the diffusing agent, is precipitated.

このような濃縮溶液、或いは析出物が被処理物
であるウエハー上に落下すると、塗布ムラとウエ
ハー間の被膜厚のバラツキを生じ不良品を製作す
ることとなり、製品歩留りの面等において極めて
不利である。
If such a concentrated solution or precipitate falls onto the wafer being processed, it will cause uneven coating and variations in film thickness between wafers, resulting in the production of defective products, which is extremely disadvantageous in terms of product yield, etc. be.

斯る不利を解消すべく従来にあつては、スポン
ジ、布若しくはこれらに溶剤を浸み込ませたもの
を用いてノズル先端周縁部を拭きとり、濃縮した
溶液又は析出物がウエハー上に落下するのを防い
でいる。しかしながら、このような手段では手作
業に頼らざるを得ず、ノズルとスピンナーヘツド
との空間が狭い場合には拭き取り作業が困難とな
る。また拭き取り作業を行なうとスピンナヘツド
上或いはスピンナケース底面に異物が落下し、ス
ピンナーの回転でこれが舞い上り、ウエハー表面
に異物が付着する虞れが多分にある。そして更
に、塗布工程とこれに前後する他の工程とを連続
せしめた場合に、塗布工程において作業が一時中
断することになり、自動化を企図することができ
ず量産性の向上を阻害している。
In order to eliminate this disadvantage, in the past, the periphery of the nozzle tip was wiped using a sponge, cloth, or something impregnated with a solvent, and the concentrated solution or precipitate fell onto the wafer. It prevents However, such a method requires manual work, and if the space between the nozzle and the spinner head is narrow, the wiping operation becomes difficult. Furthermore, when wiping is performed, there is a high possibility that foreign matter will fall onto the spinner head or the bottom of the spinner case, and when the spinner rotates, this foreign matter will fly up and adhere to the wafer surface. Furthermore, when the coating process and other processes that precede and follow it are made to be continuous, the work is temporarily interrupted during the coating process, making it impossible to plan for automation and hindering the improvement of mass productivity. .

本発明者は上述の如き技術的課題に鑑み、これ
を有効に解決すべく本発明を為したものであり、
その目的とする処はノズル先端部を拭き取り等の
洗浄作業を行なわなくとも、先端周縁部において
溶液が濃縮したり、或いは溶質が析出したりする
ことがない液滴下装置を提供するにある。
In view of the above-mentioned technical problems, the present inventor has devised the present invention to effectively solve the problems.
The objective is to provide a liquid dropping device that does not cause the solution to concentrate or the solute to precipitate at the periphery of the nozzle tip, even without cleaning the nozzle tip by wiping the tip.

斯る目的を達成すべく本発明はノズル先端部を
囲む遮蔽体によつて遮蔽室を形成し、この遮蔽室
内を溶剤蒸気雰囲気とするための溶剤の貯留部を
遮蔽室内に設けたことをその要旨としている。
In order to achieve such an object, the present invention forms a shielding chamber by a shielding body surrounding the nozzle tip, and provides a solvent storage part in the shielding chamber to create a solvent vapor atmosphere in the shielding chamber. This is the summary.

以下に本発明の好適な実施例を添付図面に従つ
て詳述する。
Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

第1図は本発明に係る液滴下装置1の要部を示
すものであり、2は装置1のスピンナーケースに
回転自在に支承されたスピンナーである。このス
ピンナー2は回転軸3と載置盤4とからなり、軸
3には真空ポンプ等と連通する貫通孔を穿設する
とともに、載置板4にはこの貫通孔に連なる凹溝
を形成し、載置板4上に載置したウエハー5を吸
引固定するようにしている。
FIG. 1 shows the main parts of a liquid dropping device 1 according to the present invention, and 2 is a spinner rotatably supported by a spinner case of the device 1. As shown in FIG. This spinner 2 consists of a rotating shaft 3 and a mounting plate 4. The shaft 3 has a through hole that communicates with a vacuum pump, etc., and the mounting plate 4 has a groove connected to the through hole. , the wafer 5 placed on the mounting plate 4 is fixed by suction.

