JPH01210429A - Production of woven glass fiber fabric - Google Patents
Production of woven glass fiber fabricInfo
- Publication number
- JPH01210429A JPH01210429A JP3561688A JP3561688A JPH01210429A JP H01210429 A JPH01210429 A JP H01210429A JP 3561688 A JP3561688 A JP 3561688A JP 3561688 A JP3561688 A JP 3561688A JP H01210429 A JPH01210429 A JP H01210429A
- Authority
- JP
- Japan
- Prior art keywords
- glass fiber
- woven fabric
- fiber woven
- glass
- organic compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003365 glass fiber Substances 0.000 title claims abstract description 75
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000004744 fabric Substances 0.000 title abstract description 15
- 239000002759 woven fabric Substances 0.000 claims abstract description 73
- 150000002894 organic compounds Chemical class 0.000 claims abstract description 27
- 239000007788 liquid Substances 0.000 claims abstract description 20
- 239000011521 glass Substances 0.000 abstract description 12
- 238000005553 drilling Methods 0.000 abstract description 8
- 238000009835 boiling Methods 0.000 abstract description 6
- 230000005484 gravity Effects 0.000 abstract description 3
- 238000001035 drying Methods 0.000 abstract description 2
- CYRMSUTZVYGINF-UHFFFAOYSA-N trichlorofluoromethane Chemical compound FC(Cl)(Cl)Cl CYRMSUTZVYGINF-UHFFFAOYSA-N 0.000 abstract 1
- 229940029284 trichlorofluoromethane Drugs 0.000 abstract 1
- 239000000835 fiber Substances 0.000 description 16
- 239000002966 varnish Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 13
- 229920005989 resin Polymers 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- 238000005470 impregnation Methods 0.000 description 10
- 239000000758 substrate Substances 0.000 description 9
- 239000003822 epoxy resin Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- 239000007921 spray Substances 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 239000012530 fluid Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000002834 transmittance Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000005507 spraying Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- 238000004513 sizing Methods 0.000 description 3
- ILJSQTXMGCGYMG-UHFFFAOYSA-N triacetic acid Chemical compound CC(=O)CC(=O)CC(O)=O ILJSQTXMGCGYMG-UHFFFAOYSA-N 0.000 description 3
- 238000009941 weaving Methods 0.000 description 3
- DDMOUSALMHHKOS-UHFFFAOYSA-N 1,2-dichloro-1,1,2,2-tetrafluoroethane Chemical compound FC(F)(Cl)C(F)(F)Cl DDMOUSALMHHKOS-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- VOPWNXZWBYDODV-UHFFFAOYSA-N Chlorodifluoromethane Chemical compound FC(F)Cl VOPWNXZWBYDODV-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- CYTYCFOTNPOANT-UHFFFAOYSA-N Perchloroethylene Chemical group ClC(Cl)=C(Cl)Cl CYTYCFOTNPOANT-UHFFFAOYSA-N 0.000 description 2
- XSVMFMHYUFZWBK-NSHDSACASA-N Rivastigmine Chemical compound CCN(C)C(=O)OC1=CC=CC([C@H](C)N(C)C)=C1 XSVMFMHYUFZWBK-NSHDSACASA-N 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- PXBRQCKWGAHEHS-UHFFFAOYSA-N dichlorodifluoromethane Chemical compound FC(F)(Cl)Cl PXBRQCKWGAHEHS-UHFFFAOYSA-N 0.000 description 2
- 235000019404 dichlorodifluoromethane Nutrition 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- FKRCODPIKNYEAC-UHFFFAOYSA-N ethyl propionate Chemical compound CCOC(=O)CC FKRCODPIKNYEAC-UHFFFAOYSA-N 0.000 description 2
- 229940108366 exelon Drugs 0.000 description 2
- 150000008282 halocarbons Chemical class 0.000 description 2
- JYGXADMDTFJGBT-VWUMJDOOSA-N hydrocortisone Chemical compound O=C1CC[C@]2(C)[C@H]3[C@@H](O)C[C@](C)([C@@](CC4)(O)C(=O)CO)[C@@H]4[C@@H]3CCC2=C1 JYGXADMDTFJGBT-VWUMJDOOSA-N 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- TZIHFWKZFHZASV-UHFFFAOYSA-N methyl formate Chemical compound COC=O TZIHFWKZFHZASV-UHFFFAOYSA-N 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- -1 silane compound Chemical class 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- AJDIZQLSFPQPEY-UHFFFAOYSA-N 1,1,2-Trichlorotrifluoroethane Chemical compound FC(F)(Cl)C(F)(Cl)Cl AJDIZQLSFPQPEY-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- QCDWFXQBSFUVSP-UHFFFAOYSA-N 2-phenoxyethanol Chemical compound OCCOC1=CC=CC=C1 QCDWFXQBSFUVSP-UHFFFAOYSA-N 0.000 description 1
- 229920001342 Bakelite® Polymers 0.000 description 1
- CGKQZIULZRXRRJ-UHFFFAOYSA-N Butylone Chemical compound CCC(NC)C(=O)C1=CC=C2OCOC2=C1 CGKQZIULZRXRRJ-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 239000004338 Dichlorodifluoromethane Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 229940087091 dichlorotetrafluoroethane Drugs 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 238000007602 hot air drying Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000004439 roughness measurement Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 229950011008 tetrachloroethylene Drugs 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Treatment Of Fiber Materials (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
Description
【発明の詳細な説明】
(°産業上の利用分野)
本発明は、積層板等の複合材料に使用するガラス繊維織
布の製造法に関し、特にコンピューター又は各種電気機
器、電子機器2通信機器等のプリント配線基板用として
好適なガラス繊維織布の製造法に関するものである。Detailed Description of the Invention (°Industrial Field of Application) The present invention relates to a method for manufacturing glass fiber woven fabric used in composite materials such as laminates, and in particular to computers, various electrical devices, electronic devices, communication devices, etc. The present invention relates to a method for manufacturing a glass fiber woven fabric suitable for use in printed wiring boards.
