JPH0130911B2 - - Google Patents
Info
- Publication number
- JPH0130911B2 JPH0130911B2 JP14501484A JP14501484A JPH0130911B2 JP H0130911 B2 JPH0130911 B2 JP H0130911B2 JP 14501484 A JP14501484 A JP 14501484A JP 14501484 A JP14501484 A JP 14501484A JP H0130911 B2 JPH0130911 B2 JP H0130911B2
- Authority
- JP
- Japan
- Prior art keywords
- undecyl
- methylimidazole
- copper
- methylene
- mixture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 23
- 229910052802 copper Inorganic materials 0.000 claims description 19
- 239000010949 copper Substances 0.000 claims description 19
- 239000000203 mixture Substances 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- SQZLLYMZDZQMRH-UHFFFAOYSA-N 5-methyl-4-[(5-methyl-2-undecyl-1h-imidazol-4-yl)methyl]-2-undecyl-1h-imidazole Chemical compound N1C(CCCCCCCCCCC)=NC(CC2=C(NC(CCCCCCCCCCC)=N2)C)=C1C SQZLLYMZDZQMRH-UHFFFAOYSA-N 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- 150000003839 salts Chemical class 0.000 claims description 8
- JQEVCCUJHLRAEY-UHFFFAOYSA-N 5-methyl-2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=C(C)N1 JQEVCCUJHLRAEY-UHFFFAOYSA-N 0.000 claims description 7
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N 4-methylimidazole Chemical compound CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 claims description 4
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims 1
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 150000002460 imidazoles Chemical class 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 238000002845 discoloration Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- QGJOPFRUJISHPQ-UHFFFAOYSA-N Carbon disulfide Chemical compound S=C=S QGJOPFRUJISHPQ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 150000001298 alcohols Chemical class 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-M Lactate Chemical compound CC(O)C([O-])=O JVTAAEKCZFNVCJ-UHFFFAOYSA-M 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 150000007522 mineralic acids Chemical class 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium peroxydisulfate Substances [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 1
- VAZSKTXWXKYQJF-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)OOS([O-])=O VAZSKTXWXKYQJF-UHFFFAOYSA-N 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000002481 ethanol extraction Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- -1 imidazole compound Chemical class 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- XDAHMMVFVQFOIY-UHFFFAOYSA-N methanedithione;sulfane Chemical compound S.S=C=S XDAHMMVFVQFOIY-UHFFFAOYSA-N 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- 239000000693 micelle Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/14—Nitrogen-containing compounds
- C23F11/149—Heterocyclic compounds containing nitrogen as hetero atom
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、銅金属の防錆方法に関するものであ
り、プリント配線板、電線、一般電気部品、銅製
品等が、その利用分野である。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for preventing rust of copper metal, and its fields of application include printed wiring boards, electric wires, general electrical parts, copper products, and the like.
従来の技術
銅金属の表面にある種の長鎖アルキルイミダゾ
ールを含む溶液を接触させると、銅金属の表面に
イミダゾール化合物の被膜が形成され、これによ
つて優れた防錆作用が生起することが知られてい
る。（特公昭46−17046号、同48−11454号、同48
−25621号及び同49−26183号各公報参照）
発明が解決しようとする問題点
しかるに上記の方法で処理された銅表面は、特
に処理直後の暫くの間粘着性を示し、指で触ると
所謂ベタツキが感じられ、之が一部の顧客の不満
の因となつている。Prior Art When a solution containing a certain kind of long-chain alkylimidazole is brought into contact with the surface of copper metal, a film of an imidazole compound is formed on the surface of the copper metal, and this results in an excellent antirust effect. Are known. (Special Publications No. 46-17046, No. 48-11454, No. 48
(Refer to Publications No. 25621 and No. 49-26183) Problems to be Solved by the Invention However, the copper surface treated by the above method exhibits stickiness, especially for a while immediately after treatment, and when touched with a finger, it becomes so-called sticky. It feels sticky, which is a cause of dissatisfaction among some customers.
本発明が解決しようとする問題点は所謂このベ
タツキである。 The problem that the present invention aims to solve is this so-called stickiness.
問題点を解決するための手段
本発明は新規な４，4′−メチレン−ビス−（２
−ウンデシル−５−メチルイミダゾール）と公知
の２−ウンデシル−４−メチルイミダゾールの混
合物、あるいは該混合物の適当な塩で銅表面を処
理し、所謂ベタツキの少ない防錆方法を提供する
ものである。Means for Solving the Problems The present invention provides a novel 4,4'-methylene-bis-(2
The present invention provides a rust prevention method with less stickiness by treating the copper surface with a mixture of 2-undecyl-5-methylimidazole) and the known 2-undecyl-4-methylimidazole, or an appropriate salt of the mixture.
