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JPH0124053B2 - - Google Patents
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JPH0124053B2 - - Google Patents

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Publication number
JPH0124053B2
JPH0124053B2 JP58191700A JP19170083A JPH0124053B2 JP H0124053 B2 JPH0124053 B2 JP H0124053B2 JP 58191700 A JP58191700 A JP 58191700A JP 19170083 A JP19170083 A JP 19170083A JP H0124053 B2 JPH0124053 B2 JP H0124053B2
Authority
JP
Japan
Prior art keywords
cavity
temperature
mold
plate
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58191700A
Other languages
Japanese (ja)
Other versions
JPS6083818A (en
Inventor
Kazuo Maehara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Chemical Industry Co Ltd
Original Assignee
Asahi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Industry Co Ltd filed Critical Asahi Chemical Industry Co Ltd
Priority to JP19170083A priority Critical patent/JPS6083818A/en
Publication of JPS6083818A publication Critical patent/JPS6083818A/en
Publication of JPH0124053B2 publication Critical patent/JPH0124053B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/26Moulds

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Description

【発明の詳細な説明】 本発明は射出成形用金型の構造に関する。詳し
くは主にキヤビテイ部分での温度分布が不適当に
なるのを防止し、もつて射出成形品の成形収縮率
が不均一になるのを最大限防止し、射出成形品が
変形するのを防止するほか、金型温度を一定温度
に安定させるまでの時間を短縮して生産性を向上
させるための金型構造に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to the structure of an injection mold. In detail, it mainly prevents inappropriate temperature distribution in the cavity, prevents uneven molding shrinkage of injection molded products to the maximum extent possible, and prevents injection molded products from deforming. In addition, it relates to a mold structure for improving productivity by shortening the time required to stabilize the mold temperature at a constant temperature.

射出成形に於いて数多くある成形条件の中でも
金型の温度が、成形収縮率その他の品質に及ぼす
影響が極めて大きいこと、殊に結晶性樹脂におい
てはそれが顕著であることはよく知られている。
従つて現在は、金型温度を或る一定の温度に保つ
ための積極的な手段を講じるのが常識となつてい
る。とはいつても現在行なわれている温調の方法
にはいくつかの問題がある。
It is well known that among the many molding conditions in injection molding, the temperature of the mold has an extremely large effect on mold shrinkage rate and other quality, and this is especially noticeable for crystalline resins. .
Therefore, it is now common sense to take active measures to maintain the mold temperature at a certain constant temperature. However, there are some problems with the current temperature control methods.

現在の金型温調の基本的な考え方は、金型を一
個の鉄塊とみなし、その鉄塊に一定温度の熱媒体
を循環させ、全体を一定温度に保つという考え方
である。このやり方には大きくみて2つの問題が
提起できる。
The basic concept of current mold temperature control is to treat the mold as a single piece of iron, and to circulate a heating medium at a constant temperature through the piece of iron to maintain the entire mold at a constant temperature. There are two major problems that can be raised with this approach.

第一には、温調を開始してから金型温度が定常
状態(一定温度を安定に保つ状態)に落ちつくま
でに長い時間を必要とする。定常状態に至るまで
は金型温度が変化しているために成形品の品質も
変化し、従つて本生産は出来ず、生産性を害して
いる。
First, it takes a long time for the mold temperature to settle down to a steady state (a state in which a constant temperature is maintained stably) after temperature control is started. Until a steady state is reached, the quality of the molded product changes because the mold temperature changes, and therefore regular production is not possible, which impairs productivity.

本来、成形品の品質に直接的に影響するのはキ
ヤビテイ部分の温度およびキヤビテイに至る流路
部分(スプル、ランナと呼ばれる部分)の温度で
あつて、これらの部分は金型の一部に過ぎない。
従つて、基本的にはこれらの部分だけが温度コン
トロールされればよいわけであるが、金型を構成
している材料が普通鉄系で、比較的良熱伝導体で
あるため、一部をコントロールするつもりであつ
ても結果的に金型全体を温度コントロールするこ
とになる。それだけ必要以上に熱容量の大きな部
分を温調するわけであるから必然的にその温度を
安定させるために必要な熱量は大きくなり、安定
させるまでに長い時間を必要とする。
Originally, the temperature of the cavity and the flow path leading to the cavity (parts called sprues and runners) directly affect the quality of the molded product, and these parts are only a part of the mold. do not have.
Therefore, basically it is only necessary to control the temperature of these parts, but since the material that makes up the mold is usually iron-based and is a relatively good heat conductor, it is necessary to control the temperature of some parts. Even if you intend to control the temperature, you end up controlling the temperature of the entire mold. Since the temperature of a portion with a larger heat capacity than necessary is controlled, the amount of heat required to stabilize the temperature inevitably increases, and it takes a long time to stabilize the temperature.

