JPH0131578B2 - - Google Patents
Info
- Publication number
- JPH0131578B2 JPH0131578B2 JP57132732A JP13273282A JPH0131578B2 JP H0131578 B2 JPH0131578 B2 JP H0131578B2 JP 57132732 A JP57132732 A JP 57132732A JP 13273282 A JP13273282 A JP 13273282A JP H0131578 B2 JPH0131578 B2 JP H0131578B2
- Authority
- JP
- Japan
- Prior art keywords
- vibrator
- vibration
- bending
- vibration sensor
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 238000005452 bending Methods 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 230000005496 eutectics Effects 0.000 claims description 2
- 230000010287 polarization Effects 0.000 claims description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
- G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
- G01H11/08—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means using piezoelectric devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H13/00—Measuring resonant frequency
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
- H10N30/302—Sensors
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
Description
【発明の詳細な説明】
本発明は振動物体における弾性振動を検出する
のに適した共振型振動センサ、特に所定の周波数
について検出感度の優れた共振型振動センサに関
するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a resonant vibration sensor suitable for detecting elastic vibrations in a vibrating object, and particularly to a resonant vibration sensor with excellent detection sensitivity at a predetermined frequency.
従来、振動物体における弾性振動を検出するセ
ンサとして、振動物体の固有振動数に共振周波数
を含わせた屈曲振動モードの片持ちはり構造の矩
形状バイモルフ圧電振動子がよく知られている。
しかしながら、機械的に、あるいは温度変化など
によつて発生する応力により、支持部にずれが生
じ、安定な共振周波数が得られないという欠点を
有していた。ところが、貼り合わせ圧電振動子中
にレーザ加工機等の溶融切断手断で所定の周波数
に共振を有する屈曲振動子を作製し、この屈曲振
動子の周辺を支持固定することによつて安定な共
振周波数を有する共振型振動センサが得られる。
しかし、貼り合わせ圧電振動子の接着には、これ
まで有機系接着剤特にエポキシ系接着剤が用いら
れていたが、レーザ加工機を用いて溶融させて切
削すると有機系接着剤は炭化し、屈曲振動子の出
力取り出し用電極間を短絡させてしまうという問
題がある。 BACKGROUND ART Conventionally, a rectangular bimorph piezoelectric vibrator having a cantilever structure and having a bending vibration mode in which a resonance frequency is included in the natural frequency of a vibrating object is well known as a sensor for detecting elastic vibration in a vibrating object.
However, it has had the disadvantage that a stable resonant frequency cannot be obtained because the support portion is displaced due to stress generated mechanically or due to temperature changes. However, by creating a bending vibrator that resonates at a predetermined frequency in a bonded piezoelectric vibrator by melt cutting using a laser processing machine, etc., and by supporting and fixing the periphery of this bending vibrator, stable resonance can be achieved. A resonant vibration sensor having a frequency can be obtained.
However, until now, organic adhesives, especially epoxy adhesives, have been used to bond bonded piezoelectric vibrators, but when they are melted and cut using a laser processing machine, the organic adhesives carbonize and bend. There is a problem in that the output extraction electrodes of the vibrator are short-circuited.
本発明はこのような共振型振動センサの問題点
を解決せんとするものであり、複数枚の板状圧電
素子を無機接着剤で接着した貼り合わせ圧電振動
子中に屈曲振動モードの振動子を溶融切断して、
安定に弾性振動を検出できる振動センサを提供す
ることを目的としている。 The present invention aims to solve the problems of such resonance type vibration sensors, and includes a bending vibration mode vibrator in a bonded piezoelectric vibrator made by bonding a plurality of plate-shaped piezoelectric elements with an inorganic adhesive. Melt and cut,
The purpose of this invention is to provide a vibration sensor that can stably detect elastic vibrations.