(従来の技術)
従来、プリント配線基板は、産業用の場合、ガラス繊維
織布にエポキシ樹脂等の熱硬化性樹脂を含浸したプリプ
レグを金属箔と積層し、加熱加圧して接着させることに
よって、いわゆる金属張積層板に製造され、プリント配
線基板に供される。(Prior Art) Conventionally, printed wiring boards for industrial use are made by laminating prepreg, which is made by impregnating woven glass fiber cloth with thermosetting resin such as epoxy resin, on metal foil, and bonding it by heating and pressing. It is manufactured into a so-called metal-clad laminate and used as a printed wiring board.
プリント配線基板は、基板の構成によって片面金属張積
層板、多層印刷配線板があり、積層枚数の違いによって
フレキシブルプリント配線基板に適したり、リジッドプ
リント配線基板に適したものがある。何れの場合におい
ても、プリント配線基板には有機シラン化合物のような
表面処理剤で処理したガラス繊維織布に熱硬化性樹脂を
含浸したプリプレグが用いられる。Printed wiring boards are divided into single-sided metal-clad laminates and multilayer printed wiring boards depending on the structure of the board, and depending on the number of laminated sheets, some are suitable for flexible printed wiring boards and others are suitable for rigid printed wiring boards. In either case, the printed wiring board uses prepreg, which is a glass fiber woven fabric treated with a surface treatment agent such as an organic silane compound and impregnated with a thermosetting resin.
プリント配線基板にガラス繊維織布を使用する理由は機
械強度や寸法安定性、耐熱性といったガラス繊維の優れ
た特性を利用するものであるが。The reason why glass fiber woven fabric is used for printed wiring boards is to take advantage of the excellent properties of glass fiber, such as mechanical strength, dimensional stability, and heat resistance.
従来のガラス繊維織布では種々の特性の面で必ずしも十
分とはいえなかった。例えば、基板の寸法変化率は回路
形成の精度をあげる上で極めて重要であり、特に多層印
刷配線板では1回路位置の層間ずれの発生は致命傷とな
る。近年回路パターンの高密度化1層数の増大により層
間ずれの許容量がより厳しくなり9寸法変化の少ない基
板材料が要求されている。かかる基板の寸法変化率に基
材のガラス繊維織布が大きな影響を与えている。したが
って、従来9寸法変化の少ないプリント配線基板を製造
する試みが種々行なわれている。例えば、積層する際の
加圧条件の検討1回路パターンの工夫等が行われている
が、いまだ十分に満足するものではない。また、ガラス
繊維織布についても、繊維のフィラメント径や経糸と緯
糸の織密度の比、単位面積当たりの重量、厚さ等を特定
化したものが提案されているが、十分とはいえなかった
。さらに、多層のプリント配線基板は、穿孔機によって
スルーホール加工されるが、孔壁面の仕上がり精度の向
上や、ドリル寿命を延ばすような基材が強く求められて
いる。これに対して、ガラス繊維織布の強度や弾性率を
特定化して穿孔加工性を改良しようとする試みもあるが
、十分とはいえなかった。Conventional glass fiber woven fabrics have not always been sufficient in terms of various properties. For example, the dimensional change rate of a substrate is extremely important in improving the accuracy of circuit formation, and especially in multilayer printed wiring boards, the occurrence of interlayer misalignment at one circuit position is fatal. In recent years, as the density of circuit patterns has increased and the number of layers per layer has increased, tolerances for interlayer misalignment have become stricter, and substrate materials with less dimensional change are required. The glass fiber woven fabric of the base material has a great influence on the dimensional change rate of such a substrate. Therefore, various attempts have been made to manufacture printed wiring boards with little dimensional change. For example, efforts have been made to consider the pressure conditions during lamination and to improve the circuit pattern, but the results are still not fully satisfactory. In addition, for glass fiber woven fabrics, proposals have been made that specify the filament diameter of the fibers, the ratio of warp and weft weaving density, the weight per unit area, the thickness, etc., but these are not sufficient. . Furthermore, multilayer printed wiring boards are formed with through holes using a drilling machine, and there is a strong demand for a base material that improves the finishing accuracy of the hole wall surface and extends the life of the drill. In response to this, there have been attempts to improve perforation processability by specifying the strength and elastic modulus of glass fiber woven fabrics, but these efforts have not been sufficient.
また1回路の高密度化のため金属張積層板に回路形成す
る際2表面粗度が微細な回路印刷に影響を及ぼすことも
知られており、できるだけ表面の平滑なことが要求され
ている。かかる要求に応じて、ガラス繊維織布の表面の
凹凸を平滑にするために、ガラス繊維織布を構成する繊
維をウォータージェットによって開繊することが知られ
ているが、より平滑な面を有するガラス繊維織布が要求
されている。It is also known that when circuits are formed on metal-clad laminates to increase circuit density, surface roughness affects fine circuit printing, and the surface is required to be as smooth as possible. In response to such demands, it is known that the fibers constituting the glass fiber woven fabric are opened using a water jet in order to smooth out the unevenness on the surface of the glass fiber woven fabric. Glass fiber woven fabrics are required.