実はこの点については改善法があり実効を上げ
ている。第1図はその改善方法をとり入れた金型
構造の一例を示している。同図は、金型の縦断面
を示したもので、キヤビテイ2を形成したキヤビ
テイ駒10が何個か(同図では2個)キヤビテイ
駒保持プレート11a(一般にキヤビテイプレー
トと呼ばれている)に収納されている。そしてキ
ヤビテイ駒保持プレート11aの裏面には断熱板
4aを挾んでバツクアツププレート12が配置さ
れ、さらにスペーサブロツク13、固定プレート
15の順で各各強固に固定され、固定プレート1
5は断熱板4bを挾んで射出成形機の移動側ダイ
プレート5に強固に固定されている。
In fact, there are ways to improve this point, and they are proving effective. FIG. 1 shows an example of a mold structure incorporating this improvement method. The figure shows a longitudinal section of the mold, and shows how many cavity pieces 10 (two in the figure) form the cavity 2, and the cavity piece holding plate 11a (generally called a cavity plate). It is stored in. A backup plate 12 is arranged on the back side of the cavity piece holding plate 11a with the heat insulating plate 4a in between, and a spacer block 13 and a fixing plate 15 are each firmly fixed in this order.
5 is firmly fixed to the movable die plate 5 of the injection molding machine with the heat insulating plate 4b interposed therebetween.

なお、第1図において、14はエジエクタピ
ン、16はエジエクタプレートで、エジエクタピ
ン14はバツクアツププレート12、断熱板4
a、移動側のキヤビテイ駒10aを貫挿してお
り、成形後、移動側の金型を移動させ、エジエク
タプレート14を押してエジエクタピン16をキ
ヤビテイ2に突き出すことにより成形品を金型よ
り取り出す。7はスプルブツシユ、8はスプルラ
ンナ、9は中間プレート、17は取付けプレー
ト、18はダイプレートである。第2図は、温調
用水孔6の流路形状を示すための説明図で第1図
の断面の垂直方向から観察した状態を示す。
In FIG. 1, 14 is an ejector pin, 16 is an ejector plate, and the ejector pin 14 is connected to the back-up plate 12 and the heat insulating plate 4.
a, a cavity piece 10a on the moving side is inserted through the mold, and after molding, the mold on the moving side is moved, the ejector plate 14 is pushed and the ejector pin 16 is pushed out into the cavity 2, and the molded product is taken out from the mold. 7 is a sprue bush, 8 is a sprue runner, 9 is an intermediate plate, 17 is a mounting plate, and 18 is a die plate. FIG. 2 is an explanatory diagram for showing the flow path shape of the temperature regulating water hole 6, and shows the state observed from the vertical direction of the cross section of FIG. 1.

かかる構造から断熱板4a,4bを取り除いた
ものが従来の一般的な金型構造であつて、その場
合は先の説明のとおり、金型全体が温度コントロ
ールの対称となるのみならず、成形機の移動側ダ
イプレートにも熱が伝わり易い構造のためさらに
大きな熱容量部分で温度コントロールしなければ
ならない不利を負う。そこで第1図に示したよう
に、断熱板を入れることによつて温度コントロー
ルすべき部分の実質的な熱容量を小さくすること
が出来る。特に断熱板4aのようにキヤビテイ2
になるべく近いところに断熱板を配置すれば、先
の実質的な熱容量を最も小さくすることが出来、
結果的にキヤビテイ部の温度を非常に早く安定状
態に到達させることが出来る。ただこの改善方法
にはやや難点がある。つまり、断熱板が型締力に
十分持ちこたえなければならないため高価な材料
を用いなければならないのと、それでもなおかつ
鉄材ほどの強度を得にくいため、断熱板の厚さ分
が金型厚さとして増加し、成形機への取り付け上
不都合をまねくことがある。
A conventional general mold structure is one in which the heat insulating plates 4a and 4b are removed from such a structure, and in that case, as explained above, not only the entire mold becomes symmetrical for temperature control, but also the molding machine Because of the structure in which heat is easily transferred to the die plate on the moving side, there is a disadvantage that the temperature must be controlled using a portion with a larger heat capacity. Therefore, as shown in FIG. 1, by inserting a heat insulating plate, it is possible to reduce the substantial heat capacity of the portion where the temperature is to be controlled. Especially the cavity 2 like the heat insulating plate 4a.
By placing the insulation board as close as possible, the actual heat capacity can be minimized,
As a result, the temperature of the cavity can reach a stable state very quickly. However, this improvement method has some drawbacks. In other words, the insulation board must be able to withstand the mold clamping force sufficiently, so expensive materials must be used, and even then, it is difficult to obtain the same strength as steel, so the thickness of the insulation board increases as the mold thickness. However, this may lead to inconvenience when installing it to the molding machine.

