JPH0123936B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing electronic components, and particularly to a method for manufacturing chip-type electronic components.

Conventionally, the above manufacturing method was disclosed in Japanese Patent Application Laid-open No. 1986-
There are some such as those disclosed in No. 27912. This involves bending a metal clad plate with metal foil on one side into a U-shape in the longitudinal direction so that the metal foil is on the outside to form a gutter-like filling capacity. Electronic component elements are loaded at equal intervals, the electrodes of these elements are connected to the metal foil on the outer side wall of the filling container by soldering or retaining, resin is injected into the filling container, and the metal foil on the bottom of the filling container is Then, the filled container is cut and separated at an intermediate position between each electronic component element. However, in this manufacturing method, the electrodes of the element must be individually soldered or welded to the metal foil on the outer side wall of the filling container, which is cumbersome.

SUMMARY OF THE INVENTION An object of the present invention is to provide a manufacturing method that facilitates the soldering of the electrodes of each electronic component element to each metal foil at the same time.

Therefore, the present invention provides (a) long holes for bending, which are formed at predetermined intervals along both longitudinal edges of the strip-shaped insulator at biased positions, and (b) pasting metal foil on one side of the band-shaped insulator; and (c) forming a window between the two windows. (d) placing solder in each of the windows; and (e) placing a plurality of solders on the surface of the strip-shaped insulator opposite to the surface on which the metal foil is attached. A process of arranging electronic component elements at predetermined intervals so that their electrodes are in contact with the solder in the window, and (f) heating the solder all at once to solder each of the electrodes to each of the metal foils. process and (g)
a process of bending the band-shaped insulator along each of the long holes for bending and filling the gutter-like body with the metal foil located on the outside; and (h) a process of filling the gutter-like body with resin. and (i) cutting the gutter-like body in the width direction at positions between the respective electronic components.

In this manufacturing method, windows are formed in the strip-shaped insulator in the step (a), and metal foil is placed on the outside of the window in the step (c), so each window is soldered in the step (d). By simply placing the electrodes in contact with each of these solders in step (e), and heating them in step (f), it is possible to simultaneously solder the electrodes to a large number of metal foils. Work becomes easier.

Hereinafter, the present invention will be explained in detail based on one embodiment shown in the drawings. FIG. 1 shows a chip-type tantalum capacitor manufactured by the manufacturing method according to the present invention. In the same figure, 2 is a support body, and the bottom wall part 4
and end wall portions 6, 8. 10 and 12 are long holes for bending. Windows 14 and 16 are bored near the end walls 6 and 8 of the bottom wall 4, and an external electrode 18 is provided so as to straddle the ends of the end wall 6 and the bottom wall 4 and cover the windows 14. It is provided. Similarly, an external electrode 20 is provided so as to straddle the ends of the end wall 8 and the bottom wall 4 and cover the window 16. 22 is a capacitor element, 24 is its cathode layer, 25 is an anode lead wire, 2
6 is an anode member. Cathode layer 24 and anode member 2
6 is soldered to the external electrode 20 via the windows 14 and 16 with solders 27 and 28. In addition,
The anode lead wire 26 and the anode member 28 are welded. Although not shown in the figure, the support body 2 is filled with a synthetic resin so that the capacitor element is buried therein, and in some cases, a heat-resistant plate is filled so as to straddle the upper ends of the end walls 6 and 8. may be provided.