本発明方法において使用される４，4′−メチレ
ン−ビス−（２−ウンデシル−５−メチルイミダ
ゾール）は、下記の構造式を有し、
２−ウンデシル−４−メチルイミダゾールとパラ
フオルムアルデヒドを、溶剤を用い、あるいはそ
れを用いずに、触媒と共に加熱することにより合
成することができる。 4,4'-methylene-bis-(2-undecyl-5-methylimidazole) used in the method of the present invention has the following structural formula: 2-Undecyl-4-methylimidazole and paraformaldehyde can be synthesized by heating with a catalyst, with or without a solvent.
なお、４，4′−メチレン−ビス−（２−ウンデ
シル−５−メチルイミダゾール）の物性は次の通
りである。 The physical properties of 4,4'-methylene-bis-(2-undecyl-5-methylimidazole) are as follows.
無色結晶。水及びアセトンに不溶。アルコール
類に可溶。 Colorless crystal. Insoluble in water and acetone. Soluble in alcohols.
TCL（シリカＧ、アセテン、B.T.B発色）Rf0.25
〜0.35
融点：182〜183℃
νKBr cn -1：2925、2855、1618、1531、1465、1445、
1420（第１吸収）1375、1316、1037、918、833、
713
NMR（CD3OD）
δ；3.65、ｓ、2H（メチレン基）
；2.65、ｔ、4H（α−メチレン）
；2.00、ｓ、6H（メチル基）
；1.61、ｍ、4H（β−メチレン）
；1.27、ｍ、32H（ウンデシル基）
；089、ｔ、6H（ウンデシル基の末端メチル）
Mass；ｍ／e484（Ｍ）、329、357、343、249、240
銅金属の表面は大気中で次第に汚染され、やが
て本来の色調と光沢を失い、特に硫化水素および
二硫化炭素のような硫黄化合物を含む雰囲気中で
は速やかに褐色化するものである。TCL (Silica G, acetene, BTB color development) Rf0.25
~0.35 Melting point: 182~183℃ ν KBr cn -1 : 2925, 2855, 1618, 1531, 1465, 1445,
1420 (first absorption) 1375, 1316, 1037, 918, 833,
713 NMR (CD 3 OD) δ; 3.65, s, 2H (methylene group); 2.65, t, 4H (α-methylene); 2.00, s, 6H (methyl group); 1.61, m, 4H (β-methylene) ;1.27, m, 32H (undecyl group); 089, t, 6H (terminal methyl of undecyl group) Mass; m/e484 (M), 329, 357, 343, 249, 240 The surface of copper metal gradually It becomes contaminated and eventually loses its original color and luster, and quickly turns brown, especially in an atmosphere containing sulfur compounds such as hydrogen sulfide and carbon disulfide.
以上のことは銅製品の商品価値を著しく低下さ
せる。 The above causes a significant decrease in the commercial value of copper products.
本発明者等は、４，4′−メチレン−ビス−（２
−ウンデシル−５−メチルイミダゾール）と２−
ウンデシル−４−メチルイミダゾールの混合物溶
液、あるいは該混合物の塩の溶液で銅の表面を処
理することによつて顕著な防錆効果が発揮され、
且つこのように処理された表面の所謂ベタツキの
程度が低いことを見出した。 The present inventors have discovered that 4,4'-methylene-bis-(2
-undecyl-5-methylimidazole) and 2-
By treating the surface of copper with a solution of a mixture of undecyl-4-methylimidazole or a solution of a salt of the mixture, a remarkable rust-preventing effect is exhibited.
It has also been found that the so-called stickiness of the surface treated in this manner is low.
本発明の実施に適する塩は水溶性でなければな
らない。そのような塩は該混合物と有機酸あるい
は無機酸のいずれかより形成されるものである。 Salts suitable for the practice of this invention must be water soluble. Such salts are those formed from the mixture and either organic or inorganic acids.
酸の役割は該混合物を水に溶解させることにあ
る。従つて、そのような役割を果たすものであれ
ばいかなる酸も使用出来る。 The role of the acid is to dissolve the mixture in water. Therefore, any acid that fulfills such a role can be used.
代表的な有機酸として酢酸、グリコール酸、蓚
酸、琥珀酸、乳酸が使用され、無機酸として塩
酸、硫酸、燐酸、硝酸が使用される。 Typical organic acids used are acetic acid, glycolic acid, oxalic acid, succinic acid, and lactic acid, while hydrochloric acid, sulfuric acid, phosphoric acid, and nitric acid are used as inorganic acids.
本発明の方法において使用される塩の溶剤は、
水又はアルコール類である。 The salt solvent used in the method of the invention is
Water or alcohol.
アルコール類は次のようなものである。 Alcohols are as follows.