(発明が解決しようとする課題)
本発明は、上記のような課題を解決しようとするもので
あって、その目的は樹脂ワニスの含浸性に優れ、穿孔加
工性9寸法安定性5表面平滑性及び耐熱性に優れた積層
板を得ることができるガラス繊維織布を容易に製造する
ことができるガラス繊維織布の製造法を提供することに
ある。(Problems to be Solved by the Invention) The present invention attempts to solve the above-mentioned problems, and its purpose is to provide excellent impregnation properties of resin varnish, and to improve perforation processability, 9 dimensional stability, and 5 surface smoothness. Another object of the present invention is to provide a method for producing a glass fiber woven fabric that can easily produce a glass fiber woven fabric that can produce a laminate with excellent heat resistance.
(課題を解決するための手段)
本発明者等は、上記のような課題を解決するため、鋭意
検討を重ねた結果、ガラス繊維織布に液状の有機化合物
を高圧ジェット流にして噴射することによってガラス繊
維織布を構成しているガラス繊維束がほぐされるととも
に、ガラス繊維の樹脂ワニスに対する濡れ特性が著しく
向上し、樹脂含浸性が向上し、それによって上記の課題
が解決できることを見出して本発明に到達した。(Means for Solving the Problems) In order to solve the above problems, the inventors of the present invention, as a result of extensive studies, have discovered that a high-pressure jet stream of a liquid organic compound is injected onto a glass fiber woven fabric. This book was developed based on the discovery that the glass fiber bundles that make up the glass fiber woven fabric are loosened, and that the wetting properties of the glass fibers with respect to the resin varnish are significantly improved, improving the resin impregnation properties, thereby solving the above problems. invention has been achieved.
すなわち1本発明は、ガラス繊維織布に、液状の有機化
合物の高圧ジェット流を噴射することを特徴とするガラ
ス繊維織布の製造法を要旨とするものである。That is, one aspect of the present invention is a method for producing a glass fiber woven fabric, which is characterized by injecting a high-pressure jet stream of a liquid organic compound onto the glass fiber woven fabric.
以下9本発明の詳細な説明する。Hereinafter, nine aspects of the present invention will be described in detail.
本発明においては、ガラス繊維織布に液状の有機化合物
を高圧ジェット流にして噴射するものであるが、ここで
液状の有機化合物としては、比重が0.6〜2.0.沸
点が一130℃〜250℃の有機化合物が好ましく用い
られる。沸点は有機化合物を噴射して付与した後にガラ
ス繊維織布から除去する際の除去の容易さの観点からし
て低い方が好ましい。通常取り扱い易さ等の点から、沸
点が約20℃〜150℃の有機化合物が特に好ましい。In the present invention, a liquid organic compound is injected as a high-pressure jet stream onto a glass fiber woven fabric, and the liquid organic compound has a specific gravity of 0.6 to 2.0. Organic compounds having a boiling point of 1130°C to 250°C are preferably used. A lower boiling point is preferable from the viewpoint of ease of removal when the organic compound is applied by spraying and then removed from the glass fiber woven fabric. From the viewpoint of ease of handling, organic compounds having a boiling point of about 20°C to 150°C are particularly preferred.
上記の液状の有機化合物は1種のみでなく、2種以上を
使用してもよい。Not only one type of the above-mentioned liquid organic compound may be used, but two or more types may be used.
かかる液状の有機化合物としては1例えば、アルコール
頬、エーテル類、ケトン類、エステル類。Examples of such liquid organic compounds include alcohols, ethers, ketones, and esters.
芳香族炭化水素類、ハロゲン化炭化本57類が挙げられ
る。Examples include aromatic hydrocarbons and halogenated hydrocarbons.
アルコール類としては3例えば、メタノール。Examples of alcohols include methanol.
エタノール、イソプロピルアルコール、ブチルアルコー
ル、エーテル類としては、ジエチルエーテル、メチルセ
ロソルブ、エチルセロソルブ、フェニルセロソルブ、ケ
トン類としては、アセトン。Ethanol, isopropyl alcohol, butyl alcohol, ethers include diethyl ether, methyl cellosolve, ethyl cellosolve, phenyl cellosolve, and ketones include acetone.
プロピオン、ブチロン、メチルエチルケトン、エステル
類としては、酢酸エチル、プロピオン酸エチル、蟻酸メ
チル等が挙げられる。また、芳香族炭化水素類としては
、ベンゼン、トルエン、キシレン、エチルベンゼン、ク
ロロベンゼン、ハロゲン化炭化水素類としては、塩化メ
チレン、クロロホルム、四塩化炭素、トリクレン、テト
ラクロロエチレン、ジクロロジフルオロメタン(フロン
−12)、モノクロロジフルオロメタン(フロン−22
)。Propion, butylone, methyl ethyl ketone, and esters include ethyl acetate, ethyl propionate, methyl formate, and the like. Further, aromatic hydrocarbons include benzene, toluene, xylene, ethylbenzene, chlorobenzene, and halogenated hydrocarbons include methylene chloride, chloroform, carbon tetrachloride, trichlene, tetrachloroethylene, dichlorodifluoromethane (Freon-12), Monochlorodifluoromethane (Freon-22
).
トリクロロトリフルオロメタン(フロン−113)。Trichlorotrifluoromethane (Freon-113).
ジクロロテトラフルオロエタン(フロン−114)等が
挙げられる。Examples include dichlorotetrafluoroethane (Freon-114).
本発明に使用される有機化合物は回収することが好まし
く、その場合の作業性や安全性等を加味して総合的にみ
た場合、特にフッ素化炭化水素系の有機化合物、いわゆ
るフロン系化合物が好ましい。It is preferable to recover the organic compound used in the present invention, and when considering the workability and safety in that case, fluorinated hydrocarbon-based organic compounds, so-called fluorocarbon-based compounds, are particularly preferable. .