以下、本発明の一実施例を図面を用いて詳細に
説明する。図は、本発明にかかる振動を検知する
屈曲振動モードの振動子を、厚さ方向に分極軸を
有する円板状圧電素子二板を貼り合わせた圧電振
動子中に局在させた構造を示している。なお、第
１図は上面図、第２図は縦断面図、第３図は底面
図である。 Hereinafter, one embodiment of the present invention will be described in detail using the drawings. The figure shows a structure in which a bending vibration mode vibrator for detecting vibration according to the present invention is localized in a piezoelectric vibrator made by bonding two disc-shaped piezoelectric elements having polarization axes in the thickness direction. ing. Note that FIG. 1 is a top view, FIG. 2 is a longitudinal sectional view, and FIG. 3 is a bottom view.
円板状圧電素子１，２を、それぞれの電極１
ａ，２ａで電気的に導通するように、十分に薄い
無機接着剤層３で接着されており、さらにこの貼
り合わせ圧電振動子をレーザ加工機によりコ字状
に切断されて、スリツト４が設けられている。そ
して、電極１ｂ，２ｂにはそれぞれリード線５，
６が接続されている。この貼り合わせ圧電振動子
の、スリツト４の周辺から外周までの部分を被支
持部とすれば、スリツト４で囲まれた部分が屈曲
振動モードのいわゆる片持ちはり型振動子として
機能する。振動によつて発生する出力電圧は、前
記貼り合わせ圧電振動子の上下面電極１ｂ，２ｂ
間に得られ、リード線５，６間から取り出され
る。共振周波数Frは振動部の板厚をＴ、スリツト
４で囲まれた部分の長手方向の長さをｌとすれ
ば、FrはＴ／l2比例するので、これら寸法Ｔ、ｌ
により所定の値に設定できる。 Disc-shaped piezoelectric elements 1 and 2 are connected to respective electrodes 1
A and 2a are bonded together with a sufficiently thin inorganic adhesive layer 3 so as to be electrically conductive, and this bonded piezoelectric vibrator is cut into a U-shape using a laser processing machine to form a slit 4. It is being Lead wires 5 and 5 are connected to the electrodes 1b and 2b, respectively.
6 is connected. If the portion of this bonded piezoelectric vibrator from the periphery of the slit 4 to the outer periphery is the supported portion, the portion surrounded by the slit 4 functions as a so-called cantilever type vibrator in a bending vibration mode. The output voltage generated by vibration is applied to the upper and lower electrodes 1b and 2b of the bonded piezoelectric vibrator.
It is obtained between the lead wires 5 and 6 and taken out from between the lead wires 5 and 6. The resonant frequency F r is determined by the thickness of the vibrating section as T and the length of the part surrounded by the slit 4 in the longitudinal direction as l. Since F r is proportional to T/l 2 , these dimensions T, l
can be set to a predetermined value.
このように貼り合わせ圧電振動子中に屈曲振動
モードの振動子を局在させることにより、貼り合
わせ圧電振動子の支持固定する部分の変化に対し
て、屈曲振動子の共振周波数変化は少なく、安定
である。しかし、円板状圧電素子を有機性接着剤
で接着した場合、有機性接着剤はレーザ光の照射
によつて炭化し、スリツトの内壁面に付着して、
貼り合わせ面側の電極と外側の電極とを短絡させ
てしまうおそれがきわめて大きい。 By localizing the flexural vibration mode vibrator in the bonded piezoelectric vibrator in this way, the resonant frequency of the flexural vibrator changes little and remains stable even when the parts that support and fix the bonded piezoelectric vibrator change. It is. However, when a disk-shaped piezoelectric element is bonded with an organic adhesive, the organic adhesive is carbonized by laser light irradiation and adheres to the inner wall surface of the slit.
There is a very high possibility that the electrode on the bonding surface side and the electrode on the outside will be short-circuited.