またスピンナー2の上方にはノズル6と、この
ノズル6を囲む遮蔽体7を配設し、この遮蔽体7
によつてノズル6の先端部6aが臨む遮蔽室8を
形成している。即ち、遮蔽体7は略々円筒状の側
壁7aと、この側壁7aの上端部に設けられノズ
ルの挿通孔9が形成された上蓋7bと、側壁7a
の下端部に設けられ中央部が上方に立ち上つた裁
頭円錐形の底蓋7cとからなつており、この底蓋
7cの中央部にノズル6から落下する滴下液が通
過する穴10を形成している。
Further, a nozzle 6 and a shield 7 surrounding this nozzle 6 are arranged above the spinner 2, and this shield 7
This forms a shielding chamber 8 that the tip 6a of the nozzle 6 faces. That is, the shielding body 7 includes a substantially cylindrical side wall 7a, an upper lid 7b provided at the upper end of the side wall 7a and having a nozzle insertion hole 9 formed therein, and the side wall 7a.
It consists of a bottom cover 7c in the shape of a truncated cone, which is provided at the lower end and whose center part rises upward, and a hole 10 is formed in the center of the bottom cover 7c, through which the dripping liquid falling from the nozzle 6 passes. are doing.

このように側壁7a、上蓋7b、底蓋7cとに
よつて構成される遮蔽体7の上蓋7bの挿通孔9
にノズル6を通し、ノズル6の中間部に上蓋7b
を一体的に固着し、遮蔽体7で区画される遮蔽室
8の中央部にノズル先端6aを位置せしめてい
る。そして上記底蓋7cと側壁7aとによつて溶
剤11の貯留部であるパン12を形成している。
尚、遮蔽室8に臨むノズル6は、上記上蓋7bの
挿通孔9に昇降自在に挿通せしめてもよい。
As described above, the insertion hole 9 of the upper lid 7b of the shielding body 7 is constituted by the side wall 7a, the upper lid 7b, and the bottom lid 7c.
Pass the nozzle 6 through the nozzle 6, and attach the upper cover 7b to the middle part of the nozzle 6.
are integrally fixed, and the nozzle tip 6a is located in the center of a shielding chamber 8 partitioned by a shielding body 7. A pan 12, which is a reservoir for the solvent 11, is formed by the bottom lid 7c and the side wall 7a.
The nozzle 6 facing the shielding chamber 8 may be inserted into the insertion hole 9 of the upper lid 7b so as to be able to move up and down.

而して、遮蔽室8内は上記パン12から蒸発す
る有機溶剤等の蒸気によつて飽和され、ノズル先
端周縁部に表面張力等によつて残留する溶液中の
溶剤は蒸発することがない。
Therefore, the inside of the shielding chamber 8 is saturated with the vapor of the organic solvent etc. evaporated from the pan 12, and the solvent in the solution remaining at the periphery of the nozzle tip due to surface tension etc. does not evaporate.

次に第1図に示した装置を用いた場合の実施例
をもつて本発明の具体的効果を説明する。
Next, specific effects of the present invention will be explained using an example in which the apparatus shown in FIG. 1 is used.

実験例 溶剤パンにあらかじめ有機溶剤たるエチルアル
コールを入れておき、遮蔽室内をエチルアルコー
ルの蒸気雰囲気として、内径1mmのノズルから東
京応化工業(株)製の拡散剤(OCD SiFilm,SiO2
度5.9%:主溶剤はエチルアルコール)を滴下し
た。
Experimental example Ethyl alcohol, an organic solvent, is placed in a solvent pan in advance, and a vapor atmosphere of ethyl alcohol is created in the shielded chamber. A diffusing agent manufactured by Tokyo Ohka Kogyo Co., Ltd. (OCD SiFilm, SiO 2 concentration 5.9%) is applied through a nozzle with an inner diameter of 1 mm. : The main solvent was ethyl alcohol) was added dropwise.

滴下後1時間放置しておいても、ノズルの先端
周縁部には固形物の析出及び拡散剤溶液の濃縮は
認められなかつた。
Even after being left for one hour after dropping, no solid matter was deposited on the periphery of the tip of the nozzle, and no concentration of the diffusing agent solution was observed.

一方パンの中に有機溶剤を入れず、遮蔽室内を
空気で満した状態で、上記と同様に拡散剤溶液を
滴下した。この場合には滴下後5分経過したとき
すでにノズル先端周縁部に固形物が析出してい
た。以上の実験条件は温度25℃、湿度60%であつ
た。
On the other hand, the diffusing agent solution was dropped into the pan in the same manner as above, with the shielding chamber filled with air without putting any organic solvent into the pan. In this case, solid matter had already precipitated around the periphery of the nozzle tip 5 minutes after dropping. The above experimental conditions were a temperature of 25°C and a humidity of 60%.