本発明においては、ガラス繊維織布に、上記のような液
状の有機化合物を高圧ジェット流にして噴射するもので
あるが、高圧ジェット流の噴射圧力は20〜1000
kg / crl 、好ましくは50〜500 kg
/ ciの範囲から選ばれる。上記の液状の有機化合物
として比較的比重の大きい有機化合物を用いると、噴射
圧力を小さくすることができる。噴射圧力が小さすぎる
と、ガラス繊維織布の樹脂ワニスに対する濡れ性の向上
が小さく、一方、大きすぎると。In the present invention, the liquid organic compound as described above is injected as a high-pressure jet onto the glass fiber woven fabric, and the injection pressure of the high-pressure jet is 20 to 1000.
kg/crl, preferably 50-500 kg
/ci range. When an organic compound having a relatively high specific gravity is used as the liquid organic compound, the injection pressure can be reduced. If the injection pressure is too small, the improvement in the wettability of the glass fiber woven fabric to the resin varnish will be small; on the other hand, if the injection pressure is too large.
織布の局所的な目荒れや切断が生ずることがある。Local roughening or cutting of the woven fabric may occur.
上記高圧ジェット流を織布に噴射するに際しては、処理
する織布の巾方向に対して複数の小径ロノズルを等間隔
で配置させ、織布を走行させながら、高圧ジェット流を
噴射させることが好ましい。When injecting the high-pressure jet stream onto the woven fabric, it is preferable to arrange a plurality of small-diameter nozzles at equal intervals in the width direction of the woven fabric to be treated, and to inject the high-pressure jet stream while running the woven fabric. .
また、織布に高圧ジェット流を噴射するに際しては、で
きるだけ均一に噴射させることが好ましい。Further, when injecting the high-pressure jet stream onto the woven fabric, it is preferable to spray the jet stream as uniformly as possible.
ノズルからの流体の織布が受けるエネルギーを均一にす
るためには1例えば、ノズルを偏心回転させたり、ノズ
ルからの噴射流体を扇状に広げ、スプレー化して織布に
吹き付ける方法、あるいは織布の巾方向にスリットを入
れたノズルから噴射する方法等が採用される。織布に局
部的に偏って高圧ジェット流が当たると、目荒れの斑等
が生ずるので、要求品質に応じてノズルの数や噴射方式
等を適宜選択する。In order to uniformize the energy received by the fluid from the nozzle on the woven fabric, 1. For example, there are methods such as rotating the nozzle eccentrically, spreading the fluid ejected from the nozzle into a fan shape, turning it into a spray, and spraying it onto the woven fabric. A method such as spraying from a nozzle with a slit in the width direction is adopted. If the woven fabric is hit by a high-pressure jet flow locally, roughness and unevenness will occur, so the number of nozzles, jetting method, etc. are appropriately selected depending on the required quality.
偏心回転ノズルを用いる場合は、ノズル口径は0.1〜
0.61程度のものが好ましく、偏心の程度は軸の中心
から約10〜20+n、回転数は1000〜4000r
pm程度が好ましい。When using an eccentric rotating nozzle, the nozzle diameter should be 0.1~
It is preferably about 0.61, the degree of eccentricity is about 10 to 20+n from the center of the shaft, and the rotation speed is 1000 to 4000 r.
It is preferably about pm.
織布の走行速度は、あまり速すぎると、処理が不均一に
なり、ノズルの軌跡が織布の残ることがあるので、軌跡
が視認できない程度の比較的低い速度とすることが好ま
しい。例えば0.1m/min〜200nI/lll1
n程度が適当である。If the running speed of the woven fabric is too fast, the processing may become uneven and the woven fabric may remain in the trajectory of the nozzle. Therefore, it is preferable to set the running speed to a relatively low speed such that the trajectory cannot be visually recognized. For example, 0.1m/min to 200nI/lll1
Approximately n is appropriate.
スプレーノズルを用いる場合は、その口径は回転ノズル
の場合と同様に、0.1〜0.6鰭程度のものが好まし
く、また5噴射角度は10〜60″が好ましい。また、
噴射方法としては、織布の11方向にノズルを等間隔に
配置して、中方向にノズルを往復運動させて噴射する方
法を採用してもよい。When using a spray nozzle, its diameter is preferably about 0.1 to 0.6 fins, as in the case of a rotating nozzle, and the spray angle is preferably 10 to 60''.
As a spraying method, a method may be adopted in which nozzles are arranged at equal intervals in 11 directions of the woven fabric and the nozzles are reciprocated in the middle direction to spray.
本発明においては9通常、上記のようにしてガラス繊維
織布に噴射して付着された液状の有機化合物は、!l布
を熱風乾燥又は減圧乾燥等によって乾燥して除去される
。乾燥後の有機化合物の量は。In the present invention, the liquid organic compound sprayed onto the glass fiber woven fabric as described above is usually used. 1 The cloth is dried and removed by hot air drying or vacuum drying. The amount of organic compounds after drying.
織布の全重量に対して5%以下、好ましくは2%以下、
特に好ましくは1%以下である。残存する液状の有機化
合物が多いと、プリント配線板等の積層板の成形時にボ
イド等が発生し易くなる傾向がある。有機化合物の場合
は、水に比べると悪影響が少なく、ある程度存在してい
ても問題がないものであり、このことが本発明の利点で
もある。5% or less, preferably 2% or less based on the total weight of the woven fabric,
Particularly preferably, it is 1% or less. If there is a large amount of remaining liquid organic compound, voids etc. tend to be more likely to occur during molding of a laminate such as a printed wiring board. In the case of organic compounds, they have less adverse effects than water, and even if they exist to some extent, there is no problem, which is also an advantage of the present invention.