さて従来の温調の考え方における第2の問題
は、特に多数個取り金型において指摘される。第
3図はその問題を安性的に示したものである。同
図は移動側キヤビテイプレートをパーテイング面
の側から見たもので、キヤビテイプレート1(キ
ヤビテイプレート1はキヤビテイ駒10とキヤビ
テイ保持プレート11とから形成される)に方形
のキヤビテイ2を4ケ所設けてある。そして曲線
a,b,c,d,eはキヤビテイプレート1の平
面的な温度分布の等温線を示しており、aからe
の順に低温になつている。同図の状況は、ある程
度の連続成形後のほぼ定常状態に至つた時の一時
点のものである。同図のようなキヤビテイ配列で
は金型の中央部分は樹脂からの供給熱が4方から
流入するための温度が高くなり易く、図示したよ
うな温度分布となる。このような場合、一つのキ
ヤビテイ内での温度分布に注目すると、金型の中
心部に近い部分あるいは他のキヤビテイに近い部
分の方が、金型の外周と近い部分よりも高温にな
りがちであり、温度の高い部分の方が収縮率が大
きくなるため、一部品の中に収縮率の差を生じ
る。実察問題としてこの収縮率の分布自身が問題
となることも、もちろんあるが、それ以上に特に
成形品が薄肉の場合に、この収縮率の位置的な差
によつて変形を起こし易いということが問題にな
る。実察発明者らは、薄肉の円盤状の成形品にお
いてキヤビテイの配置に基づく金型内の温度分布
が成形品の変形に強く影響し、ために良品と成形
することが困難になるという事実を多数経験して
いる。
Now, the second problem with the conventional concept of temperature control is particularly pointed out in multi-cavity molds. Figure 3 shows the problem in a safe manner. This figure shows the moving side cavity plate viewed from the parting surface side, and shows four square cavities 2 on the cavity plate 1 (the cavity plate 1 is formed from a cavity piece 10 and a cavity holding plate 11). There are several locations. Curves a, b, c, d, and e indicate isothermal lines of the planar temperature distribution of cavity plate 1, and curves a to e
The temperature is decreasing in this order. The situation shown in the figure is at a certain point in time when a substantially steady state has been reached after a certain degree of continuous molding. In the cavity arrangement as shown in the figure, the temperature in the central part of the mold tends to be high because the heat supplied from the resin flows in from four directions, resulting in a temperature distribution as shown in the figure. In such a case, if we look at the temperature distribution within one cavity, the parts near the center of the mold or the parts near other cavities tend to be hotter than the parts near the outer periphery of the mold. Since the shrinkage rate is greater in the higher temperature parts, there will be differences in the shrinkage rate within each part. Of course, the distribution of this shrinkage rate itself is a problem as a matter of practical observation, but even more so, especially when the molded product is thin, deformation is likely to occur due to the positional difference in this shrinkage rate. becomes a problem. The inventors discovered the fact that in thin-walled disk-shaped molded products, the temperature distribution inside the mold based on the cavity arrangement strongly affects the deformation of the molded product, making it difficult to mold it into a good product. I have experienced many.

