JPH0130299B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention provides bumping-treated IC chips.
This relates to an IC gigantic bonding device that presses onto a copper foil lead pattern on a tape (FPC tape) that has been plated in a predetermined manner, and simultaneously bonds a large number of fingers to bumps on an IC chip.

In a conventional device of this type, a wafer is pasted onto a wafer pasting substrate made of glass or the like, and IC chips are individually pasted onto the substrate by complete dicing. The board to which the IC chip is attached is placed on a table that moves in X and Y directions orthogonal to each other. On the other hand, the FPC tape is wound on a pair of reels, and is transported at a predetermined pitch by a tape transport device installed on a tape transport guide column. Fine adjustment is possible in the XY directions. A bonding tool that can move up and down and an ITV camera are installed at the processing position where the IC chip and FPC tape are bonded, and the ITV camera monitors the mutual positions of the bonding tool, IC chip, and FPC tape. While doing so, the IC chip and the tape are moved in the X and Y directions to align them, and the bonding tool is lowered to press the bumps of the IC chip and the fingers of the FPC tape, and they are bonded by heat and pressure. The bonding tool can be moved back and forth in the raised position, and is retracted to a position that does not obstruct the view of the ITV. In such an apparatus, since the tape transport column that guides the tape is moved in the XY direction, the rigidity of the column is likely to be insufficient, and there is a possibility that accuracy may be reduced. Further, although both ends of the tape are wound on reels, the middle part thereof is moved and adjusted in the X and Y directions, which is undesirable because the tape is twisted.

The present invention aims to provide an IC gigantic bonding device that eliminates the above-mentioned drawbacks.

Hereinafter, the present invention will be explained with reference to the drawings. In the drawings, reference numeral 1 denotes a base, on which a gate-shaped tape conveyance guide column 2 is fixed as seen in FIG. 1, and between the columns, 1st XY table 3
and the second XY table 4 are sequentially stacked.
The 1st XY table 3 is attached to the base in the X direction (left and right)
It consists of an X table 5 that is slidably provided on the X table and its driving pulse motor 6, and a Y table 7 that is provided slidably on the X table in the Y direction (back and forth direction) and its driving pulse motor 8. 2nd XY
The table 4 includes an X table 9 provided on the Y table 7 of the first XY table 3 and a pulse motor 10 for driving the same, a Y table 11 on the X table and a pulse motor 12 for driving the same.
A support column 13 is fixed on the Y table 7 of the first XY table 3, and a bonding tool 14 is provided at the tip of the column and an ITV camera 15 is provided above it. On the other hand, on the Y table 11 of the second XY table 4, a support table 16 for placing and fixing the substrate on which the IC chip is attached is provided so as to be movable up and down and rotatable in a horizontal plane. is connected to a lever 18 supported by a lever 17, the other end of which rests on a cam 19, and the table 16 is moved up and down by rotation of the cam. The support table 16 has a manual adjustment function that allows it to be rotated and fixed in a horizontal plane in order to finely adjust the orientation of the placed IC chip, but this will not be described in detail here.

The base 1 is provided with a supply reel 21 and a take-up reel 22 for the tape 20 on both sides thereof.
is guided by a guide 23 on the tape conveyance guide column 2, and driven by a driving sprocket wheel 24.
It is fed by a predetermined pitch and positioned by the positioning lever 25. On the other hand, a bonding area A (Fig. 3) indicating the pressing position of the bonding tool 14 is provided in the field of view of the ITV camera 15, and the bonding area A (Fig. 3) is moved from the retracted position shown in Fig. 2 by a mechanism not shown. It moves to an upper position and further descends to press the IC chip and finger to perform the bonding process.

Next, the operation will be explained. First, move the FPC tape and IC chip one pitch at a time. The FPC tape 20 is guided by a guide 23 provided on the tape conveyance guide column 2, is fed by one pitch by a driving sprocket wheel 24, and the finger of the tape 20 is moved to the bonding area A by a positioning lever 25. The IC chip is positioned at the reached position, and the IC chip is fed one pitch by the movement of the second XY table 4 while being stuck to the substrate fixed to the support table 16, and a new IC chip is supplied to the bonding area A. This tape 2
While the 0 and IC chips are being fed, the support table 16 is at the lowest position so that the IC chips on the table do not come into contact with the tape.
When the movement of the tape and the IC chip is completed, the table 16 or the cam 19 is operated to raise it to an intermediate position for alignment. Here, the driving pulse motors 6, 8, 10, and 12 of each XY table are operated to move the XY table in the XY direction, and connect the bonding area A and the IC chip in the camera.
Accurately match the position of the FPC tape. That is,
By moving the first XY table 3, a predetermined position of the finger portion of the tape 20 is accurately aligned with a predetermined position of the bonding area A. Similarly, by moving the second XY table 4, the IC
Make sure the chip matches bonding area A exactly.

Next, the tool 14 is advanced from the retracted position and further lowered to press the tape onto the IC chip and connect the fingers of the lead pattern to the bumps on the IC chip. The bonding tool 14 is heated and contributes to bonding the finger and bump, and the heat also helps to bond the IC.
The wax that adheres the chips to the wafer-attached substrate melts, and only the bonded IC chips are peeled off from the substrate, attached to the tape, and transported. Subsequently, the tool is retracted, the table 16 is lowered to the lowest position, and the tape and IC chip are each fed one pitch.
The next lead pattern and IC chip are sent to the processing position, and the same operations as above are repeated.

As is clear from the above, according to the present invention, ITV
Since the camera and bonding tool move on the first XY table and the tape does not move, the rigidity of the tape transport guide column can be increased and accuracy can be improved. In addition, since the tape does not get twisted like in the past, there is no deterioration in quality. Furthermore, the tool can be moved significantly in the front and back direction (Y direction), and the first XY table can be moved back and forth, so it can be applied to various types of lead patterns, such as those where the device hole is offset to the edge of the tape. can do.

[Brief explanation of drawings]

FIG. 1 is a front view showing one embodiment of the present invention, FIG. 2 is a right side view of FIG. 1, and FIG. 3 is a plan view. 2...Table transport guide column, 3...1st XY
Table, 4... 2nd XY table, 13... Support column, 14... Bonding tool, 15...
ITV camera, 16...Support table, 20...
tape, 23... guide, 24... drive sprocket, 25... positioning lever.

Claims (1)

[Claims] 1 Fix the transport guide column that guides the tape with the lead pattern to which the IC chips are to be bonded,
XY perpendicular to the lower part of the tape conveyance path
Two sets of XY tables, each consisting of a table that moves in the direction of
An IC gang bonding device characterized by being equipped with a TV camera that aligns an IC chip and a table, and a bonding tool that heats and presses the IC chip and tape.