本発明に用いられるガラス繊維織布を構成するガラスの
組成は特に制限はないが1例えば、Eガラス、Cガラス
、Sガラス等が好ましく用いられる。特に、プリント配
線基板用の場合は、無アルカリガラスのEガラスが好ま
しい。The composition of the glass constituting the glass fiber woven fabric used in the present invention is not particularly limited, but for example, E glass, C glass, S glass, etc. are preferably used. In particular, for printed wiring boards, E glass, which is a non-alkali glass, is preferable.
また、ガラス繊維織布を構成するガラス繊維の繊維径は
、ガラス繊維織布を製織し得る限りいかなる繊維径でも
よいが、数μmないし数十μmの範囲のものが好ましい
。Further, the fiber diameter of the glass fibers constituting the glass fiber woven fabric may be any fiber diameter as long as the glass fiber woven fabric can be woven, but it is preferably in the range of several μm to several tens of μm.
本発明において用いられるガラス繊維織布は。The glass fiber woven fabric used in the present invention is:
通常、上記のガラス繊維を複数本合わせて得られるガラ
スヤーンを、整経工程、糊付工程にかけた後、製織して
得られる。Usually, it is obtained by weaving a glass yarn obtained by combining a plurality of the above-mentioned glass fibers, after subjecting it to a warping process and a sizing process.
ガラス繊維織布の織組織としては1例えば、平織、綾織
、朱子織、三輪織等の他いかなるものでもよい。The weave structure of the glass fiber woven fabric may be, for example, plain weave, twill weave, satin weave, tricycle weave, or any other weave.
ガラス繊維織布の経糸と緯糸の単位長さ当たりの本数、
厚さ、単位面積当たりの重さは1日本工業規格のR−3
414やアメリカ合衆国軍用規格(MIL規格)に該当
するものが好ましいが、これらに限定されるものではな
い。これらの規格に該当するガラス繊維以外の厚さは約
20μm〜約300μmであり1重さは約20g1rd
〜約350 g / mである。Number of warp and weft threads per unit length of glass fiber woven fabric,
Thickness and weight per unit area: 1 Japanese Industrial Standards R-3
414 or the United States military standard (MIL standard), but is not limited thereto. The thickness of fibers other than glass fibers that meet these standards is about 20 μm to about 300 μm, and the weight of one piece is about 20 g1rd.
~350 g/m.
本発明において用いられるガラス繊維織布としては、上
記の規格に該当しないガラス繊維織布はもとより、ガラ
ス繊維とガラス繊維以外の繊維とからなる織物1例えば
、ガラス繊維と炭素繊維との混繊物、ガラス繊維と有機
繊維との混繊物、ガラス繊維とセラミックス繊維との混
繊物等であってもよい。なお、ガラス繊維と有機繊維と
の混繊物の場合は、有機繊維として、上記の液状の有機
化合物によって膨潤等のおそれのない繊維を選択する。The glass fiber woven fabrics used in the present invention include not only glass fiber woven fabrics that do not meet the above standards, but also woven fabrics made of glass fibers and fibers other than glass fibers, such as mixed fibers of glass fibers and carbon fibers. , a mixed fiber of glass fiber and organic fiber, a mixed fiber of glass fiber and ceramic fiber, etc. may be used. In addition, in the case of a mixed fiber of glass fiber and organic fiber, fibers that are not likely to be swollen by the above-mentioned liquid organic compound are selected as the organic fiber.
本発明において用いられるガラス繊維織物は。The glass fiber fabric used in the present invention is:
製織に必要な集束剤が付着している段階のガラス繊維織
布(以下、生機という)、集束剤を除去した段階のガラ
ス繊維織布(以下、クリーニング済みガラス繊維織布と
いう)、生機又はクリーニング済みガラス繊維織布を有
機シラン化合物で処理したガラス繊維織布(以下、シラ
ン処理織布という)等何れのガラス繊維織布があっても
よい。Glass fiber woven fabric with a sizing agent necessary for weaving attached (hereinafter referred to as gray fabric), glass fiber woven fabric in a stage where the sizing agent has been removed (hereinafter referred to as cleaned glass fiber woven fabric), gray fabric or cleaned Any glass fiber woven fabric may be used, such as a glass fiber woven fabric obtained by treating a finished glass fiber woven fabric with an organic silane compound (hereinafter referred to as a silanized woven fabric).
(作 用)
本発明のガラス繊維織布の製造法は、上記のように液状
の有機化合物の高圧ジェット流をガラス繊維織布に噴射
するので、流体のエネルギーと液状の有機化合物による
膨潤、洗浄作用によって。(Function) In the method for producing a glass fiber woven fabric of the present invention, a high-pressure jet stream of a liquid organic compound is injected onto the glass fiber woven fabric as described above, so that the energy of the fluid and the liquid organic compound cause swelling and cleaning. By action.
繊維束の物理的な構造が改善される。さらに、樹脂ワニ
ス等の樹脂を含浸させたときに、樹脂のフィラメント内
への浸透性が増大するとともに、界面の極性が改善され
、樹脂のフィラメント間への密着性が著しく向上する。The physical structure of the fiber bundle is improved. Furthermore, when impregnated with a resin such as resin varnish, the permeability of the resin into the filaments increases, the polarity of the interface is improved, and the adhesion of the resin between the filaments is significantly improved.