このような場合、温調水路を工夫して金型内の
温度分布を小さくすることはもちろん原理的に可
能であるが、温調水路の配置は自由度があまり大
きくないこと、また温度分布は給熱、放熱のバラ
ンスで決まるものであるから、成形の条件が変わ
る毎にその水路の設計を変える必要があると、そ
して何より熱バランスを計算(あるいは実験的に
測定)すること自体が非常に難しい。従つて、温
度分布を水路設計で均一にする方法は原理的に有
力とはいえ実用上は至難といわざるを得ない。
In such cases, it is of course possible in principle to reduce the temperature distribution inside the mold by devising temperature control channels, but there is not much freedom in arranging the temperature control channels, and the temperature distribution Since it is determined by the balance between heat supply and heat radiation, it is necessary to change the design of the water channel every time the molding conditions change, and above all, calculating (or experimentally measuring) the heat balance itself is extremely difficult. difficult. Therefore, although the method of making the temperature distribution uniform through waterway design is effective in principle, it must be said that it is extremely difficult in practice.

本発明は、以上2つの問題を効果的に改善する
手段を提供するものである。
The present invention provides means for effectively improving the above two problems.

即ち、本発明は、各々温度調節手段を有する複
数のキヤビテイ駒がキヤビテイ駒保持プレートに
保持された多数個取り金型の各キヤビテイ駒とキ
ヤビテイ駒保持プレートとの間に断熱層が設けら
れている射出成形用金型の構造である。
That is, the present invention provides a multi-cavity mold in which a plurality of cavity pieces each having a temperature adjustment means are held on a cavity piece holding plate, and a heat insulating layer is provided between each cavity piece and the cavity piece holding plate. This is the structure of an injection mold.

上記本発明における断熱層は、キヤビテイ相互
間の熱の影響を抑えると共に、温度調節すべき領
域を小さく区画して、各温度調節手段が受け持つ
温度調節すべき領域の実質的熱容量を小さくする
働きをなすものである。
The heat insulating layer in the present invention has the function of suppressing the influence of heat between the cavities and dividing the area to be temperature controlled into smaller areas, thereby reducing the substantial heat capacity of the area to be temperature controlled by each temperature adjusting means. It is what you do.

かかる機能を効果的かつ具体的に果すため、本
発明は、キヤビテイを形成している部分それぞれ
の周囲と断熱片を形成するものである。
In order to effectively and specifically fulfill this function, the present invention forms a heat insulating piece around each part forming the cavity.

本発明を実施例に従つてさらに説明する。第4
図および第5図は本発明の一実施例を示す構造図
で、第4図は金型の移動側を、パーテイング面側
から見た平面図であり、第5図は、同じく移動側
を第4図に示したX,Yを通る面で断面した縦断
面図である。第4図および第5図において、キヤ
ビテイ2を形成したキヤビテイ駒10がキヤビテ
イ保持プレート11(一般にキヤビテイプレート
と呼ばれる)に収納されていおり、このキヤビテ
イ駒保持プレート11の裏面にはバツクアツププ
レート12そしてスペーサブロツク13、固定プ
レート15がこの順にそれぞれ強固に固定されて
いる。そしてキヤビテイ駒10それぞれの周囲に
は断熱空気層3が形成されており、従つてキヤビ
テイ駒10とキヤビテイ駒保持プレート11とは
一部を除いて直接的には熱を伝えない構造であ
る。そして図には示していないが、温調用の水路
の主幹経路がバツクアツププレート12に配さ
れ、支経路が各キヤビテイ駒10に導かれてお
り、各キヤビテイ駒10は温調用熱媒によつて温
度コントロールされる。
The present invention will be further explained with reference to Examples. Fourth
5 and 5 are structural diagrams showing one embodiment of the present invention, FIG. 4 is a plan view of the moving side of the mold viewed from the parting surface side, and FIG. FIG. 4 is a vertical sectional view taken along a plane passing through X and Y shown in FIG. 4; 4 and 5, a cavity piece 10 forming a cavity 2 is housed in a cavity holding plate 11 (generally called a cavity plate), and a back-up plate 12 is provided on the back side of this cavity piece holding plate 11. The spacer block 13 and the fixing plate 15 are each firmly fixed in this order. A heat insulating air layer 3 is formed around each of the cavity pieces 10, and therefore, the cavity pieces 10 and the cavity piece holding plate 11 have a structure in which heat is not directly transmitted to them except for a part. Although not shown in the figure, the main path of the temperature control waterway is arranged in the backup plate 12, and the branch paths are led to each cavity piece 10, and each cavity piece 10 is connected to the temperature control heat medium. Temperature controlled.