メタノール、エタノール、イソプロパノール、
ｎ−プロパノール、エチレングリコール、エチレ
ン−グリコール−モノ−メチルエーテル。 methanol, ethanol, isopropanol,
n-propanol, ethylene glycol, ethylene-glycol-mono-methyl ether.
また両イミダゾール混合物の場合の溶剤として
は、上記のアルコール類とクロロホルム又はクロ
ロセンが使用される。 In the case of a mixture of both imidazoles, the above-mentioned alcohols and chloroform or chlorocene are used as the solvent.
本発明の実施態様について次に述べる。 Embodiments of the present invention will be described next.
銅金属の表面を酸洗浄あるいはサンドペーパー
によつて仕上げ、引き続き４，4′−メチレン−ビ
ス−（２−ウンデシル−５−メチルイミダゾール）
と２−ウンデシル−４−メチルイミダゾールまた
はこれらの塩を含む溶液中に浸漬する。あるいは
浸漬の代わりに該溶液を塗布または噴霧してもよ
い。 The surface of the copper metal is finished by acid cleaning or sandpaper, followed by 4,4'-methylene-bis-(2-undecyl-5-methylimidazole).
and 2-undecyl-4-methylimidazole or a salt thereof. Alternatively, the solution may be applied or sprayed instead of dipping.
４，4′−メチレン−ビス−（２−ウンデシル−
５−メチルイミダゾール）と２−ウンデシル−４
−メチルイミダゾールとのモル比は、1.0：0.8な
いし1.0：2.0の範囲内にある。 4,4'-methylene-bis-(2-undecyl-
5-methylimidazole) and 2-undecyl-4
- the molar ratio with methylimidazole is in the range 1.0:0.8 to 1.0:2.0.
以上の処理は、０〜100℃の温度範囲で実施出
来るが室温下で行うのが最も簡単で望ましい。 The above treatment can be carried out at a temperature range of 0 to 100°C, but it is easiest and most desirable to carry out it at room temperature.
前述の溶液濃度は0.01〜5.0wt％であり、特に
0.1〜2.0wt％が望ましい。 The aforementioned solution concentration is 0.01-5.0wt%, especially
0.1-2.0wt% is desirable.
処理時間は１分間以上あれば、それで充分であ
る。 A treatment time of 1 minute or more is sufficient.
後処理は水洗、乾燥の順で行われる。勿論、水
洗を省略することは出来る。 Post-treatment is performed in the order of washing with water and drying. Of course, washing with water can be omitted.
作 用
長鎖アルキル基を有する両イミダゾール混合物
又はその塩を含む溶液を銅金属の表面に接触させ
ると、先ず両イミダゾールの−NH−基が銅表面
に吸着し、−NH−基がアンカー（anchor）の役
目を果たし、銅原子と該イミダゾール分子の間に
ある種の化学結合を生じ、次いで銅表面に結合し
た先の両イミダゾールに溶液中の残余の両イミダ
ゾールが長鎖アルキル基のミセル形成力によつて
順次集合し、銅表面はイミダゾールのミセルによ
り全面的に被覆される。Action When a solution containing a mixture of both imidazoles having a long-chain alkyl group or a salt thereof is brought into contact with the surface of copper metal, the -NH- groups of both imidazoles are first adsorbed on the copper surface, and the -NH- groups act as anchors. ), forming a kind of chemical bond between the copper atom and the imidazole molecule, and then the remaining imidazoles in the solution bond to the two imidazoles that have bonded to the copper surface due to the micelle-forming ability of the long-chain alkyl group. The copper surface is completely covered with imidazole micelles.
種類の相異なる２種イミダゾール化合物が上述
の方法で、銅表面に同時に付着すると云う現象は
興味深い。 The phenomenon that two different types of imidazole compounds are simultaneously deposited on a copper surface by the method described above is interesting.
この現象を支持する一つの実験について次に述
べる。 An experiment that supports this phenomenon is described below.
過硫酸アンモニウムと硫酸の水溶液で清浄化し
た250grの銅粉に、該混合物（１：１モル比）の
乳酸塩の2wt％水溶液50mlを加え、ついで該銅粉
を水洗乾燥した。 To 250 gr of copper powder cleaned with an aqueous solution of ammonium persulfate and sulfuric acid, 50 ml of a 2 wt % aqueous solution of lactate in the mixture (1:1 molar ratio) was added, and then the copper powder was washed with water and dried.
該乾燥銅粉をソツクスレー抽出器によるエタノ
ール抽出に付し、抽出液のTLC（シリカＧ、エタ
ノール）を検したところ、モル比略１：１に相当
する２つのスポツトが認められた。 When the dried copper powder was subjected to ethanol extraction using a Soxhlet extractor and the TLC (silica G, ethanol) of the extract was analyzed, two spots corresponding to a molar ratio of approximately 1:1 were observed.