以上の説明で明らかな如く、本発明によれば、
ノズルを遮蔽体によつて囲んで遮蔽室を形成し、
この遮蔽室に溶剤の貯留部を設けたので、ノズル
先端部が臨む遮蔽室内が常に溶剤蒸気によつて飽
和状態とされ、このためノズル先端部に残つた溶
液から溶剤が蒸発することがなく、ノズル先端部
において溶液が濃縮されたり、或いは溶質が析出
することがない。
As is clear from the above description, according to the present invention,
A shielding chamber is formed by surrounding the nozzle with a shielding body,
Since a solvent reservoir is provided in this shielded chamber, the interior of the shielded chamber facing the nozzle tip is always saturated with solvent vapor, which prevents the solvent from evaporating from the solution remaining at the nozzle tip. The solution will not be concentrated or the solute will not precipitate at the nozzle tip.

したがつて被処理物表面への濃縮溶液或いは溶
質である固形物の落下を未然に防ぐことができ、
製品歩留りを飛躍的に向上せしめることができ
る。更に手作業によりノズル先端周縁部を拭き取
り等する必要がなく、塗布工程とこれに前後する
工程とを一体連続工程化することができるので量
産性の向上を図ることができ、製品のコストダウ
ンに資する等多大の利点を発揮する。
Therefore, it is possible to prevent solids such as concentrated solutions or solutes from falling onto the surface of the object to be treated,
Product yield can be dramatically improved. Furthermore, there is no need to manually wipe the periphery of the nozzle tip, and the coating process and the processes surrounding it can be integrated into a continuous process, improving mass production and reducing product costs. It offers many advantages such as contributing to

【図面の簡単な説明】[Brief explanation of drawings]

図面は本発明の好適実施例及び従来例を示すも
のであり、第1図は本発明に係る液滴下装置の要
部の縦断側面図、第2図は従来装置の縦断側面図
である。 尚図面中1は液滴下装置、5は被処理物、6は
ノズル、7は遮蔽体、7aは側壁、7cは底蓋、
8は遮蔽室、12は溶剤の貯留パンである。
The drawings show a preferred embodiment of the present invention and a conventional example, and FIG. 1 is a longitudinal sectional side view of the essential parts of the liquid dropping device according to the present invention, and FIG. 2 is a longitudinal sectional side view of the conventional device. In the drawings, 1 is a droplet dropping device, 5 is an object to be treated, 6 is a nozzle, 7 is a shield, 7a is a side wall, 7c is a bottom cover,
8 is a shielded chamber, and 12 is a solvent storage pan.

Claims (1)

【特許請求の範囲】[Claims] 1 被処理物上に溶液を滴下するノズルと、この
ノズルが臨むとともに、ノズルからの滴下液が通
過するための開口部を有する遮蔽室を形成する遮
蔽体と、上記遮蔽室内を溶剤蒸気雰囲気とすべく
遮蔽室内に設けられた溶剤の貯留パンとからな
り、該溶剤の貯留パンは、遮蔽室の側壁と、この
側壁の下端部に設けられ中央部が上方に立ち上が
つた裁頭円錐形の底蓋とから形成されていること
を特徴とする液滴下装置。
1. A nozzle for dropping a solution onto a workpiece, a shielding body that forms a shielding chamber facing the nozzle and having an opening through which the liquid dripped from the nozzle passes, and a solvent vapor atmosphere inside the shielding chamber. The solvent storage pan is composed of a side wall of the shielded chamber, and a truncated conical shape provided at the lower end of the side wall with a central portion rising upward. A liquid dropping device characterized in that it is formed from a bottom lid.
JP4752581A 1981-03-30 1981-03-30 Liquid dropping device Granted JPS57162666A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4752581A JPS57162666A (en) 1981-03-30 1981-03-30 Liquid dropping device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4752581A JPS57162666A (en) 1981-03-30 1981-03-30 Liquid dropping device

Publications (2)

Publication Number Publication Date
JPS57162666A JPS57162666A (en) 1982-10-06
JPH0117748B2 true JPH0117748B2 (en) 1989-03-31

Family

ID=12777531

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4752581A Granted JPS57162666A (en) 1981-03-30 1981-03-30 Liquid dropping device

Country Status (1)

Country Link
JP (1) JPS57162666A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4748742B2 (en) * 2009-02-13 2011-08-17 東京エレクトロン株式会社 Substrate processing apparatus and substrate processing method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5081067A (en) * 1973-11-16 1975-07-01
JPS5165882A (en) * 1974-12-05 1976-06-07 Sony Corp Fuotorejisutono tofuhoho
JPS528383U (en) * 1975-07-02 1977-01-20

Also Published As

Publication number Publication date
JPS57162666A (en) 1982-10-06

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