かかる構造にあつては、前述のようにキヤビテ
イ2相互間での熱の移動はキヤビテイ駒保持プレ
ート11を通して最短距離で行なわりることはな
く、キヤビテイ2からキヤビテイ駒10を経て、
バツクアツププレート12を経、さらに他のキヤ
ビテイ駒10を経てそのキヤビテイ駒10に設け
られたキヤビテイ2の部分に至るという経路をと
る。従つて従来に比してキヤビテイ相互間の熱伝
達経路は長くなり、キヤビテイ相互間の熱の相互
影響はきわめて小さくなる。この効果は、前記キ
ヤビテイ駒10とキヤビテイ駒保持プレート11
の間に設けた断熱空気層3の深さ(パーテイング
面に直角の方向の長さ)が深いほど大きくなるこ
とは明らかであるが、発明者らの実験によれば、
前記深さは例えば絶対値として約20mm、あるいは
別の表現法をとれば、成形品の平面寸法(第4図
の円形のキヤビテイ2の直径)の約5分の1の深
さであつても十分改善の効果が認められた。また
この点は原理的に考えても前記深さは如何程であ
つても効果が得られることは明らかである。ま
た、前記断熱空気層3のように、この断熱層を空
気層にするのが容易かつ効果的であるが、同部に
強度あるいは剛性を必要とする場合には空気の代
わりにセラミツク等の断熱性素材を用いることも
もちろん可能である。
In such a structure, as described above, heat transfer between the cavities 2 is not carried out in the shortest distance through the cavity piece holding plate 11, but from the cavity 2 through the cavity piece 10.
A route is taken in which it passes through the backup plate 12 and further passes through another cavity piece 10 to reach the portion of the cavity 2 provided in that cavity piece 10. Therefore, the heat transfer path between the cavities becomes longer than in the past, and the mutual influence of heat between the cavities becomes extremely small. This effect is achieved by the cavity piece 10 and the cavity piece holding plate 11.
It is clear that the deeper the depth (the length in the direction perpendicular to the parting surface) of the insulating air layer 3 provided between the parts, the larger it becomes, but according to the inventors' experiments,
For example, the depth may be about 20 mm in absolute value, or if expressed in another way, even if it is about one-fifth of the planar dimension of the molded product (the diameter of the circular cavity 2 in Fig. 4). A sufficient improvement effect was observed. Moreover, considering this point in principle, it is clear that the effect can be obtained regardless of the depth. In addition, it is easy and effective to make this heat insulating layer an air layer like the above-mentioned heat insulating air layer 3, but if strength or rigidity is required in the same part, a heat insulating layer such as ceramic or the like can be used instead of air. Of course, it is also possible to use a synthetic material.

次に第6図にキヤビテイ駒11aとバツクアツ
ププレート12との間に断熱板4を介在させた例
を示す。この断熱板4によりキヤビテイ駒11a
の断熱はより完全になる。なお、キヤビテイ駒1
0a,10bに設けられた温調用水路6は、平面
図とすると円管状の流路形状となる。
Next, FIG. 6 shows an example in which a heat insulating plate 4 is interposed between the cavity piece 11a and the backup plate 12. This heat insulating plate 4 allows the cavity piece 11a to
The insulation will be more complete. In addition, cavity piece 1
The temperature control water channels 6 provided at 0a and 10b have a circular tubular flow path shape when viewed in a plan view.