実施例 １
サンドペーパーで磨き、ベンゼンで脱脂した幅
３cm、長さ10cmの銅張積層板を４，4′−メチレン
−ビス−（２−ウンデシル−５−メチルイミダゾ
ール）と２−ウンデシル−４−メチルイミダゾー
ルの等モル混合物の乳酸塩の2wt％水溶液
（PHO約6.0）に室温で２分間浸漬したのち、該
板を取出して水洗した。Example 1 A copper-clad laminate 3 cm wide and 10 cm long, polished with sandpaper and degreased with benzene, was coated with 4,4'-methylene-bis-(2-undecyl-5-methylimidazole) and 2-undecyl-4- After being immersed in a 2 wt % aqueous solution of lactate of an equimolar mixture of methylimidazole (PHO approximately 6.0) at room temperature for 2 minutes, the plate was taken out and washed with water.
処理表面の所謂ベタツキの少あないことが認め
られた。その後、該板を二硫化炭素製造工場内に
放置した。 It was observed that there was some so-called stickiness on the treated surface. Thereafter, the plate was left in a carbon disulfide manufacturing factory.
放置後９日間経過した時点で変色は認められな
かつたのに対し、未処理の対照板には著しい変色
が認められた。 No discoloration was observed after 9 days of standing, whereas significant discoloration was observed in the untreated control board.
実施例 ２
実施例１と同様にして表面清浄化した相当銅張
積層板を４，4′−メチレン−ビス−（２−ウンデ
シル−５−メチルイミダゾール）と２−ウンデシ
ル−４−メチルイミダゾールの１：２モル混合物
の2wt％メタノール溶液に室温で２分間浸漬した
のち、該板を取り出し、少時風乾させた。Example 2 A corresponding copper-clad laminate whose surface was cleaned in the same manner as in Example 1 was treated with 4,4'-methylene-bis-(2-undecyl-5-methylimidazole) and 2-undecyl-4-methylimidazole. : After being immersed in a 2 wt % methanol solution of a 2 molar mixture at room temperature for 2 minutes, the plate was taken out and air-dried for a while.
表面のベタツキの少ないことが認められた。 It was observed that the surface was less sticky.
そのものを実施例１と同様の場所に放置した。 The sample was left in the same location as in Example 1.
９日間経過した時点では変色は認められなかつ
たのに対し、対照板には著しい変色が認められ
た。 No discoloration was observed after 9 days had elapsed, whereas significant discoloration was observed on the control board.
発明の効果
本発明によれば、銅金属の表面に極めて短時間
のうちにベタツキの程度の少ない被膜を形成する
ことができ、しかも該被膜は甚だ強靭であり長期
に亘つて顕著な防錆作用を呈する。Effects of the Invention According to the present invention, a less sticky film can be formed on the surface of copper metal in an extremely short period of time, and the film is extremely tough and has a remarkable anti-rust effect over a long period of time. exhibits.
Claims (1)
4′−メチレン−ビス−（２−ウンデシル−５−メ
チルイミダゾール） 構造式 と２−ウンデシル−４−メチルイミダゾールの混
合物あるいは該両化合物の塩の混合物を含む溶液
と接触させることを特徴とする銅金属の防錆方
法。 ２ ４，4′−メチレン−ビス−（２−ウンデシル
−５−メチルイミダゾール）と２−ウンデシル−
４−メチルイミダゾールのモル比が1.0：0.8ない
し1.0：2.0の範囲内にある特許請求の範囲第１項
に記載の方法。[Scope of Claims] 1. The surface of copper metal is represented by the following structural formula 4,
4'-methylene-bis-(2-undecyl-5-methylimidazole) Structural formula 1. A method for preventing rust of copper metal, the method comprising contacting a copper metal with a solution containing a mixture of and 2-undecyl-4-methylimidazole or a mixture of salts of these two compounds. 2 4,4'-methylene-bis-(2-undecyl-5-methylimidazole) and 2-undecyl-
A method according to claim 1, wherein the molar ratio of 4-methylimidazole is in the range of 1.0:0.8 to 1.0:2.0.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14501484A JPS6123775A (en) | 1984-07-11 | 1984-07-11 | Method for preventing corrosion of copper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14501484A JPS6123775A (en) | 1984-07-11 | 1984-07-11 | Method for preventing corrosion of copper |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6123775A JPS6123775A (en) | 1986-02-01 |
| JPH0130911B2 true JPH0130911B2 (en) | 1989-06-22 |
Family
ID=15375443
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14501484A Granted JPS6123775A (en) | 1984-07-11 | 1984-07-11 | Method for preventing corrosion of copper |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6123775A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01184289A (en) * | 1988-01-19 | 1989-07-21 | Sumitomo Metal Mining Co Ltd | Production of member for heat exchanger fin |
-
1984
- 1984-07-11 JP JP14501484A patent/JPS6123775A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6123775A (en) | 1986-02-01 |
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