Next, a manufacturing method according to the present invention will be explained. First, the strip-shaped insulator 30 is punched out as shown in FIG. The strip insulator 30 is made of polyimide or glass epoxy and has a thickness of about 0.1 mm.
At a position biased toward one longitudinal edge of the strip-shaped insulator 30,
Long holes 10 for bending are punched out at predetermined intervals along its longitudinal edge. Similarly, an elongated bending hole 12 is punched out at a position biased toward the other longitudinal edge of the strip-shaped insulator 30 so as to correspond to the elongated bending hole 10 along the longitudinal edge. A rectangular window 14 is punched out at a position inside each bending slot 10, and a rectangular window 16 is punched at a position inside each bending slot 12. A strip-shaped insulator 3 further than each bending slot 10, 12
Elongated holes 32 and 34 for end wall height regulation are punched out at positions deviating from the longitudinal edges of 0 so as to correspond to these. In addition, width dimension regulation slots 36 and 38 are punched out on both sides of each window 14 and height regulation slot 32, and similarly, width dimension regulation slots 36 and 38 are punched out on both sides of each window 14 and height regulation slot 34. Elongated holes 40 and 42 are punched out. Width dimension defining windows 44 are punched out between the width dimension defining slots 36 and 38 and the width dimension defining slots 40 and 42, respectively. These end wall height defining long holes 32, 34, width dimension defining long holes 36, 38, and width dimension defining window 44.
The part surrounded by the support body 2 becomes the support 2, and the part between the end wall height regulating slot 32 and the bending slot 10 becomes the end wall 6, and the part surrounded by the bending slot 10 becomes the end wall 6. , 12 becomes the bottom wall 4, and the long hole 12 for bending
The portion between the end wall height defining long hole 34 and the end wall 8
becomes.

As shown in FIG. 3, the thickness is about 25 to 50 μ over the entire back surface of the strip-shaped insulator 30 punched out in this way.
A copper foil 46 of m is attached. Then, the external electrodes 18, 20 are produced by etching or punching this copper foil 46 as shown in FIG.
Note that FIG. 4 shows the back surface of the strip-shaped insulator 30.

Then, on the front side of the strip-shaped insulator 30, solder 27 is placed on each window 18, and solder 28 is placed on each window 20. Thereafter, the capacitor element 22 is placed so that the cathode layer 24 is placed on the window 16 and the anode member 26 is placed on the window 14, and the solders 27 and 28 are melted through a heating furnace, for example, as shown in FIG. The external electrode 18 and the anode member 26 are soldered, and the external electrode 20 and the cathode layer 24 are soldered.

After that, as shown in FIG.
At positions 0 and 12, the strip insulator 30 is bent to form a trough-like body so that the external electrodes 18 and 20 are located on the outside. Then, insulating synthetic resin is injected into this trough-like body so that the capacitor element 22 is buried therein. After this synthetic resin has hardened, the gutter-like body is cut along the cutting line shown by the dashed line in the figure, and also cut so as to connect the long holes 32 and 34 for adjusting the height of the end walls. This completes the production. In addition, when attaching a heat-resistant plate, the belt-shaped heat-resistant plate may be placed after resin injection.

In the above embodiment, a capacitor element is used, but various electronic components can be used as long as they have two electrodes. Further, although copper foil was used, other metal foils may be used. Furthermore, although a long hole for defining the width dimension and a long hole for defining the window and end wall height were punched out, these may be unnecessary in some cases.

[Brief explanation of drawings]

FIG. 1 is a longitudinal sectional view of a chip type capacitor manufactured by the manufacturing method according to the present invention, and FIGS. 2 to 6 are process diagrams of one embodiment of the present invention. 10, 12... Long hole for bending, 14, 16...
Window for electrode connection, 22... Capacitor element (electronic component element), 27, 28... Solder, 30... Band-shaped insulator.

Claims (1)

[Claims] 1. Long holes for bending are formed at predetermined intervals along the long edges at offset positions on both longitudinal edges of the strip-shaped insulator, and electrodes are provided at positions inside each of the long holes for bending. A process of drilling a connection window, a process of pasting metal foil on one side of the strip-shaped insulator, a process of removing the metal foil sandwiched between the windows on both sides, and a process of removing the metal foil sandwiched between the windows on both sides. The process of placing solder in each of the windows on the surface opposite to the surface to which the foil is attached, and the process of placing a plurality of electronic component elements on the surface of the strip-shaped insulator opposite to the surface to which the metal foil is attached to their electrodes. a process of arranging the electrodes at predetermined intervals so as to be in contact with the solder in the window; a process of heating the solder all at once to solder the electrodes to the metal foils; A process of bending the metal foil along the bending long hole to form a gutter-like body with the metal foil positioned on the outside, a process of filling the gutter-like body with resin, and a process of forming the gutter-like body into each of the electronic component elements. A method of manufacturing an electronic component, which comprises cutting in the width direction at respective positions in between.