本発明は以上述べたように、特に多数個取りの
金型で、キヤビテイ相互間の熱の影響をごく小さ
くし、もつて収縮率の不均一や変形を最少限に
し、高品質の成形を可能にする他、温調すべき領
域の実質的な熱容量が小さくできるため、温調を
開始して一定の安定な温度状態に至らしめるに必
要な時間を短縮し、従つて生産性を高め、成形の
コスト低減に非常に有効である。
As described above, the present invention minimizes the influence of heat between cavities, especially in multi-cavity molds, thereby minimizing uneven shrinkage and deformation, and enables high-quality molding. In addition, since the actual heat capacity of the area to be temperature controlled can be reduced, the time required to start temperature control and reach a constant stable temperature state is shortened, thus increasing productivity and molding. It is very effective in reducing costs.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来の金型の構造を示す縦断面図、第
2図は第1図の温調用水孔を示すための説明図、
第3図は従来の金型における温度分布の一例を示
した図、第4図、第5図は本発明にかかる金型構
造の一例を示したもので、第4図は平面図、第5
図は縦断面図であり、第6図は本発明の他の実施
例を示した縦断面図である。 1…キヤビテイプレート、2…キヤビテイ、3
…断熱空気層、4,4a,4b…断熱板、5a…
移動側のダイプレート、5b…固定側のダイプレ
ート、6…温調用水孔、7…スプルブツシユ、8
…スプルランナ、9…中間プレート、10a…移
動側のキヤビテイ駒、10b…固定側のキヤビテ
イ駒、11a…移動側のキヤビテイ駒保持プレー
ト、11b…固定側のキヤビテイ駒保持プレー
ト、12…バツクアツププレート、13…スペー
サブロツク、14…エジエクタプレート、15固
定プレート、16…エジエクタピン、17…取付
けプレート。
Fig. 1 is a vertical cross-sectional view showing the structure of a conventional mold, Fig. 2 is an explanatory diagram showing the temperature control water hole in Fig. 1,
FIG. 3 is a diagram showing an example of temperature distribution in a conventional mold, and FIGS. 4 and 5 are examples of a mold structure according to the present invention.
The figure is a longitudinal sectional view, and FIG. 6 is a longitudinal sectional view showing another embodiment of the present invention. 1...Cavity plate, 2...Cavity, 3
...Insulating air layer, 4, 4a, 4b...Insulating board, 5a...
Moving side die plate, 5b...fixed side die plate, 6...temperature control water hole, 7...sprue bush, 8
... Sprull runner, 9... Intermediate plate, 10a... Cavity piece on moving side, 10b... Cavity piece on fixed side, 11a... Cavity piece holding plate on moving side, 11b... Cavity piece holding plate on fixed side, 12... Backup plate, 13...Spacer block, 14...Ejector plate, 15 Fixing plate, 16...Ejector pin, 17...Mounting plate.

Claims (1)

【特許請求の範囲】[Claims] 1 各々温度調節手段を有する複数のキヤビテイ
駒がキヤビテイ駒保持プレートに保持された多数
個取り金型の各キヤビテイ駒とキヤビテイ駒保持
プレートとの間に断熱層が設けられていることを
特徴とする射出成形用金型の構造。
1. A multi-cavity mold in which a plurality of cavity pieces each having a temperature adjustment means are held on a cavity piece holding plate is characterized in that a heat insulating layer is provided between each cavity piece and the cavity piece holding plate. Structure of injection mold.
JP19170083A 1983-10-15 1983-10-15 Structure of injection mold Granted JPS6083818A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19170083A JPS6083818A (en) 1983-10-15 1983-10-15 Structure of injection mold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19170083A JPS6083818A (en) 1983-10-15 1983-10-15 Structure of injection mold

Publications (2)

Publication Number Publication Date
JPS6083818A JPS6083818A (en) 1985-05-13
JPH0124053B2 true JPH0124053B2 (en) 1989-05-10

Family

ID=16279019

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19170083A Granted JPS6083818A (en) 1983-10-15 1983-10-15 Structure of injection mold

Country Status (1)

Country Link
JP (1) JPS6083818A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3111951B2 (en) * 1997-11-10 2000-11-27 住友電気工業株式会社 Manufacturing method of precision molded parts
FR2964899B1 (en) * 2010-09-17 2014-03-14 C E M A MULTI-PRINT, INJECTION MOLDING MOLD
CN106363873B (en) * 2016-08-25 2019-12-06 河南理工大学 non-balance injection molding die

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5087151A (en) * 1973-12-05 1975-07-14
JPS5312778U (en) * 1976-07-15 1978-02-02
JPS5312778A (en) * 1976-07-22 1978-02-04 Miura Eng Int Active carbon adsorption apparatus
JPS5340055A (en) * 1976-09-25 1978-04-12 Sumitomo Bakelite Co Method of injection molding thermosetting resin and mold device
JPS5468861A (en) * 1977-11-11 1979-06-02 Matsushita Electric Works Ltd Mold and method for controlling its temperature
JPS5714423A (en) * 1980-06-27 1982-01-25 Onkyo Corp Drawing method for vibration diaphragm

Also Published As

Publication number Publication date
JPS6083818A (en) 1985-05-13

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