かかる織布によると。According to such woven fabrics.
優れた耐熱性1寸法安定性2表面平滑性及び穿孔加工性
を有する積層板が得られる。A laminate having excellent heat resistance, dimensional stability, surface smoothness, and perforation processability is obtained.
本発明によってガラス繊維織布を処理すると。When woven glass fiber fabrics are treated according to the present invention.
従来のウォータージェットによる処理では到達し得ない
ようなガラス繊維織布の界面特性の改良が認められる。Improvements in the interfacial properties of woven glass fiber fabrics that cannot be achieved with conventional water jet treatments are observed.
特に、プリント配線基板用材料として使用する場合には
、ガラス繊維の表面に極く微量の水分が吸着していても
ワニス含浸、積層板の成形に際し1種々の障害を生ずる
ので、水を完全に除去することが要求されるが1本発明
の方法によると、液状の有機化合物のジェット流を噴射
するものであるから、かかる有機化合物の除去が容易で
あり、また有機化合物が残存していても、ワニス含浸時
の濡れが良好であり、全く問題にならない。In particular, when used as a material for printed wiring boards, even the slightest amount of water adsorbed on the surface of glass fibers will cause various problems during varnish impregnation and laminate forming, so water must be completely removed. However, according to the method of the present invention, since a jet stream of liquid organic compounds is injected, such organic compounds can be easily removed, and even if organic compounds remain, they can be removed. , Wetting during varnish impregnation is good, and there is no problem at all.
(実施例) 次に8本発明を実施例に基づいて具体的に説明する。(Example) Next, the present invention will be explained in detail based on examples.
以下の実施例におけるガラス繊維織布の性能及び織布か
ら得られたプリプレグの作成条件及び緒特性の測定法は
次のとおりである。The performance of the glass fiber woven fabric and the preparation conditions and properties of the prepreg obtained from the woven fabric in the following Examples are as follows.
(1)ガラス繊維織布へのワニス含浸性織布へのワニス
含浸性を光透過度で評価した。(1) Varnish impregnation into glass fiber woven fabric The varnish impregnation into the woven fabric was evaluated by light transmittance.
光透過度は次のようにして測定した。Light transmittance was measured as follows.
まず、トリアセテートフィルムを貼ったガラス板の透過
光の強度を測定し1次いで、トリアセテートフィルムを
貼ったガラス板の上にガラス繊維織布を置き、このガラ
ス繊維織布にエポキシ樹脂のワニスを流延してから3分
後の透過光の強度を測定し2次の式から光透過度を算出
した。この場合、光透過度の値が大きい程、含浸性が良
好であることを示す。なお、エポキシ樹脂のワニスとし
ては、NEMA規格のFR−4組成のエポキシ樹脂の5
0重粗景のメチルセロソルブ溶液も用いる。First, the intensity of transmitted light through the glass plate with the triacetate film pasted was measured. Next, a glass fiber woven cloth was placed on the glass plate with the triacetate film pasted, and epoxy resin varnish was poured onto the glass fiber woven cloth. After 3 minutes, the intensity of the transmitted light was measured, and the light transmittance was calculated from the following equation. In this case, the larger the light transmittance value, the better the impregnating property. In addition, as an epoxy resin varnish, epoxy resin 5 of FR-4 composition according to NEMA standards is used.
A 0-heavy methyl cellosolve solution is also used.
■。■.
光透過度(%) = −X100
O
ただし+ 10はトリアセテートフィルムとガラス板
の透過光の強度+ 11 はガラス繊維織布とエポキ
シ樹脂の透過光の強度を示す。Light transmittance (%) = -X100 O where +10 indicates the intensity of light transmitted through the triacetate film and the glass plate, +11 indicates the intensity of light transmitted through the glass fiber woven fabric and the epoxy resin.
(2)プリプレグの作成条件
ガラス繊維織布に下記の組成の樹脂を含浸させてプリプ
レグを作った。その際に樹脂含有量は42重量%に調製
した。(2) Prepreg Preparation Conditions A prepreg was prepared by impregnating a glass fiber woven fabric with a resin having the composition shown below. At that time, the resin content was adjusted to 42% by weight.
エピコート5045(臭素化ビスフェノールA型エポキ
シ樹脂;油化シェル社製の商品名)100重量部エピコ
ー目54(ノボラック型脂エポキシ樹脂;油化シェル社
製の商品名)30重量部
ジシアンジアミド(硬化剤) 4重量部ベンジ
ルジメチルアミン(硬化促進剤)0.2重量部メチルセ
ロソルブ(溶剤)
(3)寸法安定性
JIS C−6486に準拠して測定する。Epicort 5045 (brominated bisphenol A type epoxy resin; trade name manufactured by Yuka Shell Co., Ltd.) 100 parts by weight Epicort 54 (novolak type fatty epoxy resin; trade name manufactured by Yuka Shell Co., Ltd.) 30 parts by weight dicyandiamide (curing agent) 4 parts by weight benzyldimethylamine (hardening accelerator) 0.2 parts by weight methyl cellosolve (solvent) (3) Dimensional stability Measured in accordance with JIS C-6486.
(4)半田耐熱性
8枚のプリプレグを重ね合わせ、その両面の外側に、そ
れぞれ銅箔(厚さ18μm)を積層し、プレス圧40
kg / Ct& + キュア温度170℃、キュア時
間90分間として加熱加圧して銅張基板を作成した。(4) Solder heat resistance 8 sheets of prepreg are stacked, copper foil (18 μm thick) is laminated on the outside of both sides, and a press pressure of 40 μm is applied.
kg/Ct&+ A copper-clad substrate was prepared by heating and pressing at a curing temperature of 170° C. and a curing time of 90 minutes.