板状圧電素子の貼り合わせに使用する無機性接
着剤としてはたとえばガラス性の接着剤がある。
これは溶融状態になつても有機物接着剤のように
炭化することがなく、円板状圧電素子電極間の短
絡が起こらない。また、ガラスに代えてハンダの
薄い箔を使用して電極間をハンダ付けしたり、あ
るいは接着剤の一方をAu蒸着電極、他方をAu表
面にSiを蒸着した電極としておけば数百度の温度
でAuとSiの共晶接着をしたりしても、同じ効果
を得ることができる。 Examples of inorganic adhesives used for bonding plate-shaped piezoelectric elements include glass adhesives.
Even when it is in a molten state, it does not carbonize unlike organic adhesives, and short circuits between the disc-shaped piezoelectric element electrodes do not occur. In addition, if you use a thin foil of solder instead of glass to solder between the electrodes, or use one side of the adhesive as an Au vapor-deposited electrode and the other as an electrode with Si vapor-deposited on the Au surface, the temperature can be maintained at several hundred degrees. The same effect can be obtained by eutectic bonding of Au and Si.
以上の説明からも明らかなように、本発明によ
れば貼り合わせ圧電振動子中に屈曲振動モードの
振動子を溶融切断加工することが可能となり、屈
曲振動子の共振周波数を安定させることができ
る。 As is clear from the above description, according to the present invention, it is possible to melt and cut a bending vibration mode vibrator in a bonded piezoelectric vibrator, and the resonance frequency of the bending vibrator can be stabilized. .
第１図は本発明の一実施例の振動センサの上面
図、第２図はその断面図、第３図はその底面図で
ある。
１，２……板状圧電素子、１ａ，１ｂ，２ａ，
２ｂ……電極、３……接着剤層、４……スリツ
ト。
FIG. 1 is a top view of a vibration sensor according to an embodiment of the present invention, FIG. 2 is a sectional view thereof, and FIG. 3 is a bottom view thereof. 1, 2...Plate piezoelectric element, 1a, 1b, 2a,
2b...electrode, 3...adhesive layer, 4...slit.
Claims (1)
素子を無機接着材で貼り合わせた構造の圧電振動
子中に、溶融切断して所定周波数に共振を有する
屈曲振動モードの屈曲振動子を局在させたことを
特徴とする振動センサ。 ２ 板状圧電素子の貼り合わせにハンダ、または
AuとSiの共晶接着を用いたことを特徴とする特
許請求の範囲第１項記載の振動センサ。[Claims] 1. A piezoelectric vibrator having a structure in which a plurality of plate-shaped piezoelectric elements having polarization axes in the thickness direction are bonded together with an inorganic adhesive, and a bending vibration that is melt-cut and has resonance at a predetermined frequency. A vibration sensor characterized by localized mode bending oscillators. 2 Use solder or
The vibration sensor according to claim 1, characterized in that eutectic adhesion of Au and Si is used.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57132732A JPS5923223A (en) | 1982-07-28 | 1982-07-28 | vibration sensor |
| EP83107244A EP0100501B1 (en) | 1982-07-28 | 1983-07-23 | Vibration sensor |
| DE8383107244T DE3379175D1 (en) | 1982-07-28 | 1983-07-23 | Vibration sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57132732A JPS5923223A (en) | 1982-07-28 | 1982-07-28 | vibration sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5923223A JPS5923223A (en) | 1984-02-06 |
| JPH0131578B2 true JPH0131578B2 (en) | 1989-06-27 |
Family
ID=15088293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57132732A Granted JPS5923223A (en) | 1982-07-28 | 1982-07-28 | vibration sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5923223A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5053671A (en) * | 1987-11-16 | 1991-10-01 | Nissan Motor Company, Limited | Piezoelectric sensor for monitoring kinetic momentum |
| JPH0274868A (en) * | 1988-09-09 | 1990-03-14 | Nissan Motor Co Ltd | Piezoelectric type dynamic quantity sensor |
| CN111678664B (en) * | 2020-04-22 | 2021-09-07 | 中建深圳装饰有限公司 | Curtain wall plate falling risk discrimination method based on vibration analysis |
-
1982
- 1982-07-28 JP JP57132732A patent/JPS5923223A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5923223A (en) | 1984-02-06 |
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