JPH0123389B2 - - Google Patents

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a plastic carrier tape that is convenient for attaching chipped electronic components to electronic equipment using an automatic insertion machine, etc., and a method for manufacturing the same. be.

[Prior art]

Carrier tape is used to attach chipped electronic components to electronic equipment using an automatic insertion machine.
Since they are usually thrown away, they need to be cheap. Therefore, it is desired to use plastic carrier tape and to make its processing as inexpensive as possible.

Additionally, the plastic carrier tape must be such that the chipped electronic components can be accurately attached to the electronic device.

Therefore, hot processing, which is simple and accurate, has traditionally been used to process plastic carrier tapes.

[Problem that the invention seeks to solve]

However, plastic carrier tapes have had a problem in that the recessed holes that accommodate chipped electronic components produced by cold working tend to crack or tear while the carrier tape is running.

In order to manufacture a plastic carrier tape using the conventional hot working method, there is a problem in that the plastic carrier tape must be heated.

Further, there was a problem that the plastic carrier tape itself could be bent by the heat, and that the rectangular recesses that could accommodate chipped electronic components could be deformed.

Various attempts have been made to cold-process plastic carrier tape to eliminate this problem, but the process of forming box-shaped recessed holes that can accommodate chipped electronic components has not been possible. Accidents such as the side of the hollow hole being torn,
A problem arose in that chipped electronic components fell off.

In order to solve the above-mentioned conventional problems, the present invention provides that even if recessed holes in a plastic carrier tape are formed by cold working, electronic components that are chipped on five sides other than the opening on the top end surface can be formed. The object of the present invention is to provide an excellent plastic carrier tape that can hold the parts and prevent the above-mentioned parts from falling off.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a plastic carrier tape that does not tear through the recessed holes during cold working or running the carrier tape.

An object of the present invention is to provide an inexpensive method of manufacturing a plastic carrier tape that does not require a heating device because the plastic carrier tape is squeezed cold.

According to the present invention, even when a plastic carrier tape is cold-processed, the side edges of the rectangular recessed holes capable of accommodating chipped electronic components do not come off, and the desired recessed holes can be formed. The object of the present invention is to provide a method for manufacturing a plastic carrier tape that can be manufactured using a plastic carrier tape.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method for producing plastic carrier tapes that allows precise recessed holes to be formed in only two steps, which are exactly the same as when producing plastic carrier tapes by hot working. It is something.

[Means for solving problems]

To achieve the above object, the plastic carrier tape of the present invention has rectangular recessed holes capable of accommodating chipped electronic components, and recessed holes are provided at the four corners in the depth direction of the recessed holes. A cutout is provided to prevent the recessed hole from tearing during machining or running the carrier tape.

Further, the manufacturing method of the present invention includes a first step of simultaneously drilling a plastic carrier tape feeding hole and through holes at locations corresponding to the four corners of the square recessed hole in the depth direction; , and a second step of cold extruding a rectangular recessed hole capable of accommodating a chipped electronic component.

[Embodiment] FIGS. 1 to 3 show an embodiment of the present invention.

FIG. 1 is a front perspective view of a plastic carrier tape, FIG. 2 is a back perspective view, and FIG. 3 is an explanatory view of the first and second steps of the present invention.

In the figure, 1 is a plastic carrier tape, 2 is a square recessed hole that can accommodate chipped electronic components (not shown), 2' is a recessed hole seen from the back side of the carrier tape 1, and 3 is a carrier tape feed hole. , 4 is a through hole that is drilled at the same time as the feed hole 3 before cold drawing the recessed hole 2, and 4' is a corner of the recessed hole 2 in the depth direction, where a plastic member is missing. It is a part.

First, in the first step, a through hole 4 is formed at the corner 4' in the depth direction of the feed hole 3 of the plastic carrier tape 1 and the recessed hole 2 whose shape corresponds to the size of the chipped electronic component. Drill at the same time.

It goes without saying that the recessed hole 2 can be of any shape, such as pentagonal or hexagonal, in addition to the rectangular shape of the embodiment, depending on the shape of the chipped electronic component. Also, hollow hole 2
When is square, the number of through holes 4 need not be limited to four, and may be two.

Next, as a second step, the rectangular recessed hole 2 capable of accommodating the chipped electronic component is cold-drawn using a mold (not shown).

As a result, as shown in FIGS. 1 and 2, the plastic members corresponding to the four corners 4' in the depth direction of the recessed hole 2 are missing, but the plastic members of the recessed hole 2 are missing. The five sides other than the opening side are not missing and are firmly connected to the plastic carrier tape 1.

As a result of comparing and using the recessed holes 2 of the plastic carrier tape 1 made in this way with the recessed holes of the conventional example, it was found that even when the carrier tape is run at high speed, the recessed holes of the present invention do not crack or tear. was not recognized.

〔Effect of the invention〕

According to the present invention, in the plastic carrier tape, holes are provided at the four corners of the recessed holes for accommodating chipped electronic components, so that the recessed holes are not torn during cold working or during running of the carrier tape.

In the present invention, the five faces other than the opening face of the rectangular recessed hole capable of accommodating chipped electronic components are reliably connected to the plastic carrier tape.
The chipped electronic component accommodated in the recessed hole is held by the five surfaces and can be prevented from falling off.

Since the present invention involves cold working, no heating means is required, and the manufacturing cost can be reduced.

Since the present invention involves cold working, it is possible to prevent bending of the plastic carrier tape itself or deformation of the recessed holes.

[Brief explanation of drawings]

FIG. 1 is a front perspective view of the plastic carrier tape, FIG. 2 is a back perspective view, and FIG. 3 shows the first and second steps. In the figure, 1... plastic carrier tape, 2... square recessed hole capable of accommodating chipped electronic components, 3... carrier tape feed hole, 4...
...through hole, 4'...missing part.

Claims (1)

[Scope of Claims] 1. In a plastic carrier tape having rectangular recessed holes capable of accommodating chipped electronic components, the four corners in the depth direction of the recessed holes are cold worked or the carrier tape is run. A plastic carrier tape characterized by having a hole inside to prevent the hollow hole from tearing. 2. A first step of simultaneously drilling a carrier tape feeding hole and through-holes at locations corresponding to the four corners of the square recessed hole in the depth direction, and accommodating chipped electronic components in the through-hole portions. A second step of cold extruding a rectangular recessed hole that can be formed.