次いで銅箔をエツチングした後、基板を常圧下に一定時
間煮沸後、260℃の半田浴槽に30秒間浸漬し、半田
浴槽から取出した後の積層板の界面剥離(ブリスター)
、ガラス繊維織布を構成する経糸と緯糸の交差点の剥離
(ミーズリング)を調べる。Next, after etching the copper foil, the board was boiled under normal pressure for a certain period of time, then immersed in a 260°C solder bath for 30 seconds, and the interfacial peeling (blister) of the laminate after being taken out from the solder bath.
, to investigate separation (measling) at the intersection of the warp and weft yarns that make up the glass fiber woven fabric.
煮沸時間を順次延ばしていき、剥離が生じ始める煮沸時
間を耐熱時間とする。したがって、この時間が長い程、
耐熱性がよいと判定する。The boiling time is gradually increased, and the boiling time at which peeling begins is defined as the heat resistance time. Therefore, the longer this time,
It is determined that the heat resistance is good.
(5)表面平滑性
上記(4)と同様にして作成した銅張基板の表面平滑性
をJIS B−0601r表面粗さ測定法」に準拠し
て、100cm平方のサンプルの60個所を1個所の長
さ10+uとして測定した。(5) Surface smoothness The surface smoothness of the copper-clad board prepared in the same manner as in (4) above was measured in accordance with the JIS B-0601r Surface Roughness Measurement Method. The length was measured as 10+u.
(6)穿孔加工性
プリプレグを122枚重し、さらにその上下に銅箔(厚
さ18μm)を重ねて、プレス圧力40 kg / c
nl 。(6) 122 sheets of perforated prepreg were stacked, and copper foil (thickness: 18 μm) was layered on top and bottom, and a press pressure of 40 kg/c was applied.
nl.
キュア温度170℃、キュア時間100分として加熱加
圧して銅張基板を作成した。A copper-clad substrate was prepared by heating and pressing at a curing temperature of 170° C. and a curing time of 100 minutes.
上記銅張基板を下記の穿孔加工条件で穿孔した。The above copper-clad substrate was perforated under the following perforation conditions.
ドリル回転数(rpm)及びドリル送り(ドリル1回転
当りの穿孔長さ;μm/rev、)の変化による孔壁面
の粗さ(μ)を測定し、これをもって穿孔加工性を評価
した。この際、ドリルによるヒツト数は約5000ヒツ
トとし、約5000ヒツトの穿孔の後に測定した。また
、この測定は断面の顕微鏡観察によって行った。The roughness (μ) of the hole wall surface was measured as a result of changes in drill rotation speed (rpm) and drill feed (drilling length per drill revolution; μm/rev), and the drilling workability was evaluated using this. At this time, the number of hits by the drill was approximately 5,000, and measurements were taken after approximately 5,000 hits. Moreover, this measurement was performed by microscopic observation of the cross section.
く穿孔加工条件〉
エクセロン■製の穿孔機(商品名工クセロンマーク5)
を使用し、上記銅張基板をそれぞれ4枚重ねて穿孔加工
した。穿孔機のドリルは直径1 +uのストレートドリ
ルを使用し、当板としてベークライト板を用い、基板の
上側に厚さ0.8mm、下側に厚さ1.6龍の当板を当
てて穿孔加工した。Drilling processing conditions〉 Drilling machine manufactured by Exelon (Product name: Exelon Mark 5)
Using this method, four of the above copper-clad substrates were stacked and perforated. A straight drill with a diameter of 1+U is used as the drilling machine, and a Bakelite plate is used as a backing plate.The top side of the board is placed with a 0.8mm thick backing plate, and the bottom side is placed with a 1.6mm thick backing plate for drilling. did.
実施例1〜4.比較例1.2
経糸及び緯糸としてそれぞれガラスヤーンECG75
110を用いて、経糸密度44本/25cm、緯糸密度
33本/25cmに製織した巾107cm、重さ210
gのシラン処理をしだ平織ガラス繊維織布(ユニチカ■
製、商品名20134K)に、第1表に示す種々の条件
で処理を施した。Examples 1-4. Comparative Example 1.2 Glass yarn ECG75 as warp and weft respectively
Width: 107 cm, weight: 210 woven with warp density of 44 threads/25 cm and weft thread density of 33 threads/25 cm using 110 threads.
Silane treated plain weave glass fiber woven fabric (Unitika ■
(trade name: 20134K) was treated under various conditions shown in Table 1.
流体の噴射ノズルとしては、扇状のジェット流を噴出す
るスプレーノズルであって、その形状は織布の走行方向
の厚さ約511.巾方向の噴出角度40″のものを用い
、ノズル口径は0.1mm、ノズル間隔は50龍でとし
た。ノズルと織布との距離を70■■、織布の走行速度
を10 m/minとして高圧液体のジェット流を噴射
した。The fluid ejecting nozzle is a spray nozzle that ejects a fan-shaped jet stream, and its shape is approximately 511 mm thick in the running direction of the woven fabric. A jet with an ejection angle of 40'' in the width direction was used, the nozzle diameter was 0.1 mm, and the nozzle spacing was 50mm.The distance between the nozzle and the fabric was 70mm, and the running speed of the fabric was 10 m/min. A jet stream of high-pressure liquid was ejected.
流体を噴射した後、130℃で5分間熱風乾燥してガラ
ス繊維織布中の液体を除去した。After the fluid was injected, the glass fiber fabric was dried with hot air at 130° C. for 5 minutes to remove the liquid in the glass fiber woven fabric.
第1表
得られた各処理織布のワニス含浸性及び各処理織布から
作成した基板の特性を第2表に示す。Table 1 Table 2 shows the varnish impregnation properties of each of the treated woven fabrics obtained and the characteristics of the substrates made from each of the treated woven fabrics.
なお、実施例1は上記液体噴射処理前の織布をそのまま
測定に供したものである。In Example 1, the woven fabric before the liquid jet treatment was directly subjected to measurement.
第2表から明らかなように1本発明の方法による実施例
1〜4によって得られたガラス繊維織布は、ワニスの含
浸性が著しく向上しており、これを用いて作成した基板
は何れも9寸法変化率1表面平滑性、半田耐熱性及び穿
孔加工性の何れにおいても優れていることが判る。As is clear from Table 2, the glass fiber woven fabrics obtained in Examples 1 to 4 according to the method of the present invention have significantly improved varnish impregnation properties, and all substrates made using the same have significantly improved varnish impregnation properties. 9 Dimensional change rate 1 It can be seen that the material is excellent in all of surface smoothness, solder heat resistance, and perforation workability.
(発明の効果)
本発明の製造法によると、ガラス繊維織布に対するワニ
スの含浸性を著しく向上させることができる。また1本
発明の方法によって得られるガラス繊維織布によると、
耐熱性1寸法安定性1表面平滑性及び穿孔加工性に優れ
たプリント配線基板等の積層板を容易に得ることができ
る。また5本発明によるガラス繊維織布によると、力学
特性。(Effects of the Invention) According to the production method of the present invention, the impregnation of varnish into glass fiber woven fabric can be significantly improved. Furthermore, according to the glass fiber woven fabric obtained by the method of the present invention,
Laminated boards such as printed wiring boards having excellent heat resistance, dimensional stability, surface smoothness, and perforation workability can be easily obtained. Furthermore, according to the glass fiber woven fabric according to the present invention, mechanical properties.
熱特性に優れた構造用複合材料を得ることができる。A structural composite material with excellent thermal properties can be obtained.
Claims (1)
ット流を噴射することを特徴とするガラス繊維織布の製
造法。(1) A method for producing a glass fiber woven fabric, which comprises injecting a high-pressure jet stream of a liquid organic compound onto the glass fiber woven fabric.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3561688A JPH01210429A (en) | 1988-02-17 | 1988-02-17 | Production of woven glass fiber fabric |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3561688A JPH01210429A (en) | 1988-02-17 | 1988-02-17 | Production of woven glass fiber fabric |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01210429A true JPH01210429A (en) | 1989-08-24 |
Family
ID=12446780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3561688A Pending JPH01210429A (en) | 1988-02-17 | 1988-02-17 | Production of woven glass fiber fabric |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01210429A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002121303A (en) * | 2000-10-19 | 2002-04-23 | Sumitomo Bakelite Co Ltd | Prepreg and production method for laminated sheet using the same |
| JP2008291407A (en) * | 2007-05-28 | 2008-12-04 | Unitika Glass Fiber Co Ltd | Cleaning method for inorganic fiber fabric |
-
1988
- 1988-02-17 JP JP3561688A patent/JPH01210429A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002121303A (en) * | 2000-10-19 | 2002-04-23 | Sumitomo Bakelite Co Ltd | Prepreg and production method for laminated sheet using the same |
| JP2008291407A (en) * | 2007-05-28 | 2008-12-04 | Unitika Glass Fiber Co Ltd | Cleaning method for inorganic fiber fabric |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5837624A (en) | Woven glass cloth for printed wiring board and printed wiring products manufactured therefrom | |
| TWI450666B (en) | Production method of multilayer printed wiring board and multilayer printed wiring board | |
| EP1103168A2 (en) | High density printed circuit substrate and method of fabrication | |
| KR970003990B1 (en) | Laminating material for printed circuit board of low dielectric constant | |
| JP3578466B2 (en) | Inorganic fiber woven fabric for reinforcement and multilayer printed wiring board using the same | |
| US5311660A (en) | Methyl chloroform-free desmear process in additive circuitization | |
| JPH01210429A (en) | Production of woven glass fiber fabric | |
| JPH08259274A (en) | Glass cloth surface treatment method | |
| JP2001055642A (en) | Cloth for resin reinforcement and laminated board using the same | |
| JP2003347743A (en) | Prepreg, multilayer printed circuit board and method for its manufacture | |
| JP2001031782A (en) | Prepreg and laminate prepared by using the same | |
| JPS63270833A (en) | Glass fiber fabric for printed wiring circuit board | |
| JPH0697670A (en) | Board for multilayer printed wiring | |
| JP3933475B2 (en) | Glass cloth, prepreg, and multilayer board on which conductor pattern is formed | |
| JP4433651B2 (en) | High laser processability insulating resin material, high laser processability prepreg, and high laser processability metal-clad laminate | |
| JP2001094260A (en) | Manufacturing method of multilayer printed wiring board | |
| JP2001329449A (en) | Glass cloth for printed circuit board | |
| JPH0393653A (en) | Treatment of glass fiber woven fabric | |
| JPS63267514A (en) | Material for flexible printed circuit board | |
| JP4703030B2 (en) | Glass cloth patterned by plating | |
| JPH05152766A (en) | Formation of via hole in organic board | |
| JP2009138286A (en) | Aramid fiber fabric, and prepreg and laminate using the fabric | |
| JPH02251664A (en) | Treatment of glass cloth | |
| JPH05140873A (en) | Manufacturing method of glass cloth for resin reinforcement | |
| JP2001348757A (en) | Glass cloth and printed wiring board |